getting started with the steval-stlkt01v1 sensortile ... · user manual um2101 - rev 5 - march 2019...
TRANSCRIPT
IntroductionThe STEVAL-STLKT01V1 development kit for the STEVAL-STLCS01V1 SensorTile board is a highly integrated developmentplatform with a broad range of functions aimed at improving system design cycles and accelerating the delivery of results.
The tiny SensorTile core system board (13.5 x 13.5 mm) embeds high-accuracy and very-low-power inertial sensors, abarometric pressure sensor and a digital MEMS top-port microphone. The onboard 80-MHz MCU features a dedicatedhardware microphone interface and ultra-low-power support. The wireless network processor provides Bluetooth Smartconnectivity and the integrated balun maximizes RF performance for minimum size and design effort.
The kit includes a cradle expansion board for software and system architecture design support and a compact cradle hostfeaturing a battery charger and SD card interface for on-field testing and data acquisition; both boards come complete with SWDprogramming interfaces.
It contains FCC ID: S9NSTILE01 and module IC 8976C-STILE01 certified with PMN: STEVAL-STLKT01V1; HVIN: STEVAL-STLCS01V1; HMN: STEVAL-STLCX01V1; FVIN: bluenrg_7_1_e_Mode_2-32MHz-XO32K_4M.img.
Figure 1. SensorTile functional block diagram
The FP-SNS-ALLMEMS1 firmware provides a complete framework to build wearable applications. The STBLESensorapplication based on the BlueST-SDK protocol allows data streaming and a serial console over BLE controls the configurationparameters for the connected boards.
It is recommended to upgrade the SensorTile firmware to the latest available version on www.st.com.
Getting started with the STEVAL-STLKT01V1 SensorTile integrated development platform
UM2101
User manual
UM2101 - Rev 5 - March 2019For further information contact your local STMicroelectronics sales office.
www.st.com
1 Getting started
1.1 OverviewThe STEVAL-STLKT01V1 development kit includes everything you need to remotely sense and measure motion,environmental and acoustic parameters. It is designed to support the prototyping phases of new projects and canbe used in the contexts below.An evaluation system• Evaluate high accuracy and very low power ST sensors in an optimized system architecture• Field-test data fusion and embedded signal processing algorithms• Deploy data collection campaigns to support custom algorithm development
Reference design• Compact solution for high-accuracy, low-power motion, environmental and audio sensor data in compact
form-factor designs• Complete hardware and software examples form the starting point for new designs with:
– hardware: schematics, Gerber, BoM, 3D CAD– software: from basic examples (STSW-STLKT01) to complete function packs (FP-SNS-ALLMEMS1,
FP-AUD-BVLINK1)
Embedded software development kit• Source code project examples based on the STM32Cube architecture• Fully compatible with the Open.Software embedded processing libraries, and supported by the STM32 ODE• Host board implements the Arduino UNO R3 expansion connector to enable bridging to well-known
development ecosystems such as STM32 ODE and Arduino
Fast prototyping tool• Plug or solder onto your prototype motherboard to instantly add its embedded sensing and communication
functions to your design• Use the 3D CAD files to integrate the SensorTile in your mechanical design
1.2 Package componentsInside the STEVAL-STLKT01V1 package, you will find all the components needed to experience the demo on thisoptimized platform and to start developing you application
UM2101Getting started
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Figure 2. SensorTile kit blister
1.3 Initial setup with pre-loaded demoThe easiest thing to do after unpacking is to run the preloaded software using the SensorTile board together withthe cradle expansion (STLCX01V1).
Step 1. Take the SensorTile and plug it on the cradle expansion through the dedicated connector. Take care tomatch the orientation shown below.
Figure 3. Orientation of SensorTile and cradle expansion connectors
UM2101Initial setup with pre-loaded demo
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Figure 4. SensorTile mounted on cradle expansion
Step 2. Connect a USB type A to mini-B USB cable to turn ON the board for the first time, verify that the J2jumper is in position 2-3 (power supply from USB). If everything works fine then you’ll see theSensorTile LED blinking approximately every 2 seconds.
Step 3. The board is now ready to connect to the STBLESensor app: available on official stores for Android oriOS.
Note: To exploit the newest features, upgrade the default firmware version to the new version of the FP-SNS-ALLMEMS1 function pack.
1.4 System requirementsAs the STEVAL-STLKT01V1 is already programmed with FP-SNS-ALLMEMS1 firmware, to run the demo, youonly need:• a smartphone or tablet with minimum Android™ 4.4 or iOS™ 8.0 operating systems and minimum BLE
technology 4.0• a USB type A to mini-B USB cable for power supply (connected to a PC, AC adapter or any other source)
To start designing your own project, you will need:• a Windows™ PC (ver. 7 or higher) with an IAR, KEIL or AC6 firmware development environment• a USB type A to Micro USB male cable to connect the STEVAL-STLKT01V1 to the PC for power supply• an STM32 Nucleo board with ST-LINK V2.1 in-circuit debugger/programmer (preferred) or other compatible
device• the ST-LINK Utility for firmware download (latest embedded software version on www.st.com)
UM2101System requirements
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2 STEVAL-STLCS01V1 hardware description
The STEVAL-STLCS01V1 (SensorTile) is a highly integrated reference design that can be plugged into form-factor prototypes, adding sensing and connectivity capabilities to new designs through a smart hub solution. It canalso easily support development of monitoring and tracking applications as standalone sensor nodes connectedto iOS™/Android™ smartphone applications.The SensorTile occupies a very small 13.5x13.5 mm square outline, with all the electronic components on the topside and small connector on the bottom side to plug it onto the cradle expansion board. The connector pinout isrepeated on 18 PCB pads that render the SensorTile a solderable system on module as well.The figure below and following two tables provide the main board component and pinout details.
Figure 5. STEVAL-STLCS01V1 main components and pinout
Table 1. STEVAL-STLCS01V1 main components
Reference Device Description
A MP34DT05-A MEMS audio sensor digital microphone
B LD39115J18R 150 mA low quiescent current low noise LDO 1.8 V
C STM32L476 MCU ARM Cortex-M4 32-bit microcontroller
D LSM6DSM iNEMO inertial module: low-power 3D accelerometer and 3D gyroscope
E LSM303AGR Ultra-compact high-performance eCompass module: ultra-low power 3D accelerometer and3D magnetometer
F LPS22HB MEMS nano pressure sensor: 260-1260 hPa absolute digital output barometer
G BlueNRG-MS Bluetooth low energy network processor
H BALF-NRG-02D3 50 Ω balun with integrated harmonic filter
UM2101STEVAL-STLCS01V1 hardware description
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Table 2. STEVAL-STLCS01V1 pinout
Board pin CONN pin Pin name MCU pin Main functions (1)
1 2 MIC_CLK PC2 DFSDM1_CKOUT, ADC
2 4 VDD_OUT VDD/VBAT 1.8V from onboard LDO
3 6 VIN / Power supply for LDO [2 V-5.5 V]
4 8 VDDUSBVDDIO2
VDDUSBPower supply for USB peripheral and VDDIO2 [1.8 V-3.3 V]
5 10 GND VSS Ground
6 12 RXD/USB_DP PD2/PA12 USART5 RX or USB_OTG_FS DP (2)
7 14 TXD/USB_DM PC12/PA11 USART5 TX or USB_OTG_FS DM 1
8 16 SAI_CLK PG9 (3) SAI2_SCK_A, SPI3_SCK
9 15 SAI_FS PG10(3) SAI2_FS_A, SPI3_MISO
10 13 SAI_MCLK PG11(3) SAI2_MCLK_A, SPI3_MOSI
11 11 SAI_SD PG12(3) SAI2_SD_A, SPI3_NSS
12 9 GPIO2 PB8/PB9/PC1 DFSDM_DATIN6, I2C3_SDA
13 7 GPIO3 PC0 DFSDM_DATIN4, I2C3_SCL
14 5 NRST NRST STM32 Reset
15 3 SWD_CLK SWD Programming interface clock
16 1 SWD_IO SWD Programming interface IO
17 / GND Ground
18 / GND Ground
1. Refer to STM32L476 Datasheet on www.st.com for the complete set of functions of each pin2. USB_OTG_FS Peripheral is functional for VDDUSB ≥ 3V3. Logic level of this pins is referred to VDDIO2
2.1 Power supplyThe SensorTile board has the following input supply pins:1. VIN is the input for the onboard voltage regulator generating 1.8 V (150 mA max).2. VDDUSB is an input for the STM32L4 VDDUSB and VDDIO2 pins (to use the STM32L4 USB OTG
peripheral, VDDUSB must be ≥ 3 V)VDD is an output for 1.8 V.If the USB peripheral and other 3.3 V signals are not needed for a particular application, you can connect VDD toVDDUSB so that one power supply can power the whole system. This connection can be done externally (e.g.,SB8 on STLCX01V1) or by soldering a 0 Ω resistor on R2 (bottom layer).
UM2101Power supply
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Figure 6. STEVAL-STLCS01V1 power supply block diagram
Figure 7. STEVAL-STLCS01V1 component placement (top side)
2.2 Differences among the STEVAL-STLCS01V1 generationsThere are two slightly different generations of SensorTile (STEVAL-STLCS01V1).To distinguish among the two, you need to observe the Balun package (U4):• if the package is black (opaque), it is "First generation"
UM2101Differences among the STEVAL-STLCS01V1 generations
UM2101 - Rev 5 page 7/36
Figure 8. SensorTile first generation
• if the package is transparent, it is "Second generation"
Figure 9. SensorTile second generation
The difference among the two generations is in the part numbers used for U4 and U11:• First generation: U4 →BALF-NRG-01D3, U11→MP34DT04• Second generation: U4 →BALF-NRG-02D3, U11→ MP34DT05-A
UM2101Differences among the STEVAL-STLCS01V1 generations
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3 STLCX01V1 hardware description
The SensorTile cradle expansion is an easy-to-use companion board for SensorTile and the SensorTile cradleboards included in the SensorTile Kit. The SensorTile board does not need to be soldered onto the cradleexpansion board, but can be plugged onto the dedicated connector (see Figure 3. Orientation of SensorTile andcradle expansion connectors and Figure 4. SensorTile mounted on cradle expansion.Apart from being a standalone host for the SensorTile board, the cradle expansion board can be connected to anSTM32 Nucleo or other expansion board via the Arduino UNO R3 connectors to easily expand functionality.
Figure 10. STLCX01V1 main components
Table 3. STLCX01V1 main components
Reference Device Description
A SensorTile connector and footprint To plug or solder the SensorTile board
B Arduino UNO R3 UNO R3 connector For STM32 Nucleo board compatibility
C ST2378ETTR 8-bit dual supply 1.71 V to 5.5 V level translator
D micro-USB connector, USBLC6-2P6(U1), LDK120M-R (U4)
micro USB power supply /communication port and 3.3 V voltageregulation
E Audio DAC, phono jack 16-Bit, low-power stereo audio DAC and 3.5 mm stereo phono jack
F SWD connector, Reset button 5-pin SWD connector for programming debugging and board resetbutton
3.1 Power supplyThe power is either supplied by the host PC via USB or by an external source through the Arduino UNO R3connector (CN6.5).Jumper J2 selects the power source for the onboard 3.3 V regulator (U4) and the SensorTile VIN pin:
UM2101STLCX01V1 hardware description
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• position 1-2: 5 V external• position 2-3: 5 V via USB (default)
The 3.3 V output of the regulator can be routed to the Arduino UNO R3 connector to power on other externalcomponents by soldering SB18 (default OFF).The VDDUSB pin of the SensorTile can be connected to two different power sources:• 3.3 V – SB9 (default ON)• 1.8 V (SensorTile VDD) – SB8 (default OFF)
3.2 USB deviceThe USB connector on the board can be used to supply power and for communication (USB_OTG_FS).To use the USB peripheral, use the following solder bridge configuration:• SB10, SB11, SB20 and SB21 OFF (disconnect the signals from U5)• SB9 ON (supply 3.3 V to the USB peripheral of the STM32 MCU)
3.3 Audio DACThe PCM1774 is a low-power stereo DAC designed for portable digital audio applications, and can be driven bythe SensorTile to play any kind of Audio stream. A dedicated 3.5 mm audio jack makes it easy to connectheadphones or active loudspeakers.In order to use the onboard audio DAC (U3), the SAI (serial audio interface) and I²C signals must be routed to thecomponent using the following configuration:• SB12, SB13, SB14, SB15, SB16 and SB17 OFF (disconnect the signals from Arduino UNO R3 connector)• SB2, SB3, SB4, SB5, SB6, SB7 ON (connect the signals to the DAC)
3.4 Solder bridge details
Table 4. STLCX01V1 solder bridge details
Solder Bridge SensorTile signal Onboard signal Arduino signal
SB1 Reset CN8.2
SB2 (1) GPIO3 DAC control – I2C SCL (pull-up)
SB3(1) GPIO2 DAC control – I2C SDA (pull-up)
SB4(1) SAI_SD DAC Audio – I2S_SD
SB5(1) SAI_SCK DAC Audio – I2S_SCK
SB6(1) SAI_FS DAC Audio – I2S_WS
SB7(1) SAI_MCLK DAC Audio – I2S_MCLK
SB8 VDDUSB VDD – 1.8V from SensorTile
SB9(1) VDDUSB 3V3 from regulator
SB10 RXD-USB_DP Level Translator - UART_RX CN9.2
SB11 RXD-USB_DP Level Translator - UART_TX CN9.1
SB12 SAI_SD SPI_CS CN5.3
SB13 SAI_MCLK SPI_MOSI CN5.4
SB14 SAI_FS SPI_MISO CN5.5
SB15 SAI_SCK SPI_SCK CN5.6
SB16(1) GPIO3 CN5.10
SB17(1) GPIO2 CN5.9
SB18 MIC_CLK Level Translator - MIC_CLK_3V3 CN9.5
SB19 3V3 – 3V3_Nucleo CN6.2 CN6.3
UM2101USB device
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Solder Bridge SensorTile signal Onboard signal Arduino signal
SB20 TXD-USB_DM Level Translator - UART_RX CN9.2
SB21 TXD-USB_DM Level Translator - UART_TX CN9.1
SB22 GPIO2 Level Translator - GPIO2_3V3 CN9.6
SB23 GPIO3 Level Translator – GPIO3_3V3 CN9.7
1. Closed by default.
Figure 11. STLCX01V1 component placement (top side)
UM2101Solder bridge details
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4 STLCR01V1 hardware description
The SensorTile cradle is a small companion board for SensorTile, geared at the development of form factorprototypes. You need to solder the SensorTile board to this board to render the system robust.The small cradle is ideal for applications requiring small, standalone, battery-powered sensor nodes.
Figure 12. STLCR01V1 cradle main components
Table 5. STLCR01V1 main components
Reference Device Description
A SensorTile footprint To solder the SensorTile board
B HTS221 Capacitive digital sensor for relative humidity and temperature
C STBC08PMR, STC3115, LDK120M-R, USBLC6-2P6
800 mA standalone linear Li-Ion battery charger with thermal regulation,Gas gauge IC, 200 mA low quiescent current very low noise LDO, verylow capacitance ESD protection
D Power on/off switch
E SWD connector 5-pin SWD connector for programming and debugging
F Micro USB connector, 3-pin batteryconnector
Micro USB battery charging supply /communication port and connectorfor Li-Ion battery power supply
G Micro-SD card socket
Solder the SensorTile board onto the cradle board as shown in the figure below.
UM2101STLCR01V1 hardware description
UM2101 - Rev 5 page 12/36
Figure 13. SensorTile soldered onto cradle board
4.1 Power supplyThe main board power supply is the 100 mAh lithium-Ion polymer battery attached to the appropriate connectoron the PCB.
Figure 14. Battery connection and power switch
The battery can be recharged via USB connected to a PC or any micro-USB battery charger.A red LED indicates the charging status:• steady ON: the USB plug is correctly connected and the board is charging• steady OFF: charging complete• blinking: battery not present
UM2101Power supply
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The onboard STBC08 battery charger IC is configured by default with a maximum charging current of 50 mA. It ispossible to modify this current by changing the R5 resistor value.Equation 1: Icℎrg = 1VR5 ∙ 1000 (1)
The default 20 kΩ value for R5 hence gives: 1V20K ∙ 1000 = 50mA (2)
During normal usage, the battery needs to be connected to the board for proper operation. When the battery isplugged, the board is turned ON via the SW1 switch. This switch enables LDK120 3V3 voltage regulator pin,which powers all board components.
4.2 SensorTile and cradle assembly in form factor caseRefer to the following image for the orientation of the soldered SensorTile and cradle boards in the dedicated formfactor case.
Figure 15. SensorTile and cradle in plastic case
UM2101SensorTile and cradle assembly in form factor case
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Figure 16. STEVAL-STLCR01V1 component placement (top side)
UM2101SensorTile and cradle assembly in form factor case
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Figure 17. STEVAL-STLCR01V1 component placement (bottom side)
UM2101SensorTile and cradle assembly in form factor case
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5 SensorTile programming interface
To program the board, connect an external ST-LINK to the SWD connector on the cradle; a 5-pin flat cable isprovided in the SensorTile Kit package.The easiest way to obtain an ST-LINK device is to get an STM32 Nucleo board, which bundles an ST-LINK V2.1debugger and programmer.Ensure that CN2 jumpers are OFF and connect your STM32 Nucleo board to the SensorTile cradle via the cableprovided, paying attention to the polarity of the connectors. Pin 1 is identified by:• a small circle on the PCB silkscreen – STM32 Nucleo board and SensorTile cradle expansion• the square shape of the soldering pad – connector on the SensorTile cradle.
Figure 18. STM32 Nucleo board, cradle and cradle expansion SWD connectors
Figure 19. SWD connections with 5-pin flat cable
UM2101SensorTile programming interface
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6 Sensors and Bluetooth low energy connectivity
6.1 LSM6DSMThe LSM6DSM is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscopeperforming at 0.65 mA in high-performance mode and enabling always-on low-power features for an optimalmotion experience for the consumer. The LSM6DSM supports main OS requirements, offering real, virtual andbatch sensors with 4 Kbytes for dynamic data batching.ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used forthe production of micromachined accelerometers and gyroscopes. The various sensing elements aremanufactured using specialized micromachining processes, while the IC interfaces are developed using CMOStechnology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of thesensing element.The LSM6DSM has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of±125/±245/±500/±1000/±2000 dps. The LSM6DSM fully supports EIS and OIS applications as the moduleincludes a dedicated configurable signal processing path for OIS and auxiliary SPI configurable for bothgyroscope and accelerometer.High robustness to mechanical shock makes the LSM6DSM the preferred choice of system designers for thecreation and manufacturing of reliable products.
6.2 LSM303AGRThe LSM303AGR is an ultra-low-power high-performance system-in-package featuring a 3D digital linearacceleration sensor and a 3D digital magnetic sensor. The device has linear acceleration full scales of±2g/±4g/±8g/±16g and a magnetic field dynamic range of ±50 gauss.The LSM303AGR includes an I²C serial bus interface that supports standard, fast mode, fast mode plus, andhigh-speed (100 kHz, 400 kHz, 1 MHz, and 3.4 MHz) and an SPI serial standard interface. The system can beconfigured to generate an interrupt signal for free-fall, motion detection and magnetic field detection.The magnetic and accelerometer blocks can be enabled or put into power-down mode separately.
6.3 LPS22HBThe LPS22HB is an ultra-compact piezoresistive absolute pressure sensor which functions as a digital outputbarometer. The device comprises a sensing element and an IC interface which communicates through I²C or SPIfrom the sensing element to the application.The sensing element, which detects absolute pressure, consists of a suspended membrane manufactured using adedicated process developed by ST.The LPS22HB is available in a full-mold, holed LGA package (HLGA). It is guaranteed to operate over atemperature range extending from -40 °C to +85 °C. The package is holed to allow external pressure to reach thesensing element.LPS22HB is factory calibrated but a residual offset could be introduced by the soldering process. This offset canbe removed with a one-point calibration.(For further details, refer to application note AN4833, "Measuringpressure data from ST's LPS22HB digital pressure sensor", on www.st.com.)
6.4 MP34DT05-AThe MP34DT05-A is an ultra-compact, low power, omnidirectional, digital MEMS microphone built with acapacitive sensing element and an IC interface.The sensing element, capable of detecting acoustic waves, is manufactured using a specialized siliconmicromachining process dedicated to producing audio sensors.The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to providea digital signal externally in PDM format.The MP34DT05-A is a low-distortion digital microphone with a 64 dB signal-to-noise ratio and –26 dBFS ±3 dBsensitivity.
UM2101Sensors and Bluetooth low energy connectivity
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6.5 BLUENRG-MSThe BlueNRG-MS is a very low power Bluetooth low energy (BLE) single-mode network processor, compliant withBluetooth specification v4.1. The BlueNRG-MS supports multiple roles simultaneously and can act at the sametime as Bluetooth smart sensor and hub device.The Bluetooth Low Energy stack runs on the embedded ARM Cortex-M0 core. The stack is stored on the on-chipnon-volatile Flash memory and can be easily upgraded via SPI.The device comes pre-programmed with a production-ready stack image(Its version could change at any timewithout notice). A different or more up-to-date stack image can be downloaded from the ST website andprogrammed on the device through the ST provided software tools.The BlueNRG-MS allows applications to meet the tight advisable peak current requirements imposed by standardcoin cell batteries.The maximum peak current is only 10 mA at 1 dBm output power. Ultra low-power sleep modes and very shorttransition times between operating modes allow very low average current consumption, resulting in longer batterylife.The BlueNRG-MS offers the option of interfacing with external microcontrollers via SPI transport layer.
6.6 BALF-NRG-02D3This device is an ultra-miniature balun which integrates matching network and harmonics filter.Matching impedance has been customized for the BlueNRG transceiver.The BALF-NRG-02D3 uses STMicroelectronics IPD technology on non-conductive glass substrate whichoptimizes RF performance.
UM2101BLUENRG-MS
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7 Bill of materials
Table 6. STEVAL-STLCS01V1 bill of materials
Item Q.ty Ref. Value Description Order code Manufacturer
1 1 U1
ARM Cortex-M4 32b MCUMicrocontroller
STM32L476JGY6TR ST
2 1 U2 150 mA, 1.8 Vlow quiescentcurrent lownoise LDO
LD39115J18R ST
3 1 U9Ultra-lowPower Acc +Magn
LSM303AGRTR ST
4 1 U10Low-PowerAccelerometer + Gyroscope
LSM6DSMTR ST
5 1 U6
BluetoothLow-EnergyChip V4.1 -MS
BlueNRG-MSCSP ST
6 1 U13Low-powerpressuresensor
LPS22HBTR ST
7 1 U11MEMS audiosensor digitalmicrophone
MP34DT05-A ST
8 1 U4BluetoothLow-EnergyBalun chip
BALF-NRG-02D3 ST
9 1 X2CRYSTAL32MHZ 8PFSMD
CX2016DB32000D0FLJCC AVX
10 1 X1 32.7680kHz,20ppm, 4pF, 60kΩ Crystal ABS06-107-32.768KHZ-T Abracon
11 2 C2, C20 4pF 25V CAP CERNP0 0201 CBR02C409B3GAC Kemet
12 2 C12, C17 15pF 25V CAP 0201NP0 02013A150JAT2A AVX
13 1 FT1 10pF 25V CAP CERNP0 0201 250R05L100GV4T Johanson
Technology
14 1 R2 0 Ω Resistor SMDR0402 Any
15 1 FT2 Any
16 1 MT 0.40pF 25V CAP CERNP0 0201 250R05L0R4AV4T Johanson
Technology
17 2 C32, C34 2.2µF 6.3VCAPCERAMICX5R, 0201
02016D225MAT2A AVX
18 1 C9 0.22µF 6.3V CAP CERX7S 0201 C0603X7S0J224K030BC TDK
UM2101Bill of materials
UM2101 - Rev 5 page 20/36
Item Q.ty Ref. Value Description Order code Manufacturer
19 1 C30 150nF, 10V CAP, MLCC,X5R, 0201 C0603X5R1A154K030BB TDK
20 2 C14, C31 100pF 25V CAP CERNP0 0201 250R05L101JV4T Johanson
Technology
21 1 ANT1 2.4GHZ ANTENNASMD ANT016008LCS2442MA1 TDK
22 9C4, C5, C10,
C11, C13, C18,C29, C33, C43
0.1µF 6.3V ±10% CAP CERX5R 0201 GRM033R60J104KE19D Murata
23 1 R1 560 Ω Resistor SMD Any
24 9C1, C3, C6, C7,C8, C15, C16,
C19, C441µF 6.3V CAP CER
X5R 0201 CL03A105KQ3CSNC Samsung
25 1 LED 605 nm, 2 V, 10mA, 50 mcd
LED, LowPower,Orange
KPG-0603SEC-TT KINGBRIGHT
26 1 CONN 0.4mmConnectorBoard-to-Board
BM10NB(0.8)-16DS-0.4V(51) Hirose
27 1 L1 3.9nH 400mA 300MΩ FIXED IND LQP03TN3N9B02D Murata
28 1 SWD Cable 2.54mm, L=15cm 5 pin ribboncable Any
Table 7. STLCX01V1 bill of materials
Item Q.ty Ref. Value Description Order code Manufacturer
1 1 CN2 BM10JC-16DP-0.4V(53) BM10JC-16DP-0.4V(53) Hirose
2 1 CN5 HEADER 10 SSQ-110-03-L-S Samtec
3 2 CN6,CN9 HEADER 8 SSQ-108-03-L-S Samtec
4 1 CN8 HEADER 6 SSQ-106-03-L-S Samtec
5 5 C1,C5,C10,C13,C14 100nF X7R Any
6 2 C4,C6 47uF, 6.3V Tantal Any
7 4 C8,C9,C11,C12
4.7uF, >6.3V,<2 Ω ESR Tantal Any
8 2 C15,C16 4.7uF, 10V X5R Any
9 1 J1 PHONOJACK STEREO 35RASMT4BHNTRX Switchcraft
10 1 J2 Header M 3x1 Any
11 4 J3,J4,J5,J6 PCB Hole Any
12 1 RESET SYS_MODE PTS820 J20M SMTR LFS C&KComponents
13 1 R1 47kΩ ±1% Any
14 1 R2 147kΩ±1% Any
UM2101Bill of materials
UM2101 - Rev 5 page 21/36
Item Q.ty Ref. Value Description Order code Manufacturer
15 11
SB2,SB3,R3,SB4,R4,SB5,SB6,SB7,SB9,SB16,SB17
0R Any
16 2 R5,R6 4K7 Any
17 14
SB1,SB8,SB10,SB11,SB12,SB13,SB14,SB15,SB18,SB19,SB20,SB21,SB22,
SB23
NC Any
18 1 SWD CON5 Any
19 1 USB USB-MICRO USB3075-30-A GCT
20 1 U1 USBLC6-2P6 USBLC6-2P6 ST
21 1 U3 PCM1774RGP PCM1774RGP TI
22 1 U4 LDK120M-R LDK120M-R ST
23 1 U5 ST2378ETTR ST2378ETTR ST
Table 8. STLCR01V1 bill of materials
Item Q.ty Ref. Value Description Order code Manufacturer
1 1 BATT Battery Connector 78171-0003 Molex
2 1 CHRG Red LED Any
3 3 C1,C8,C9 100nF X7R Any
4 4 C2,C3,C6,C7 10V, 4.7µF X5R Any
6 1 C10 10V, 1µF X5R Any
7 1 LED1 LED Green Any
8 1 R1 47kΩ±1% Any
9 1 R2 147kΩ±1% Any
10 1 R3 2kΩ Any
11 2 R4,R8 1kΩ Any
12 1 R5 20kΩ±1% Any
13 3 R6,R7,R11 NC Any
14 1 R10 0 Ω Any
15 1 R9 50mΩ±1%,>=1/16W Any
16 1 SD Micro-SD DM3D-SF Hirose
17 1 SWD CON5 Any
18 1 SW1 PWR SSAJ120100 Alps ElectricCo.
19 1 USB USB-MICRO USB3075-30-A GCT
20 1 U1 USBLC6-2P6 USBLC6-2P6 ST
21 1 U2 STBC08PMR STBC08PMR ST
22 1 U3 LDK120M-R LDK120M-R ST
UM2101Bill of materials
UM2101 - Rev 5 page 22/36
Item Q.ty Ref. Value Description Order code Manufacturer
23 1 U4 STC3115IQT STC3115IQT ST
24 1 U5 HTS221 HTS221 ST
25 1 Battery 3.7V100mAh
LiPO-501225 3pinconnector LiPO-501225 Himax
electronics
26 1 Plastic Box Plastic Box Any
27 2 M2-Nut HEX shape HEX Nut M2 -steel Any
28 1 M2-Screw Pan head -Phillips
10mm M2 Panhead Phillips -steel
Any
29 1 M2-Screw Pan head -Phillips
12mm M2 Panhead Phillips -steel
Any
UM2101Bill of materials
UM2101 - Rev 5 page 23/36
8 Schematic diagrams
Figure 20. STEVAL-STLCS01V1 schematic diagram (1 of 2)
Decoupling Capacitors
LED
1KP
G-0
603S
EC-T
T
GND
R1
LED
SAI_
SD
1u1u 100n 100n1u
GND GNDGNDGND GND
1u
GND
1u
GND
C1C3 C4 C5C6C8 C15
VDD
VDD
VDD
VDD
VDD
VDD
VDD
USB
Crystal
ABS06-107-32.768KHZ-T
4p 4p
GND GND
X1
C2 C20
OSC
32_O
UT
OSC
32_I
N
Ultra-low-power DSP STM32L476xx Microcontroller
STM32L476JGY6
VDDUSBA1
PA15A2
PD2A3
PG9A4
PG14A5
PB3A6
PB7A7
VSS1A8
VDDA9
VSS2B1
PA14B2
PC12B3
PG10B4
PG13B5
VDDIO2B6
PB6B7
PC13B8
VBATB9
PA12
C1
PA13
C2
PC11
C3
PG12
C5
PG11
C4
PB4
C6
PB5
C7
PC15
C8
PC14
C9
PA11
D1
PA10
D2
PC10
D3
BOO
T0D
7
PH1
D8
PH0
D9
PC9
E1
PA8
E2
PA9
E3
PB8 E7PB9 E8NRST E9PC7 F1PC8 F2PC6 F3PC2 F7PC1 F8PC0 F9PB15 G1PB14 G2PB11 G3PA1 G4PA4 G5PA2 G6PC3 G7VREF+ G8VSSA G9
PB12
H1
PB13
H2
PB10
H3
PA7
H4
PA6
H5
PA5
H6
PA3
H7
PA0
H8
VDD
AH
9VD
D2
J1VS
S3J2
PB2
J3PB
1J4
PB0
J5PC
5J6
PC4
J7VD
D3
J8VS
S4J9
U1
BLU
E_M
OSI
BLU
E_SC
K
BLU
E_IR
Q
BLU
E_M
ISO
BLU
E_C
S
BLU
E_R
ST
GN
D
GN
D
GND
GND
GNDG
ND
VDD
VDD
VDD
VDD
VDD
VDD
NRST
TXD-USB_DM
TXD
-USB
_DM
GPI
O6
GPIO5GPIO3GPIO2
GPIO2GPIO2
VDDUSB
VDDUSB
MIC_CLK
RXD-USB_DP
RXD
-USB
_DP
SAI_SCK
SAI_FS
SAI_
MC
LKSA
I_SD
INT2
INT2
INT2INT2
INT2INT2
MIC_DATA
OSC
32_O
UT
OSC
32_I
N
CS_
AG
CS_
M
CS_
A
CS_
P
SPI_
CLK
SPI_SDA
TEST
1
Low-Drop Out Voltage Regulator
LD39115J18
1u
VDD
GND GND
100n
GND GND
1u
GND
1u
VDD
VDD
VDD
0
ENA2 GND A1
INB2 OUT B1
U2
C7
C10 C16C19
R2
VDD
VIN VDD
USB
Hirose bottom connector (optional)
BM10NB(0.8)-16DS-0.4V(51)
P1P1 P2 P2
P3P3 P4 P4
P5P5 P6 P6
P7P7 P8 P8
P9P9 P10 P10
P11P11 P12 P12
P13P13 P14 P14
P15P15 P16 P16
G2G2
G1G1 G4 G4
G3 G3
CONN
GND
GND
GND
GND
GND
VDDNRST VIN
TXD-USB_DM
GPIO6GPIO5
GPIO3GPIO2
VDDUSB
MIC_CLK
RXD-USB_DP
SAI_SCKSAI_FSSAI_MCLK
SAI_SD
SWD_GNDSWD_IOSWD_CLK
SWD_VDD
LP_UART_TX, I2C3_SDA, ADC_IN2, DFSDM_CKIN4 (DFSDM_DATIN6)LP_UART_RX, I2C3_SCL, ADC_IN1, DFSDM_DATIN4
ADC_IN3, DFSDM_CKOUT
USART RX or USB DPUSART TX or USB DM
SWD_RST
SPI3_NSS, SAI2_SD_ASPI3_MOSI, SAI2_MCLK_A
SPI3_SCK, SAI2_SCK_ASPI3_MISO, SAI2_FS_A
Moon Pin output
GND
GND
GNDVDD
NRST
VIN
TXD-USB_DM
GPIO6GPIO5
GPIO3GPIO2
VDDUSB
MIC_CLK
RXD-USB_DP
SAI_SCKSAI_FS SAI_MCLK
SAI_SD
+5V supply3.0V - 3.6V supply
UM2101Schematic diagrams
UM2101 - Rev 5 page 24/36
Figure 21. STEVAL-STLCS01V1 schematic diagram (2 of 2)
Digital Microphone
MP34DT04GND
CLK B3
DOUT B4
GNDG1*4
LR B2VDDB1
U11
GNDVDD
MIC_CLK
MIC_DATA
Accelerometer + Gyroscope
100n 100n
C11 C18
GN
D
GN
D
VDD
VDD
LSM6DS3H
SDOP1
SDXP2
SCXP3
INT1P4
VDD
IOP5
GN
D1
P6
GN
D2
P7
VDD P8INT2 P9OCS P10NC P11
CS
P12
SCL
P13
SDA
P14
U10
GN
DG
ND
GNDGND
VDD
VDD
VDD
INT2
CS_
AGSP
I_C
LKSP
I_SD
A
Pressure Sensor
LPS22HB
SDO
P5
VDD_IOP1
SCLP2 CS P6INT/DRDY P7
GN
D1
P8
GN
D2
P9
VDD
P10
RES
P3
SDA
P4
U13
GN
D
GN
D
GN
D
VDD
VDDCS_PSPI_CLK
SPI_
SDA
Accelerometer + Magnetometer
220n
GND
LSM303AGR
C9
SCLP1
CS_XLP2
CS_MAGP3
SDAP4 DRDY P7GND2 P8
VDD P9VDD_IO P10
INT1
P12
INT2
P11
C1
P5
GN
D1
P6
U9
GND
GN
D
VDDVDD
CS_M
CS_ASPI_CLK
SPI_SDA
BlueNRG - Bluetooth low energy chip
Tuning
Balun + chip antenna
UM2101Schematic diagrams
UM2101 - Rev 5 page 25/36
Figure 22. STLCX01V1 schematic diagram
15
SH
1
7
OUT
SensorTile
SAI_FS
182
5V
1213
SWDIO
TILE_RESET
1
SensorTile ConnectorUSB, SWD, Power
RXD-USB_DP
SWDCLK
SB8
CN2BM10B(0.8)-16DP-0.4V(51)
3
1
C15
4.7μF 6
3V3
14
3V3
GN
D
2
6
MIC_CLK
G3
VDDUSB
13GPIO2
D11
GPIO3
SAI_MCLK
V_USB
G2
4
8
10
V_USB
VIN
RXD-USB_DP
GPIO2
J2
11
3
VIN
3 SB9
16
SAI_MCLK
Max 200mA
SAI_SCK
4
4
C16
4.7μF
2
TXD-USB_DM
5
3EN
SensorTile Footprint
3
7
V_USB
2
VDDADJ
11
4
12
SWDCLK
SWDIO
TXD-USB_DM G1
9
D3
TXD-USB_DM
3
VIN
16
5
8
14GPIO3
D4
TILE_RESET
SH
2
D2
VDD
4
IN
VDDUSB
1
USB-MICRO
1
5
MIC_CLK 17
5
VDDUSB
C1
100nF
SAI_SD
2
1
1
1
1
Fixing holesOn the cornersHole: 2.2mmHead: 4mm
STM32 Nucleo
R2147K
10RXD-USB_DP
VBUS5
SAI_SCK
VDD
4
1
6
RESET
3 C14100nF
TILE_RESET2
5
15
R147K
9
1
G4
VIN
SAI_FS
6
SAI_SD
GND2
SAI_SCK
3
6
3
I2C_SCL
3V3
2
CN9
SB18
6UART_TX
SB19 7
GPIO2_3V32
CN5
R5
4K7
SPI_CS7
SB15
1
SB14
SB12
4
UART_RX
6
SB16
TILE_RESET
SAI_MCLK
5
3
4
6
5
GPIO3_3V3
SAI_FSSPI_SCK
8
2
8
CN6
3
1
83V3_Nucleo
5
GPIO21I2C_SDA
GPIO3
SB1
2
SPI_MOSI54
R6
4K7
SPI_MISO
3V3
CN8
5VSB17
10
SAI_SD
1
4
9
MIC_CLK_3V3
7
SB13
SWDCLK 34
TILE_RESET 5
SWD
1
VDD
SWDIO
2
SB10
4
2
C10100nF
L6
11
UART_RX
6
GPIO3
SB20
SB23L3
RXD-USB_DP
8
19VCC
13CC7
20
16
L5
TXD-USB_DM
CC3
14
CC1
U5
ST2378ETTR
UART_TX
L7
MIC_CLK_3V3 3CC2
OE
TXD-USB_DM
L1
17
CC4
MIC_CLK
5
18
VDD
CC515
10
CC67
SB22
GPIO3_3V3
SB11
GPIO2_3V3
1
CC89
VL
VDD
C13100nF
L8
RXD-USB_DP
L2
GPIO2
12
GN
D
SB21
L4
3V3
U4 LDK120M-R
ADR1
VCO
M
3
SAI_FS
SCKI
SAI_MCLKSB5
R40R
1719
+
3V3
AGN
D +
SB4 11
P
13MODE
5
J1
PHONOJACK STEREO
H_L
VDD
7
3V3
14
AIR
VIO
2
1
PAD
C4 47μF4
LRCK
C114.7μF16
SB2 PGNDGPIO3DIN SB6
3
4
SB7C5
100nF
VCC
SAI_SCK
+
12
2GPIO2
206
R30R
18
+
15
BCK
C9 4.7μF
9
SDA
C124.7μF
SAI_SD
3V3 8D
GN
D
AIL
H_R
+
SB3
10
SCL
C8 4.7μF
VPA5C6 47μF+
U3 PCM1774RGP
U1 USBLC6-2P6
UM2101Schematic diagrams
UM2101 - Rev 5 page 26/36
Figure 23. STLCR01V1 schematic diagram
3
D2
3V3
5
USBLC6-2P6
6
VBUS
D1RXD-USB_DP2
RESET
C1
100nF
SWDCLK
D4
5
2
1
3
VDD
3
USB, SWD, Power switch
V_USBUSB-MICRO
4D3
R41K
2
1RXD-USB_DM
5
4
1
SH2
2
1
SWDIO
SWD
SH1
LED1
4SWDCLK
V_USB
GND
SDA
5
2 1
1
DRDY
VDD
C9
100nF
DAT
0
4
SCL
CLK
VDD
SWB
U5
R7NC
2I2C_SDA
SD_MISO
DETC
3V3
I2C_SCL
6
SD_SCK
DAT
2
SD_CS
SD
Micro-SD
GND
CD
/DAT
3
CS
8
SW
DAT
1
3
6
57
C8
100nF
GN
D
SWA
4
CM
D
VDD
R6NC
SD_MOSI
3
HTS221
HTS221 sensor
micro-SD card socket
2
SCL
C10
1μF
VBat
3
Vcc
5
SDA
BATT
Battery Connector
SW1
PWR
VIN
R950 mΩR8
1K
ADJ
1
4
VCC
VBat
V_USB
9
BAT_NTC
CHRGPWR_ON
6BATD/CD
VBat
8
5
C7
4.7μF
I2C_SCL
PROG
U4
C2
4.7μFV_USB2
1
4
OUT
10
VPROG = 1VIBAT=(VPROG/RPROG)x1000RPROG=1000*VPROG/IBAT
BAT_NTC
PAD
R11NC
R100R
7
2
1
2
Bat-
VBat
R2147K
Battery Charger
GND
GN
D C3
4.7μF
3
CHRG
C6
4.7μF
1
6
CHRG
BAT
EN3
VBat
NC
R520K
3
U3
I2C_SDAALM
Max 200mA
4
R32K
V_USB
3V3_EN IN1
GN
D
CHRG
5
VBat
R147K
3V3
CG
STBC08PMR
2
7RSTIO
U1
LDK120M-R
U2
STC3115IQT
VDD3V3
SWDCLKSWDIO
RESET
MIC_CLK
RXD-USB_DPRXD-USB_DM
SD_CSSD_MISOSD_SCK
SD_MOSI
I2C_SCLI2C_SDA
SensorTile footprint
123456789 10
14
1615
131211
1718
UM2101Schematic diagrams
UM2101 - Rev 5 page 27/36
9 Formal notices required by the U.S. Federal CommunicationsCommission ("FCC")
FCC NOTICE: This device complies with part 15 of the FCC Rules. Operation is subject to the following twoconditions: (1) This device may cause harmful interference, and (2) this device must accept any interferencereceived, including interference that may cause undesired operation.Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operatethe equipment.Additional warnings for FCCThis equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in aresidential installation. This equipment generates, uses and can radiate radio frequency energy and, if notinstalled and used in accordance with the instructions, may cause harmful interference to radio communications.However, there is no guarantee that interference will not occur in a particular installation. If this equipment doescause harmful interference to radio or television reception, which can be determined by turning the equipment offand on, the user is encouraged to try to correct the interference's by one or more of the following measures:• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and the receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.
UM2101Formal notices required by the U.S. Federal Communications Commission ("FCC")
UM2101 - Rev 5 page 28/36
10 Formal product notice required by the Industry Canada ("IC")
Innovation, Science and Economic Development Canada Compliance - This device complies with Innovation,Science and Economic Development RSS standards. Operation is subject to the following two conditions: (1) thisdevice may not cause harmful interference, and (2) this device must accept any interference received, includinginterference that may cause undesired operation. Changes or modifications not expressly approved by themanufacturer could void the user’s authority to operate the equipment.Conformité à Innovation, Sciences et Développement Économique Canada - Cet appareil est conforme auxnormes RSS d'Innovation, Science et Développement économique. L'utilisation est soumise aux deux conditionssuivantes: (1) cet appareil ne doit pas causer d'interférences nuisibles, et (2) cet appareil doit accepter derecevoir tous les types d’interférence, y comprises les interférences susceptibles d'entraîner un fonctionnementindésirable. Les changements ou les modifications non expressément approuvés par le fabricant pourraientannuler le permis d'utiliser l'équipement.
UM2101Formal product notice required by the Industry Canada ("IC")
UM2101 - Rev 5 page 29/36
11 TYPE certification
The module has been tested according to the following TYPE certification rules:• Type of specified radio equipment:
– radio equipment according to the certification ordinance article 2-1-9– sophisticated low power data communication system in a 2.4 GHz band
• Class of emissions, assigned frequency and antenna power:– F1D, 2402 to 2480 MHz, channel separation 2 MHz/40 channels, 0.006 W
• Certification number:– 006-000482
The design and manufacturing are certified on the basis of the Japan Radio Law 38-24.
UM2101TYPE certification
UM2101 - Rev 5 page 30/36
Revision history
Table 9. Document revision history
Date Version Changes
17-Aug-2016 1 Initial release.
28-Aug-2017 2Updated Section "Introduction", Section 1.1: "Overview", Section 1.3: "Initial setup with pre-loadeddemo", Section 6.4: "MP34DT04", Section 6.5: "BLUENRG-MS" and Section 9: "Formal productnotice required by the Industry Canada ("IC")"
30-Oct-2017 3
Added Figure 7: "STEVAL-STLCS01V1 component placement (top side)", Figure 9: "STLCX01V1component placement (top side)", Figure 14: "STEVAL-STLCR01V1 component placement (topside)", Figure 15: "STEVAL-STLCR01V1 component placement (bottom side)" and Section 10:"TYPE certification".
Updated Figure 21: "STLCR01V1 schematic diagram".
18-Jul-2018 4
Added Section 2.2 Differences among the STEVAL-STLCS01V1 generations, Section 6.4MP34DT05-A and Section 6.6 BALF-NRG-02D3.
Updated Figure 1. SensorTile functional block diagram and Figure 6. STEVAL-STLCS01V1 powersupply block diagram.
07-Mar-2019 5 Added references to STBLESensor application.
UM2101
UM2101 - Rev 5 page 31/36
Contents
1 Getting started . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
1.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Package components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.3 Initial setup with pre-loaded demo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 System requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 STEVAL-STLCS01V1 hardware description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
2.1 Power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Differences among the STEVAL-STLCS01V1 generations . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 STLCX01V1 hardware description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
3.1 Power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.2 USB device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.3 Audio DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.4 Solder bridge details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4 STLCR01V1 hardware description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
4.1 Power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.2 SensorTile and cradle assembly in form factor case . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5 SensorTile programming interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
6 Sensors and Bluetooth low energy connectivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
6.1 LSM6DSM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.2 LSM303AGR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.3 LPS22HB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.4 MP34DT05-A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.5 BLUENRG-MS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.6 BALF-NRG-02D3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7 Bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
8 Schematic diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
9 Formal notices required by the U.S. Federal Communications Commission ("FCC") .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
10 Formal product notice required by the Industry Canada ("IC") . . . . . . . . . . . . . . . . . . . . .29
UM2101Contents
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11 TYPE certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
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List of tablesTable 1. STEVAL-STLCS01V1 main components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5Table 2. STEVAL-STLCS01V1 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Table 3. STLCX01V1 main components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Table 4. STLCX01V1 solder bridge details. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Table 5. STLCR01V1 main components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Table 6. STEVAL-STLCS01V1 bill of materials. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20Table 7. STLCX01V1 bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21Table 8. STLCR01V1 bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22Table 9. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
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List of figuresFigure 1. SensorTile functional block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1Figure 2. SensorTile kit blister . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3Figure 3. Orientation of SensorTile and cradle expansion connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3Figure 4. SensorTile mounted on cradle expansion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4Figure 5. STEVAL-STLCS01V1 main components and pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5Figure 6. STEVAL-STLCS01V1 power supply block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Figure 7. STEVAL-STLCS01V1 component placement (top side) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Figure 8. SensorTile first generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Figure 9. SensorTile second generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Figure 10. STLCX01V1 main components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Figure 11. STLCX01V1 component placement (top side). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Figure 12. STLCR01V1 cradle main components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Figure 13. SensorTile soldered onto cradle board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Figure 14. Battery connection and power switch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Figure 15. SensorTile and cradle in plastic case . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14Figure 16. STEVAL-STLCR01V1 component placement (top side) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Figure 17. STEVAL-STLCR01V1 component placement (bottom side) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16Figure 18. STM32 Nucleo board, cradle and cradle expansion SWD connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17Figure 19. SWD connections with 5-pin flat cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17Figure 20. STEVAL-STLCS01V1 schematic diagram (1 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24Figure 21. STEVAL-STLCS01V1 schematic diagram (2 of 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25Figure 22. STLCX01V1 schematic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26Figure 23. STLCR01V1 schematic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
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