for video equipment mn3113f - panasonic · 31 osub sub pulse output o unwanted charge (v hh , v l2)...
TRANSCRIPT
For Video Equipment
SDB00056BEM 1
MN3113FVertical Driver LSI for Video Camera CCD Area Image Sensor
OverviewThe MN3113F is a vertical driver LSI for a two-dimen-
sional interline CCD image sensor. It features a built-inpower supply circuit that, in conjunction with suchexternal components as six booster capacitors and twovoltage stabilization capacitors, produces stabilized+15.0V and –10.0V power supplies from a +5.0V inputand HD pulses.
The MN3113F makes it possible to drive a CCD imagesensor on a single 5 volt power supply.
Features Single 5 volt power supply
Adjustable output voltage for regulated voltagecircuit
Applications Video cameras
Pin Assignment
QFP044-P-1010
(TOP VIEW)
C1–
C2–
C3
–C
4 –
C5
–O
VE
EC
6 –
VC
C1
C6+
OV
DD
HD
VE
EV
HH
OSU
BV
L2
VL
1O
V1
VM
13O
V3
OV
2V
M24
OV
4
VHVDDVCC2IV2IV4SENSE1VOUT+VIN+CAP3CAP2CAP1
ISUBCH1IV1IV3
CH2SENSE2
VOUT–VIN –GNDC1+C3+
1 2 3 4 5 6 7 8 9 10 11
2221201918171615141312
3435363738394041424344
33 32 31 30 29 28 27 26 25 24 23
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MN3113F For Video Equipment
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Block Diagram
VOUT–
OV
EE
VL2
VEE
ISUB
IV1
GND
CH1
IV3
CH2
SENSE2
30
33
34
36
35
37
38
39
VIN –41
40
1
6
43
C1–
2
C1+
3
C2–
44
C3
–
4
C3+
C6+
5C
4 –
7 9
C5
–
C6
–
8V
CC
1
10O
VD
D
VH
H
293132
OSU
B
28
VL
1
27
OV
1
26
VM
13
25
OV
3
24
OV
2
23 22
VM
24
OV
4
VH
42
CAP2
CAP1
VOUT+
VIN+
VDD
VCC2
IV2
IV4
HD
SENSE1
CAP3
20
21
19
18
17
16
15
14
13
12
11Negative and positive boosting voltage generator
Negative regulatedvoltage output
Inverter circuitPositive regulated
voltage output
Tristate driver
Tristate driver
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For Video Equipment MN3113F
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Pin DescriptionsPin No. Symbol Pin Name I/O Function Description
8 VCC1 "H" level power supply I "H" level input for 5 volt circuits
20 VCC2 for input block
42 GND "L" level power supply I "L" level input for 5 volt circuits
for input block
22 VH "H" level power supply I "H" level input for high-voltage circuits
for vertical driver
32 VHH "H" level power supply I "H" level input for high-voltage circuits
for SUB driver
27 VM13 "M" level power supply I "M" level input for high-voltage circuits
24 VM24 for vertical driver
29 VL1 "L" level power supply I "L" level input for high-voltage circuits
for vertical driver
30 VL2 "L" level input I "L" level input for high-voltage circuits
for SUB driver
21 VDD Power supply 1 for driver I "H" level for high-voltage circuits
33 VEE Power supply 2 for driver I "L" level for high-voltage circuits
15 VIN+ Positive regulated voltage I Positive regulated voltage block
block voltage input voltage input pin
41 VIN – Negative regulated voltage I Negative regulated voltage block
block voltage input voltage input pin
11 HD HD pulse input I HD pulse input pin
19 IV2 Transfer pulse input I Charge transfer pulse input pin
18 IV4 Transfer pulse input I Charge transfer pulse input pin
36 IV1 Transfer pulse input I Charge transfer pulse input pin
37 IV3 Transfer pulse input I Charge transfer pulse input pin
35 CH1 Charge pulse input I Charge readout pulse input pin
38 CH2 Charge pulse input I Charge readout pulse input pin
34 ISUB SUB pulse input I Unwanted charge rejection pulse input pin
17 SENSE1 Positive voltage sensing I Positive voltage control sensing pin
input
39 SENSE2 Negative voltage sensing I Negative voltage control sensing pin
input
43 C1+ C1 connection O Booster block voltage charging capacitor
1 C1– connection pins
2 C2+ C2 connection O Booster block voltage charging capacitor
C2– connection pins
44 C3+ C3 connection O Booster block voltage charging capacitor
3 C3 – connection pins
4 C4 – C4 connection O Booster block voltage charging capacitor
connection pins
5 C5 – C5 connection O Booster block voltage charging capacitor
connection pins
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MN3113F For Video Equipment
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Pin Descriptions (continued)Pin No. Symbol Pin Name I/O Function Description
7 C6 – C6 connection pins O Booster block voltage charging capacitor
9 C6+ connection pins
10 OVDD Booster block positive O Booster block positive voltage output pin
voltage output
6 OVEE Booster block negative O Booster block negative voltage output pin
voltage output
16 VOUT+ Positive regulated voltage O Positive regulated voltage output pin
output
40 VOUT– Negative regulated voltage O Negative regulated voltage output pin
output
23 OV4 Binary transfer pulse O Binary (VM24 , VL1) transfer pulse
output output pin
25 OV2 Binary transfer pulse O Binary (VM24 , VL1) transfer pulse
output output pin
26 OV3 Tristate transfer pulse O Tristate (VH , VM13 , VL1) transfer pulse
output output pin
28 OV1 Tristate transfer pulse O Tristate (VH , VM13 , VL1) transfer pulse
output output pin
31 OSUB SUB pulse output O Unwanted charge (VHH , VL2) rejection
pulse input pin
12 CAP1 Stabilizing capacitor O Pins for connecting capacitors for internal
13 CAP2 connection voltage stabilization circuits
14 CAP3
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For Video Equipment MN3113F
5
Functional Description
Binary transfer pulses (vertical driver block)IV2 OV2
IV4 OV4
H L
L M
Tristate transfer pulses (vertical driver block)CH1 IV1 OV1
CH2 IV3 OV3
HH L
L M
LH L
L H
*1 IV1, IV2, IV3, IV4, CH1, CH2
H: VCC
L: GND
OV1, OV2, OV3, OV4
H: VH
M: VM13 , or VM24
L: VL1
Unwanted charge rejection pulses (SUB driver block)ISUB OSUB
H L
L H
*1 ISUB
H: VCC
L: GND
OSUB
H: VHH
L: VL2
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MN3113F For Video Equipment
6
Electrical Characteristics(1) DC characteristics
VHH=VH=15.0V , VM13=VM24=1.0V , GND=0.0V ,
VCC1=VCC2=5.0V (=VCC), VL1 =–7.0V , VL2 =–10.0V , Ta=+25˚C
Parameter Symbol Test conditions min typ max UnitQuiescent supply current IDDST VI=GND , VCC 2 4 mA
Operating supply current IDDDYN VI=GND , VCC 45 90 mA
Power supply output pins OVDD , OVEE
Positive voltage stabilization VOUT+ VI=GND , VCC , IO=7mA 14.5 15.0 15.5 V
circuit output voltage fINHD=15.7kHz
Negative voltage stabilization VOUT– VI=GND , VCC , IO=–2mA –10.5 –10.0 –9.5 V
circuit output voltage fINHD=15.7kHz
Input pins IV1 , IV2 , IV3 , IV4 , CH1 , CH2 , ISUB , HD
"H" level voltage VIH 3.5 VCC V
"L" level voltage VIL GND 1.5 V
Input leak current ILI VI=0 to 5V ±1 µA
Output pins 1 (Binary output) OV2 , OV4
Output voltage "M" level VOM1 VI=GND , VCC , IOM1=–1mA 0.9 VM24 V
Output voltage "L" level VOL1 VI=GND , VCC , IOL1=1mA VL1 –6.9 V
Output on resistance "M" level RONM1 IOM1=–50mA 40 ΩOutput on resistance "L" level RONL1 IOL1=50mA 40 Ω
Output pins 2 (Tristate output) OV1 , OV3
Output voltage "H" level VOH2 VI=GND , VCC , IOH2=–1mA 14.9 VH V
Output voltage "M" level VOM2 VI=GND , VCC , IOM2=–1mA 0.9 VM13 V
Output voltage "L" level VOL2 VI=GND , VCC , IOL2=1mA VL1 –6.9 V
Output on resistance "H" level RONH2 IOH2=–50mA 50 ΩOutput on resistance "M" level RONM2 IOM2=±50mA 40 ΩOutput on resistance "L" level RONL2 IOL2=50mA 40 Ω
Output pin 3 (SUB output) OSUB
Output voltage "H" level VOHH3 VI=GND , VCC , IOHH3 =–1mA 14.9 VHH V
Output voltage "L" level VOL3 VI=GND , VCC , IOL3=1mA VL2 –9.9 V
Output on resistance "H" level RONHH3 IONHH3=–50mA 50 ΩOutput on resistance "L" level RONL3 IONL3=50mA 40 Ω
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For Video Equipment MN3113F
7
(2) AC characteristics
VHH=VH=15.0V , VM13=VM24=1.0V , GND=0.0V ,
VCC1=VCC2=5.0V (=VCC) , VL1=–7.0V , VL2=–10.0V , Ta=+25˚C
Parameter Symbol Test Conditions min typ max UnitOutput pins 1 (Binary output) OV2 , OV4
Transmission delay time tPLM No load 100 200 ns
tPML From "L" level to "M" level
Rise time tTLM 200 300 ns
Fall time tTML
Output pins 2 (Tristate output) OV1 , OV3
Transmission delay time tPLM No load 100 200 ns
tPML From "L" level to "M" level
Transmission delay time tPMH No load 200 400 ns
tPHM From "M" level to "H" level
Rise time tTLM 200 300 ns
Fall time tTML
Rise time tTMH 200 300 ns
Fall time tTHM
Output pin 3 (SUB output) OSUB
Transmission delay time tPLHH No load 100 200 ns
tPHHL From "L" level to "H" level
Risie time tTLHH 200 300 ns
Fall time tTHHL
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MN3113F For Video Equipment
8
Timing Chart
1. Binary transfer pulses
2. Binary transfer pulses
3. Tristate transfer pulses
4. Tristate transfer pulses
5. SUB pulses
H
L
L
M
H
M
L
L
H
H
H
L
L
M
L
H
H
H
H
H
M
L
L
L
L
L
63.5µs254µs
2µs
IV2
OV2
IV4
OV4
IV1
CH1
IV3
ISUB
CH2
OV1
OV3
OSUB
3µs
63.5µs
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For Video Equipment MN3113F
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Notes
*1: These diodes must have a VF of 0.7V.
*2: These diodes must be Schottky barrier diodes (MA723).
*3: The booster circuit's electrolytic capacitors (C1 to C8) and voltage stabilization capacitors (C9 and C10) must have
little impedance fluctuation at low temperatures.
Application Circuit Example
34
35
36
37
38
39
40
41
42
43
44
ISUB
CH1
IV1
IV3
CH2
SENSE2
VOUT–
VIN –
GND
C1+
C3+
1 2 3 4 5 6 7 8 9 10 11
C1–
C2–
C3
–
C5
–
C4
–
OV
EE
C6
–
VC
C1
C6+
OV
DD
HD
33 32 31 30 29 28 27 26 25 24 23
VE
E
VH
H
OSU
B
VL
2
VL
1
OV
1
VM
13
OV
3
OV
2
VM
24
OV
4
22
12
13
14
15
16
17
18
19
20
21VDD
VCC2
IV2
IV4
SENSE1
VOUT+
VIN+
CAP3
CAP2
CAP1
VH
C4C2 C
8
D1
C1
C9
D7
R4
C19
C20
R5
D3*1
*1
*2
*2
D4
D5 C17
D6
C18
< +15
.0V
>
< –7.
9V >
< –7.
2V >
< –10
.0V
>
C14
R1
C16
to C
CD
’s s
ourc
e fo
llow
er p
ower
su
pply
for
OD
, R
D, a
nd I
S pi
ns
to C
CD
’s
øV p
in
to C
CD
’s
PT p
in
C15
R3
R2
C12
C13
5 vo
lt in
put
C5
C3
C1
C10
C6
D2
+
+
+
+
+
+
++
from
clo
ck
gene
rato
r
Schottky barrier diode
Diode with VF =0.7V
+
++
+
+
+
from
clo
ck g
ener
ator
C7
+
MN3113F
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MN3113F For Video Equipment
10
Package Dimensions (Unit: mm)
33
12.3±0.4
10.0±0.2
23
34
44
1 11
0.6±0.2
1.15±0.2
10.0
±0.2
12.3
±0.4
2.1±
0.3
0.1±
0.1
2.0±
0.2
(1.0
)
22
12
(1.0)
Seating plane
0° to 10°
0.35±0.1
0.1
0.8
0.15
+0.
1-0
.05
QFP044-P-1010
Note) The package of this product will be changed to lead-free type (QFP044-P-1010E). See the new package dimensions section
later of this datasheet.
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For Video Equipment MN3113F
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Usage Notes
External components1. This product requires two Schottky barrier diodes.
We recommend the following components.
Schottky barrier diodes: MA723 or equivalents
Ta=25˚C
Component Model number Typical characteristics Notes
Schottky barrier diodes MA723 IF =200mA, VF ≤ 0.55V
The MN3113F will not operate properly if the components do not satisfy the above specifications.
2. Always use the specified components for peripheral circuits so as to ensure that OVEE and VL do not reversepotentials when the power is turned off.
As the above sketch illustrates, allowing OVEE to exceed VL1 and VL2 by more than 0.7 V produces the riskof applying a forward bias to the PN junction, turning on the parasitic transistor, and generating anovercurrent that produces latch-up.
If this phenomenon arises, increase the size of capacitor C8 or decrease the size of capacitor C10 to increasethe OVEE time constant.
(See the sample application circuit for the locations of C8 and C10.)
Normal operationGND
OFF
VL1/VL2
OVEE
Faulty operation
0.7V or higher
Reversal
GND
OFF
VL1/VL2
OVEE
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MN3113F For Video Equipment
12
3. Adjusting boost voltages with SENSE pins
The MN3113F provides the SENSE pins, SENSE1 and SENSE2, for adjusting the boost voltages (VOUT+
and VOUT– ) with the following procedures.
Adjusting the positive boosted voltage
(1) Making VOUT+ < 15V
Insert a resistor, R, between the SENSE1 pin (pin 17) and the VOUT+ pin (pin 16). The theoretical outputvoltage at the VOUT+ pin is then given by the following formula.
VOUT+' = VCC x 50kΩ + 100kΩ//R
50kΩ
(where 100 kΩ//R is the effective resistance ofthe 100 kΩ resistor and R connected in parallel.)
For example, if R is 50 kΩ,
VOUT+' = 5 x 50kΩ + 33.3kΩ
= 8.3V 50kΩ
(2) Making VOUT+ > 15V
Insert a resistor, R, between the SENSE1 pin (pin 17) and the GND pin (pin 42).
VOUT+' = VCC x 50kΩ//R + 100kΩ
50kΩ//R
Adjusting the negative boosted voltage
(1) Making VOUT– < –10V
Insert a resistor, R, between the SENSE2 pin (pin 39) and the GND pin (pin 42).
VOUT–' = VCC x 50kΩ//R + 50kΩ
50kΩ//R
(2) Making VOUT– > –10V
Insert a resistor, R, between the SENSE2 pin (pin 39) and the VOUT– pin (pin 40).
VOUT–' = –VCC x 50kΩ + 50kΩ//R
50kΩ
For example, if R is 50 kΩ,
VOUT–' = –5 x 50kΩ + 25kΩ
= –7.5V 50kΩ
Note, however, that the above formulas are mere guidelines, that the internal resistances vary betweensamples, and that therefore each sample will have to be adjusted.
Note also that booster circuit capacity and output load current impose limits on adjustments for boostingVOUT+ above 15V and VOUT– below –10V.
(The maximum possible adjustments are 20V for VOUT+ and –15V for VOUT– .)
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For Video Equipment MN3113F
13
New Package Dimensions (Unit: mm)
• QFP044-P-1010E (Lead-free package)
0.10
±0.1
0
22
23
12
11
33
34
1
44
10.0
0±0.
20
12.3
0±0.
40(1.0
0)
12.30±0.40
10.00±0.20
2.10
±0.
30
2.00
±0.
20
Seating plane
1.15±0.20
0.60±0.20
0.35±0.10(1.00)
0° to 10°
0.15
+0.
10
-0.0
5
0.80
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Request for your special attention and precautions in using the technical information andsemiconductors described in this book
(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book.
(3)The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-ucts may directly jeopardize life or harm the human body. Any applications other than the standard applications intended.
(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7)This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
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