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PUBLIC SENIOR DIRECTOR TECHNOLOGY DEVELOPMENT JON CHEEK FUTURE OF EMBEDDED PROCESSING WITH FD SOI OCTOBER 2018

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Page 1: FUTURE OF EMBEDDED PROCESSING WITH FD SOIsoiconsortium.eu/wp-content/uploads/2018/10/2018... · Industry’s Lowest Leakage Memories Conventional FD-SOI SRAM NXP Ultra-Low Leakage

PUBLIC

SENIOR DIRECTOR

TECHNOLOGY DEVELOPMENT

JON CHEEK

FUTURE OF EMBEDDED PROCESSING WITH FD SOI

OCTOBER 2018

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1 COMPANY CONFIDENTIAL

Technology made large populations possible; large

populations now make technology indispensable.

Joseph Krutch

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2 COMPANY CONFIDENTIAL

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3 COMPANY CONFIDENTIAL

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4 COMPANY CONFIDENTIAL

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5 COMPANY CONFIDENTIAL

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6 COMPANY CONFIDENTIAL

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7 COMPANY CONFIDENTIAL

WILL EXCEED

3XEARTH’S POPULATION

BY 2020 IoT DEVICES

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8 COMPANY CONFIDENTIAL

SCALABILITY OF EMBEDDED PROCESSING

BROADEST APPLICATION PROCESSOR DYNAMIC RANGE28 FD SOI PLATFORM

PUBLIC

GPU

7000 NU 1 Shader

ARM v7

A7 CPU Cluster

7ULP

Display

MIPI / Alpha

Blending

Parallel I/F

LP IO/ LP Conn

Cortex-M4

ARM DSP EXT GPU 7000L

4 Shader

VPU H.265 /

H.264

ARM v8

A35 CPU Cluster

Display

Controller

IMG Capture

Audio DSP

HSIO / LSIO / Conn

8QXP

GPU

7000UL2 Shader

VPU H.265 /

H.264

ARM v8

A35 CPU Cluster

8DX

Cortex-M4

Display

Controller

IMG Capture

Audio DSP

HSIO / LSIO / Conn

Cortex-M4GPU

7000XS/VX

8 Shader

GPU

7000XS/VX

8 Shader

VPU H.265 VPU H.264

ARM v8 A53

CPU Cluster

ARM v8 A72

CPU Cluster

Display

Controller

Display

Controller

Imaging Capture Imaging Capture

Audio DSP HSIO / LSIO / Conn

8QuadMax

Cortex-M4 Cortex-M4

1

3

2

Power Efficiency

High Performance

Power-Performance

>>RBB

ARVt

TOx

<< Iq

>>FBB

LVt

LPower IP

Lext

LVt

RVtLPower IP

Lext

HPerf IP

>Vdd

>Vdd

DVFS

i.MX 8

i.MX 8X

i.MX 7

HPerf IPRBB

RVt Lext

<<Vmin

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9 COMPANY CONFIDENTIAL

SCALABILITY OF EMBEDDED PROCESSING

CROSSING OVER TO MICROCONTROLLERS28 FD SOI PLATFORM

PUBLIC

Ultra-low Power

Dynamic & Static

Common IP with i.MX

ARM Cortex M7 + 2D

Large OCRAM

i.MX 8

i.MX 8X

i.MX RT

i.MX 7

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PUBLIC 10 10

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PUBLIC 11 11

• ARM Cortex-A class

and Cortex-M cores

• 600 MHz to 2 GHz performance

• Thousands of applications

• Full open-source OS platforms

APPLICATIONS PROCESSORS

i.MX

MCUs

KINETIS & LPC

• ARM Cortex-M cores

• Performance

up to 300 MHz

• Embedded memory

• Easy to use tools

• RTOS support

Best OfBoth Worlds

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PUBLIC 12 12

CROSSOVER PROCESSORS

i.MX RT

• ARM Cortex-M cores

• Over 600 MHz performance

• Deterministic instructions

• Short latency

• Easy to use tools

• RTOS support

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PUBLIC 13

i.MX RT Crossover ProcessorsLeveraging FD SOI for Edge Computing

Larger Internal SRAM

ARM Cortex® - M7Instruction & Data Cache, L2 Cache,

Tightly Coupled Memory (TCM)

Connectivity(UART, I2C, USB, SPI, GPIO,

10/100 Ethernet, USB 2.0, etc.)

Timers

Securitywith on-the-fly decryption

Multi-media with 2D Graphics

Display Interface Camera Interface

External Memory SupportExternal SDRAM, NOR,

NAND

System Control Power Management with Integrated DCDC

i.MX RT

PUBLIC 13

• > 3x higher compute

performance vs today’s

MCUs

• 2x faster instruction

pipeline vs. M4

• 2x faster DSP vs. M4

• 10-100x improved

inference time

• NXP optimized memory

architecture

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PUBLIC 14

Industry’s Lowest Leakage Memories

Conventional

FD-SOI SRAM

NXP Ultra-Low

Leakage SRAM

MRAM –

Non-Volatile

SRAM

>10X improvement

10X improvement

• 28nm FD-SOI

• Arm Cortex-M4

• 512kB NXP Ultra

Low Leakage SRAM

• 2MB of STT-eMRAM

• Proprietary dynamic application-

dependent power-performance tunability

• Ultra-low voltage operation plus high

reliability at elevated temperatures

• Industry-leading non-volatile e-MRAM

• 1,000X faster wake-up than e-flash

• 400X lower write power than e-flash

• 1,000-10,000x faster write time than

e-flash

• Higher endurance than e-flash

PUBLIC 14

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PUBLIC 15

Body Biasing – Leveraging for Market Leadership

PUBLIC 15

Quad Core Subsystem

• Vdd Overdrive Only

• SOG Global Body Biasing

• Independent Domain Body Biasing

• On Chip Memory Array Body Biasing

• Assymetric Device Body Biasing

• Mixed Vt Common Well Body Biasing

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PUBLIC 16

Static Power Leadership

PUBLIC 16

Sub Pico Amp Per Bit Memories

0.35V Vmin Capability

Supporting -40C to 125C

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PUBLIC 17

Dynamic Power Leadership

PUBLIC 17

High Granularity Bias Techniques

Mixed Vt Common Well Capability

<0.6V Vmin Capability

Supporting -40C to 125C

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PUBLIC 18

Machine Learning – Edge Computing Enabled by FD SOI

18

Voice Processing

Gesture Control

Active Object

Recognition

Personal / Property

Home Environment

Multi-camera

Observation

Augmented Reality

Smart Sense & Control

i.MX 6 & 71-2x Cortex-AARM

i.MX RTCortex-MARM

Scalable & optimized inference engines across the entire MCU & Apps Processors

8

8

i.MX 8Dual GPUs – 128 GFLOPS

OpenCL 1.2 + VX Extensions GPU assembly

High-end Edge Compute & AI

4

i.MX 8XSingle GPU – 32 GFLOPS

OpenCL 1.2 FP

Mid-end Edge ComputeLow-end Edge Compute

MCU Edge Compute

Trained ModelsInference Engines

Training & Classification in the Cloud

PUBLIC

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PUBLIC 19PUBLIC 19

i.MX 8

- Food Segmentation & ID

- Bottle counting

i.MX 8

- Food ID (20 classifier)

- 6mS Inference

- 99% accuracy

i.MX RT

- Food ID (5 classifier)

- 66mS Inference

- 99% accuracy

Smart Microwave

Smart Fridge

Smart Appliance

Proof of Concept

CES 2018

Utilizes Simple

CNN Neural Net

To Identify Food

(aka FoodNet)

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20 COMPANY CONFIDENTIALPUBLIC

Scalable Solutions

Lowest Leakage Memories

Real Time & General Compute

Leadership Thru Body Biasing

Best Dynamic & Static Power

Enabling Edge Compute

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21 COMPANY CONFIDENTIALPUBLIC

The Future of Embedded Processing Enabled by FD SOI

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