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ADVANCED FPGA BASED SYSTEM DESIGN Dr. Tayab Din Memon [email protected] Lecture 3 & 4

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Page 1: FPGA Based System Designimtiazhussainkalwar.weebly.com/uploads/1/1/8/2/11827483/...Standard parts vs. custom •Do you build your system with an FPGA or with custom silicon? •FPGAs

ADVANCED FPGA

BASED SYSTEM DESIGN Dr. Tayab Din Memon

[email protected]

Lecture 3 & 4

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Books

• Recommended Books:

• Text Book: FPGA Based System Design by Wayne Wolf

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Overview

• Why VLSI?

• Moore’s Law.

• Why FPGAs?

• The VLSI and system design process.

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Why VLSI?

• Integration improves the design:

• lower parasitics = higher speed;

• lower power;

• physically smaller.

• Integration reduces manufacturing cost-(almost) no

manual assembly.

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VLSI and you

• Microprocessors:

• personal computers;

• microcontrollers.

• DRAM/SRAM/flash.

• Audio/video and other consumer systems.

• Telecommunications.

• FPGAs, ASICS, ASIP, and etc.

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Moore’s Law

• Gordon Moore: co-founder of Intel.

• Predicted that number of transistors per chip would grow

exponentially (double every 18 months).

• Exponential improvement in technology is a natural trend:

steam engines, dynamos, automobiles.

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Moore’s Law plot

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The cost of fabrication

• Current cost: $2-3 billion.

• Typical fab line occupies about 1 city block, employs a

few hundred people.

• New fabrication processes require 6-8 month turnaround.

• Most profitable period is first 18 months-2 years.

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Cost factors in ICs

• For large-volume ICs:

• packaging is largest cost;

• testing is second-largest cost.

• For low-volume ICs, design costs may swamp all

manufacturing costs.

• $10 million-$20 million.

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Packaging

• In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board.

• In the integrated circuit industry it is called simply packaging and sometimes semiconductor device assembly, or simply assembly. Sometimes it is called encapsulation or seal. The packaging stage is followed by testing of the integrated circuit [Source: Wikipedia].

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Mask cost vs. line width

0

100,000

200,000

300,000

400,000

500,000

600,000

700,000

800,000

900,000

1,000,000

.25 micron .18 micron .13 micron .09 micron

mask cost ($)

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Beyond Moore’s Law

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Beyond Moore’s Law: 20nm FPGA

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Field-programmable gate arrays

• FPGAs are programmable logic devices:

• Logic elements + interconnect.

• Provide multi-level logic.

LE

LE

LE

Interconnect

network

LE

LE

LE

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FPGA Architecture in a Glance

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Logic Element

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FPGAs and ASIC

• FPGAs are standard parts:

• Pre-manufactured.

• Don’t worry (much) about physical design.

• Custom silicon:

• Tailored to your application.

• Generally lower power consumption.

• Revisit:

• FPGAs use a grid of logic gates, and once stored, the data doesn't

change, similar to that of an ordinary gate array.

• The term "field-programmable" means the device is programmed

by the customer, not the manufacturer [Source: Wikipedia].

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Standard parts vs. custom

• Do you build your system with an FPGA or with custom

silicon?

• FPGAs have shorter design cycle.

• FPGAs are great for prototyping and low-volume production

• FPGAs have no manufacturing delay.

• FPGAs reduce inventory.

• FPGAs are slower, larger, more power-hungry.

• however, that any relatively complex mid- to high-volume design for

which power consumption, component cost and size are important

issues requires another solution for mass production, where ASIC

comes in place (i.e., Custom Silicon)

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Standard parts vs. custom

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Standard parts vs. custom

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Standard parts vs. custom

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FPGA Based System Design (Goals and Techniques)

• Performance – The logic must run at a required rate.

Performance may be measured in throughput and latency

• Power/energy – The chip must often run within an energy

or power-budget. Too critical in battery-powered systems

• Design time – you can’t take forever to design the

system. FPGAs, because they are standard parts, have

several advantages in design time. They can be used as

prototype, can be programmed quickly, and they can be

used as parts in final design

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FPGA Based System Design (Goals and Techniques)

• Design Cost – Design time is one important component

of design cost, but other factors, such s the required

support tools, may be a consideration. FPGA tools are

often less expensive than custom VLSI tools.

• Manufacturing cost – manufacturing cost of FPGAs (i.e.,

replicating the system many times) is generally more

expensive than ASICs. However, the fact they are

standard parts helps to reduce their cost.

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Programming technologies

• SRAM.

• Can be programmed many times.

• Must be programmed at power-up.

• Antifuse.

• Programmed once.

• Flash.

• Similar to SRAM but using flash memory.

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Challenges in system design

• Multiple levels of abstraction: starting from specification to

architecture, and logic design.

• Multiple and conflicting constraints: low cost and high

performance are often at odds.

• Short design time: Late products are often irrelevant.

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The system design process

• May be part of larger product design.

• Major levels of abstraction:

• specification;

• architecture;

• logic design;

• circuit design;

• layout. FPGA-based system design

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Dealing with complexity

• Divide-and-conquer: limit the number of components you

deal with at any one time.

• Group several components into larger components:

• transistors form gates;

• gates form functional units;

• functional units form processing elements;

• etc.

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Hierarchical name

• Interior view of a component:

• components and wires that make it up.

• Exterior view of a component = type:

• body;

• pins.

Full

adder

a

b cin

sum

cout

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Instantiating component types

• Each instance has its own name:

• add1 (type full adder)

• add2 (type full adder).

• Each instance is a separate copy of the type:

Add1(Full

adder)

a

b cin

sum

cout

Add2(Full

adder)

a

b cin

sum Add1.a

Add2.a

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Component hierarchy

top

i1 xxx i2

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Hierarchical names

• Typical hierarchical name:

• top/i1.foo

component pin

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Levels of abstraction

• Specification: function, cost, etc.

• Architecture: large blocks.

• Logic: gates + registers.

• Circuits: transistor sizes for speed, power.

• Layout: determines parasitics.

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Circuit abstraction

• Continuous voltages and time:

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Digital abstraction

• Discrete levels, discrete time:

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Register-transfer abstraction

• Abstract components, abstract data types:

+

+

0010

0001

0100

0111

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Top-down vs. bottom-up design

• Top-down design adds functional detail.

• Create lower levels of abstraction from upper levels.

• Bottom-up design creates abstractions from low-level

behavior.

• Good design needs both top-down and bottom-up efforts.

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Design abstractions

specification

behavior

register-

transfer

logic

circuit

layout

English

Executable

program

Sequential

machines

Logic gates

transistors

rectangles

Throughput,

design time

Function units,

clock cycles

Literals,

logic depth

nanoseconds

microns

function cost

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Explanation

• Behavior – A detailed, executable description of what the

chip should do, but not how it should do it

• Register-transfer – The system’s time behavior is fully-

specified – we know the allowed input and output values

on every clock cycle – but the logic isn’t specified as

gates

• Logic – the system designed in terms of Boolean logic

gates, latches, and flip-flops.

• Configuration – the logic must be placed into logic

elements around the FPGA and the proper connections

must be made between those logic elements. Placement

and routing perform these important steps.

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END OF THE LECTURE

3 & 4