hardware management module

X64 Workshop
Hardware Management

Andy Harness

Systems-TSC Technical Community

Managing X64 Hardware

AMD CPU Types

System Upgrades - CPUs

System Upgrades - Memory

Identification of M2/Non-M2 Systems

Updating ILOM Firmware

System Board Replacement

Updating FRUID data

Current Issues

Single-core Opteron

AMD64

Direct Connect Architecture

Integrated DDR DRAM Memory Controller

HyperTransport Interconnect Technology

CPU1

1MB L2 Cache

MemoryController

HT0

HT1

HT2

Single Core AMD Opteron Design

CPU01MB L2 Cache

System Request Queue

Crossbar Switch

CPU01MB L2 CacheGo to slide 21 to show architectural differences between single and dual core

AMD Direct Connect Architecture

The AMD Direct-Connect Architecture eliminates traditional system bottlenecks created by Front Side Bus (FSB) architecture

Best approach of directly interconnecting CPU, memory, and I/O resources :

Direct connection of CPUs to each other using Coherent HyperTransport links

Direct connection of CPUs to I/O resources using HyperTransport links

Direct connection of CPUs to memory using integrated DDR memory controller

Direct connection between CPUs on the same die (Dual-core)

HyperTransport

HyperTransport

I/O

Direct Connect Architecture is the new terminology from AMD that regroups under one name all the technologies that differentiate AMD and Intel technology.

Dual-core Opteron

AMD64 was designed as CMP (Chip-level Multi-Processing) from the start with Crossbar Switch and System Request Queue (CPU1 uses 2nd port on SRQ)

Each core has dedicated 1MB L2 Cache

Both cores share the memory controller and HyperTransport interconnects

Performance characterization of single-core based systems have revealed that the Memory and HyperTransport bandwidths are under-utilized even while running high-end server workloads

CPU1

1MB L2 Cache

MemoryController

HT0

HT1

HT2

Dual-core AMD Opteron Design

CPU01MB L2 Cache

System Request Queue

Crossbar Switch

AMD64 processors designed from ground up to support multi-core

Seamless migration from single-core to multi-core

Same infrastructure

Same power envelope

Think about it. Higher performance. Same power envelope. Same infrastructure. Think about all the things you dont have to change:

Motherboard

Power supply

Cooling solutions

Heat sinks

All this requires is a processor swap and a BIOS update. This is an easy migration path for customers to increase their computing power in a cost-effective, non-disruptive manner.

Launched 21 April 2005

Leverage AMD Direct Connect Architecture to connect two CPUs on one die along with the memory, I/O which improves the overall system performance and efficiency

Socket compatible with existing AMD Opteron 940-pin sockets that support 90nm (95W/80A)

Only Rev E based systems are Dual-core upgradable with a BIOS update

Compatible with x86 and AMD64 applications

AMD CPUs - Next Generation Opteron (Rev F)

Continuity

Same 32/64-bit execution core

Same Power envelope

Same AMD Direct Connect Architecture w/ upto 3 HT links per CPU

Same 1 MB L2 cache per core

New Features

Second generation Opteron design

Dual-Core only

Seamless Dual-Core to Quad-Core upgradeability in same thermal envelope and socket

AMD Virtualization (AMD-V) hardware assisted support

Sockets F (LGA-1207) or AM2 (PGA-940)

AMD CPUs - Next Generation Opteron (Rev F)

Steppings F2 & F3

Rev F Opteron CPUs shipping in CY06Q4 are stepping F2

AMD were due to start production of F3 processors in November 2006 (Series 2000 & 8000) and December 2006 (Series 1000)

Stepping F3 has several Errata fixes

#133: Internal Termination Missing on Some Test Pins

#153: Potential System Hang in Multiprocessor systems with ? 14 Cores

#157: SMIs that are not Intercepted May Cause Unpredictable System Behaviour

Stepping F3 allows higher speed bins than F2

AMD has released BIOS code that ensures mixing of F2 & F3 CPUs in a single system. It is up to each Product Team to decide testing/qualification of such configurations Next Generation Opteron (Rev F)

AMD CPUs Opteron Rev F Model Naming

2 2 2 2

1/2/8

2

XX

3rd & 4th digits = relative performance
compared to other processors in the series

2nd digit = socket generation (Rev F = 2)

1st digit = scalability, max number of processors
supported (1, 2, or 8)

4-digit nomenclature

AMD Opteron Rev. E and Rev. F

Opteron Steppings & Sockets

Rev F Socket F

Rev F is the Processor Stepping

Socket F (1207) is the physical socket

Rev F Opteron uses different sockets

Opteron Series 2000 & 8000 use socket F (1207)

Opteron Series 1000 use Socket AM2

Socket F will be used by Opteron G (Quad Core)

AMD Opteron Rev F Model Naming

1200 Series

100 Series replacement

Single socket only

1 HT link, Not Cache Coherent

Socket AM2

2200 Series


Up to 2 sockets

3 HT links, 1 is Cache Coherent

Socket 1207

8200 Series


Up to 8 sockets

3 HT links, ALL are Cache Coherent

Socket 1207

System Upgrades

CPU Upgrade Options

Memory Upgrade Options

System Upgrades

Can I Upgrade from a Rev E CPU to a Ref F CPU?

Generally NO because...

CPU sockets are different

Memory Type is different

What about X4600?

ALL CPU/Mem boards including DIMMs need to be replaced

The BIOS/ILOM firmware must be updated to M2 version
during the upgrade procedure


CPU General Rules

All CPUs must be the same model

All CPUs must be the same clock speed

No Mixing of Single/Dual Core

All CPUs should be the same Stepping

May require specific firmware levels

Opteron Steppings

More info: http://www.amd.com/processorquickrefguide

Main differences between Opteron steppings


Sun Fire V20z Compatibility Between Components and Software for Each Server Version


Sun Fire V20z CPU Options and Part Numbers


Sun Fire V40z Compatibility Between Components and Software for Each Server Version


Sun Fire V40z CPU Options and Part Numbers

System Upgrades - Memory

General Memory Configuration Rules

Memory Types

Registered (Buffered) vs Unbuffered (Unregistered) DIMMs

DDR2 vs DDR1

Memory slots

Memory placement

Buffered vs. Unbuffered DIMMs

Registered DIMMs have additional registers placed between the CPUs and DIMMs

Improves signal integrity, allowing longer traces

and larger, more reliable memory subsystems

Up to 4GB per DIMM slot, 8 DIMM slots per CPU (4 typical)

Unbuffered DIMMs do not have these registers

Lower cost and slightly higher performance

Up to 4 DIMM slots per CPU

Sun Fire X2100 w/AMD Opteron 100 Series CPU

a stick of memory that contains registers will actually hold data for one full clock cycle before it's passed on. A small performance hit is generally incurred as a result. Registered memory is all about scalability and stability.

Memory Speed vs. DIMM Slots/CPU

4 DIMM slots per Opteron processor

Optimized for memory performance

Enables the use of higher performing DIMMs

4 DIMMs @ DDR400 outperforms 8 DIMMs @ DDR266

8 DIMM slots per Opteron processor

Trades memory capacity for performance

DDR400 DIMMs can only be used to populate 4 DIMM slots, leaving the remaining 4 unused

DDR333 DIMMs can only be used to populate 6 DIMM slots, leaving the remaining 2 unused

DDR266 DIMMs can be used to populate 8 DIMM slots but with a very noticeable performance impact

8 DIMMS slots per socket requires physically larger systems (X2200-M2)

Memory Placement

The AMD Opteron processors memory controller works in 64-bit (single channel) or 128-bit (dual channel) mode ECC operation.

For best memory performance, AMD recommends running in 128-bit mode ECC operation.

To enable 128-bit mode, DIMMs should be populated in 2 identical pairs such that they each occupy one-half of the AMD Opteron processors 128-bit memory controller interface.

This is a logical View at bus level which does not represent physical location of DIMMs on Motherboard.

64-bit

Pair 2

64-bit

Pair 1

This shows optimum memory placement in V20z and V40z for full capacity usage of 128 bit memory bus.

DDR2 vs DDR memory

240 pins vs 184 pins

Keyway in different Position

Label Description e.g PC2-5300 vs PC3200

Identification of M2/Non-M2 systems

Using the Service Processor

From the Operating System

Physical Identification


Common Differences

1/2/8000 Series CPUs v 1/2/800 series CPUs

Heatsinks

DDR2 v DDR1 memory

PCIexpress v PCI-X

Reference Documentation

http://www.sun.com/blueprints/1106/820-0373.pdf


Product Name

Shown in BIOS Boot Screen

BIOS Setup Utility

ILOM CLI under /SYS/MB

IPMItool fru output

CPU Information

Solaris - psrinfo -pv

Linux cat /proc/cpuinfo

Windows Look in Device Manager for Processors





-> show /SYS/MB

/SYS/MB

Targets:

BAT

NET0

NET1

P0

P1

Properties:

SEEPROM =

Product Information:

manufacturer name = SUN MICROSYSTEMS

product name = Sun Fire X4100 M2

version = (no information)

serial number = 0640BD0152

part number = 602-3482-01

T_AMB = 21.000000 degrees C

V0_VDD = No reading available

V0_VDDIO = No reading available

V0_VTT = No reading available

V1_VDD = No reading available

V1_VDDIO = No reading available

V1_VTT = No reading available

V_+12V = No reading available

V_+1V2 = No reading available



V_+3V3MAIN = No reading available

V_+3V3STBY = 3.252400 Volts

V_+5V = No reading available

V_-12V = No reading available

Commands:

cd

show

->


FRU Device Description : mb.fru (ID 2)

Chassis Type : Rack Mount Chassis

Chassis Part Number : 000-0000-00

Chassis Serial : 0226-0638LHF013N

Board Product : ASSY,MOTHERBOARD,X4600,REV F

Board Serial : 1762TH1-0625001244

Board Part Number : 501-7638-01

Board Extra : 01

Board Extra : G4F_MB

Product Manufacturer : SUN MICROSYSTEMS

Product Name : SUN FIRE X4600

Product Part Number : 602-3472-01

Product Serial : 0640AM0978

Output from ipmitool fru print command


Everyone and Everything Participating on the Network

X2100 M2

X2100


X4100 M2

X4100



X4200 M2

X4200


Ultra20 M2

Ultra20



Ultra40 M2

Ultra40


The upgrade of the ILOM firmware on the Galaxy range of systems should be carried out in a specific manner to avoid loss of system fruid data and to ensure the safe operation of the system

This is to confirm that upgrade in steps is still required contrary to some inferred messages circulating

SW1.0 ==>SW1.1==>SW1.2 or SW1.2.1-->SW1.3

==> has to pre-flash and flash upgrade in that order

--> no pre-flash needed.


The G12 (not G12F) step by step upgrade process, starting from a system with SW1.0a (ILOM build 6464) would look like below. Step #1 is only for early access systems with ILOM build 6169.Your entry point in this process will depend on what firmware level the system is running. For example, with a system with ILOM build 9306, start from step #4.

1. SW1.0a - ILOM build 6464 URL: http://www.sun.com/download/products.xml?id=436bd009

2. Pre-flash script: ilom.X4100-preflash_1.2.sh

3. SW1.1 - ILOM build 9306 URL: http://www.sun.com/download/products.xml?id=442f01f5

4. Pre-flash script ilom.X4100-preflash_1.2.sh

5. SW 1.2 - ILOM 1.0.5 build 12029c URL: http://www.sun.com/download/products.xml?id=44cfd445

6. SW 1.3 - ILOM 1.1.1 (or 1.1.1.1) build 15632 URL: http://www.sun.com/download/products.xml?id=45b94409

Updating FRUID data

After Service intervention or firmware update the FRUID information stored in the SEEPROM for the one or more parts may no longer be correct and may need to be re-entered manually

On Galaxy type systems, this can be accomplished using the service processor utility servicetool

Updating FRUID data

Example of Good Data

-> show /SYS/MB/SEEPROM

Properties:

SEEPROM =



product name = SUN FIRE X4200


serial number = 0550AN026D


Example of Bad Data

-> show /SYS/MB/SEEPROM

Properties:

SEEPROM =



product name = SUN FIRE X4100


serial number = 0000000000


Updating FRUID data

Example of Updating System Board FRUID data

Log in to Service Processor as user sunservice

ebusy>ssh -l sunservice va64-x4200c-sp-gmp03

sunservice@va64-x4200c-sp-gmp03's password:changeme

Issue the servicetool command, and answer the questions

[(flash)root@SUNSP00144F0E27BD:~]# servicetool --board_replaced=mainboard \

--fru_product_part_number --fru_product_serial_number

Updating FRUID data

Servicetool is going to update the mainboard FRU with product and chassis information collected from the removed mainboard.

The following preconditions must be true for this to work: * The new mainboard must be installed. * The service processor must not have been replaced with the motherboard. * The service processor firmware must not have been upgraded prior to the motherboard replacement; do firmware upgrades after component swaps!Do you want to continue (y|n)? yMainboard FRU configuration has been updated.

Servicetool is going to update the mainboard FRU product part number.Do you want to continue (y|n)? y

When entering values, do not use quotes; If you require embedded quotes, escape them with three backslashes; e.g. \\\"

Updating FRUID data

What is the new product part number? 602-3103-01The product part number has been updated.The new part number is: "602-3103-01"

Servicetool is going to update the mainboard FRU product serial number.Do you want to continue (y|n)? yWhen entering values, do not use quotes; If you require embedded quotes, escape them with three backslashes; e.g. \\\"

What is the new product serial number? 0550AN026DThe product serial number has been updated.The new serial number is: "0550AN026D"

Updating FRUs... done[(flash)root@SUNSP00144F0E27BD:~]#

Current Issues

FAB 102770 Galaxy power busbar connections

CR 6335741 X4100 PCI Riser causing reboots

CR 6515060 X4600 Randomly powers off

CR 6537731 X4600M2 DIMM slots labelled wrongly

FAB 102770 Thermal Issue on Galaxy

Failure to properly tighten the System/Motherboard or the DC Power Distribution Board bus bar connections on Galaxy may lead to thermal event

New Nut design

Screws should be torqued to 7.5in/lbs (0.847385 Newton Meters) and 18in/lbs (2.03372 Newton Meters) for nuts.

Busbar test to monitor 12v rail with and without load

http://nsgrelease.sfbay/galaxy12/releases/G12x-SW1.3-rc38/ops/061215/

http://sdpsweb.central/FIN_FCO/FAB/102770/SPE/busbar


1) Copy the latest busbar tool to the service processor /coredump directory.

scp busbar sunservice@?sp_ip?:/coredump

(where ?sp_ip? is the target IP address)

.....continue conection (yes/no)? yes

password:changeme

2) ssh into the targeted system

ssh sunservice@?sp_ip?

password:changeme

# cd /coredump


busbar

loopcnt - This is the number of time you wish busbar to run. If this value is 0 then busbar will run forever.

System name - This specifies the machine type to test. Below is a list of systems known to busbar. system name g1= Galaxy1g2= Galaxy2g1= Galaxy1eg2e= Galaxy2eg1f= Galaxy1fg2f= Galaxy2fcnst= Constellation

For example, to run busbar 3 time on Constellation I would use the following command:

./busbar 3 cnst

Description:

The busbar was designed to find systems with poor busbar connections. This done by reading the 12 volt sensor twice. The first time the 12 volt sensor is read with the system in reset and the fans spun down so as to minimize the load on the system. The second time the 12 volt sensor is read with the system running and the fans at their highest rpm so as to maximize the load on the system. The two numbers are compared, if the difference between the two is greater than 5% then there may be a problem with the
bus bar connection and an error is generated.


CR 6335741 X4100 PCI Riser causing reboots

Excessive ring-back noise during write cycles from the option card installed on the 133MHz Slot (slot 1)

Workaround only use slot 0 (100MHz)

Replace Riser Card, 501-6914-01with 501-6914-02

Engineering suggest replacing both risers

Until FCO is available raise CIC

CR 6515060 X4600 Randomly Powers Off

Small percentage of CPUs giving ThermTrip errors

BIOS 44 (SW1.3) available end of march, will log ThermTrip events as default. If applied, ThermTrip events will cause the system to shutdown. When the system is powered on, there will a message stating a ThermTrip event has occurred. This message is also logged and can be retrieved by ipmitool.

Further debugging using latest version of HDT required to isolate failing CPU. Requires debug BIOS which disables shutdown on ThermTrip so only Sun badged engineers allowed to use it


Thermtrip detected by hdtl Example

[(flash)root@SUNSP00144F26E93F:/coredump]# ./hdtl -y

hdtDiag: Galaxy/Thumper HDT Diagnostics, Version 0.9.6

-------------------------------------------------------

hdtDiag: ThermTrip Diags

Stopping IPMI Stack....Done.

no dbdry cpu 00

hdtDiag: resetting system, hard reset

hdtDiag: waiting for power good

hdtDiag: Power on 01

stopped at reset vector

hdtDiag: Galaxy4: 8 - CPU Configuration mod 00ff

hdtDiag: Power is on

hdtDiag: relocating 8132

hdtDiag: ck08 : 0x005110de

CK08 System Control Register space 0x4400

00 : 0x09000000

04 : 0x00000000


f8 : 0x00000000

fc : 0x00000000

TCO Status Register : 0x00410002

THERMTRIP_STS asserted : THERMTRIP detected by ck08

TCO Ctrl Register : 0x00ff0800

THERMTRIP_RST set : G2/S5 shutdown on THERMTRIP enabled

hdtDiag: reset to get to ASP's

hdtDiag: resetting system, hard reset

hdtDiag: exit HDT mode

hdtDiag: cpu 0 Slot A : 0x11510120 ENABLED

hdtDiag: cpu 1 Slot C : 0x104f0020 ENABLED

hdtDiag: cpu 2 Slot B : 0x0f570220 ENABLED

hdtDiag: cpu 3 Slot D : 0x0f4d0220 ENABLED

hdtDiag: cpu 4 Slot E : 0x104c0120 ENABLED

hdtDiag: cpu 5 Slot F : 0x0f4f0220 ENABLED

hdtDiag: cpu 6 Slot G : 0x10490120 ENABLED

hdtDiag: cpu 7 Slot H : 0x10460320 ENABLED

[(flash)root@SUNSP00144F26E93F:/coredump]#


Hdtl output using engineering BIOS

f8 : 0x00000000

fc : 0x00000000

TCO Status Register : 0x00400000

THERMTRIP_STS de-asrt : No THERMTRIP detected by ck08

TCO Ctrl Register : 0x00fe1000

THERMTRIP_RST set : G2/S5 shutdown on THERMTRIP disabled

hdtDiag: cpu 0 Slot A : 0x115e0120 ENABLED

hdtDiag: cpu 1 Slot C : 0x105f0020 ENABLED

hdtDiag: cpu 2 Slot B : 0x0f63022a ENABLED THERMTRIP CORE0

hdtDiag: ===> CPU slot B : reset caused by THERMTRIP

hdtDiag: cpu 3 Slot D : 0x0f560220 ENABLED

hdtDiag: cpu 4 Slot E : 0x10590120 ENABLED

hdtDiag: cpu 5 Slot F : 0x0f5a0220 ENABLED

hdtDiag: cpu 6 Slot G : 0x10560120 ENABLED

hdtDiag: cpu 7 Slot H : 0x10500320 ENABLED

[(flash)root@SUNSP00144F26E93F:/coredump]#

CR 6537731/6538830 X4600-M2 DIMM slots labelled wrongly in service manual and on service label

G4's top cover service label, pn 263-2329-04-50, X4600 M2.
Step #10 "DIMM Insertion" the DIMM slot number information is INCORRECT

Currently it shows: [Board top edge]

DIMM0 -White - Pair 0

DIMM1 -White - Pair 0

DIMM2- Black - Pair 1


The label should read: [Board top edge]

DIMM3 -White - Load first - Pair1

DIMM2 -White - Load first - Pair1



[email protected]

SteppingC0CGE4Frequency1.4 2.2 GHz1.4 2.4 GHz1.6 2.6 GHzModelsX40 x48X40 x50X42 x52HyperTransport800 MHz1000 MHzSocket940940Manufacturing Tech.130 nm90 nmPackageCeramicOrganicL2 Cache1 MB1 MBMax Idd60 A80 AMax Power89 W95 W

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Sun Microsystems, Inc.

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Sun Confidential: Internal Only

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ebusy>ss

SteppingRev. ERev. FGenerationFirst GenerationNext GenerationCoresSingle/DualDual/Quad ReadyFrequency1.6 3.0 GHz1.8 - 3.2 GHzModelsX40 - x85X210 - x224HyperTransport1000 MHz (2000 MT/s)Memory ControllerRegistered ECC DDR1-266/333/400 (200/800 Series) Unbuffered ECC DDR1-266/333/400 (100 Series)Registered ECC DDR2-400/533/667 (2000/8000 Series)Unbuffered ECC DDR2-400/533/667/800 (1000 Series)Memory BandwidthUp to 6.4 GB/sUp to 10.7 GB/s (2000/8000 Series)Up to 12.8 GB/s (1000 Series)L1 Cache64 KB (Data) + 64 KB (Instruction) per coreL2 Cache1 MB per coreMax Power95/120 W (200/800 Series) 104/110 W (100 Series)95/120 W (2000/8000 Series)103/125 W (1000 Series)Socket940-pin (200/800 Series)939-pin (100 Series)Socket F 1207-pin (2000/8000 Series)Process Tech.90 nm SOI

???Page ??? (???)04/11/2007, 11:52:41Page /

???Page ??? (???)04/11/2007, 12:00:47Page / Chassis FRU P/NMotherboard P/NSingle/Dual CoreStepping VersionCPU VRM P/N Memory TypeMemoryVRM PNMinimum NSVMinimum BIOS380-0979370-6730SingleC0F370-6680DDR 333F370-66462.1.0.9f1.27.11380-1168370-7691SingleCGF370-6680DDR 333F370-66462.1.0.16b1.30.5380-1194370-7788SingleE6, E4,F370-7746DDR 333/400 F370-77472.2.0.6h1.32.7.2380-1194370-7788Single, DualE6, E4,F370-7746DDR 333/400 F370-77472.3.0.111.33.5.2380-1194370-7788Single, DualE6, E4, E1F370-7746DDR 333/400 F370-77472.3.0.11c1.33.7.2380-1194370-7788Single, DualE6, E4, E1F370-7746DDR 333/400 F370-77472.4.0.61.34.4.2380-1194370-7788Single, DualE6, E4, E1F370-7746DDR 333/400 F370-77472.4.0.81.34.6.2380-1194370-7788Single, DualE6, E4, E1F370-7746DDR 333/400 F370-77472.4.0.121.35.2.2

???Page ??? (???)04/11/2007, 12:00:47Page /

???Page ??? (???)04/11/2007, 12:00:47Page / Single Core CPUX-optionsCustomer Replaceable Components PN

Opteron 844, 1.8 GHz, CG Stepping595-7482-xxF370-6902-xx



Opteron 848, 2.2 GHz, E4 Stepping594-1099-xxF370-7704-xx





Dual Core CPUOpteron DC 870, 2.0 GHz, E6 Stepping594-1623-xxF370-7796-xx

Opteron DC 875, 2.2 GHz, E6 Stepping594-1622-xxF370-7797-xx



???Page ??? (???)04/11/2007, 12:00:47Page /

???Page ??? (???)04/11/2007, 12:00:47Page / Single Core CPUX-optionsCustomer Replaceable Components PN

Opteron 242, 1.6 GHz, C0 SteppingNo longer availableF370-6695-xx






Opteron 244, 1.8 GHz, E Stepping594-0660-xxF370-7710-xx




Dual Core CPUOpteron DC 270, 2.0 GHz, E Stepping594-1663-xxF370-7799-xx

Opteron DC 275, 2.2 GHz, E Stepping594-1664-xxF370-7800-xx

???Page ??? (???)04/11/2007, 12:00:47Page /

???Page ??? (???)04/11/2007, 12:00:47Page / Chassis FRU P/NMotherboard P/NSingle/Dual CoreStepping Version CPU VRM P/N Memory TypeMemoryVRM P/NMinimum NSVMinimum BIOS380-1010370-6929SingleC0F370-6680DDR 333F370-66462.1.0.16b2.22.4380-1206370-7808SingleE6, E1F370-7746DDR 333/400 F370-77472.2.0.6h2.32.8.2380-1206370-7808Single, DualE1F370-7746DDR 333/400 F370-77472.3.0.112.33.5.2380-1206370-7808Single, DualE4, E1F370-7746DDR 333/400 F370-77472.3.0.11c2.33.7.2380-1206370-7808Single, DualE6, E4, E1, CG, C0F370-7746DDR 333/400 F370-77472.4.0.62.34.4.2380-1206370-7788Single, DualE6, E4, E1, CG, C0F370-7746DDR 333/400 F370-77472.4.0.82.34.6.2380-1378370-7788Single, DualE6, E4, E1, CG, C0F371-1463DDR 333/400 F371-14642.4.0.122.35.2.2

???Page ??? (???)04/11/2007, 12:00:48Page /

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