goodix’s ultra-thin optical under-display fingerprint · overview / introduction 4 oexecutive...

©2020 by System Plus Consulting | SP20552 Goodix’s Ultra-Thin Optical In-Display Fingerprint | Sample 1Report Ref.: SP20552

22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Goodix’s Ultra-Thin Optical Under-Display FingerprintLatest generation of sensors using micro-opticsSP20552 - Imaging report by Stéphane ELISABETH

Lab. analysis done by Nicolas RADUFEApril 2020 – Sample

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

http://www.systemplus.fr/



Table of Contents

Overview / Introduction 4

o Executive Summary

o Reverse Costing Methodology

Company Profile 8

o Goodix

o Supply Chain

o OnePlus 7T Pro 5G McLaren Teardown

o Oppo Reno 3 Pro 5G Teardown

Physical Analysis 16

o Summary of the Physical Analysis 17

o Module Assembly 19

Module Views

Module Overview: Screen Assembly, CIS

Module Cross-Section: PCB, Adhesives

o Sensor Die 30

Sensor Die Views & Dimensions

Sensor Die Overview

Sensor Delayering & Main Block IDs

Sensor Die Process

Sensor Die Cross-Section: Filter, Micro Lens, Collimator

Sensor Die Process Characteristics

Goodix’s Under-Display vs. Ultra-Thin In-Display Fingerprint 63

Physical Comparison: Device Structure, CIS

Physical Comparison: Wafer Level Optics vs. Lens System

Physical Comparison: Optical vs. Ultrasonic

Sensor Manufacturing Process 69

o Global Overview

o Sensor Die Front-End Process & Fabrication Unit

o Optical Back-End Process

o Optical Back-End Process Flow & Fabrication Unit

o Packaging Process & Fabrication Unit

Cost Analysis 80

o Summary of the Cost Analysis 81

o Yields Explanation & Hypotheses 83

o Sensor Die 85

Sensor Die Front-End Cost

Optical Back-End Cost

Optical Back-End Cost per process steps

Sensor Die Probe Test, Thinning & Dicing

Sensor Die Wafer & Die Cost

o Complete Module 91

Packaging Cost

Packaging Cost per process steps

Back-End: Final Test

Module Component Cost

Goodix’s Under-Display vs. Ultra-Thin In-Display Fingerprint 98

Process Comparison: Assembly, CIS

Cost Comparison: Under vs. In-Display

Cost Comparison: Optical vs. Ultrasonic

Selling Price 103

Feedbacks 102

SystemPlus Consulting Services 109




Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Cost Comparison

Selling Price Analysis

Feedbacks

Related Reports

About System Plus

Executive Summary

• This full reverse costing study has been conducted to provide insights on technology data, manufacturing cost and sellingprice of the Goodix Latest Generation of Under-Display Fingerprint.

• With more than 120 designs in several flagships on the market, Goodix this year offers a new version of the fingerprintsensor. It’s called the ultra-thin in-display optical fingerprint sensor, and it uses a micro lens design instead of optical lenses.The sensor is located on the front of the device, directly under the glass display and the organic light emitting diode (OLED)material.

• This report focusses on analyzing the optical sensor and its integration under the display. The sensor is manufactured from aFront-Side Illumination CMOS Image Sensor (FSI-CIS), with an on-chip Near InfraRed (NIR) filter, collimator and Micro LensArray (MLA). The component also includes features to provide a small gap between the CIS and the OLED material.

• Since the last version of the device, Goodix made several changes at the optical level but also at the integrated circuit (IC)level. Indeed, the sensor doesn’t require any additional circuits besides the sensor IC. Power management and signalprocessing rely on the main board chipset.

• This complete analysis of the optical fingerprint module includes analyses of the sensor die and the optical part, along withcost analysis and price estimation for the module. It also includes a physical and technical comparison with the previousgeneration of the sensor from Goodix. Finally, a cost comparison is included with Goodix’s previous fingerprint sensor with anoptical lens.




Overview / Introduction

Company Profile & Supply Chain o Goodixo Supply Chaino Smartphone Teardown

Physical Analysis

Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks

Related Reports

About System Plus

OnePlus 7T Pro 5G McLaren Teardown

OnePlus 7T Pro 5G McLaren Teardown – Front, Side and Rear View©2020 by System Plus Consulting

• Dimensions:162.6 x 75.6 x 8.8 mm

In-Display Fingerprint

Tri-Camera Module





Company Profile & Supply Chain o Goodixo Supply Chaino Smartphone Teardown

Physical Analysis

Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks

Related Reports

About System Plus

OnePlus 7T Pro 5G McLaren vs. Oppo Reno 3 Pro 5G Teardown






Physical Analysis o Synthesiso Module Assembly

o Views & Dimensionso Overviewo Cross-Section

o Sensor Dieo Views & Dimensionso Overviewo Delayeringo Die Processo Die Cross-sectiono Process Characteristics

Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks

Related Reports

About System Plus

Summary of the Physical Analysis









Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks

Related Reports

About System Plus

Module Cross-Section









Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks

Related Reports

About System Plus

Die Overview









Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks

Related Reports

About System Plus

Die Cross-Section






Physical Analysis

Physical Comparisono Under-Display vs. In-Displayo Optical vs. Ultrasonic


Cost Analysis

Cost Comparison


Feedbacks

Related Reports

About System Plus

Fingerprint Goodix 2020 vs. Goodix 2019






Physical Analysis

Physical Comparisono Under-Display vs. In-Displayo Optical vs. Ultrasonic


Cost Analysis

Cost Comparison


Feedbacks

Related Reports

About System Plus

Fingerprint Goodix 2020 vs. Qualcomm Ultrasonic Sensor






Physical Analysis

Physical Comparison

Manufacturing Process Flowo Sensor Die Front-End Processo Sensor Fabrication Unito Optical Back-End Processo Optical Fabrication Unito Packaging Processo Final Test & Assembly Unit

Cost Analysis

Cost Comparison


Feedbacks

Related Reports

About System Plus

Optical Back-End Process

Sensor Module Cross-Section – Schematic©2020 by System Plus Consulting






Physical Analysis

Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks

Related Reports

About System Plus

Optical Back-End Process Flow (1/3)






Physical Analysis

Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks

Related Reports

About System Plus

Packaging Process

Sensor Module Cross-Section – Schematic©2020 by System Plus Consulting






Physical Analysis

Physical Comparison


Cost Analysiso Cost Analysis Summaryo Yields Explanation &

Hypotheseso Wafer FE & BE Costo Die Costo Packaging Costo Component Cost

Cost Comparison


Feedbacks

Related Reports

About System Plus

Collimator, Color Filter & Microlenses Back-End Cost






Physical Analysis

Physical Comparison




Cost Comparison


Feedbacks

Related Reports

About System Plus

CIS Wafer & Die Cost






Physical Analysis

Physical Comparison




Cost Comparison


Feedbacks

Related Reports

About System Plus

Component Cost






Physical Analysis

Physical Comparison


Cost Analysis

Cost Comparisono Under-Display vs. In-Display


Feedbacks

Related Reports

About System Plus

Fingerprint Goodix 2020 vs. Goodix 2019






Physical Analysis

Physical Comparison


Cost Analysis

Cost Comparison

Selling Price Analysiso Definition of Priceso Manufacturer Financialso Complete Module Price

Feedbacks

Related Reports

About System Plus

Complete System Price






Physical Analysis

Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks

Related Reports

About System Plus

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

Related Reports

MARKET & TECHNOLOGY REPORTS & MONITORS - YOLE DÉVELOPPEMENT

MEMS, Sensors & Actuators• Status of the MEMS Industry 2019• Consumer Biometrics: Market and Technologies Trends 2018• CMOS Image Sensor Quarterly Market Monitor

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

Imaging• Goodix Under-Display Optical Fingerprint• Qualcomm 3D Sonic Sensor Fingerprint• Synaptics’ Under-Display Fingerprint Scanner Inside the

VIVO X21 UD Smartphone



https://www.i-micronews.com/products/consumer-biometrics-market-and-technologies-trends-2018/


https://www.i-micronews.com/products/status-of-the-mems-industry-2019/


https://www.i-micronews.com/products/cmos-image-sensor-service-camera-module-research/

https://www.systemplus.fr/reverse-costing-reports/goodix-under-display-optical-fingerprint/

https://www.systemplus.fr/reverse-costing-reports/qualcomm-3d-sonic-sensor-fingerprint/

https://www.systemplus.fr/reverse-costing-reports/synaptics-under-display-fingerprint-scanner-inside-the-vivo-x21-ud-smartphone/










COMPANYSERVICES




Physical Analysis

Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks

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About System Pluso Company serviceso Contacto Legal

Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>60 reports per year)

Costing Tools

Trainings






Physical Analysis

Physical Comparison


Cost Analysis

Cost Comparison


Feedbacks

Related Reports

About System Pluso Company serviceso Contacto Legal

Contact

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goodix’s ultra-thin optical under-display fingerprint · overview / introduction 4 oexecutive...

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