further improvements and developments: optimization of ultra-thin nbn (and other nitrides or...

1
Further improvements and developments: Optimization of ultra-thin NbN (and other nitrides or cuprates) superconducting fil Development of new integrated digital applications of NbN and nitrides devices inte Fabrication and characterization of superconducting NbN epitaxial ultrathin layers and nanowires R. Espiau de Lamaestre 1 , E. Bellet-Amalric 1 , R. Setzu 1 , J-C. Villégier 1 , J. Claudon 2,1 , J-Ph. Poizat 2,1 , C. Delacour 2 , V. Bouchiat 2 , L. Méchin 3 , P. Moretti 4 , 1 CEA-Grenoble (France), 2 CNRS-Grenoble (France), 3 ENSI-Caen (France) , 4 UCB-Lyon (France) Perspectives Epitaxial superconducting film deposition conditions Typical DC-magnetron sputtering conditions and characterization of a 3 to 100 nm film epitaxially grown on R-plane sapphire or MgO 2MM02 Structuration of NbN layers for photon detection Applied Superconductivity Conference 20 0 2000 4000 6000 8000 10000 12000 0,5 1,0 1,5 2,0 G a p (m V) Tem perature (m K) 200 nm (T), normalized conductance (2 (0) = 4.3 meV) using LT-STM and Jc (T) characterisations and surface imaging (2x2 µm 2 ) showing a good uniformity and small roughness in a 3.4 nm thick NbN on 3inch R- plane sapphire. NbN (100 ) Epitaxial growth of 4 nm NbN on Si (100) using either an ultrathin TaNx (~1 nm) silicide or an YSZ buffer layer Reciprocal space section in both plane chosen for this study. Epitaxial relation: Experimental limits are materialized by light (wavelength) and dark (plane opaque sample) grey. Example of Mo 2 N cubic nitride thin film (~10 nm thick) epitaxially grown of on R-plane Sapphire HR-TEM cross-section image of an ultrathin NbN film grown at 600°C on R-plane sapphire 0 1 2 3 4 5 6 7 8 9 10 11 12 0,1 1 C riticalcurren tI C (m A) T em p e ra tu re (K ) N bN (3 .4 n m )/R -S a p p h ire (A 1179) M.Faucher et al. Physica C, 368, 211, (2002) NbN (3.4 nm thick) nano- bridges patterned by e-Beam lithography Characterization of 3-7 nm epi-NbN films on R-plane sapphire and on Si (100) -3 .4 -3 .3 -3 .2 -3 .1 -3 -2 .9 -2 .8 -2 .7 Q x 4.5 4.6 4.7 4.8 4.9 5 5.1 Qz 0 .25 0.5 1 1.5 2 2.5 3 4 5 6 7 8 9 10 11 6.6nm epi-NbN on R-sapphire. Reciprocal space map (units: 2/) around the awaited position (Qx=- 3.05; Qz=4.82, green circle) of the 004 diffraction peak of NbN. Time (ns) 3 2 1 1 10 012 1 1 21 135 O Al NbN =-40.2° 100nm NbN line spaced by 100nm. E beam litho,PMMA Very thin (2.5-10nm thick) epi-NbN superconducting layers with large Tc and large Jc are grown by dc-magnetron sputtering in a controlable way on heated 3' and 4' R-plane Sapphire, YSZ or silicide buffered silicon (100) and MgO (100). Very thin (~1nm) AlN overlayer are insuring storage without degradation. (135) NbN growth on top of R-plane Sapphire at 600°C is directly observed by XRD for very thin layers. E-beam lithography or AFM tip anodization are used for patterning robust NbN nanowires less than 100nm width & meander SSPD. Stability of NbN layers under proton irradiation allows the realization of buried optical wave-guide under NbN stripes. Such NbN nanolayers and SSPD integrated devices are applied to photon detection, THz mixers and fast RSFQ circuit interfaces. epi-YSZ is deposited by PLD AFM lithography limited by the tip radius ~30nm Narrow and dense (80% surface) 2 µm NbN NbNOx Oxide 5µm 0,0E +00 5,0E +02 1,0E +03 1,5E +03 2,0E +03 2,5E +03 0 100 200 300 T (K ) R (O hm s irradiated non irradiated 0,0E+00 5,0E+02 1,0E+03 1,5E+03 2,0E+03 2,5E+03 3,0E+03 12,50 13,00 13,50 T (K) R (O hm s Observation of SSPD single photon @~1µm time response of the NbN (3.4 nm thick) NbN 3.4 nm strips before and after proton irradiation: 1 MeV/1.75.1016 ions/cm2 + 0.95 MeV/1.75.1016 ions/cm2 Same 6.6 nm NbN sample as for XRD

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  • 200 nm

    Time (ns)

    epi-YSZ is deposited by PLD

    2 m

    NbN

    NbNOx

    Oxide

    5m

    Same 6.6 nm NbN sample as for XRD

    Further improvements and developments:

    Optimization of ultra-thin NbN (and other nitrides or cuprates) superconducting films on large wafers and of patterned devices adapted to Hot Electron Bolometer SSPD.Development of new integrated digital applications of NbN and nitrides devices integrated with NbN RSFQ circuits on silicon wafers (see talk 3EA04)

    Fabrication and characterization of superconducting NbN epitaxial ultrathin layers and nanowires
    R. Espiau de Lamaestre1, E. Bellet-Amalric1, R. Setzu1,J-C. Villgier1,

    J. Claudon2,1, J-Ph. Poizat2,1, C. Delacour2,V. Bouchiat2, L. Mchin3,P. Moretti4,

    1 CEA-Grenoble (France), 2 CNRS-Grenoble (France), 3 ENSI-Caen (France) , 4 UCB-Lyon (France)

    Perspectives

    Epitaxial superconducting film deposition conditions

    Typical DC-magnetron sputtering conditions and characterization of a 3 to 100 nm film epitaxially grown on R-plane sapphire or MgO

    2MM02

    Structuration of NbN layers for photon detection

    Applied Superconductivity Conference 2006

    D(T), normalized conductance (2 (0) = 4.3 meV) using LT-STM and Jc (T) characterisations and surface imaging (2x2 m2) showing a good uniformity and small roughness in a 3.4 nm thick NbN on 3inch R-plane sapphire.

    NbN (100)

    Epitaxial growth of 4 nm NbN on Si (100) using either an ultrathin TaNx (~1 nm) silicide or an YSZ buffer layer

    Reciprocal space section in both plane chosen for this study. Epitaxial relation:

    Experimental limits are materialized by light (wavelength) and dark (plane opaque sample) grey.

    Example of Mo2N cubic nitride thin film (~10 nm thick) epitaxially grown of on R-plane Sapphire

    HR-TEM cross-section image of an ultrathin NbN film grown at 600C on R-plane sapphire

    M.Faucher et al. Physica C, 368, 211, (2002)

    NbN (3.4 nm thick) nano-bridges patterned by e-Beam lithography

    Characterization of 3-7 nm epi-NbN films on R-plane sapphire and on Si (100)

    6.6nm epi-NbN on R-sapphire. Reciprocal space map (units: 2/) around the awaited position (Qx=-3.05; Qz=4.82, green circle) of the 004 diffraction peak of NbN.

    =-40.2

    100nm NbN line spaced by 100nm. E beam litho,PMMA

    Very thin (2.5-10nm thick) epi-NbN superconducting layers with large Tc and large Jc are grown by dc-magnetron sputtering in a controlable way on heated 3' and 4' R-plane Sapphire, YSZ or silicide buffered silicon (100) and MgO (100). Very thin (~1nm) AlN overlayer are insuring storage without degradation. (135) NbN growth on top of R-plane Sapphire at 600C is directly observed by XRD for very thin layers.

    E-beam lithography or AFM tip anodization are used for patterning robust NbN nanowires less than 100nm width & meander SSPD. Stability of NbN layers under proton irradiation allows the realization of buried optical wave-guide under NbN stripes. Such NbN nanolayers and SSPD integrated devices are applied to photon detection, THz mixers and fast RSFQ circuit interfaces.

    AFM lithography limited by the tip radius ~30nm

    Narrow and dense (80% surface)

    Observation of SSPD single photon @~1m time response of the NbN (3.4 nm thick)

    NbN 3.4 nm strips before and after proton irradiation: 1 MeV/1.75.1016 ions/cm2 + 0.95 MeV/1.75.1016 ions/cm2

    0

    2000

    4000

    6000

    8000

    10000

    12000

    0,5

    1,0

    1,5

    2,0

    Gap (mV)

    Temperature (mK)

    0

    2

    4

    6

    8

    10

    12

    14

    16

    18

    20

    0

    2

    4

    6

    8

    10

    12

    14

    Mo

    2

    N / R-AL

    2

    O

    3

    A-1162

    R

    square300K

    = 32

    W

    R (

    W

    )

    T (K)

    0

    1

    2

    3

    4

    5

    6

    7

    8

    9

    10

    11

    12

    0

    50

    100

    150

    200

    250

    R(

    W

    )

    T (K)

    NbN (4 nm) /buffer/Si (100)

    ref. A-2032

    0

    5

    10

    15

    20

    25

    30

    0

    20

    40

    60

    80

    100

    Resistance

    (

    W

    )

    Temperature (K)

    NbN(3nm)/YSZ(130nm)/Si

    A-2090 - R(T)

    NbN/MgO

    NbN/Al2O3NbNMo2N

    Ar/N2 pressure (Pa)1.81.81,7/0,21,7/0,2

    Target power (W/cm2)10.610.411.411.4

    Deposition rate (nm/s)4.55.566

    Substrate Temp (C)600600600600

    Tc (K) 9.24.616.5 > 7

    Resistivity at 10K~ 0.3 ~ 0.3 ~ 80 ~ 20

    0

    1

    2

    3

    4

    5

    6

    7

    8

    9

    10

    11

    12

    0,1

    1

    Critical current I

    C

    (mA)

    Temperature (K)

    NbN (3.4 nm)/R-Sapphire (A1179)

    -3.4

    -3.3

    -3.2

    -3.1

    -3

    -2.9

    -2.8

    -2.7

    Qx

    4

    .

    5

    4

    .

    6

    4

    .

    7

    4

    .

    8

    4

    .

    9

    5

    5

    .

    1

    Q

    z

    0.25

    0.5

    1

    1.5

    2

    2.5

    3

    4

    5

    6

    7

    8

    9

    10

    11

    {

    }

    (

    )

    [

    ]

    3

    2

    1

    1

    10

    012

    1

    1

    21

    135

    O

    Al

    NbN

    8

    10

    12

    14

    16

    18

    20

    1E-5

    1E-4

    1E-3

    0,01

    0,1

    1

    10

    100

    RRR=0.76

    T

    c

    =12.74K

    D

    T

    c

    =0.9K

    A2040

    T (K)

    R (Ohms)

    0,0E+00

    5,0E+02

    1,0E+03

    1,5E+03

    2,0E+03

    2,5E+03

    0100200300

    T (K)

    R (Ohms)

    irradiated

    non irradiated

    0,0E+00

    5,0E+02

    1,0E+03

    1,5E+03

    2,0E+03

    2,5E+03

    3,0E+03

    12,5013,0013,50

    T (K)

    R (Ohms)