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The TOTEM ExperimentThe TOTEM ExperimentT1 Telescope (CSC)T1 Telescope (CSC)T2 Telescope (GEM)T2 Telescope (GEM) Roman Pots (Si Edgeless detect.)Roman Pots (Si Edgeless detect.)

Gennaro RuggieroCERN, PH Department

on behalf of the

TOTEM Collaborationhttp://totem.web.cern.ch/Totem/

Politecnico di Bari and Sezione INFN

Bari, ItalyCase Western Reserve University

Cleveland, Ohio,USA

Institut für Luft- und Kältetechnik, Dresden, Germany

CERN, Geneva, Switzerland

Università di Genova and Sezione INFN Genova, Italy

University of Helsinki and HIP, Helsinki, Finland Academy of Sciences,Praha, Czech Republic

Penn State University

University Park, USA

Brunel University, Uxbridge, UK

XI th Int. Conf. on Elastic and Diffractive Scattering, Blois, France, May 2005

TOTEM TDR is fully approved by the LHCC and the Research Board

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T1:3.1 << 4.7

T2: 5.3 < < 6.5

T1 T2 CASTOR (CMS)

RP1 (147 m) RP2 (180 m) RP3 (220 m)

Experimental apparatus

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3.6< lηl < 4.7

T1 TELESCOPE T1 TELESCOPE

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T1 telescope with CSCT1 telescope with CSC

•Read out of both cathode Read out of both cathode planes planes (192 cathode strips each)(192 cathode strips each)•Anode wires:3mm pitch, 30Anode wires:3mm pitch, 30m m •T1 trigger: combination of T1 trigger: combination of anode signals from different anode signals from different planesplanes

60°

~3 m planes staggered to planes staggered to improve pattern improve pattern recognitionrecognition

5 planes of Cathode Strip Chambers5 planes of Cathode Strip Chambers

Measurement of 3 coordinates per planeMeasurement of 3 coordinates per plane

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4 large size prototypes built and tested

Successfully tested in 2004 Test Beam in X5

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Collar

Castor Calorimeter (CMS)

Vacuum Chamber

1800 mm

400 mmBellow

T2 GEM Telescope 13.5 m

from IP

charge amplification struct. and charge collection / readout struct. geometrically decoupled.

T2 TELESCOPE with T2 TELESCOPE with GEMsGEMs

6060mm

5.3< lηl < 6.2

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GEM for the T2 TelescopeGEM for the T2 Telescope

Analog r/o circular strips

Digital r/o pads 65() x 24(= 1536 padsPads: x = 0.06 x 0.018 2x2 mm2 __ 7x7 mm2

Strips: 256 (width: 80 m,pitch: 400 m)

pads

strips

Totem GEM prototype built in 2004

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……comment the picturecomment the picture

full size prototype built and tested in 2004

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T1 resolution : T1 resolution : x = 0.36 mmx = 0.36 mm

y = 0.62 mmy = 0.62 mm

T2 resolution: T2 resolution: RR~115~115mm

~ 16mrad~ 16mrad

Reconstructed vertex well inside the Reconstructed vertex well inside the beampipe (beampipe (~3mm) and within ~3mm) and within 5 cm 5 cm along the beam axisalong the beam axis

The primary vertex resolution is sufficientThe primary vertex resolution is sufficient

to discriminate beam-beam from beam-to discriminate beam-beam from beam-

gas eventsgas events

Primary vertex resolution

R

z

Telescopes performances: vertex reconstruction

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2004 - TOTEM ROMAN POT IN COASTING SPS BEAM

The Roman PotsThe Roman Pots

The TOTEM ROMAN POT Project on the web: http://project-romanpot.web.cern.ch/project-romanpot/

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Beampipes

Roman Pot unit

-Vertical and horizontal pots mounted as close as possible-BPM fixed to the structure gives precise position of the beam-Final prototype at the end of 2005

BPMBPM

Roman Pot stations

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•shape and size of the window is defined

•Welding technology of the thin window is the main issue

• Brazing (used for the SPS) can be improved

• TIG welding gives better results, (i.e. planarity of 100microns)

•Laser and Electron-beam welding are considered for a new prototype in 2005

TIG

we

ld c

ross

sec

tio

n

200 µm

Thin WindowThin Window

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RF Measurements with EM RF Measurements with EM Probes in the Roman PotProbes in the Roman Pot

B-field probe

E-field probe Top window 210 m thick

Bottom window 140 m thick NetworkAnalyser

Wire through Roman Pot

d

Transmission measurement as a function of distance (d) and Transmission measurement as a function of distance (d) and frequency (f)frequency (f)

50 dB

60 dB

~60 dB

Loop (140m window)

Loop (210m window)

Pin (140m window)

d = 2mm

Pin w/o window

Loop w/o window

Pin (210m window)

f = 40MHz

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Si Edgeless Detectors in the Si Edgeless Detectors in the RPsRPs

Roman Pot in the SPS (October ‘04)

stack of modules connected to the motherboard

Edgeless detector module

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hybrid

Flexible connections

detector

beam

the Roman Pot hybridthe Roman Pot hybrid

Readout chip VFAT

Pitch adapter on detectoractive edges

(“planar/3D”)

planar technology with CTS(Current Terminating

Structure)

50

m

10

m

66 mm pitch

dead

are

a

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S/N distribution (X5 test beam October 2004)

Planar with CTS edge

Planar with 3D edge

S/N S/N

Based On Two Different TechnologiesBased On Two Different Technologies Similar, but different advantages Similar, but different advantages

CTS is less “edgeless” than 3D edgesCTS is less “edgeless” than 3D edges CTS has bigger S/N ratio than 3D edgesCTS has bigger S/N ratio than 3D edges

Both fulfill the requirements of the Roman Both fulfill the requirements of the Roman Pots Pots Structure of both detectors is identical for electronicsStructure of both detectors is identical for electronics

Two different type of Si Edgeless Two different type of Si Edgeless DetectorsDetectors

S/N of 24 for a thickness of ~350m S/N of 16 for a thickness of ~210m

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The Planar Detector with The Planar Detector with Current Terminating Current Terminating

Structure (CTS)Structure (CTS)

0 50 100 15010

-10

10-8

10-6

10-4

10-2

Bias Voltage, V

Cu

rre

nt,

A

Bulk CurrentSurface Current

Currents at -12oC

I1

I2

(1229±8)m

Metrology: (1209±10)m

Edg. Detect 1Edg. Detect 1 Edg. Detect. 2Edg. Detect. 2

Test Beam in X5 (2003)

Edg. Detect 2

Ref. Detect(strip pitch 50m)

Edg. Detect 1

Ref. Detect strip number

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Radiation Tests on Edgeless Planar Radiation Tests on Edgeless Planar DetectorsDetectors

Studies on irradiated silicon detectors are in progress: Studies on irradiated silicon detectors are in progress: No increase in the surface current with fluence (as expected)No increase in the surface current with fluence (as expected)Bulk current increases with fluence in agreement with what observed in Bulk current increases with fluence in agreement with what observed in standard planar detectors standard planar detectors (damage factor )(damage factor ) These data suggest a radiation hardness for the Edgeless Planar These data suggest a radiation hardness for the Edgeless Planar detectors detectors equal to the standard planar detectors up to 10equal to the standard planar detectors up to 101414 “n”/cm “n”/cm22..

600

500

400

300

200

100Sur

face

Cur

rent

, µA

20151050

fluence, 10^13 n cm-2

Surface current

Bulk current

150

100

50

0Bul

k C

urre

nt a

t fu

ll de

ple

tion,

µA

1086420

fluence, 10^13 n cm-2

A/cm105Fluence Volume

Current 17

I∝*Φ

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T4-4C Single Strip

050

100150200250300350400450500

0 10 20 30 40 50 60 70

Bias Voltage (V)L

eaka

ge

Cu

rren

t (n

A)

Simulation with “Medici” of the equipotential lines of a p on n planar/3D structure (J. Segal)

IV of the full device in one of the pre-production detectors.

Planar/3D detectors: combine Planar/3D detectors: combine planar and 3D technologiesplanar and 3D technologies

PLANAR DETECTOR + DOPANT DIFFUSED IN FROM DEEP ETCHED EDGE THEN FILLED WITH POLYSILICON (C. Kenney 1997). Back plane physically extends at the edge. Active volume enclosed by an electrode: “active edge”

Add here photo of RP

Active edges: X-ray measurement

150 mm

Sig

nal [a

.u.]

5mm deadarea

Strip 1 Strip 2

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3D-Si Detector: Edge Sensitivity (Test Beam 2003)3D-Si Detector: Edge Sensitivity (Test Beam 2003)

With high energy particle tracksWith 6 m 13 keV X-rays

Fit width = (3.203 ± 0.004) mmPhys. width = (3.195 ± 0.001) mm

10 – 90 % signal transition = (6 ± 2) m

Electrodes ~ 1.8% of total area

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RP test in the SPS has been successfulRP test in the SPS has been successful : : TOTEM has TOTEM has gained experience in installing and operating the system gained experience in installing and operating the system in the tunnel.in the tunnel.

Final RP prototype ready at the end of 2005. Final RP prototype ready at the end of 2005.

Installation in the LHC tunnel mid2006 Installation in the LHC tunnel mid2006

Forward proton detectorsForward proton detectors: : both technologies both technologies (Edgeless Planar & Planar 3D) are chosen. Full (Edgeless Planar & Planar 3D) are chosen. Full production & test in 2006. production & test in 2006.

T1 telescopeT1 telescope: : ready for production. Integration test in ready for production. Integration test in CMS during Sept. 2005. CMS during Sept. 2005.

T2 telescopeT2 telescope: : production of a pre-series of 5 final production of a pre-series of 5 final detectors in 2005, full production in 2006 detectors in 2005, full production in 2006

Summary: detectorsSummary: detectors

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