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LTE Chipsets for the Internet of Things 4 TH GSMA GLOBAL MOBILE IOT SUMMIT June 27, 2017 Copyright © 2017 Sequans Communications

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Page 1: GSMA GLOBAL MOBILE IOT SUMMIT...•In mass-production since 2016 with modules as small as 122mm2 •Certified by Verizon, December 2016; in progress with many others •>12 publicly

LTE Chipsets for the Internet of Things

4TH GSMA GLOBAL MOBILE IOT SUMMITJune 27, 2017

Copyright © 2017 Sequans Communications

Page 2: GSMA GLOBAL MOBILE IOT SUMMIT...•In mass-production since 2016 with modules as small as 122mm2 •Certified by Verizon, December 2016; in progress with many others •>12 publicly

Copyright © 2017 Sequans Communications

IoT Success Depends on Innovation and Fast Time to Market

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Page 3: GSMA GLOBAL MOBILE IOT SUMMIT...•In mass-production since 2016 with modules as small as 122mm2 •Certified by Verizon, December 2016; in progress with many others •>12 publicly

3Copyright © 2017 Sequans Communications

Sequans 100% focused on single-mode LTE for IoT

Leader in single-mode LTE modules and operator certification

Delivered optimized <$10 module

1. IoT SoC2. Cost optimization

Single SKU enables one moduleFor worldwide deployment

Introduced LTE for IoT

2nd Gen IoTchipset

1st Gen IoT chipset3rd Gen LTE chipset

4th Gen IoTchipset

3rd Gen IoTchip

Sequans: IoT Leadership

Launched Monarch LTE for IoT Chip Future Innovation

Future Time Reduction1. Test, certification2. Integrated platform

Page 4: GSMA GLOBAL MOBILE IOT SUMMIT...•In mass-production since 2016 with modules as small as 122mm2 •Certified by Verizon, December 2016; in progress with many others •>12 publicly

4Copyright © 2017 Sequans Communications

• The world’s most advanced single-chip LTE-M/NB-IoT solution

• In mass-production since 2016 with modules as small as 122mm2

• Certified by Verizon, December 2016; in progress with many others

• >12 publicly announced customers, including Gemalto, Huawei, Fibocom

• Monarch-based end equipment can be purchased today

Innovation: Key Partnerships Optimize Technology & Costs

• Advanced technology process

• Low power process collaboration

• Monarch consumes <1μA in PSM mode

• Advanced FEM design to enable WW SKU

• Monarch + Skyworks FEM allows the same HW to be used WW with no HW changes

• Cost doesn’t increase with more bands

• Inventory management, smallest size

Page 5: GSMA GLOBAL MOBILE IOT SUMMIT...•In mass-production since 2016 with modules as small as 122mm2 •Certified by Verizon, December 2016; in progress with many others •>12 publicly

5Copyright © 2017 Sequans Communications

HW, SDK

Support

HW, SW

Support

HW HW

SW & Support

Modules drawn to proportional scale

Form/Fit/Function

P2p & SW comp.

• FPGA & chip level testing• Focus on acceleration of cert• joint labs, knowledge sharing

• Seed module open to partners; lower dev costs, fast TTM• Expand form-factors; support certifications

• Platforms enable full application for fast TTM, and lower costs

• Pre-integrated with connectivity, sensors for diverse applications

Time: Key Partnerships Lower Entry Barriers, Accelerate Ecosystem

PRE-CERT

DEPLOYMENT

• Cert of chipset and seed module for early ramp customers

• Certification supported by Sequans

CERTIFICATION DEVELOPMENT

Page 6: GSMA GLOBAL MOBILE IOT SUMMIT...•In mass-production since 2016 with modules as small as 122mm2 •Certified by Verizon, December 2016; in progress with many others •>12 publicly

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Delivers Innovation and Time Savings for Faster Time to Revenue for Mobile IoT

Thank You!

Copyright © 2017 Sequans Communications

Page 7: GSMA GLOBAL MOBILE IOT SUMMIT...•In mass-production since 2016 with modules as small as 122mm2 •Certified by Verizon, December 2016; in progress with many others •>12 publicly