fujitsu (semiconductor integrated circuit devices) fujitsu … · 2009-08-28 · fujitsu...

Fujitsu (Semiconductor Integrated Circuit Devices)

Quality and Reliability AssuranceFor further information please contact:

North and South AmericaFUJITSU MICROELECTRONICS AMERICA, INC.1250 E. Arques Avenue, M/S 333Sunnyvale, CA 94085-5401, U.S.A.Tel: +1-408-737-5600 Fax: +1-408-737-5999http://www.fma.fujitsu.com/

EuropeFUJITSU MICROELECTRONICS EUROPE GmbHPittlerstrasse 47, 63225 Langen,GermanyTel: +49-6103-690-0 Fax: +49-6103-690-122http://emea.fujitsu.com/microelectronics/

KoreaFUJITSU MICROELECTRONICS KOREA LTD.206 KOSMO TOWER, 1002 Daechi-Dong,Gangnam-Gu,Seoul 135-280, Republic of KoreaTel: +82-2-3484-7100 Fax: +82-2-3484-7111http://kr.fujitsu.com/fmk

Asia PacificFUJITSU MICROELECTRONICS ASIA PTE LTD.151 Lorong Chuan, #05-08 New Tech Park556741 SingaporeTel : +65-6281-0770 Fax : +65-6281-0220http://www.fmal.fujitsu.com/

FUJITSU MICROELECTRONICS SHANGHAI CO., LTD.Rm. 3102, Bund Center, No.222 Yan An Road (E),Shanghai 200002, ChinaTel : +86-21-6146-3688 Fax : +86-21-6335-1605http://cn.fujitsu.com/fmc

FUJITSU MICROELECTRONICS PACIFIC ASIA LTD.10/F., World Commerce Centre, 11 Canton RoadTsimshatsui, KowloonHong KongTel : +852-2377-0226 Fax : +852-2376-3269http://cn.fujitsu.com/fmc/en/

FUJITSU MICROELECTRONICS LIMITEDShinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku,Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387http://jp.fujitsu.com/fml/en/

FUJITSU MICROELECTRONICS LIMITEDJanuary,2009

Specifications are subject to change without notice. For further information please contact each office.

All Rights Reserved.The contents of this document are subject to change without notice.Customers are advised to consult with sales representatives before ordering.The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information.FUJITSU MICROELECTRONICS assumes no liability for any damages whatsoever arising out of the use of the information.Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU MICROELECTRONICS or any third party or does FUJITSU MICROELECTRONICS warrant non-infringement of any third-party's intellectual property right or other right by using such information. FUJITSU MICROELECTRONICS assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein.The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect tothe public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).Please note that FUJITSU MICROELECTRONICS will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products.Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions.Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws.The company names and brand names herein are the trademarks or registered trademarks of their respective owners.

© 2002-2009 FUJITSU MICROELECTRONICS LIMITED Printed in JapanAD00-00003-12E January,2009Edited: Sales Promotion Dept.

Explanation of the late President Kanjiro Okada's motto–

"Quality speaks for itself–no matter where you go"

In 1966, Fujitsu began a companywide movement to ensure high levels of quality and reliability.

During its preparation, then-president Kanjiro Okada stated that

"Suppressing costs and meeting deadlines is important, but these are meaningless if the quality is not good. Quality precedes everything."

This statement summarizes Fujitsu's unwavering commitment to quality.

Contents

Quality and Reliability-Key Words at FUJITSU MICROELECTRONICS (Semiconductor Devices) 2

The Key to High Levels of Quality and Reliability 4Personnel Training

• Overall Training System 4• Qfinity Activities • Quality Control Education and Training 5

Integrated Manufacturing Management to Ensure Quality Semiconductor Devices 6Organization to Ensure Quality and Reliability

• Areas of Responsibility • Organization of the Quality Assurance Division

• Quality Assurance System Structure 6

Ensuring the Quality and Reliability of Semiconductor Devices 8Quality and Reliability Management Program

• Design Review Flowchart 8• Design Review • Verification of Product Planning

• Verification of Technology and Basic Design • FMEA (Failure Mode and Effects Analysis) 9Reliability Test

• Process Qualification • Engineering Tests • Moisture Sensitivity Level 10• Production Qualification Tests 11• Screening • Burn-In 12• Reliability Monitoring Tests • FIT Rate 13

Ensuring the Quality and Reliability of Semiconductor Devices 14Quality Programs

• Example of Quality Control Flowchart • Incoming Inspection • In-Process Inspections

• In-Process QA Inspection 14• Statistical Process Control (SPC) 15

Maintaining the Quality and Reliability of Semiconductor Devices 16Quality and Reliability Support

• Equipment Maintenance • Measurement System Analysis (MSA) 16• Environmental Control • Electrostatic Discharge (ESD) Controls

• Shipment Control (Moisture Absorption Control) 17• Control of Components, Materials and Suppliers • In-Process Troubleshooting

• Design and Process Changes 18• Traceability • Document Management • Ensuring Continuous Improvement 19• Failure Analysis and Identification of Root Causes 20• Internal Quality Auditing • Third Party Certification 21

Business Diversity 22Providing Customized Products

• Quality Grades 22• Foundry Services • Bare Chips 23

Customer Satisfaction 24Customer Services and Support

• Quality and Reliability Database • Customer Audit 24• Failure Analysis 25

Environmental Issues 26

Technology Center and Plants for Semiconductor Devices 27

Quality & Reliability 1

2 Quality & Reliability Quality & Reliability 3

“High Quality”

Company-wide“SCRUM”Initiative

CustomerSatisfactionCustomer

Satisfaction

Committed to MANUFACTURE the“High Quality”Products

Note: SCRUM (Satisfying Customers & Reforming of Us Movement) initiative is a reform and improvement initiative aimed at reforming the management frameworks which support the FUJITSU MICROELECTRONICS group from the customer's point of view.

Raise the employees' awareness of contribution to the“High quality”

Continuous Improvement

Development cycle and quality-driven technology

Planning DevelopmentMass

production Market

Quality and Reliability—Key Words at FUJITSU MICROELECTRONICS (Semiconductor Devices)

Ensuring Quality through Personnel Training

Paying Attention to Quality at Every Stage

Maintaining optimal conditions throughout the production process is the key to providing semiconductor devices with consistently high yield rates and quality levels. To ensure that we meet our quality goals, we perform stringent quality checks at each stage of manufacturingÑfrom product planning through to final delivery.

Guaranteeing Reliability throughout ManySegments of Society

Our extensive expertise as a leading provider of computers and telecom-munications equipment enables us to develop products that meet a variety of customer needs. We seek to contribute to diverse segments of society by providing highly reliable products created from highly reliable semiconductor devices.

Not only are our staff members highly skilled in all aspects of process management and control, they are also totally dedicated to achieving the highest standards of quality and reliability.

By employing leading-edge production technologies, we have earned an excellent reputation in Japan and overseas for the quality and reliability of our semiconductor devices. This reputation has been earned through tireless efforts to ensure the quality and reliability of our products. We concentrate in particular on these three aspects of our people, processes and products.

FUJITSU MICROELECTRONICSQuality Confidence

Training Type

BasicTraining

OJT"on-the-jobtraining"

Item Contents

Company Outline

Outline of Semiconductors

Quality Control (QC)

Explanation of Safety and Sanitation

Qfinity Activities

Explanation of Standardization

Quality Management System

Environmental Management Systems

Inspection

Training in Areas Other than Inspection

Organization and Positioning of the QA Division

Operations and Types of Semiconductors, Semiconductor Production Processes, Handling of Semiconductors

Concept of Quality Control, Explanation of Quality and Reliability, Explanation of Inspection

Handling of Chemicals, Points to be Considered During Work

Outline of Activities

Necessity of Standardization, System of Standardization

Internal Quality Systems/ISO 9000 series, etc.

ISO 14001 Series and Fujitsu Environmental Management Systems

Basic Knowledge, Inspection Based on Specifications

How to Summarize Data, Defect Analysis, SPC, Completion Control

FUJITSU MICROELECTRONICS employ-ees receive quality control education and training in which they learn how to improve product quality by employing consistent quality goals. This training also helps to improve overall employee morale. In addition to performing regular quality control checks at each product stage, each employee is given the opportunity to independently apply their training results to perform autonomous self-checks, with the aim of ensuring quality and reliability and of identifying nonconforming products as rejects early on.

Personnel TrainingAt FUJITSU MICROELECTRONICS, we believe that people are the most important element in our efforts to ensure quality and reliability. To achieve these goals, we provide extensive and continual personnel training at every level and in each depart-ment. Our goal is to train people to think creatively and to turn their ideas into products.

* HR: High ReliabilityVE: Value EngneeringCF: Coustomer Focus

High Level Customer Liaison

Development ofFujitsu Brand

Conventional Activities*HR, VE, CF, etc.

Existing SystemGoal Management,

Education, Knowledge Management, etc.

New SystemNew Business Model- New Manufacturing -

The word "Qfinity" is made by combining "Quality" and "Infinity," and reflects our commitment to pursing infinite quality. The purpose of our Qfinity activities is to enhance the value of the Fujitsu brand and to further tie the mutual relationship for trust with our customers by undertaking significant improve-ments to the quality of our products and services. To this end, all employees in the Fujitsu Group make extensive use of IT to obtain data as a basis for reforming processes, and for improving not only the function and reliability of products, but also customer support, delivery, and costs.

* LTC: LSI Technical Center


The Key to High Levels of Quality and Reliability

Overall Training System

Qfinity Activities

Quality Control Education andTraining

QA Department Training for New Employees

• Courses for different purposes• Newly appointed executive personnel training

• Foreman training(manufacturing personnel/specialist foreman)

• Newly appointed foreman training• Foreman and team leader candidate training

• Leader training

• New recruit basic education• New recruit induction education

• Language education• International operations education• Education prior to overseas deployment• Business school• JAIMS• Trainees

• Off-site education for engineers

• Domestic universities and graduate schools• Common courses• Specialist field courses

[School within company]• Fujitsu Technological School

• Level 6 promotion training• Level 5 promotion training

• New recruit self-training• New recruit basic education• New recruit induction education

Executive personnel education

[International education]

Supervisor

education

Various training at LT

C*

Mid-level personnel

educationN

ew em

ployee education

[Technical education]

Mid-level personnel education

New personnel education

[Education for people ranked by level] [Skill development training] [Education for people ranked by specific duties]

Production:

Material (purchasing)Control

Production ProcessControl

Inter-ProcessAudit/Inspection

Final Testing

Shipping Inspection

Facility Control

In-ProcessTroubleshooting

Failure Analysis

Collection and Application Information

Purchasing and QA Departments

Manufacturing Department

QA Department

Testing Department

QA Department

Facility Engineering Department

QA, Manufacturing and Testing Departments

Reliability Warranty and QA Departments

All Departments

Task Division in Charge

Development:

Reliability Design

Process Development

Design Review

Mass-ProductionEngineering Approval Testing

Design, Process, Assembly and Testing Departments

Design, Process, Assembly and Testing Departments

Design, Process, Assembly and Testing, QA and General Quality Assurance Departments

QA Department

Customer *Sales Department

*Sales Department : FUJITSU ELECTRONICS INC.

Device DesignDepartment

EngineeringDepartment

QualityAssurance Division Quality Assurance

Department Testing Department

Manufacturing Department Product Shipping

Department Production Control

Department Facility Maintenance

Department

Pla

nnin

g S

tage

Des

ign

and

Exp

erim

enta

l Dev

elop

men

tM

ass-

Pro

duct

ion

Sta

geF

ield

Manufacturing Plant

User Tec hnology Support Department

Development/Technology

Quality AssuranceDivision

Reliability and Quality ManagementDepartment, Akiruno Technology Center

(Responsible for Reliability and Quality Management)

Reliability Engineering Department,Akiruno Technology Center

(Responsible for Reliability Engineering)

Reliability and Quality Assurance Department,Akiruno Technology Center

(Responsible for Failure Analysis and Customer Support)

Quality Assurance Department,Mie/Aizuwakamatsu/Iwate Plant

Subsidiary Company QualityAssurance Departments*

FUJITSU INTEGRATED MICROTECHNOLOGY LTD.FUJITSU SEMICONDUCTOR TECHNOLOGY INC.

*

CS Delivery

Establishing Engineering Standards

Product Review (DR2)

Pilot Mass Production

Characteristics Evaluation Product Qualification Tests

Mass Production Review (DR3)

Establishing Manufacturing Standards

Manufacturing Product & Material Control

Warehousing

Delivery

Customer complaints

Information Product PlanningMarket Research

ES Delivery

Design Verification

Technical Review (DR1)

Pilot Production

Characteristics/Reliability Evaluation

Confirmation of Customer Specifications

Initial Shipping Control

Mass Production Stability Review (DR4)

Component and Material Incoming

Final Test Shipping Inspection

Equipment Maintenance

Shipping

Failure Analysis

Development Planning Review (DR0)

Customer complaints Handling

Quality/Customer complaints

Information

In-Process Inspection

Statistical Process Control (SPC)

In-ProcessQA Inspection

ReliabilityMonitoring Test

Quality/Customer complaintsInformation Related to Manufacturing

Legend: Basic route: Assist route: Information route

Table of task assignments by division

Organization to Ensure Quality and ReliabilityFUJITSU MICROELECTRONICS's system for ensuring the overall reliability of semicon-ductor devices involves the allocation of responsibility to every department engagedin a product's development and manufac-ture, including technologies and manufac-turing processes and the control of materi-als. The Quality Assurance Division controls this overall system.Quality assurance departments at each of FUJITSU MICROELECTRONICS's manu-facturing plants interact with the Quality Assurance Division which functions as the overall center for assuring quality and reliability.

To assure high levels of reliability, the depart-ment is charged with the following responsi-bilities.

Organization of the Quality Assurance Division


Integrated Manufacturing Management to Ensure Quality Semiconductor Devices

Areas of Responsibility Quality Assurance System Structure

Function/Process/Requirements

Target Type:

Use:

Section in charge: Prepared by: Key date: FMEA NoInitial release: yy/mm/dd, Rev. No. and Rev. Date:(latest) yy/mm/dd (7)

Team:

Possible failure mode

Effect of failure Severity Class Failure cause/

mechanismCurrent design failure prevention management

Current design failure detection management Detection Risk priority

number (RPN) Measures Person in charge/Schedule

Measures and execution day

Effect of measures

Severity Occurrence Detection Risk priority number

Occurrence

8 Quality & Reliability

Quality and Reliability Management ProgramWe are responding to developments such as increasing degrees of integration with a shortened development time for our semiconductor circuits. In addition to reducing development time at each stage, we are also committed to bolstering quality and reliability.Semiconductor product quality efforts begin at the planning stages. Customer requirements identified by market surveys are incorporated into product planning and reflected in product quality efforts. Compil-ing this information enables us to begin development with clearly established quality and reliability standards, schedules and systems for development.

Our involvement in quality issues extendsthroughout the planning design, prototype development and manufacturing stages. The following flowchart illustrates our processes for evaluating and verifying our semiconductor devices.

ProductDefinition

VerrficationDesign FMEA

DR0Development

PlanningReview

DR1TechnicalReview

DR2ProductReview

DR3Mass

ProductionReview

DR4Mass

ProductionStabilityReview

Technology/ Basic DesignVerification

ProcessQualification

ElectricalCharacteristics

EngineeringEvaluation

Process FMEA

ProductQualification

ShippingDecision

ReliabilityScreening

ReliabilityMonitoring

Market ResearchProduct Definition &DevelopmentPlanning

Product Design Pilot CircuitFabrication

Experiment ProductFabrication Pre-Mass Production Mass Production

Design Review Contents

DevelopmentPlanning Review

(DR0)

Technical Review(DR1)

Product Review(DR2)

MassProduction Review

(DR3)

The results of DR0 determine the basic design for the product characteristics and reliability. Pilot circuits are produced for evaluation, and the basic technology is established. The Technical Review examines this basic design to verify that the development technology is appropriate.

Characteristics, functions and reliability of pilot products are verified at this stage. Conditions and specifications for pilot mass production are determined, and other steps are taken to prepare for mass production.

The Development Planning Review evaluates the processes, circuits, materials and equipment to be used for the new product. It also establishes a schedule for DR1, DR2 and DR3.

Before mass production, product evaluations and product qualification tests are conducted on the pre-mass production products. The Mass Production Review confirms the findings of the product qualification tests including the specifications and equipment allocations required for mass production, and makes the final decision to begin mass production.

MassProduction

Stability Review(DR4)

This review provides feedback based on the results of the control of the early flow of early mass produced items, process fault data, and faults experienced by customers. It also provides information for use in the design review of the next product.

Design ReviewIn each step of the design review (as illustrated in the flow chart on the previous page), we objectively evaluate product quality-including functionality, cost, marketability, reliability, form, packaging and delivery time. A special-ized team identifies potential problems in each phase of development, and makes changes accordingly.The Design Review that is part of FUJITSU MICROELECTRONICS's Quality Assurance Program consists of five steps: 1) Developing Planning Review (DRO), Technical Review (DR1), Product Review (DR2), Mass Produc-tion Review (DR3), and Mass Production Stability Review (DR4).

Verification of Product Planning An in-depth market survey is conducted before the planning and development of a new product. Methods of application, required characteristics, target quality, and target reliability are all determined on the basis of this survey. The planning and development planning of a product determined through this process is evaluated in DR0.

Verification of Technology and Basic DesignThe technology used for a new product is evaluated using basic product designs and pilot circuits. These basic product designs and pilot circuits are ultimately evaluated in DR1.The technical feedbacks on the results are provided for the technology and basic design.

FMEA(Failure Mode and Effects Analysis)Through the incorporation of FMEA in product design and processes, the generation, detection, and effects of all possible failures and their causes are evaluated under ten items. A risk index is formed by combining the values recorded for each item. Corrective measures are then undertaken starting with the item with the highest value. FMEA is both a corrective and preventative process used to confirm the implementation of measures designed to deal with anticipated faults.


Ensuring the Quality and Reliability of SemiconductorDevices

Design Review Flowchart

Example of FMEA Sheet

NBTI[Negative Bias Temperature Instability]

Note: For surface mount devices, thermal stress is applied prior to testing.

ElectromigrationWiring material, structure,

current densityCurrent density,

temperature

Stress migration Wiring material, structure Temperature, stress

Hot carrier injectionTransistor structure,

distribution of impuritiesElectric field

Gate oxide integrity Structure, oxide film characteristics Electric field, temperature

Transistor structure,oxide film characteristics Electric field, temperature

Test Design Item Main Acceleration Factor

77 X 3lot

46 X 3lot

46 X 3lot

46 X 3lot

26 X 3lot

26(Option)

26(Option)

26(Option)

3

3

3

2

77 X 1lot

46 X 1lot

46 X 1lot

46 X 1lot

26 X 1lot

26(Option)

26(Option)

26(Option)

3

3

3

2

Option

Option

18 X 3lot

18 X 3lot

Option

11(Option)

11(Option)

11(Option)

11(Option)

31 X 1lot

18 X 1lot

18 X 3lot

18 X 3lot

11 X 1lot

11(Option)

11(Option)

11 X 1lot

11(Option)

New process technology Circuit technologyProcess technology and assemblypackage technology combinations

Assembly package technology

Reliability TestProcess QualificationTo ensure the reliability of newly developed technologies, we conduct process qualification using TEGs (Test Element Groups)* for all fundamental failure modes.These tests are categorized as process technol-ogy qualifications.* TEG (Test Element Group): A group of elements used to identify

and evaluate specific failure modes.

Engineering TestsAt the early stage of pilot production, reliabil-ity assessments are performed as necessary. TEGs that resemble the actual product are used to identify technical problems and provide feedback prior to mass production.

Moisture Sensitivity LevelIn general, when resin components of plastic packages that have absorbed moisture are subjected to heat stress during mounting, cracks can develop in the packaging. For plastic surface mount devices, we examine each package configuration and the individual components that constitute packages, and perform moisture-induced stress sensitivity tests as necessary. Based on the results of these assessments, packages are classified by moisture sensitivity, and customers are notified of recommended mounting conditions to counter heat stress during mounting.

Production Qualification TestsBecause the characteristics of newly manufac-tured components, as well as combinations of components, may affect reliability, we conduct production qualification tests (reliability evaluation) on representative products or TEGs equivalent to the product in question.

Qualification Family Representative AssessmentsThe following technical items are take into account in determining qualification families and representative products:

• Process technologies- Design rule

- Materials used

- Structure• Assembly technologies

- Design rule

- Materials used

- Structure• Circuit technology• Process technology and package

technology combinationsThe sample size and items test for reliability are determined according to the newness of the technology and testing purposes (refer to table below).

HTOL* 125°C

THB* 85°C, 85%RH

T-Cycling* –65°C/150°C

PCT* 121°C, 100%RH

PCT-Bias 121°C, 100%RH

LTOL –55°C

HTS 150°C

Thermal Shock 0°C/100°C

Mechanical Sequence

ESD-1 (MM)

ESD-2 (HBM)

Latch-up

Thermal Characterization


Example of Reliability Test Items and Test Sample Size

Basic evaluation testing equipment

Wafer Process

HTOL 150°C

THB 85°C, 85%RH or PCT-Bias 121°C, 100%RH

T-Cycling −65°C/150°C

PCT 121°C, 100%RH or PCT 134°C, 85%RH

46

26

46

46

—

—

46

46

Assembly(Plastic Package)

Inst

anta

neou

s Fa

ilure

Rat

e ( λ

)

EarlyFailure Period

After screening

Before screening

RandomFailure Period

Time (T)

WearoutFailure Period

ScreeningAs illustrated in Figure 1 (p13), the failure rates for LSIs follow a "bathtub curve." Even though ensuring quality at each stage of the production process and a range of tests and inspections eliminate most causes of failure, it is possible that some may persist.FUJITSU MICROELECTRONICS's reliability screening eliminates potential early faults. Conducted prior to shipping, it involves the application of stress at a level that will not damage the product in question.

Burn-InBurn-in is effective as a reliability screening to reject the early failures. In our factories, we strive for improvement in the everyday quality of our products. When the burn-in failure rate has been reduced to a certain level, we reduce the time required for burn-in, and eventually, eliminate it all together. Even after burn-in has been eliminated, products will be periodically sampled for burn-in to assure product quality.

Reliability Monitoring TestsOnce mass production begins, products are periodically monitored to confirm the unifor-mity of quality and reliability. Tests to monitor reliability are performed on representative samples from each production line.

FIT RateA failure rate is defined as "The rate at which an item which has been operated up to a particular point in time will bring on a failure within a specific unit of time" in the JIS Z8115.F26. The Figure 1 shows it as a bathtub curve. The time process of failure is divided into 3 periods; Early Failure Period, Random Failure Period, and Wearout Failure period.The failure rate of LSIs is in general described in the random failure period. The forecasted failure rate is obtained by the formula in Figure 2, using accelerated test data taken from qualification tests and reliability monitoring tests.

0

0.92

1

2.02

2

3.11

3

4.18

4

5.24

5

6.29

Number ofFailures

Coefficient γ

Table 1

λ : Failure rateγ : Reliability coefficient (60% reliability level is used.) (See Table 1.)n : Number of testst : Test timeKt : Temperature acceleration coefficientEa : Activation energyk : Boltzmann's constant (8.617E-5eV/K)T1 : Ambient temperature (absolute temperature)T2 : Test temperature (absolute temperature)Kv: Voltage acceleration coefficientE1 : Electric field strength of oxide film at rated voltage (MV/cm)E2 : Electric field strength of oxide film during test (MV/cm)

Burn-in Equipment


Example of Reliability Monitoring Tests (Test Items and Test Samples)

Figure 1. Reliability Bathtub Curve

Figure 2: Failure Rate Calculation Method

Incoming inspection Final test

Defect inspection equipment

Check Item

Inspection of Wafers, Masks,Packages, Parts, Chemicals, etc.

Wafer Surface Inspection, Film Thickness, SurfaceResistance, Diffusion Depth, Electrical Parametersand Doping

Wafer Surface and Pattern Inspection

Wafer Surface Inspection, Monitor Test of Film Thickness

Wafer Surface Inspection, Monitor Test of Film Thickness

Test of Electrical Characteristics, Stress Test

Wafer Surface Inspection

Surface Inspection

Surface Inspection

Surface Inspection

Surface Inspection and Wire Pull Test

Surface Inspection

Surface Inspection

X-ray inspection / External Visual Inspection

External Visual Inspection



AC/DC Characteristics and Functions Test


Endurance and Environmental Tests

Process Flow

Inspection of Incoming Material/Parts

Wafer Process Diffusion/Ion Implantation

Photoetching

Metallization

Passivation (Insulating Layer Formation)

Probing Test

Wafer Shipping Inspection

Dicing

Chip Shipping Inspection

Assembly Die Bonding

Wire Bonding

Internal Surface Inspection

Internal Mechanical Inspection

Burn-in (Optional)

Reliability Monitoring Test

Warehousing

Molding

Lead Plating

Marking (Laser)

Lead Cutting and Forming


External Mechanical Inspection

Final Test

Shipping Assurance Inspection

*AQL1.0% Level1

Test/Inspection

Production ProcessTest/Inspection

QA Gate (Sampling)

Inspection of IncomingMaterials/Parts

Wafer Process

Probing Test

Chip Treatment

Assembly Process

Burn-in

Final Test

Shipping Test

Note: The quality control flowchart uses a plastic package as a representative sample. Some tests and inspections may not be applicable to all product categories.

Reliability monitoring testLead inspection equipment

Quality ProgramsTo ensure the quality of our semiconductor devices, we perform inspections of each manufacturing process.We perform a broad range of efficient process controls and inspections of the manufacturing process to assure that all products achieve the quality and reliability levels established at the design stage. The results of these tests are evaluated using statistical methods, and feedback is provided to the manufacturing process.

Incoming InspectionQuality assurance departments perform incom-ing inspection of materials at the time of procurement. This inspection helps guarantee the quality of products that we purchase.

Example of Quality Control Flowchart

In-Process InspectionsOur manufacturing groups implement these inspections to set control items and standards for each manufacturing process. Prompt feedback maintains and improves the quality consciousness throughout the groups.Inspections occur regularly for each lot and/or production line.

In-Process QA InspectionThe Quality Assurance Groups perform inspections at the end of each manufacturing phase.Using the sampling standards, the groups confirm the level of quality before the products proceed to the next phase.

Statistical Process Control (SPC)SPC is performed for especially important parameters in the manufacturing processes. Engineering groups set the major quality parameters and their specified values for the manufacturing processes to assure proper quality. The manufacturing groups determine control values for production process equipment and conditions.Once mass production begins, the manufactur-ing groups implement control plans to check and improve the product capability of each process.Some important parameters are critical dimen-sions, monitor characteristics, bonding strength, electrical characteristics and yield. Computer software checks each parameter automatically.


Ensuring the Quality and Reliability of SemiconductorDevices

Environmental Control (Central Surveillance Center)

Quality and Reliability SupportInspection and testing are vital parts of semiconductor production. Yet they cannot guarantee absolute quality and reliability. Control of environment and equipment in the manufacturing process is equally important.

Equipment MaintenanceThe maintenance of the manufacturing equipment is another important aspect of maintaining product quality. At FUJITSU MICROELECTRONICS, each piece of production equipment is regularly inspected according to stringent control standards.Each plant's equipment maintenance group regularly calibrates all instruments used for measurements and inspections. Control ledgers record the results of the calibrations. Each piece of production equipment bears a label showing the deadline for the next calibration.Only experienced specialists calibrate the measuring instruments. The standard equipment used for the calibration is calibrated with a traceability system based on Japanese government standards.

Measurement System Analysis (MSA)Control of inspection and testing equipmentMeasurement and testing equipment are used for tests and inspections that verify that semiconductor devices meet the required specifications. From the time of introduction, equipment is controlled daily and also undergoes regular calibration.• Daily inspection and regular calibration

The cycle for regular calibration is determined separately for each piece of equipment and ranges from every six months through to every 24 months. Equipment is calibrated with a traceability system based on international standards.Daily inspection cycles are also determined separately for each piece of equipment.

• Measurement System AnalysisAt FUJITSU MICROELECTRONICS, we conduct measurement system analysis in order to analyze potential variations in measuring devices.We also ensure that gage repeatability and reproducibility and measurement system analysis correspond to process capabilities.

Environmental ControlThe manufacturing environment greatly affects the quality and reliability of semiconductors. To maintain consistent product quality, we strictly control temperature, humidity, dust levels and water purity at every phase of manufacturing.We impose rigorous standards on each item and regularly monitor every aspect of the environment. We also impose control standards for product storage.

Electrostatic Discharge (ESD) ControlsThe structure of semiconductors makes them extremely sensitive to static electricity. At FUJITSU MICROELECTRONICS, we design our integrated circuits to be as resistant to static electricity as possible. We also take extensive measures to reduce static electricity throughout the manufacturing process.

Shipment Control(Moisture Absorption Control)We use moisture-protective packing for our semiconductor devices according to moisture sensitivity level, because resins are highly subject to moisture damage during the mount-ing process of surface-mounted packages. Labeling provides information about the moisture sensitivity level of each product.

Use antistatic flooring materials with a surface resistance of 1x105 to 1x1010Ω or antistatic mats

Use gloves made from materials that are charge resistant. Surface resistance of 1x105 to 1x1011Ω

Antistatic shoes that meet the following specification: Surface resistance of 1x105 to 1x1010Ω

Wear antistatic clothes with surface resistance of 1x105 to 1x1011Ω

Straps that meet the following specification: Resistance to ground of 1x105 to 1x107Ω

Use stalls that meet the following specification: Surface resistance of 1x105 to 1x1010Ω

Use work surfaces with a surface resistance of 1x105 to 1x1010Ω

Use chairs with a resistance to ground of 1x105 to 1x108Ω

For electrically powered equipment, use grounded equipment

Wafer charge voltage: Use of carts with charge voltage controlled to less than ±300V

Store wafers in box. Shelves are either grounded or have charge voltage of less than 20kV.

Use grounded shelves with a surface resistance of 1x105

to 1x1010Ω

Apply antistatic mats to shelves and ground to floor (resistance to ground of 1x105 to 1x1010Ω)

Floors

Bench tops

Chairs

Carts

Storage shelves

Work clothes,dust proof clothes

Shoes

Wrist strap

Finger stalls

Gloves

Equipment


Measurement Standards Traceability System

Meter Convention

Nationalresearchinstitutes

Publicinstitutes

FML*

*: FUJITSU MICROELECTRONICS LIMITED (abbreviated as FML)

International Committee of Weights and Measures

International System of Units

Maintaining the Quality and Reliability of Semiconductor Devices

Examples of Procedures to Control ESD

Wafer Process Assembly Process Test Process

Equipment Maintenance

(When carrying products without static electricity protection)

National Institute of Information andCommunications Technology

National Institute of AdvancedIndustrial Science and Technology

Japan QualityAssurance Organization

Japan Electric MetersInspection Corporation

Weights and MeasuresInspection Offices

Fujitsu Facilities MeasuringDevice Service

Manufacturers

Factory Weights andMeasures Control Office

On-site Measuring Devices

Company logo

* Prior to shipping, products are marked with lot numbers, allowing their production history to be traced.

Country of manufacture

Week code

Production control number (control code)

Part number

Control of Components, Materials and SuppliersThe quality of our products begins when we select the raw materials and components. Our raw material control follows the three steps below:1. The engineering group performs the basic

examination of the products for their physical and chemical characteristics.

2. QA groups perform reliability evaluation.3. Audit component manufacturers' factories

and certify those having good quality. This is followed by regular auditing for maintain-ing and improving quality.

In-Process TroubleshootingWhenever a problem arises that might affect the quality and reliability of the manufacturing process, the Quality Assurance Division immediately investigates the cause and implements countermeasures to correct the problem. The Division also confirms the effectiveness of countermeasures.

Design and Process ChangesWe maintain controlled specifications that define the procedures for process changes and notifications to customers. The proposed process changes should follow the internal PCN specifications, and be reviewed by a committee formed of members from the quality assurance department, the department where the change originated and any other related departments. Changes are classified by the specific categories, and a major change should be reviewed and approved by the manager of QA division before the implemen-tation of the change.We always customer notification in advance of changes affecting form, appearance, function, quality or reliability.

TraceabilityWe maintain complete records for incoming material and components that cover all processes through to shipment to allow identification and traceability in the event of a quality-related problem occurring on the market or during processing. An integrated database enables traceability from wafer process through to assembly, testing, and shipment. All products are marked with lot numbers at time of shipment, allowing their production history to be traced.

Document ManagementFUJITSU MICROELECTRONICS's standardsgovern all specification sheets. The group responsible for specifications prepares and revises each document. The Document Manage-ment Group is responsible for registering, distrib-uting and maintaining specification sheets. This workflow and the responsible group, which has the overall control over documents, keep the spec sheets updated.

Ensuring ContinuousImprovementWe set objectives for continuous improvement in quality, cost and delivery. Joining forces to enhance quality and reliability, we meet customers' demands through a comprehensive quality improvement campaign.

1. Improvement with in-process data2. Customer's feedback

When implementing improvement plans, we use statistical and QC techniques. In addition, we regularly measure customer satisfaction and incorporate the findings into our future improvement plans.Furthermore, we set and strive to achieve goals for continuous improvement plans.


Supplier Management Flow

In-process Troubleshooting Flow

Flowchart of Design Changes and Process ChangesProposal to changedesign or process Proposal

NotificationRequired

Abort Change

Implementation

NA

NA

Customer notification

Review of change/Evaluation

Implementationof change

Material/Process

Implement measures to prevent reoccurrence<Source of Production Fault>

Verify effectiveness of implemented measures<Quality Assurance Department>

Fault discovered<Production/Inspection>

Production fault investigation form issued<Discovery Department>

Production fault investigation formreceived and investigation assigned<Quality Assurance Department>

Investigate cause and prevent reoccurrence<Investigation Request Unit>

Create production fault response document<Investigation Request Unit>

Review response document<Quality Assurance Department>

Processing for fault products<Quality Assurance Department>

• Organization finance status• Supply capacity• Cost • TAT

• Technological evaluation

• Reliability evaluation• Certification audit

Judgement of technological evaluation, reliability experimental results, and certification audit results

• Quality• Cost and productivity• Confidentiality and environment

Select suppliers

Evaluate technologies

Evaluate quality

Certification judgement

Mass production

SPR(Supplier Performance Review)

Standard Marking (Example)


Internal Quality AuditingAt each plant, the following three types of audits are carried out periodically by the Quality Assurance Department.• Quality Management System (QMS) Audit

Audit conducted with the purpose of verifying the compatibility with QMS requirements and validity of rating requirements, department-specified requirements, customer requirements, legal regulation requirements that apply in relation to the product, etc.

• Manufacturing Process AuditAudit conducted to inspect the validity of the manufacturing process based on the documentation at the production factory such as control plans, process flowcharts, work standards, process FMEA, etc.

• Product AuditAudit conducted with the aim of verifying that the product meets the requirements at the appropriate stages during production and handover.

Third Party CertificationsIn relation to third party certifications of the quality management system, the following support is given for ISO9001 and for automobile-related ISO/TS16949 to support European automotive customers.

Failure Analysis and Identification of Root CausesEach of our factories not only monitor for faultsduring the production process, but also monitorthe results of wafer probing tests and final testing of completed products, and analyze the causes of defective products. These results are then used as feedback to the production process. Furthermore, the results of analysis of defective products that are actually returned from our customers are essential for preventing the malfunctions that occur for customers. The results are immediately reported to the related departments and the department will establish the preventive measures.

The analytic result obtained in this way is not only that the faults to be fixed, but also used to develop measures to prevent problems.The measures are also distributed sideways to areas where similar problems may occur.

Factory name and workplace Certification obtained Registration date Certification number Certifying institute

FUJITSU MICROELECTRONICS LIMITEDAkiruno Technology CenterMie PlantAizuwakamatsu PlantIwate Plant

FUJITSU MICROELECTRONICS LIMITEDMie PlantAizuwakamatsu PlantIwate Plant

Fujitsu Integrated Microtechnology Ltd. Head Office & Aizuwakamatsu PlantMiyagi PlantKyushu Plant

ISO9001

ISO/TS16949※

ISO9001

December 5, 2003

August 29, 2008August 29, 2008

December 5, 2003

November 26, 2004

JQA-QMA10719

JQA-AU0010-5JQA-AU0010-4JQA-AU0010-1

JQA-QMA11777

ISO9001:2000, ISO/TS16949:2002 Certification

JQA

Trend monitoring /data analysis

Process history

Com

plaintinform

ation

Status of complaints that occur/customer information

Direct contact with SRAMunit by nano-probe

Cross-sectional photoof gate unit (90 nm)

Quality Systems Accreditation Certificate

Investigation of Causes due to Fault Analysis

Approach to Analysis and Technology Improvements

Counterm

easure

*: Fujitsu Integrated Microtechnology Limited and Fujitsu Semiconductor Technology Limited are expected to obtain third party certification of ISO/TS16949 as follows. • Fujitsu Integrated Microtechnology Limited, Headquarters, Aizu factory and Miyagi factory: Middle of 2008 • Fujitsu Integrated Microtechnology Limited, Kyushu factory: Middle of 2009 • Fujitsu Semiconductor Technology Limited: Middle of 2009

Defect analysis

Determ

ining the cause

Root cause

For Standard Applications

G

GS

For Special Applications

GT

Providing Customized ProductsToday, semiconductors are used in a variety of fields, resulting in a diverse range of customer demand. FUJITSU MICROELECTRONICS has established quality grades for its LSI offerings to ensure that all products meet the required quality grade. We also provide customized products that satisfy the various shipping requirements of our customers.

Quality GradesOur quality assurance program assures the quality of FUJITSU MICROELECTRONICS's LSI products and is divided into three grades. Please consult the Sales Division to find out more about products used for special applica-tions.

Foundry ServicesMany of our customers have benefited from our LSI technologies via the wafer process foundry services.

Bare ChipsOur regular LSI products are packaged for easy handling, but in response to customer requests for size and weight reductions, we also ship "bare chips," that is, chips without any packaging.There is a greater possibility of in-transit damage to these chips, so extreme care should be taken when handling them. Customers are encouraged to conduct quality and reliability screening and testing for defects after mounting.

Note:Custom specifications may not be possible on some products. Please make specific inquiries when ordering.


Business Diversity

Quality Grades

General applications

Industrial applications, general automotive control applications

Automobile drive control and engine control, automobile safety devices

CustomerFUJITSU MICROELECTRONICS

Wafer process Assembly Test

Planning stage

Design and prototype stage

Mass production migration stage

Product shipping stage

Mass production stage

Request

Check and investigate customer requirements

Agree on the development

Development investigation

Review plans

Design verification

Verify

Technical review

Development prototypePrototype product

delivery

Evaluate

Enter manufacturing contract

Factory audit by customer

Mass production migration review

Review mass-production shipping

Initial mass production

Initial distribution management

Mass production verification review

Product shipping

Product delivery

Quality information

Change designs Change production process

Respond to customer complaints

Fujitsu standard specification

Customer requirement specification

Special applications

Specific applications

Standardapplications General applications

Customer specific applications / Safety applicationsex) High-safety applications (nuclear reaction control in nuclear power plants, aircraft automatic flight control, air traffic control systems, operation control in mass transit systems, medical equipment for preserving life, missile launch control in weapons systems, etc.)

Enhanced Reliabilityex) Industrial, automotive, medical (where not directly related to life)

Customer complaints

Failure AnalysisWe carefully analyze all returned products that we receive from customers, take suitable measures to prevent recurrence and provide analytical feedback to the concerned groups. Because this feedback can directly improve reliability, it is our policy to give customer complaints full attention and to do everything possible to resolve problems.Customer complaints are first directed tothe Sales /Customer Support Departments. Information is then passed on to the Reliability & QA Departments for electronic and physical analysis to determine the cause of the failure. Related divisions take appropriate measures based on the results of these analysis. Further-more, in order to fully correct the problem, similar measures are taken at all our manufac-turing facilities.

1. Presentation of Information related to Defective ProductsFor analysis of defective products, the more information there is about the defects, the more accurate failure analysis is possible. For this reason, we elicit as much detailed information from the customer as possible when receiving the customer complaint.

2. Returning Defective GoodsCustomers are requested to send defective products in the original defective state, preventing exterior defect condition change, so that proper analysis may be performed.

3. Customer Complaints Handling Period (Standard)Whenever a customer complaint arises, the Reliability and Quality Assurance Department responds with an interim report within two days of receipt of the customer complaint. The Department produces a final report within two weeks of receipt of the customer complaint.

Customer Services and SupportAt FUJITSU MICROELECTRONICS, thecustomer always comes first. That is why we put such efforts into ensuring high quality and stable product supply.For every defect discovered, an in-depth analysis is conducted to determine the cause of the problem and to incorporate preventive measures into the development process. Customers are informed of all aspects of the situation. Because the results of these analyses can provide information vital to improving reliability, it is our policy to give customer complaints full attention and to do everything possible to resolve problems.Our database services and responses to audits demonstrate our commitment to an ongoing dialogue with our customers.

Quality and Reliability DatabaseWe have developed a database for providing information quickly to customers about quality and reliability data. The following data are available to customers.• Product qualification tests• Test data for reliability monitoring (Periodic reliability data on representative models)• Shipment inspections• Others

Customer AuditWe believe that customer audits and visits to our manufacturing facilities play an important role in building trust in our relationship. Customers are welcome to visit our facilities. Through extensive customer communications, we determine customer needs and incorporate these needs into our products to ensure customer satisfaction.

Micro Focus X-Ray TV System SEM (Scanning Electro Micro Scope)EPMA (Electron Probe Micro Analysis)

EMS (Emission Micro Scope)TEM(Transmission Electron Microscope) FIB (Focus Ion Beam)


Customer Satisfaction

Process for Responding Customer Complaints

Custom

er

Sales DivisionQuality Assurance Division

Quality A

ssuranceD

epartment

TechnologyD

epartment

Plant

Reliability and Quality ManagementDepartment

(Akiruno Technology Center)

Engineering Department

Manufacturing/Management Department

ProductionPlanningDelivery

Design

Examination

Assembly

Process

ProcessAssembly

Examination

Various Analysis Systems


Iwate Plant Aizuwakamatsu Plant

Fujitsu Integrated Microtechnology Ltd. Miyagi Plant

Mie Plant Fujitsu Integrated Microtechnology Ltd. Aizu Plant (Headquarters)

Fujitsu Integrated Microtechnology Ltd. Kyushu Plant

Fujitsu Semiconductor Technology, INC.

Small boilers burning natural gas

FRAM card

NAS battery

System power LSI(MB39C308)

Environmental Issues

At our company, the environment is an extremely important management issue, and environmental activities are promoted based on the environ-mental action plan of the Fujitsu Group.The Fujitsu Group will focus on five environmental issues in the future:

• Improving the environmental value of products and services • Global warming countermeasures • Reinforcing governance • Reinforcing risk management • Environmental and social contributions

As a member of the Fujitsu Group, each of our employees strives to continue environmental activities in their workplace and local regions, and works to reduce the load on the environment and improve our environmental efficiency.

Preventing Global WarmingFUJITSU MICROELECTRONICS creates semiconductor devices that conserve energy, and also provides a service that applies this to suppressing the generation of CO2 at the stage where the customer uses semiconductor devices.

• Energy-saving power systems that use highly-efficient systempower LSIs

• Paperless reception operations using FRAM cards

Third part certificationThe Fujitsu Group has received ISO14001 global integrated certifi-cation that applies to 88 domestic and 11 overseas companies. Our domestic headquarters are mutually certified by the Japan Audit and Certification Office for Environment and Quality (JACO) and our overseas headquarters by Det Norske Veritas (DNV).

Certification acquisition date: 12th September 1995Certification number: EC98J2005

Furthermore, efforts are being made to reduce emissions of CO2 and other greenhouse gases in factories and offices.

• Introduction of NAS batteries(contributes to zero atmospheric pollution emissions and reductions in CO2)

• Strategies to reduce energy consumption at basic facilities(establishment of small flow boilers and energy conversions, etc.)

Akiruno Technology CenterLand area: 122,000m2

Established July 2000

Land area: 69,500m2

Established October 2003

Land area: 290,000m2

Established September 1980

Land area: 147,000m2


Land area: 61,200m2

Established October 2003Land area: 307,000m2


Land area: 28,100m2


Land area: 62,000m2

Established February 2007

Technology Center and Plants for Semiconductor Devices

fujitsu (semiconductor integrated circuit devices) fujitsu … · 2009-08-28 · fujitsu...

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