hd-4000 profile optimization through process enhancement · 2021. 1. 12. · hd-4000 4000 profile...
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HDHD--40004000 Profile Optimization Profile Optimization Through Process Through Process EnhancementEnhancement
Shannon DunnShannon Dunn
2004 Symposium on Polymers
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AbstractAbstractPolyimides have been frequently used as stress release layerPolyimides have been frequently used as stress release layer for wafer level packaging [WLP] especially with Cfor wafer level packaging [WLP] especially with C--4 bumped 4 bumped die. HDdie. HD--4000 is a high Tg photosensitive polyimide [PSPI] 4000 is a high Tg photosensitive polyimide [PSPI] developed to replace earlier nondeveloped to replace earlier non--photosensitive wetphotosensitive wet--etch etch polyimides thereby improving wafer throughput as well as polyimides thereby improving wafer throughput as well as resolution. Over the years a number of processing resolution. Over the years a number of processing enhancements have been developed to improve the wall slope enhancements have been developed to improve the wall slope of wetof wet--etch polyimide to achieve improved side wall coverage, etch polyimide to achieve improved side wall coverage, reduce stress and limit the pinch points in subsequent underreduce stress and limit the pinch points in subsequent under-- bump metal [UBM] layers. This presentation will focus on a bump metal [UBM] layers. This presentation will focus on a variety of process optimizations done in conjunction with HDvariety of process optimizations done in conjunction with HD-- 4000 to achieve similar smooth side4000 to achieve similar smooth side--wall profiles and their wall profiles and their resulting impact on sidewall slope of cured PSPI films.resulting impact on sidewall slope of cured PSPI films.
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Standard HDStandard HD--4000 Process 4000 Process ProcessProcess UnitUnit ConditionCondition RemarkRemark EquipmentEquipment
CoatCoat rpmrpm 25002500 Thick.Thick.-- 11um11um SVG TrackSVG Track
SoftbakeSoftbake C/secC/sec 85/90 + 95/9085/90 + 95/90 Proximity HotplateProximity Hotplate SVG TrackSVG Track
ExposureExposure mJ/cm2mJ/cm2 115115 II--linelineUltratechUltratechStepperStepper
Post ExposurePost ExposureBakeBake C/secC/sec 80/6080/60 Proximity HotplateProximity Hotplate SVG TrackSVG Track
DevelopDevelop secsec 4545 Solvent SpraySolvent Spray SVG TrackSVG Track
CureCure C/minC/min 200/30 + 375/60200/30 + 375/60N2 Purge,N2 Purge,
Thickness Thickness -- 5um5um Koyo OvenKoyo Oven
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Standard HDStandard HD--4000 Profile4000 Profile
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Profiles with Focus Offset AdjustProfiles with Focus Offset Adjust
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Post Develop Bake ProcessPost Develop Bake Process
ProcessProcess UnitUnit ConditionCondition RemarkRemark EquipmentEquipment
CoatCoat rpmrpm 25002500 Thick.Thick.-- 11um11um SVG TrackSVG Track
SoftbakeSoftbake C/secC/sec 85/90 + 95/9085/90 + 95/90ProximityProximityHotplateHotplate SVG TrackSVG Track
ExposureExposure mJ/cm2mJ/cm2 115115 II--linelineUltratech Ultratech StepperStepper
DevelopDevelop secsec 4545 Solvent SpraySolvent Spray SVG TrackSVG Track
Post DevelopPost DevelopBake Bake C/secC/sec 150/100+200/100150/100+200/100
Proximity Proximity HotplateHotplate SVG TrackSVG Track
CureCure C/minC/min 200/30 + 375/60200/30 + 375/60N2 Purge,N2 Purge,
Thickness Thickness -- 5um5um Koyo OvenKoyo Oven
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HDHD--40004000 Post Develop Bake ProfilePost Develop Bake Profile
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Post Develop Bake with Focus AdjustPost Develop Bake with Focus Adjust
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Post Exposure Queue Process Post Exposure Queue Process
ProcessProcess UnitUnit ConditionCondition RemarkRemark EquipmentEquipment
CoatCoat rpmrpm 25002500 Thick.Thick.-- 11um11um SVG TrackSVG Track
SoftbakeSoftbake C/secC/sec 85/90 + 95/9085/90 + 95/90ProximityProximityHotplateHotplate SVG TrackSVG Track
ExposureExposure mJ/cm2mJ/cm2 115115 II--linelineUltratech Ultratech StepperStepper
Post ExposurePost ExposureQueueQueue minsmins 3030
Wait before Wait before DevelopDevelop N/AN/A
DevelopDevelop secsec 4545 Solvent SpraySolvent Spray SVG TrackSVG Track
CureCure C/minC/min 200/30 + 375/60200/30 + 375/60N2 Purge,N2 Purge,
ThicknessThickness--5um 5um Koyo OvenKoyo Oven
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HDHD--4000 Queue Profile4000 Queue Profile
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Queue with Focus AdjustQueue with Focus Adjust
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Post Exposure Queue with Post Post Exposure Queue with Post Develop Bake Process Develop Bake Process
ProcessProcess UnitUnit ConditionCondition RemarkRemark EquipmentEquipment
CoatCoat rpmrpm 25002500 Thick.Thick.-- 11um11um SVG TrackSVG Track
SoftbakeSoftbake C/secC/sec 85/90 + 95/9085/90 + 95/90ProximityProximityHotplateHotplate SVG TrackSVG Track
ExposureExposure mJ/cm2mJ/cm2 115115 II--linelineUltratech Ultratech StepperStepper
Post ExposurePost ExposureQueueQueue minsmins 3030
Wait before Wait before DevelopDevelop N/AN/A
DevelopDevelop secsec 4545 Solvent SpraySolvent Spray SVG TrackSVG Track
Post DevelopPost DevelopBake Bake C/secC/sec 150/100+200/100150/100+200/100
Proximity Proximity HotplateHotplate SVG TrackSVG Track
CureCure C/minC/min 200/30 + 375/60200/30 + 375/60N2 Purge,N2 Purge,
ThicknessThickness--5um 5um Koyo OvenKoyo Oven
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HDHD--4000 Queue with Hardbake 4000 Queue with Hardbake ProfileProfile
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Queue with Hardbake thru Focus Queue with Hardbake thru Focus AdjustAdjust
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Broadband ProcessBroadband Process
ProcessProcess UnitUnit ConditionCondition RemarkRemark EquipmentEquipment
CoatCoat rpmrpm 25002500 Thick.Thick.-- 11um11um SVG TrackSVG Track
SoftbakeSoftbake C/secC/sec 85/90 + 95/9085/90 + 95/90Proximity Proximity HotplateHotplate SVG TrackSVG Track
Exposure Exposure mJ/cm2mJ/cm2 100100 BroadbandBroadbandUltratechUltratechStepperStepper
Post ExposurePost ExposureBakeBake C/secC/sec 80/6080/60
Proximity Proximity HotplateHotplate SVG TrackSVG Track
DevelopDevelop secsec 4545 Solvent SpraySolvent Spray SVG TrackSVG Track
Post DevelopPost DevelopBake Bake C/secC/sec 150/100+200/100150/100+200/100
Proximity Proximity HotplateHotplate SVG TrackSVG Track
CureCure C/minC/min 200/30 + 375/60200/30 + 375/60N2 Purge,N2 Purge,
Thickness 5umThickness 5um Koyo OvenKoyo Oven
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HDHD--4000 Broadband Profile4000 Broadband Profile
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Broadband Exposure with Queue Broadband Exposure with Queue ProcessProcess
ProcessProcess UnitUnit ConditionCondition RemarkRemark EquipmentEquipment
CoatCoat rpmrpm 25002500 Thick.Thick.-- 11um11um SVG TrackSVG Track
SoftbakeSoftbake C/secC/sec 85/90 + 95/9085/90 + 95/90Proximity Proximity HotplateHotplate SVG TrackSVG Track
Exposure Exposure mJ/cm2mJ/cm2 100100 BroadbandBroadbandUltratechUltratechStepperStepper
Post ExposurePost ExposureQueueQueue minsmins 3030
Wait before Wait before Develop Develop N/AN/A
DevelopDevelop secsec 4545 Solvent SpraySolvent Spray SVG TrackSVG Track
Post DevelopPost DevelopBake Bake C/secC/sec 150/100+200/100150/100+200/100
Proximity Proximity HotplateHotplate SVG TrackSVG Track
CureCure C/minC/min 200/30 + 375/60200/30 + 375/60N2 Purge,N2 Purge,
Thickness Thickness -- 5um5um Koyo OvenKoyo Oven
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HDHD--40004000 Broadband with Queue ProfileBroadband with Queue Profile
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HDHD--4000 Profile Optimization4000 Profile Optimization SummarySummary
Process modifications can be utilized to Process modifications can be utilized to achieve desired profile of HDachieve desired profile of HD--4000. Some 4000. Some of those process modifications are:of those process modifications are:
Focus Offset adjustmentFocus Offset adjustmentPost develop bake Post develop bake Post exposure queuePost exposure queueChange of exposure wavelength Change of exposure wavelength
It is also possible to combine several It is also possible to combine several process modifications to achieve the process modifications to achieve the required profile.required profile.
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HDHD--4000 Processing Summary4000 Processing SummaryCondition Profile Pros Remarks
PEB with Focus Adjust Reduce Crown Stepper Needed
Queue with FocusAdjust
Reduce Crown/Increase Footing
Throughput Delay/Queue Time
Post Develop Bake (PDB) Eliminate Crown
Increased ProcessingTime
Queue withPost Dev Bake
No Crown Shallow Slope
Increase Processing/Decrease Throughput
BroadbandExposure
Reduce Crown/ChangeSlope Tool Dependent
BroadbandQueue/PDB
No Crown/ShallowSlope
Tool Dependent/Increased Processing/Queue Time
HD-4000 Profile Optimization Through Process EnhancementAbstractStandard HD-4000 Process Standard HD-4000 ProfileProfiles with Focus Offset AdjustPost Develop Bake ProcessHD-4000�Post Develop Bake ProfilePost Develop Bake with Focus AdjustPost Exposure Queue Process HD-4000 Queue ProfileQueue with Focus AdjustPost Exposure Queue with Post Develop Bake Process HD-4000 Queue with Hardbake ProfileQueue with Hardbake thru Focus AdjustBroadband ProcessHD-4000 Broadband ProfileBroadband Exposure with Queue ProcessHD-4000�Broadband with Queue ProfileHD-4000 Profile Optimization�SummaryHD-4000 Processing Summary