fp7 -ict work programme 2009-107pr.kpk.gov.pl/pliki/9570/beernaert_nanoelectronics.ppt.pdf · 3.4...

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FP7 - ICT Work Programme 2009-10

3.1-3.2 Nanoelectronics

3.3 Microsystems & smart Miniaturised Systems

3.4 Flexible, organic & large area electronics

Warsaw 2009,Poland.

Dirk BeernaertHead of Unit – Nanoelectronics

Ex. Director at interim for ENIAC Joint Undertaking

Information Society & Media Directorate-General

European Commission

The European policy framework

“Lisbon”Strategy

(growth & jobs)

“Goteborg” SustainableDevelopment Strategy(quality of life &

well being)

R&D in a holistic and global contextIncreased international cooperation on RTD, impact and risk assessments, common

initiatives for sustainable growth (reduce CO2), Green IT, autonomous driving, safety, ….

Nanoelectronics & microsystems & large area electronics:

enabling and pervasive!

All elements have to work together to make it happen

- Research & Development & Innovation & Industrial Policy

- Legislation

- Lead Markets & Innovative Public Procurement

- Research + Education + Innovation (triangle of knowledge)

- Regional Policy

2

Presentations Outline

• Objective 3.1 Nanoelectronics technology

• Objective 3.2 Nanoelectronics design

• Objective 3.3 Flexible, organic & large area electronics

• Objective 3.9 Microsystems and Smart Miniaturised Systems

• Questions

Presentation Outline

• Introduction

• Motivation for the Objective

• Content of the Objective (details in WP)

• Expected Impact (see WP)

• Funding Schemes & Budget

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General Introduction

Cooperation Programme - thematic areas (€ million)

Health

€ 6100

Food, agriclture,

and biotechnology

€ 1935

Information and

Communication

Technologies

€ 9050

Nanosciences,

Materials and new

Production

Technologies

€ 3475Energy

€ 2350

Environment

€ 1890

Security

€ 1400

Space

€ 1430

Socio-economic

sciences and

humanities

€ 623Transport

€ 4160

FP7 Cooperation Programme

ICT is the largest in the Cooperation

programme with € 9,05 billion (28%)

Joint Technology Initiatives & ERANET

International Co-operation… including

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WP - ICT challenges

Europe should lead 3 major technology and socio-economic

transformations:

-Future internet

-Alternative paths to ICT components and systems

-ICT for sustainable development

The increasingly smaller, cheaper, more reliable and low consumption electronic components and systems taking into account the alternative paths to next generation technologies and building the basis for innovation in all major products and service.

Challenge 3:

Components, Systems, Engineering

www.artemis-office.org

www.eniac.eu

www.smart-systems-integration.org

www.photonics21.de

cordis.europa.eu/ims

JTI

JTI

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Challenge 3: Components, Systems, Engineering

Objectives

– IST-2007.3.2: Design of semiconductor components and electronic-based miniaturised systems (25 M€)

– IST-2007.3.3: Flexible organic and large area electronics (60 M€) – IST-2007.3.4: Embedded systems design (28 M€)– IST-2007.3.6: Computing systems (25 M€)– IST-2007.3.8: Organic photonics and other disruptive photonics technologies (30 M€)

– IST-2007.3.1: Nanoelectronics technology (35 M€)– IST-2007.3.5: Engineering of networked monitoring and control systems (32 M€)

– IST-2007.3.7: Photonics (60 M€)– IST-2007.3.9: Microsystems and smart miniaturised systems (80 M€)

Call 4Nov 2008

Call 5July 2009

FP7 ICT WP 09-10: Nanoelectronics

• Two objectives

– IST-2007.3.1: Nanoelectronics technology (35 M€)

– IST-2007.3.2: Design of semiconductor components

and electronic-based miniaturised systems (25 M€)

Total FP7: 60 M€

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Mo

ore

’s L

aw

: M

inia

turi

za

tio

n

Baselin

e C

MO

S:

CP

U, M

em

ory

, L

og

ic

130nm

90nm

65nm

45nm

32nm

22nm

Beyond CMOS

More than Moore: Diversification

Analog/RF Passives HV PowerSensors

ActuatorsBiochips

Information

Processing

Digital content

System-on-Chip

(SoC)

Interacting with people and environmentNon-digital content SoC & System-in-Package

(SiP)Combining SoC and SiP: Higher Value Systems

European Roadmap for Nanoelectronics

‘More

Moore’

‘More than

Moore’

Design

Automation

Equipment and

Materials, Manufacturing

He

tero

ge

ne

ou

s

Inte

gra

tio

n

Be

yo

nd

CM

OS

FP7(ICT-NMP)

WP 2007-2008WP 2009-2010

National /

regional

programmes

Joint Technology Initiative

Multi-Annual Strategic Plan

Annual Work Programme

Eureka

(Catrene)

White Book

Call1

Coordination

ENIAC Industry-driven long-term vision

5+ €bn

ENIAC SRAimplementation

7

FET FP 7 JTI Catrene Comp

Research Pole

Research

Council

Closer time to market

Closer to applications

Size of cooperation / EU level

Role of strategic alliances: global alliances, involvement of system houses,

involvement of material and equipment suppliers

Role of infrastructure: from research tools towards the fab is the lab

Converging technology: a lot of room at the interface, a new multi-disciplinary

game with new actors and new rules? System thinking from the beginning?

University driven / Institute driven - industry guided / industry driven & executed

Role of partnership

The funding landscape in Nanoelectronics Research

Framework Program 7

WP 2007-2008: Next-Generation Nanoelectronics Components & Electronics

Integration (call1 86 M€)

Smaller, higher performance, lower cost: “More Moore”Integration and diversification: Systems-on-Chip, Systems-in-PackageLong Term Future: Beyond CMOS

(Technology - Design - Manufacturing – Equipment)

WP 2009-2010: Nanoelectronics Technology and Manufacturing (call 5 – 35 M€)

WP 2009-2010: Design of semiconductor components and electronics based

miniaturised systems (call 4 – 25 M€)

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Thematic Coverage Call 1

TechnologyRequested: 137 M€

Funded: 50 M€

37 %

DesignRequested: 108 M€

Funded: 9 M€

8 %

ManufacturingRequested: 28 M€

Funded: 5 M€

18 %

Equipm./Metrol.Requested: 79 M€

Funded: 12 M€

15 %

ModellingRequested: 17 M€

Funded: 5 M€

29 %

GenericRequested: 12 M€

Funded: 6 M€

50 %

Funded

Technology

58%

Modelling

5%

Manufacturing

6%

Equip/Metr

14%

Generic

7%Design

10%

0

10

20

30

40

50

60

70

80

90

100

Funded LB BT Funded LB BT Funded LB BT

Beyond CMOS More Moore More than Moore

M€Generic

Design

Equip/Metrol

Manufacturing

Modelling

Technology

Thematic overview call 1

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FP7 ICT WP 09-10: Nanoelectronics

• Two objectives

– IST-2007.3.1: Nanoelectronics technology (35 M€)

– IST-2007.3.2: Design of semiconductor components

and electronic-based miniaturised systems (25 M€)

Total FP7: 60 M€

Motivation for the Objective 3.1

The continuous miniaturisation on

integrated electronic components has almost

reached the physical and technological

limits

• integration of a large number of less

known materials

• complex technological solutions

• increase of R&D and semiconductor

manufacturing costs

Industrial R&D in Europe is shifting

towards a product oriented approach by

adding extra functionalities to the basic

components

Combination of

miniaturisation and

functionalisation, ‘More

Moore’ and ‘More than

Moore’ devices into total

system solutions through the

process of monolithic and

heterogeneous integration

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Challenges Manufacturing:

Keep manufacturing competency in Europe

Flexible manufacturing of customised products

• Reduce cycle time

• Enhance production quality and variability control

• Improve equipment productivity

• Reduce the environmental impact

• Support heterogeneous integration

• Foster advanced system integration and functionalized packaging

Objective 3.1: Nanoelectronics technology

Focus on:a) Miniaturisation and functionalisation

� Beyond CMOS domain

� Advanced aspects of the ‘More than Moore’ domain

� their integration and their interfacing with existing technologies

b) Manufacturing technologies

� Flexible manufacturing with a high product mix and joint equipment assessment

� prepare for more disruptive approaches

c) Support measures

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a) Miniaturisation and functionalisation

� Beyond 22 nm devices, advanced components with lower

scaling factors including non-CMOS devices, and

� their integration and interfacing with very advanced CMOS

Activities with a high risk factor

Industrialisation perspective beyond 2014 and

having a generic development focus

Funding schemes:

STREPs

NoE

3.1 Nanoelectronics technology

Target outcome

b) Manufacturing technologies

• New semiconductor manufacturing approaches,

processes and tools for flexible manufacturing and

sustainable short cycle time manufacturing

• Joint assessments of novel process/metrology

equipment and materials and wafer integration

platforms

• Supporting 200/300mm wafer integration platforms

• Preparatory work for 450mm wafer processing

Funding schemes: STREPs, IP


Target outcome

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c) Support measures

• Roadmaps, benchmarks, selection criteria for the industrial use of ‘Beyond CMOS’

• Access to affordable silicon state-of-the-art technologies for prototyping and low volume and to design expertise and commercial tools

• Stimulation of interest of young people, training and education

• Linking of R&D strategies and stimulation of International Cooperation

• Support and coordination of preparatory work for 450 mm processing and equipment

Funding schemes:

CSA

Budget:

4.5 M€


Target outcome

� Call 5

� Open: 31 July 2009

� Close: 3 November 2009

� Funding schemes:

a) Miniaturisation and functionalisation: STREPs and one NoE;

b) Manufacturing technologies: STREPs and at least one IP

c) Support measures: CSA

� Indicative budget distribution - 35 M€:

� IP/STREP 27.5 M€

� NoE 3 M€

� CSA 4.5 M€


Summary

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Existing Design Methods cannot keep pace with the new technology generations

which result in:

•Decreased component reliability & expected lifetime,•Increased process variability, EMC effects & power dissipation problems.

Existing Design Methods cannot keep pace with the ever increasing

component/system complexity which results in:

•Increased design costs and time to market,•Requirements for Heterogeneous integration and architectural innovation, •Increased power consumption,•Difficult system testing and verification. •Decreased system reliability


New Design Methods are needed to address the challenges

• Address the whole design process in an integrated way, from system architecture to component/system manufacturing and testing,

• Integrate in the design process, H/W & S/W, reliability, EMC, thermal effects, heterogeneous components,

• Design reliable complex systems / chips containing 100 Billions of unreliable and variable devices

• Handle packaging requirements and innovative architectures,

• Improve modelling and verifications at all levels.

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3.2 Design of…

Target outcomes

a) Improved design platforms, interfaces, methods and tools

� to enhance design competences and productivity taking advantage

of the cooperation between system research, circuit design and

process development

� to enable the efficient realisation of very complex circuits from the

system architecture down to the transistor layer using deep

submicron technologies and heterogeneous integration of different

functions or different technologies in very compact systems and

subsystems including SoC and SiP

Funding schemes:

at least 1 IP

STREPs

Budget:

21.5 M€

b) Support Measures

� Bringing research results outside the consortia (dissemination, training and education), and access to supported project results, tools and methodologies

� Setting up of networked centres of excellence and a design infrastructure to validate research results & IP Blocks

� Stimulation of International Cooperation in particular with Russia and India

3.2 Design of…

Target outcomes

Funding schemes:

CSA

Budget:

3.5 M€

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� Call 4

� Now Open (19 November 2008)

� Close: 1 April 2009 (at 17:00 Brussels time)

� Funding schemes:

a) Improved design platforms, interfaces, methods and tools: IP

and STREPs

b) Support measures: CSA

� Indicative budget distribution - 25 M€:

� IP/STREP 21.5 M€

� CSA 3.5 M€

3.2 Design of…

Summary

European research on the web:

http://cordis.europa.eu

http://ec.europa.eu/comm/research/future/

Information Society and Media:

http://ec.europa.eu/information_society/

http://cordis.europa.eu/ist/

http://cordis.europa.eu/ist/directorate g

http://cordis.europa.eu/ist/nano/

Contact:

[email protected]

Information Society and Media:

http://ec.europa.eu/information_society

http://cordis.europa.eu/fp7/ict/nanoelectronics/mission_en.html

European research on the web:

http://cordis.europa.eu

http://www.eniac.eu

Contact:

[email protected]

[email protected]

[email protected]

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Flexible, Organic & Large Area Electronics

FP7 Call 4, Objective 3.3

FOLAE

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What is FOLAE ?

An emerging field …combining(no priority order)

- Organic / Inorganic materials

- Low Temp processes

- Nano-structuring of materials / interfaces

- Flexible substrate capability

- Productive in-line processing

- Large (device / substrate) area manufacturing

- Efficient electron <- -> photon conversions

The prospects of FOLAE

….

Organic and Large Area Electronics has been predicted to reach in 2 decades a market size of the order of that of

silicon today

• New markets not competing withsilicon

• New manufacturing paradigms

• Building on traditional industries

• More energy-efficient manufacturing

• Less material waste

• High market growth potential

Ultimate prospect:From wafer batch processing to Roll-to-Roll electronics manufacturing

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FOLAE in Europe

FP7 is a major step towards Flexible, Organic and Large Area Electronics

• FP7 ICT Call1 Obj. 3.2 was the first specific call for proposals on FOLAE

• After calls 1 & 2, 17 new R&D projectsin this field have been started, with a budget of around +/- 58 M€ in ICT

•Obj. 3.3 of Call 4 is a unique opportunity to X2 the FOLAE momentum in FP7 and, in combination with MS programmes, to reach critical mass in the area

(a) Devices and building blocks

IPs (min 50%) & Streps (min 30%)

(b) Flexible or foil-based systems

IPs (min 50%) & Streps (min 30%)

(c) Networks of Excellence

Call 4 Objective ICT-2009.3.3:

“Flexible, Organic and Large Area Electronics”

(d) Support measures

R&D

R&D

R&D coordination

Non R&D

54.5 M€

4 M€

1,5 M€

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• Device concepts / manufacturing

Organic / Inorganic Materials on flexible or transparent

substrates

Process / Material co-development including interface

engineering

Large-area in-line compatible processes & Manufacturing

modes, small feature size

Issues: device architectures & performance, stability, yield,

modelling, process-tolerant design, characterisation,

reliability, environmental and recycling issues

(a) Devices and building blocks

Device demonstrators: • p/n TFTs, A/D blocks• power converters• memories• thin-film batteries • sensors• active RF

(b) Flexible or foil-based systems

• functional foil - / heterogeneous integration

- Addressing complexity of building blocks integration

- Flexible / Stretchable substrates, textile

- Interconnects with discrete devices and thinned ICs

Device demonstrators:• e-paper, Signage, e-card• RF-ID tags• Energy storage systems, OPV/ batteries• OLED based systems,• Chemical/Physical/bio sensors includingsignal processing

• Transparent electronics

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(c) Networks of Excellence:

- Structuring and integrating of the research capacities

- Training and education

- Coordination of R&D,

- Promoting links between R&D institutions’ activities and Industrial needs

- Standardisation


- Promoting international collaboration

- Access to prototyping and design competences

- Coordination of national, regional and EU-wide R&D programmes

- Training and education for SMEs

(c) Networks of Excellence


4 M€

1.5 M€

ICT-2009.3.8: Organic photonics and other disruptive photonics technologies

• Organic, polymer, single molecule and carbon-nanotube based photonic components, including hybrid organic-inorganic components

(I) Organic photonics (STREP)

(II) Disruptive/cutting-edge photonic technologies and materials (STREP, NoE)

Objective ICT.2009-3.8

Call 4: 19 Nov´08-1 April´09Budget: 30 M€25 M€ (STREP)5 M€ NoE

• Effects at the limit of the light-matter interaction in nanophotonics

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Objective 3.3 versus 3.8 a) ?

For OLEDs and PVs, the choice between submission to 3.3 or 3.8 depends on the «center of gravity» of the proposal:

- If the core is OLED/PV basic photonic device � 3.8 a)

- If the core is integration of OLED/PV functionalities in electronic systems and/or manufacturability � 3.3

Ex: OLED display, area sensor

Microsystems in the ICT Programme

Objective 3.9 : Microsystems and Smart Miniaturised Systems

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MICROSYSTEMS = Integration of technologies and

functions

Nanoelectronics

Photonics

Microfluidics Biology

Micromechanics

MicrosystemsMaterials

Chemistry

Technologies:

Microsystems: At least 2 Technologies, 2 Functions (sensing-

actuating), and “Miniaturised”!

Functions:

Sensing, storing, processing, actuation, communication

Process

Communicate

InteractStore

Actuate Actuate

Sense

Close-loop

Microsystems get smart ��Smart systems

• Describe a situation, diagnose, and/or

• Predict, decide, help to decide, and/or

• Interact with the environment

• Smart (Miniaturised) System

Able to:

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1. Multiple Research fields to combine

Mechanics, electronics, fluidics, biology, magnetism, photonics

2. Multiple Materials need to work side by side

Semiconductor, ceramic, glass, organic

3. Multiple Functions to integrate

Sensing, processing, logic, memory, communication

4. Multiple Integration technological options

�Heterogeneous integration

Monolithic, hybrid, multichip

Main Challenges for Microsystems and smart

miniaturised systems

Convergence and Integration – Some

examples

Lab-on-Chip

(OPTOLABCARD)

Neural Probe arrays

(NEUROPROBES)

Smart Fabrics (PROETEX)

GSM phone

Microrobotic surgery

(ARAKNES)

Photonic biosensor (NEMOSLAB)

Nanoelectronics

Photonics

Microfluidics

Biology

MicromechanicsChemistry

RF

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(a) Heterogeneous Integration

(b) Autonomous energy efficient smart systems

(c) Application-specific Microsystems and Smart Miniaturised Systems

Biomedical

Telecommunicatio

ns

Environment

Food/Bevera

ge

Transport,

Safety and

Security Smart Fabrics,

Interactive

Textile

(d) Coordination and Support actions

ICT Objective ICT-2009.3.9:

“Microsystems and smart miniaturised systems”


Multiple core technologies and materials, integrated and interfaced:

Emphasis: - Innovative concepts of industrial relevance

Focus:

1. Heterogeneous technologies for more intelligence in microsystems:

- multi-sensing, processing, wireless communication, actuation

2. Address the “value chain” for more efficient manufacturing:

Materials, modeling, design, processes, packaging, characterisation, testing

3. Disruptive approaches for nanosensor-based microsystems

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Objective:

Long-lasting autonomous operation

Challenges:

1. Energy:

Scavenging, storage and transmission

Power generation, accumulation and consumption

2. Communication:

Smart transceivers for wireless communication of sensor-based systems:

(reconfigurable, low power, adaptive, miniature…)

(c) Application-specific Microsystems (1/2)

1. Lab-on-chip platforms, from R&D to validation in

Drug discovery, diagnosis/therapy

emphasis: integration of sample preparation, flexibility to multiple-type assays

2. Microinstruments for cell manipulation and micro-injection

3. Microsystems interacting with the human body

- miniaturised active implants

- bio-robots and non-invasive microsystems

(monitoring, diagnosis and therapy)

Biomedical

Miniaturisation for multi-functional networked microsystems

1. Smart RFID

2. Ultra-low power transceivers

3. Reconfigurable antennaTelecommunicatio

ns

Note: Biosensors and microfluidic chips/components “as such” out of scope

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(c) Application-specific Microsystems (2/2)

Environement

Food/Beverage Multi-sensing microsystems for:

• Environment (including water treatment)

• Food and beverages quality and safety

Emphasis: reliability and cost

Transport,

Safety and Security 1. Transport: Safety critical microsystems:

Emphasis: smart systems for the full electrical vehicle

2. Safety and Security: Sensors and actuators

Emphasis: networking capabilities, harsh environment

Smart Fabrics,

Interactive Textile

Multi-functional textiles and fabrics:

Seamless integration of functions:

sensing, actuating, communication, processing, power sourcing

- Integration of fibre-level components into textiles

- Stretchable and wearable electronics embedded in textiles

- Fully integrated Smart Fabric and Interactive Textile (SFIT)


1. Techno-economic analysis

2. Dissemination and promotion actions, public awareness

3. Identification of international cooperation opportunities

4. Coordination between Technology providers and Users

(for in-vitro diagnostics and food/beverage quality)

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Budget and “Instruments”



(c) Application-specific Microsystems

Biomedical

Telecommunications

Environement

Food/Beverage

Transport,

Safety and

Security Smart Fabrics,

Interactive

Textile


Budget

77 M€

3 M€

“Instrument”

IP or STREP

STREP

IP or

STREP

CSA

• Directorate G:http://cordis.europa.eu/fp7/ict/programme/challenge3_en.html

• Challenge ICT-2007.3.3 & 3.9:

http://cordis.europa.eu/fp7/ict/organic-elec-visual-display/home_en.html

• Contact: [email protected]@ec.europa.eu

[email protected]

[email protected]

[email protected]

More information ?

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Conclusion

Can Europe be competitive in nanoelectronics?

Yes WE can!!!!

We can all together do better?

Yes we can

- If Europe wants to survive, grow and take the lead in electronics (nanoelectronics, miniaturised smart systems & large area electronics.

- If Europe thinks this industry is necessary, strategic and need to be supported for Europe’s competitiveness and its social and environmental aims.

Then we can not wait and must support Research and Innovation with visionary, mid and long term oriented and economical and public appealing initiatives.

but

Equally this industry and its associations must take into account the whole ecosystems they are operating in incl. political environment, manufacturing aspects & represent all actors on European ground.

European Research PolicyEuropean Research Policy

There is light in the darkThere is light in the dark

Thank you for your attention.

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Expected Impact

� Strengthened competitiveness of the European nanoelectronics

industry

� Contribution to the competitiveness and the attractiveness of

Europe to investments

� New electronics applications of high economic and socio-

economic relevance

� Maintained European knowledge and skills,

� Increased critical mass of resources and knowledge,

� Contribution to preserving a critical mass of manufacturing

capacity in Europe

3.2 Design of…

Expected Impact

� Innovation in product architecture and increased efficiency in

product design with reduced costs & time to market (2013-2015)

� Capability in Europe to design in a reliable manner products that

use the most advanced IC manufacturing and integration processes

� Maintained leading position of Europe in product innovation and

design for major application fields.

� Use of new devices for new functionalities

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• Reinforce leadership position of Europe in the creation of flexible or large area electronics tailored to meet key societal and economic needs

ICT-2009.3.3: Flexible, organic and large area electronics

• Expected impact

Objective ICT.2009-3.3“Flexible, organic and large area electronics”

Call 4: 19 Nov´08-1 April´09Budget: 60 M€54.5 M€ CP (STREP/IP) minimum 50% IP, minimum 30% STREP 4 M€ NoE, 1.5 M€ CSA

• Contribution to the evolution of traditional industries in the EU, such as printing and clothing industries, towards the e-media revolution

• Sustainable electronic device performance and manufacturing costs matching low capital investment requirements and new market opportunities

Extra Conclusion

Can Europe be competitive in nanoelectronics?

Yes WE can!

Can WE do better?

Of course WE can!

Can we make ENIAC a success?

Yes, altogether WE can.

fp7 -ict work programme 2009-107pr.kpk.gov.pl/pliki/9570/beernaert_nanoelectronics.ppt.pdf · 3.4...

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