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    }Definition of

    Wafers}Pure Silicon

    }wafer formationprocess

    1. Silicon Ingotgrowth

    2. Crystal Shapingprocess

    3. Wafer slicing

    4. Wafer inspectionand Packing

    Formation of silicon wafers

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    A thin disk of pure silicon ( 99.99% purity)semiconductor used as a substrate material

    for Integrated Circuits ( ICs).

    A 300mm

    silicon wafer

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    Silica SiO2 99.99% pure Polycrystalline Silicon

    (EG-Si)Reduction of silica with carbon and reactingthe obtained MGMG--SiSi with gaseous HCL to get

    the pure EGEG--SiSi.

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    StepStep 11SiliconCrystalGrowth

    StepStep 22

    CrystalShapingProcess

    StepStep 33Wafer

    Slicing

    StepStep 44Wafers

    preparatio

    n steps

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    PolysiliconPolysilicon

    25002500ooCC

    Seed crystalSeed crystal

    Czochralski ProcessCzochralski Process

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    Cropping Testing GrindingFlats

    grinding

    Crystal Shaping processCrystal Shaping process

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    Cropping Testing GrindingFlats

    grinding

    CroppingCropping

    Tang Crown

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    Cropping Testing GrindingFlats

    grinding

    TestingTesting

    Testing

    Slice

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    Cropping Testing GrindingFlats

    grinding

    GrindingGrinding

    This process aims to obtain the specifieddiameter of the wafer

    Centerless grindingCenterless grinding Center grindingCenter grinding

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    Cropping Testing GrindingFlats

    grinding

    Flats grindingFlats grindingFlats are a straightened parts

    of the wafers that havebelow 200mm diameters.

    Flat

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    EdgeContouring

    Waferlapping

    Waferetching

    Waferpolishing

    Wafercleaning

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    EdgeContouring

    Waferlapping

    Waferetching

    Waferpolishing

    Wafercleaning

    Counter RotatingLapping machine

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    EdgeContouring

    Waferlapping

    Waferetching

    Waferpolishing

    Wafercleaning

    Etching purpose is to remove anydamaged layers which may be

    10m deep

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    EdgeContouring

    Waferlapping

    Waferetching

    Waferpolishing

    Wafercleaning

    Slurryconsists ofSiO2 and

    NaOH

    The purpose of polishing isto produce a smooth,specular surface on

    which device featurescan be defined by

    photolithography.

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    EdgeContouring

    Waferlapping

    Waferetching

    Waferpolishing

    Wafercleaning

    Wafer cleaning is meant to clean wafers

    from any contamination source:1. Airborne bacteria2. Grease and wax from physical

    handling.3. Metals and abrasive elements such

    as : silica , diamond dust and alumina

    from lapping ,sewing and polishingprocesses.

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    o Some wafers propertiessuch as: flatness,thickness, resistivity andtype are inspected to

    meet customersspecifications.

    o Wafers are then packedin cassettes and shippedto the customer such asAMD or Intel

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    en.wikipedia.org/wiki/Wafer_(electronics)

    http://en.wikipedia.org/wiki/Seed_crystal

    http://en.wikipedia.org/wiki/Crystal_structure

    http://www.xtal.iqfr.csic.es/Cristalografia/index-en.html

    http://www.semi.org/en/

    http://en.wikipedia.org/wiki/Czochralski_process

    www.youtube.com/watch?v=aWVywhzuHnQ

    http://cleanroom.byu.edu/EW_formation.phtml

    http://cnx.org/content/m16627/latest/

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    Any Questions?


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