h-bridge drivers (vref series) -...
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1/16 www.rohm.com 2011.2 - Rev.Dc 2009 ROHM Co., Ltd. All rights reserved.
H-bridge Drivers for Brush Motors
H-bridge Drivers (VREF Series) BD621Series,BD622Series,BD623Series
Description
These H-bridge drivers are full bridge drivers for brush motor applications. Each IC can operate at a wide range of power-supply voltages (from 3V to 36V), supporting output currents of up to 2A. MOS transistors in the output stage allow for PWM signal control, while the integrated VREF voltage control function of previous models offers direct replacement of deprecated motor driver ICs. These highly efficient H-bridge driver ICs facilitate low-power consumption design.
Contents
1) Block diagrams 2
2) Control input pins 3
3) Reference voltage (VREF) input pin 3
4) Power supply and ground pin 3
5) Driver outputs 4
6) Heat sink fin 4
7) Thermal design 5
8) Thermal derating curve and transient thermal resistance 6
9) A.S.O. curve 7
10) Application circuit examples 8
11) Evaluation board 10 Line up matrix
Rating voltage Channels Maximum output current
0.5A 1.0A 2.0A
7V 1ch BD6210 HFP / F
BD6211 HFP / F
BD6212 HFP / FP
18V
1ch BD6220F BD6221F BD6222 HFP / FP
2ch BD6225FP BD6226FP
36V
1ch BD6230F BD6231 HFP / F
BD6232 HFP / FP
2ch BD6236 FP / FM
BD6237FM
*Packages; F:SOP8, HFP:HRP7, FP:HSOP25, FM:HSOP-M28
No.11007EDY01
Application Note
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Block diagrams
SOP8 package
HRP7 package
HSOP25 package
Fig. 1 H-bridge driver block diagram
Pin description table
Pin name Function
VCC Power supply
FIN Control input (forward)
RIN Control input (reverse)
VREF Duty setting pin
OUT1 Driver output
OUT2 Driver output
RNF Power stage ground
GND Ground
VREF input pin (Page 3)
Control input pins (Page 3)
Heat sink fin (Page 4)
Power supply (Page 3)
Driver outputs (Page 4)
Ground pin (Page 3)
3
2
7 1
4
5
CTRL
PROTECT
FIN
RIN
VCC
VCC
OUT1 OUT2
8 GND
6 VREF DUTY
7
6 2
3
5
CTRL
PROTECT
FIN
RIN
VCC
OUT1 OUT2
4 GND
1 VREF DUTY
FIN
GND
21
22
12 1
20
19
CTRL
PROTECT
FIN
RIN
VCC
VCC
OUT1 OUT2
8 RNF
17 VREF DUTY
6
GND
2 13
7
23
FIN
GND
Power ground (Page 3)
Application Note
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Control input pins The input threshold voltage of the control pins are TTL level (H:2.0V, L:0.8V), with a hysteresis voltage of approximately 0.3V. The IC will accept input voltages up to the VCC voltage. The output bridge stage has a built-in "dead time" period of about 400ns (typ.) to protect against rush current; therefore, an "off" period when switching between modes is not necessary. The IC can accept a PWM input signal in the range of 20kHz to 100kHz. At frequencies less than 20kHz, the IC will enter standby mode (output: Hi-Z), and at frequencies higher than 100kHz, the output switching signal becomes unable to follow the input signal. When the system switches to standby mode from any other mode (except brake), the internal control logic remains active for at least 50µs before shutting down all other circuits. The control input pins are connected internally to pull-down resistors (100kΩ typ.). However, when operation is controlled via PWM or VREF, switching noise on the output stage may affect the input on these pins and cause undesired operation. In such cases, attaching an external pull-down resistor (10kΩ recommended) between each control pin and ground, or connecting each pin to an input voltage of 0.8V or less (preferably GND), is recommended.
Fig.2 Equivalent circuit Fig.3 Equivalent circuit with noise compensation Reference voltage input pin (VREF) pin
The VREF voltage input pin is connected to a MOSFET gate input and therefore has very high input impedance. Leaving this pin open will cause unstable operation; therefore, connect it to VCC when not using VREF control mode. As this pin is designed only to accept analog input signals, do not connect a PWM signal to the input. It can, however, be connected to a signal that switches between different voltages for IC control. When used in applications where variations on the VREF input voltage may occur, insert a capacitor between VREF and GND. However, make sure that the voltage across the capacitor does not become reverse-biased (i.e. VCC < VREF) when power is switched off.
Fig.4 Application without VREF control Fig.5 Application with unstable VREF input Power supply and ground pin
When used in applications where separate small- and large-signal power supplies are connected to the IC, the power supplies should be shorted together as close as possible to the IC’s input pins. The GND connection to the RNF pin should be shorted the same way. In the two-channel version of the device, there are separate pins for the power and ground of each channel; although they are electrically connected to each other within the device, ensure that both channels’ power and ground pins are connected externally to the power supply. When operating in VREF or PWM control mode, establish a current path for current recovery from the motor via a bypass capacitor between VCC and ground.
FIN
100k (Typ.)
RIN
PC
FIN
100k (Typ.)
RIN
PC
10k 10k
VREF
VCC VCC
GND
VREF
VCC VCC
GND
Application Note
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Fig.6 Current path when ON (PWM mode) Fig.7 Current path when OFF (PWM mode)
Recommended value of the bypass capacitor is different depending on the armature resistance of the brush motor, the use power supply voltage and the output current of driver IC. It is important to conclusively confirm that the actual motor operation, referring to the following graphs.
Driver outputs
This IC features integrated over-current protection (OCP) circuitry in the output stage to protect the IC from sudden jumps in current. However, if an instantaneous amount of current with a high rise time (0.1A/µs or more) is encountered due to power supply or ground faults, for example, internal components of the IC may be damaged before the OCP engages due to the OCP activation window of 10µs (typ.). When the IC is used in applications with a low-impedance or high-output power supply, consider adding physical protection devices (such as fuses) to the input. Do not connect an external capacitor directly to the output pin as doing so may cause a rush current to flow from the output, damaging internal components. However, if an output capacitor is necessary, for example, to reduce noise on the output, connect it in series with a resistor to avoid output rush currents. Note that doing so may increase switching power consumption in VREF or PWM control modes.
Fig.11 Snubber circuit example Heat sink fin
HPR7, HSOP25 and HSOPM28 packages feature heat sink fins. As the fin is connected directly to the internal die, it should be mounted directly to as large a ground pattern as possible to maximize heat radiation. The ground plane should also be connected to the system GND potential. Connecting the fin to anything other than GND may cause the IC to malfunction.
M
ON
OFF
OFF
ON
M
ON
OFF
OFF
OFF
Fig.8 BD621X series Fig.9 BD622X series Fig.10 BD623X series (7V rating products) (18V rating products) (36V rating products)
0
5
10
15
3 4 5 6 7
Supply Voltage [V]
Ra
[o
hm
]
0.5A
1A
2A
0
10
20
30
6 9 12 15 18
Supply Voltage [V]
Ra
[o
hm
]
0.5A
1A
2A
0
10
20
30
24 27 30 33 36
Supply Voltage [V]
Ra
[o
hm
]
1A
3A
2A
Ceramic 10µF
Electrolytic 4.7µF + Ceramic 1µF
Electrolytic 10µF + Ceramic 1µF
Electrolytic 22µF + Ceramic 1µF
+ Ceramic 1µF
Electrolytic 33µF
Electrolytic 10µF + Ceramic 1µF
Ceramic 10µF
Electrolytic 22µF + Ceramic 1µF
Electrolytic 33µF + Ceramic 1µF
+ Ceramic 1µF
Electrolytic 47µF
Ceramic 10µF
+ Ceramic 1µF
Electrolytic 4.7µF
OUT1
OUT2
M
Application Note
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Thermal design The IC must be operated below the maximum junction temperature (Tj) value of 150°C as specified in the operating conditions. The junction temperature Tj is determined by the following equation:
Tj ≈ Ta + θ j-a x Pc [°C] … (1)
Where, Tj: Junction temperature [°C], Ta: Ambient temperature [°C], Pc: Power consumption [W], θ j-a: Junction - ambient thermal resistance [°C/W]
The power consumption PC is determined by the following equation:
Pc [W] ≈ (IOUT
2 x RON) x (VREF / VCC) + IOUT x (VON(H) + VF(H)) x (1 - VREF / VCC) + VCC x ICC … (2)
Where, IOUT: Motor current [A], RON: Output on-resistance [Ω], VREF: VREF voltage [V], VCC: Supply voltage [V], VON(H): High side output on voltage [V], VF(H): High side output body diode voltage [V], ICC: Supply current [A] (Refer to the technical note about output on-voltage, body diode voltage and supply current.)
For pulse output, transient thermal resistance is used to calculate junction temperature:
Tj ≈ Ta + r(tw) x θ j-a x Pc [°C] … (3)
Where, tw: Pulse on-time [s], r(tw): Transient thermal resistance normalized by t = tw
If a single pulse is used, calculate the power dissipation by equation (3) above, using the corresponding transient thermal resistance taken from the graph on the next page. If a repeating pulse is used, calculate the normalized transient thermal resistance r’(t) using the following equation, then substitute for r(tw) in formula (3).
r’(t) ≈ θ j-a x D + (1 - D) x θ T+tw - θ T + θ tw / θ j-a [°C/W] … (4)
Where, tw: Power input time [s], T: Pulse period [s], D: Duty cycle (D=tw/T) θ T+tw, θ T, θ tw: Thermal resistance of the pulse width (T+tw), (T), (tw)
If the waveform is not rectangular in shape, its area can be approximated via the following simple waveforms:
a) Approximation of triangle wave b) Approximation of sine wave Approximate via a rectangular wave of Approximate via a rectangular wave of 0.71 x width, 0.7 x peak level. 0.91 x width, 0.7 x peak level.
Fig.12 Approximation of triangle wave Fig.13 Approximation of sine wave c) Complex wave 1 d) Complex wave 2
Approximate to a rectangular wave of Approximate to multiple rectangular blocks of similar area. similar area.
Fig.14 Complex wave 1 Fig.15 Complex wave 2
tw T
0.71 x t
t
Ppk
0.7 x Ppk
0.91 x t
t
Ppk
0.7 x Ppk
t
P
S = P x t
S
t1
P2
S P1
P3
t3 t2
Application Note
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Thermal derating curve and transient thermal resistance (reference data)
Table 1 Thermal resistance
Package θ j-a [°C/W]
SOP8 182
HSOP25 86.2
HSOP-M28 56.8
HRP7 89.3
Mounted on a 70mmx70mmx1.6mm FR4 glass-epoxy board with less than 3% copper foil.
0
20
40
60
80
100
0.001 0.01 0.1 1 10 100 1000
Meas. time [sec]
θja
[°C
/W]
ROHM standard PCB(70mm×70mm×1.6mm)
0
20
40
60
80
100
120
140
160
180
200
0.001 0.01 0.1 1 10 100 1000
Meas. time [sec]
θja
[°C
/W]
ROHM standard PCB
(70mm×70mm×1.6mm)
0
20
40
60
80
100
0.001 0.01 0.1 1 10 100 1000
Meas. time [sec]
θja
[°C
/W]
ROHM standard PCB(70mm×70mm×1.6mm)
0
10
20
30
40
50
0.001 0.01 0.1 1 10 100 1000
Meas. time [sec]
θja
[°C
/W]
ROHM standard PCB(70mm×70mm×1.6mm)
0.0
1.0
2.0
3.0
0 25 50 75 100 125 150
AMBIENT TEMPERATURE [°C]
Pd
[W
]
i)0.85W
ii)1.45W
ii) Mounted on ROHM standard PCB
(70mm x 70mm x 1.6mm FR4 glass-epoxy board)
i) Package only
0.0
1.0
2.0
3.0
0 25 50 75 100 125 150
AMBIENT TEMPERATURE [°C]
Pd
[W
]
i)1.80W
ii)2.20W
ii) Mounted on ROHM standard PCB
(70mm x 70mm x 1.6mm FR4 glass-epoxy board)
i) Package only
0.0
0.5
1.0
1.5
0 25 50 75 100 125 150
AMBIENT TEMPERATURE [°C]
Pd
[W
]
i) 0.562W
ii) 0.687W
ii) Mounted on ROHM standard PCB
(70mm x 70mm x 1.6mm FR4 glass-epoxy board)
i) Package only
0.0
2.0
4.0
6.0
8.0
10.0
0 25 50 75 100 125 150
AMBIENT TEMPERATURE [°C]
Pd
[W
]
iv ) 4 layers PCB(copper foil: 70mm x 70mm)
iii) 2 layers PCB (copper foil: 70mm x 70mm)
ii) 2 layers PCB (copper foil: 15mm x 15mm)
i) 1 layer PCB (copper foil: 10.5mm x 10.5mm)
i)1.4W
ii)2.3W
iii)5.5W
iv)7.3WMounted on ROHM standard PCB
(70mm x 70mm x 1.6mm FR4 glass-epoxy board)
Fig.16 Derating curve (SOP8) Fig.17 Derating curve (HSOP25) Fig.18 Derating curve (HSOP-M28)
Fig.19 Derating curve (HRP7)
Fig.20 Transient thermal resistance Fig.21 Transient thermal resistance Fig.22 Transient thermal resistance (SOP8) (HSOP25) (HSOP-M28)
Fig.23 Transient thermal resistance (HRP7)
data only; values are not guaranteed.
Transient thermal resistance is measured
Application Note
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ASO curve (reference data)
Note: ASO curve is measured data only, values are not guaranteed.
Fig.24 ASO curve (Ta=25°C) Fig.25 ASO curve (Ta=25°C) Fig.26 ASO curve (Ta=25°C) (7V/0.5A class) (7V/1A class) (7V/2A class)
Fig.27 ASO curve (Ta=25°C) Fig.28 ASO curve (Ta=25°C) Fig.29 ASO curve (Ta=25°C) (18V/0.5A class) (18V/1A class) (18V/2A class)
Fig.30 ASO curve (Ta=25°C) Fig.31 ASO curve (Ta=25°C) Fig.32 ASO curve (Ta=25°C) (36V/0.5A class) (36V/1A class) (36V/2A class)
0.1
1
10
1 10 100
VDS [V]
I DS [
A]
TON100ms
0.5
180.1
1
10
1 10 100
VDS [V]
I DS [
A]
TON10ms
TON=100ms
180.1
1
10
1 10 100
VDS [V]
I DS [
A]
TON10ms
TON=100ms
2
18
0.1
1
10
1 10 100
VDS [V]
I DS [
A] TON10ms
TON=100m
0.5
360.1
1
10
1 10 100
VDS [V]
I DS [
A]
TON1msTON=10ms
36
TON=100ms
0.1
1
10
1 10 100
VDS [V]
I DS [
A]
TON1msTON=10msTON=100ms
2
36
0.1
1
10
1 10 100
VDS [V]
I DS [
A] TON100ms
0.5
70.1
1
10
1 10 100
VDS [V]
I DS [
A]
TON10ms
TON=100ms
2
70.1
1
10
1 10 100
VDS [V]
I DS [
A]
TON100ms
7
Application Note
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Application examples
1) Regulated power supply application
VREF set via resistive voltage divider
The voltage across the motor equals VCC x R2/(R1+R2) during operation.
Fig.33 Application example 1
2) Unstable power supply or battery-driven application
VREF set via zener diode
Voltage across the motor equals the zener diode forward voltage during operation.
Fig.34 Application example 2
3) Reversible, variable-torque application
VREF controlled via switched zener diodes
VREF synchronizes with two different zener voltages, switched on or off by FIN or RIN signals. This application is useful when using lead-angle motors, or in applications where the load is different for forward and reverse directions.
Fig.35 Application example 3
3
2
7 1
4
5
CTRL
PROTECT
FIN
RIN
VCC
VCC
OUT1 OUT2
8 GND
6 VREF
DUTY
R1
R2
M
3
2
7 1
4
5
CTRL
PROTECT
FIN
RIN
VCC
VCC
OUT1 OUT2
8 GND
6 VREF
DUTY
R
ZD
M
3
2
7 1
4
5
CTRL
PROTECT
FIN
RIN
VCC
VCC
OUT1 OUT2
8 GND
6 VREF
DUTY
R
ZD1
M
ZD2
Application Note
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Application examples - continued
4) Application to avoid current rush on startup
VREF controlled by RC time constant on feedback loop (soft-start)
Note, however, that motor torque on startup can be decreased if the RC time constant is too long.
Fig.36 Application example 4
5) Motor temperature-speed control
VREF set by thermistor
Useful in applications where motor speed needs to follow changes in temperature, or to protect the motor from overheating.
Fig.37 Application example 5
6) Direct PWM drive
Input PWM signal directly to control pins
Connect VREF to VCC. Control pins can accept PWM signals From 20kHz to 100kHz. This example allows for forward rotation. For reverse rotation, the input signals (PWM, L) should be switched.
Fig.38 Application example 6
3
2
7 1
4
5
CTRL
PROTECT
FIN
RIN
VCC
VCC
OUT1 OUT2
8 GND
6 VREF
DUTY
M
3
2
7 1
4
5
CTRL
PROTECT
FIN
RIN
VCC
VCC
OUT1 OUT2
8 GND
6 VREF
DUTY
TH
M
R
3
2
7 1
4
5
CTRL
PROTECT
FIN
RIN
VCC
VCC
OUT1 OUT2
8 GND
6 VREF
DUTY
M
PWM
L
Application Note
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Evaluation board - 1ch / SOP8 package type 1 channel type, SOP8 package, common evaluation board Board size: 55mm x 55mm x 1.6mm ( 2 layers ), Material: FR4, Copper foil thickness: 35µm
Fig.39 Silk screen / Copper foil pattern (front)
Fig.40 Silk screen / Copper foil pattern (rear)
Fig.41 Evaluation board schematic
M
C2
C0
C1
RM
CC1
SW VRR1
RR2
CR
SW FSW R
RRC
RFC
FIN
4
GN D 8OU T11
OU T27
RIN
5
VCC
3
VM
2
VR EF 6U1
RM2
CM1
C2
C0
C1
OUT2
OUT1
VM
RM
VCC
VREF
SW VRR1
SW F
SW RRIN F IN
GND
GN DGN D
GND
OUT2
OUT1
OUT2
OUT1
GND
GNDGND1
GND2
GND
VCC
VCC
VCC VCC
VCC
VCC
VCC
RRC
RINGN D
GND
FINGN D
GN D
GND
Application Note
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Evaluation board - 1ch / HRP7 package type 1 channel type, HRP7 package, common evaluation board Board size: 55mm x 55mm x 1.6mm ( 2 layers ), Material: FR4, Copper foil thickness: 35µm
Fig.42 Silk screen / Copper foil pattern (front)
Fig.43 Silk screen / Copper foil pattern (rear)
Fig.44 Evaluation board schematic
C2
C1
CO
SW R
RRC
SW F
RFC
RR2
CR
RR1
SW V
CC1
CC2
FIN
3
GND
4
OU T12
OU T26
RIN
5
VCC
7
VR EF 1
U1
RRG RFG
GN D
GN D
GN D
VC C VCC
GN D G ND
GN D
GN D
GND1
GN D
VR EF
VC C
VC C
VR EF
OU T2
OU T1
OU T2
OU T1
RIN F IN
RIN F IN
GN D G ND
OU T2
OU T1
GN D G ND
VC C
GN DVC C
HRP 7_SMT
GND1
GN D
GN D GN D
Application Note
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Evaluation board - 1ch / HSOP25 package type 1 channel type, HSOP25 package, common evaluation board Board size: 55mm x 55mm x 1.6mm ( 2 layers ), Material: FR4, Copper foil thickness: 35µm
Fig.45 Silk screen / Copper foil pattern (front)
Fig.46 Silk screen / Copper foil pattern (rear)
Fig.47 Evaluation board schematic
VC CVC C
VC C
VC CVC C
C1
C2
CO
RM
CM1
CC1
RR1 SW V
RR2
CR
RN
SW F
RFC
SW R
RRC
OU T11
VM
22
VCC
21
FIN
20
RIN
19
VR EF17
OU T212
GN D6
RNF7
OU T213
OU T12
VM
23
GN DGN D
RNF8
U1
RM 2
CM2
CC2
GN D
GN D
GN D
GN D
GN D
GN D
GN DGN D
GN D
GN D
M
GN D
GN D
OU T2
OU T1
OU T2OU T2
VC C
VM
VCC
GN D1
GN D2
VC C
VR EF
FIN
FIN
GN D
RIN
RIN
GN D
OU T1OU T1
Application Note
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Evaluation board - 2ch / HSOP25 package type 2 channels type, HSOP25 package, common evaluation board Board size: 110mm x 55mm x 1.6mm ( 2 layers ), Material: FR4, Copper foil thickness: 35µm
Fig.48 Silk screen / Copper foil pattern (front)
Fig.49 Silk screen / Copper foil pattern (rear)
Fig.50 Evaluation board schematic
VC C VC C
VC C
VC C
VC C
VC CVC CVC CVC C
OU T2B19
GND
20
VMB
13
FINB
23
FINA
11
OU T2A6
OU T1A1
OU T1B14
VMA
25
VR EFA 9
VR EFB 21
GND
8
VCC
12
VCC
24
RNF B 16
RNF A 3
RINB
22
RINA
10
FINFIN
NC
7
U1
C0A
C1A
C2A
C0B
C1B
C2B
RM A
RM 2A
CMA RM B
RM 2B
CMB
CC1
CC2
RR2B
CRB
RR1 B SW VB
RR2A
CRA
RR1 A SW VA
RNB
RNA
SW FB
RFCB
RFGB
SW FA
RFCA
RFGA
SW RB
RRCB
RRGB
SW RA
RRCA
RRGA
BD62X6_SMT
OU T2A
OU T1A
OU T2B
OU T1B
GN D
GND3
GN D
GND1
GND2
VC C
VM A V MB
VR EFB
VC C
VR EFA
FINB
GN D
FINB
FINA
GN D
FINA
RINB
GN D
RINB
RINA
GN D
RINA
OU T2A
OU T1A
OU T2B
OU T1B
OU T2A
OU T1A
OU T2B
OU T1B
GN D
Application Note
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Evaluation board - 2ch / HSOP-M28 package type 2 channels type, HSOP-M28 package, common evaluation board Board size: 110mm x 55mm x 1.6mm ( 2 layers ), Material: FR4, Copper foil thickness: 35µm
Fig.51 Silk screen / Copper foil pattern (front)
Fig.52 Silk screen / Copper foil pattern (rear)
Fig.53 Evaluation board schematic
VCC VCC
VCC
VCC
VCC
VCCVCCVCCVCC
C0A
C1A
C2A
C0B
C1B
C2B
RMA
RM2A
RMB
RM2B
CC
1
CC
2
RR
2B
CR
B
RR1B SWVB
RR
2A
CR
A
RR1A SWVA
RNB
RNA
SWFB
RF
CB
RF
GB
SWFA
RF
CA
RF
GA
SWRB
RR
CB
RR
GB
SWRA
RR
CA
RR
GA
OUT2B20
GN
D8
VM
13
FIN
B25
FIN
A11
OUT2A6
OUT1A1
OUT1B16
VM
27
VREFA 9
VREFB 23
GN
D22
VC
C12
VC
C26
RNFB 17
RNFA 3
RIN
B24
RIN
A10
FIN
FIN
NC
19
OUT2A7
OUT1A2
OUT2B21
OUT1B15
VM
28
NC
5
VM
14
RNFB 18
RNFA 4
U1
OUT2A
OUT1A
OUT2B
OUT1B
GND
GND3
GND
GND1
GND2
RMVCC
RM2
CM
RM
RM2
VM
CM
VREFB
VCC
VREFA
FINB
GND
FINB
FINA
GND
FINA
RINB
GND
RINB
RINA
GND
RINA
OUT2A
OUT1A
OUT2B
OUT1B
OUT2A
OUT1A
OUT2B
OUT1B
GND
BD62XXFM_SMT
Application Note
15/16
BD621Series,BD622Series,BD623Series
www.rohm.com 2011.03 - Rev.D© 2011 ROHM Co., Ltd. All rights reserved.
Ordering part number
B D 6 2 1 0 F - E 2
Part No. Type
62XX
1X: 7V max.
2X: 18V max.
3X: 36V max.
X0: 1ch/0.5A X5: 2ch/0.5A
X1: 1ch/1A X6: 2ch/1A X2: 1ch/2A
Package
F: SOP8
FP: HSOP25
FM: HSOP-M28
HFP: HRP7
Packaging and forming specification
E2: Embossed tape and reel
(SOP8/HSOP25/HSOP-M28)
TR: Embossed tape and reel
(HRP7)
∗ Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction of feed The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
( )
Direction of feed
Reel1pin
(Unit : mm)
SOP8
0.9±
0.15
0.3M
IN
4°+6°−4°
0.17 +0.1-0.05
0.595
6
43
8
2
5
1
7
5.0±0.2
6.2±
0.3
4.4±
0.2
(MAX 5.35 include BURR)
1.27
0.11
0.42±0.1
1.5±
0.1
S
0.1 S
(Unit : mm)
HSOP25
7.8
± 0.
3
5.4
± 0.
2
2.75 ± 0.1
1.95 ± 0.1
25 14
1 13
0.111.
9 ±
0.1
0.36 ± 0.1
12.0 ± 0.2
0.3M
in.
0.25 ± 0.1
13.6 ± 0.2
0.8
(MAX 13.95 include BURR)
S
0.1 S
∗ Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction of feed
The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand
2000pcs
E2
( )
Direction of feed
Reel1pin
Application Note
16/16
BD621Series,BD622Series,BD623Series
www.rohm.com 2011.03 - Rev.D© 2011 ROHM Co., Ltd. All rights reserved.
∗ Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction of feed
The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand
1500pcs
E2
( )
Direction of feed
Reel1pin
(Unit : mm)
HSOP-M28
(MAX 18.85 include BURR)
0.8
7.5
±0.2
15
5.15±0.1
0.11
1.25
2.2
±0.1
1
18.5±0.2
0.5
±0.2
0.37±0.1
9.9
±0.3
4°+6°−4°
28
1.2
±0.1
5
14
0.27 +0.1−0.05
S
0.1 S
Direction of feed
1pin
Reel ∗ Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction of feed
The direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand
2000pcs
TR
( )
(Unit : mm)
HRP7
S0.08
0.73±0.11.27
0.8875
1.905±0.1
0.83
5±0.
2
1.52
3±0.
1510
.54±
0.13
0.08
±0.0
5
(MAX 9.745 include BURR)9.395±0.125
S
1.01
7±0.
28.
0±0.
13
0.27+0.1-0.05
4.5°+5.5°−4.5°
8.82±0.1(6.5)
7654321
(7.4
9)
R1120Awww.rohm.com© 2011 ROHM Co., Ltd. All rights reserved.
Notice
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N o t e s
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