for information purposes only features description
TRANSCRIPT
LT5503
15503fa
For more information www.linear.com/LT5503
Typical applicaTion
FeaTures DescripTion
1.2GHz to 2.7GHz Direct IQ Modulator and Mixer
The LT®5503 is a front-end transmitter IC designed for low voltage operation. The IC contains a high frequency quadrature modulator with a variable gain amplifier (VGA) and a balanced mixer. The modulator includes a precision 90° phase shifter which allows direct modulation of an RF signal by the baseband I and Q signals.
In a superheterodyne system, the mixer can be used to generate the high frequency RF input for the modulator by mixing the system’s 1st and 2nd local oscillators.
The LT5503 modulator output P 1dB is –3dBm at 2.5GHz. The VGA allows output power reduction in three steps up to 13dB with digital control. The baseband inputs are internally biased for maximum input voltage swing at low supply voltage. If needed, they can be driven with external bias voltages.
2.45GHz Transmitter Application, Carrier for Modulator Generated by Upmixer
applicaTions
n Single 1.8V to 5.25V Supply n Direct IQ Modulator with Integrated 90° Phase
Shifter* n 4-Step RF Power Control n 120MHz Modulation Bandwidth n Independent Double-Balanced Mixer n Modulation Accuracy Insensitive to Carrier Input
Power n Modulator I/Q Inputs Internally Biased n Available in 20-Lead FE Package
n IEEE 802.11 DSSS and FHSS n High Speed Wireless LAN (WLAN) n Wireless Local Loop (WLL) n PCS Wireless Data n MMDS
MODOUT0°
90°÷2
÷1
CONTROLLOGIC
GC1 GC2GND
MX– MX+
LO2
2.45GHzBPF
VCC12VVCC2
2V
2.45GHzMODULATED
RFOUTBI+ BI–
BQ+ BQ–
VCCMODVCCRFVCCLO1VCCLO2 MODIN
LT5503
VCCVGA
LO1
LO1IN (2075MHz)
LO2IN(750MHz)
DMODE
MIXEN
MODEN
MIXERENABLE
MODULATORENABLE
5503 TA01
VGA
I, Q DIFFERENTIAL INPUT VOLTAGE (VP-P)0.01
SSB
OUTP
UT P
OWER
(dBm
)
1
0
–5
–10
–15
–20
–25
–30
–35
–40
–45
5503 G04
0.1 10
5.25 VDC 3 VDC1.8 VDC
SSB Output Power vs I, Q Amplitude
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. Patents pending.
OBSOLETE:FOR INFORMATION PURPOSES ONLYContact Linear Technology for Potential Replacement
LT5503
25503fa
For more information www.linear.com/LT5503
absoluTe MaxiMuM raTings
Supply Voltage ........................................................ 5.5VControl Voltages .......................... –0.3V to (VCC + 0.3V)Baseband Voltages (BI+ to BI– and BQ+ to BQ–) .......±2VBaseband Common Mode Voltage .....1V to (VCC – 0.3V)LO1 Input Power ....................................................4dBmLO2 Input Power ....................................................4dBmMODIN Input Power ...............................................4dBmOperating Temperature Range ................. –40°C to 85°CStorage Temperature Range .................. –65°C to 150°CLead Temperature (Soldering, 10 sec) ................... 300°C
(Note 1)
orDer inForMaTionLEAD FREE FINISH TAPE AND REEL PART MARKING PACKAGE DESCRIPTION TEMPERATURE RANGE
OBSOLETE PART
LT5503EFE#PBF LT5503EFE#TRPBF 5503 20-Lead Plastic TSSOP –40°C to 85°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. Consult LTC Marketing for information on non-standard lead based finish parts.For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
pin conFiguraTion
1
2
3
4
5
6
7
8
9
10
TOP VIEW
20
19
18
17
16
15
14
13
12
11
BQ–
BQ+
GC1
MODIN
VCCMOD
VCCRF
LO1
VCCLO1
DMODE
MX+
BI–
BI+
GC2
MODOUT
VCCVGA
VCCLO2
LO2
MODEN
MIXEN
MX–
FE PACKAGE20-LEAD PLASTIC TSSOP
21
TJMAX = 150°C, θJA = 38°C/W
EXPOSED PAD IS GND (PIN 21)MUST BE SOLDERED TO PCB
LT5503
35503fa
For more information www.linear.com/LT5503
elecTrical characTerisTics (I/Q Modulator) VCC1 = 3VDC, 2.4GHz matching, MODEN = High, GC1 = GC2 = Low, TA = 25°C, MODRFIN = 2.45GHz at –16dBm, [I – IB] and [Q – QB] = 100kHz CW signal at 1VP-P differential, Q leads I by 90°, unless otherwise noted. (Test circuit shown in Figure 2.) (Note 3)
PARAMETER CONDITIONS MIN TYP MAX UNITS
RF Carrier Input (MODRFIN)
Frequency Range2 Requires Appropriate Matching 1.2 to 2.7 GHz
Input VSWR ZO = 50Ω 1.3:1
Input Power –20 to –10 dBm
Baseband Inputs (BI+, BI–, BQ+, BQ–)
Frequency Bandwidth (3dB) 120 MHz
Differential Input Voltage for 1dB Compressed Output 1 VP-P
DC Common Mode Voltage Internally Biased 1.4 VDC
Differential Input Resistance 18 kΩ
Input Capacitance 0.8 pF
Gain Error ±0.2 dB
Phase Error ±1 DEG
Modulated RF Carrier Output (MODRFOUT)
Output Power, Max Gain –6 –3 dBm
Output VSWR ZO = 50Ω 1.5:1
Image Suppression –26 –34 dBc
Carrier Suppression –24 –32 dBc
Output 1dB Compression –3 dBm
Output 3rd Order Intercept f1 = 100kHz, fQ = 120kHz 2 dBm
Output 2rd Order Intercept f1 = 100kHz, fQ = 120kHz 16 dBm
Broadband Noise 20MHz Offset –142 dBm/Hz
VGA Control Logic (GC2, GC1)
Switching Time 100 ns
Input Current 2 µA
Input Low Voltage 0.4 VDC
Input High Voltage 1.7 VDC
Output Power Attenuation GC2 = Low, GC1 = High 4.5 dB
Output Power Attenuation GC2 = High, GC1 = Low 9 dB
Output Power Attenuation GC2 = High, GC1 = High 13.5 dB
Modulator Enable (MODEN) Low = Off, High = On
Turn ON/OFF Time 1 µs
Input Current 105 µA
Enable VCC – 0.4 VDC
Disable 0.4 VDC
Modulator Power Supply Requirements
Supply Voltage 1.8 5.25 VDC
Modulator Supply Current MODEN = High 29 38 mA
Modulator Shutdown Current MODEN = Low 50 µA
LT5503
45503fa
For more information www.linear.com/LT5503
elecTrical characTerisTics
VCC2 = 3VDC, 2.4GHz matching, MIXEN = High, DMODE = Low (LO2 ÷ 2 mode), TA = 25°C, LO2IN = 750MHz at –18dBm, LO1IN = 2075MHz at –12dBm. MIXRFOUT measured at 2450MHz, unless otherwise noted. (Test circuit shown in Figure 2.) (Note 3)
(Mixer)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Mixer 2nd LO Input (LO2IN)
Frequency Range Internally Matched 50 to 1000 MHz
Input VSWR ZO = 50Ω 1.4:1
Input Power –20 to –12 dBm
Mixer 1st LO Input (LO1IN)
Frequency Range2 Requires Appropriate Matching 1400 to 2400 MHz
Input VSWR ZO = 50Ω 1.5:1
Input 3rd Order Intercept –30dBm/Tone, ∆f = 200kHz –12 dBm
Mixer RF Output (MIXRFOUT)
Frequency Range2 Requires Appropriate Matching 1700 to 2700 MHz
Output VSWR ZO = 50Ω 1.5:1
Small-Signal Conversion Gain PLO1 = –30dBm 5 dB
Output Power –14.7 –12.7 dBm
LO1 Suppression –22 –29 dBc
Output 1dB Compression –15 dBm
Broadband Noise 20MHz Offset –152 dBm/Hz
LO2 Divider Mode Control (DMODE) Low = fLO2 ÷ 2, High = fLO2 ÷ 1
Input Current 1 µA
Input Low Voltage (÷2) 0.4 VDC
Input High Voltage (÷1) VCC – 0.4 VDC
Mixer Enable (MIXEN) Low = Off, High = On
Turn ON/OFF Time 1 µs
Input Current 130 µA
Enable VCC – 0.4 VDC
Disable 0.4 VDC
Mixer Power Supply Requirements
Supply Voltage 1.8 5.25 VDC
Supply Current (÷2 mode) DMODE = Low, MIXEN = High 11.9 15.5 mA
Supply Current (÷1 mode) DMODE = High, MIXEN = High 10.8 mA
Shutdown Current MIXEN = Low 10 µA
Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime.
Note 2: External component values on the final test circuit shown in Figure 2 are optimized for operation in the 2.4GHz to 2.5GHz band.Note 3: Specifications over the –40°C to 85°C temperature range are assured by design, characterization and correlation with statistical process controls.
LT5503
55503fa
For more information www.linear.com/LT5503
Typical perForMance characTerisTics
Modulator Supply Current vs Supply Voltage
Modulator Shutdown Current vs Supply Voltage
MODEN Current vs Enable Voltage
Baseband Frequency Response I/Q Amplitude = 1VP-P
Typical SSB Spectrum
MODRFIN and MODRFOUT Return Loss 2.4GHz Matching
VCC1 = 3VDC, 2.4GHz matching, MODEN = high, GC1 = GC2 = low (max gain), TA = 25°C, MODRFIN = 2.45GHz at –16dBm, (I–IB) and (Q–QB) = 100kHz sine at 1VP-P differential, Q leads I by 90°, unless otherwise noted. (Test circuit shown in Figure 2.)
(I/Q Modulator)
2.45GHz Modulated Output Power vs Supply Voltage
VCC1 SUPPLY VOLTAGE (V)1.8
SUPP
LY C
URRE
NT (m
A)
3.2 4.6 5.3
38
36
34
32
30
28
26
24
22
20
5503 G01
2.5 3.9
TA = 85°C
TA = 25°C
TA = –40°C
VCC1 SUPPLY VOLTAGE (V)1.8
SHUT
DOW
N CU
RREN
T (µ
A)
3.2 4.6 5.3
100
10
1
0.1
5503 G02
2.5 3.9
TA = 85°C
TA = 25°C
TA = –40°C
MODEN = LOW
MODEN VOLTAGE (V)1.8
INPU
T CU
RREN
T (µ
A)
3.2 4.6 5.3
220
200
180
160
140
120
100
80
60
40
5503 G03
2.5 3.9
TA = 85°C
TA = –40°C
MODEN = VCC1
TA = 25°C
SUPPLY VOLTAGE (V)1.8
OUTP
UT P
OWER
(dBm
)
–2
–3
–4
–5
–62.4 3.0 3.6 4.2
5503 TA01b
4.8 5.4
PLO1 = –12dBmPLO2 = –18dBmBASEBAND = 1VP-PTA = 25°C
I, Q INPUT FREQUENCY (MHz)
OUT
PUT
POW
ER (d
Bm)
1
0
–5
–10
–15
–20
–25
–30
–35
–40
5503 G05
0.1 10
IMAGE
CARRIER
DESIREDSIDEBAND
FREQUENCY (MHz)2050
RETU
RN L
OSS
(dB)
–20
–10
2850
5503 G06
–30
–402250 2450 2650
0
MODRFOUT
MODRFIN
FREQUENCY (MHz)
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
P OUT
(dBm
)
5503 G07
2449.6 2449.8 2450.0 2450.2 2450.4 2450.6
LT5503
65503fa
For more information www.linear.com/LT5503
Typical perForMance characTerisTics
SSB Output Power vs Input Power VCC1 = 1.8V
Carrier Suppression vs Input Power VCC1 = 1.8V
SSB Output Power vs Input Power VCC1 = 3V
Carrier Suppression vs Input Power VCC1 = 3V
Image Suppression vs Input Power VCC1 = 3V
SSB Output Power vs Input Power VCC1 = 5.25V
Carrier Suppression vs Input Power VCC1 = 5.25V
Image Suppression vs Input Power VCC1 = 5.25V
Image Suppression vs Input Power VCC1 = 1.8V
2.4GHz matching, MODEN = high, GC1 = GC2 = low (max gain), MODRFIN = 2.45GHz, (I–IB) and (Q–QB) = 100kHz sine at 1VP-P differential, Q leads I by 90°, unless otherwise noted. (Test circuit shown in Figure 2.)
(I/Q Modulator)
MODRFIN INPUT POWER (dBm)–24 –22 –20 –18 –16 –14 –12 –10
SSB
OUTP
UT P
OWER
(dBm
)
–2
–4
–6
–8
–10
–12
–14
–16
–18
–20
5503 G08
TA = 85°C
TA = 25°C
TA = –40°C
MODRFIN INPUT POWER (dBm)–24 –22 –20 –18 –16 –14 –12 –10
CARR
IER
SUPP
RESS
ION
(dBc
)
–20
–30
–40
–50
5503 G09
TA = 85°C
TA = 25°C
TA = –40°C
MODRFIN INPUT POWER (dBm)–24 –22 –20 –18 –16 –14 –12 –10
IMAG
E SU
PPRE
SSIO
N (d
Bc)
–20
–30
–40
–50
5503 G10
TA = 85°C
TA = 25°C
TA = –40°C
MODRFIN INPUT POWER (dBm)–24 –22 –20 –18 –16 –14 –12 –10
SSB
OUTP
UT P
OWER
(dBm
)
0
–2
–4
–6
–8
–10
–12
–14
–16
–18
5503 G11
TA = 85°C
TA = 25°C
TA = –40°C
MODRFIN INPUT POWER (dBm)–24 –22 –20 –18 –16 –14 –12 –10
CARR
IER
SUPP
RESS
ION
(dBc
)
–20
–30
–40
–50
5503 G12
TA = 85°C
TA = 25°C
TA = –40°C
MODRFIN INPUT POWER (dBm)–24 –22 –20 –18 –16 –14 –12 –10
IMAG
E SU
PPRE
SSIO
N (d
Bc)
–20
–30
–40
–50
5503 G13
TA = 85°C
TA = 25°CTA = –40°C
MODRFIN INPUT POWER (dBm)–24 –22 –20 –18 –16 –14 –12 –10
SSB
OUTP
UT P
OWER
(dBm
)
0
–2
–4
–6
–8
–10
–12
–14
–16
–18
5503 G14
TA = 85°C
TA = 25°C
TA = –40°C
MODRFIN INPUT POWER (dBm)–24 –22 –20 –18 –16 –14 –12 –10
CARR
IER
SUPP
RESS
ION
(dBc
)
–20
–30
–40
–50
5503 G15
TA = 85°C
TA = 25°C
TA = –40°C
MODRFIN INPUT POWER (dBm)–24 –22 –20 –18 –16 –14 –12 –10
IMAG
E SU
PPRE
SSIO
N (d
Bc)
–20
–30
–40
–50
5503 G16
TA = 85°C
TA = 25°C
TA = –40°C
LT5503
75503fa
For more information www.linear.com/LT5503
Typical perForMance characTerisTics
Output Power vs Frequency 1.2GHz Matching
Carrier Feedthrough vs Frequency1.2GHz Matching
SSB Image vs Frequency1.2GHz Matching
Output Power vs Frequency1.9GHz Matching
Carrier Feedthrough vs Frequency1.9GHz Matching
SSB Image vs Frequency1.9GHz Matching
Output Power vs Frequency2.4GHz Matching
Carrier Feedthrough vs Frequency2.4GHz Matching
SSB Image vs Frequency2.4GHz Matching
VCC1 = 3VDC, MODEN = high, TA = 25°C, PMODRFIN = –16dBm, (I–IB) and (Q–QB) = 100kHz sine at 1VP-P differential, Q leads I by 90°, unless otherwise noted. (Test circuit shown in Figure 2.)
(I/Q Modulator)
MODRFIN FREQUENCY (MHz)1000 1100 1200 1300 1400
SSB
OUTP
UT P
OWER
(dBm
)
0
–2
–4
–6
–8
–10
–12
–14
–16
–18
–20
5503 G17
GC2, GC1 = 00
01
11
10
MODRFIN FREQUENCY (MHz)1000 1100 1200 1300 1400
5503 G18
CARR
IER
(dBm
)
–30
–40
–50
–60
GC2, GC1 = 00
10
11
01
MODRFIN FREQUENCY (MHz)1000 1100 1200 1300 1400
5503 G19
IMAG
E (d
Bm)
–30
–40
–50
–60
GC2, GC1 = 00
10
11
01
MODRFIN FREQUENCY (MHz)1650 1750 1850 20501950 2150
SSB
OUTP
UT P
OWER
(dBm
)
2
0
–2
–4
–6
–8
–10
–12
–14
–16
–18
5503 G20
GC2, GC1 = 00
01
10
11
MODRFIN FREQUENCY (MHz)1650 1750 1850 20501950 2150
5503 G21
CARR
IER
(dBm
)
–30
–40
–50
–60
GC2, GC1 = 00
10
11
01
MODRFIN FREQUENCY (MHz)1650 1750 1850 20501950 2150
5503 G22
IMAG
E (d
Bm)
–30
–40
–50
–60
GC2, GC1 = 00
10
11
01
MODRFIN FREQUENCY (MHz)2250 2350 2450 26502550
SSB
OUTP
UT P
OWER
(dBm
)
0
–2
–4
–6
–8
–10
–12
–14
–16
–18
5503 G23
GC2, GC1 = 00
01
10
11
MODRFIN FREQUENCY (MHz)2250 2350 2450 26502550
5503 G24
GC2, GC1 = 00
01
10
11
CARR
IER
(dBm
)
–30
–40
–50
–60
MODRFIN FREQUENCY (MHz)2250 2350 2450 26502550
5503 G25
GC2, GC1 = 00
10
11
IMAG
E (d
Bm)
–30
–40
–50
–60
01
LT5503
85503fa
For more information www.linear.com/LT5503
Typical perForMance characTerisTics
Mixer Supply Current vs Supply Voltage (LO2 ÷ 2 Mode)
Mixer Supply Current vs Supply Voltage (LO2 ÷ 1 Mode)
Mixer Shutdown Current vs Supply Voltage
RF Output Power vs LO1 Input Power (VCC2 = 1.8V)
RF Output Power vs LO1 Input Power (VCC2 = 3V)
RF Output Power vs LO1 Input Power (VCC2 = 5.25V)
LO1 Feedthrough vs LO1 Input Power (VCC2 = 1.8V)
LO1 Feedthrough vs LO1 Input Power (VCC2 = 3V)
LO1 Feedthrough vs LO1 Input Power (VCC2 = 5.25V)
2.4GHz matching, MIXEN = high, DMODE = low (LO2 ÷ 2 mode), LO2IN = 750MHz at –18dBm, LO1IN = 2075MHz. MIXRFOUT measured at 2450MHz, unless otherwise noted. (Test circuit shown in Figure 2.)
(Mixer)
VCC2 SUPPLY VOLTAGE (V)1.8
SUPP
LY C
URRE
NT (m
A)
14
13
12
11
10
9
82.5 3.2 4.63.9
5503 G26
5.3
TA = 85°C
TA = 25°C
TA = –40°C
VCC2 SUPPLY VOLTAGE (V)1.8
SUPP
LY C
URRE
NT (m
A)
14
13
12
11
10
9
82.5 3.2 4.63.9
5503 G27
5.3
TA = 85°C
TA = 25°C
TA = –40°C
DMODE = HIGH
VCC2 SUPPLY VOLTAGE (V)1.8
SHUT
DOW
N CU
RREN
T (µ
A)
100
10
1
0.12.5 3.2 4.63.9
5503 G28
5.3
TA = 85°C
TA = 25°C TA = –40°C
MIXEN = LOW
LO1IN POWER (dBm)–30
MIX
RFOU
T PO
WER
(dBm
)
–6
1195 G29
–24 –18 –12 –9–27 –21 –15
–12
–14
–16
–18
–20
–22
–24
–26
–28
TA = 85°C
TA = –40°C
TA = 25°C
LO1IN POWER (dBm)–30
MIX
RFOU
T PO
WER
(dBm
)
–6
1195 G30
–24 –18 –12 –9–27 –21 –15
–12
–14
–16
–18
–20
–22
–24
–26
–28
TA = 85°C
TA = –40°C
TA = 25°C
LO1IN POWER (dBm)–30
MIX
RFOU
T PO
WER
(dBm
)
–6
1195 G31
–24 –18 –12 –9–27 –21 –15
–12
–14
–16
–18
–20
–22
–24
–26
–28
TA = 85°C
TA = –40°C
TA = 25°C
LO1IN POWER (dBm)–30
LO1
FEED
THRO
UGH
(dBc
)
–6
1195 G32
–24 –18 –12 –9–27 –21 –15
–20
–25
–30
–35
–40
TA = 85°C
TA = –40°C
TA = 25°C
LO1IN POWER (dBm)–30
LO1
FEED
THRO
UGH
(dBc
)
–6
1195 G33
–24 –18 –12 –9–27 –21 –15
–20
–25
–30
–35
–40
TA = 85°C
TA = –40°CTA = 25°C
LO1IN POWER (dBm)–30
LO1
FEED
THRO
UGH
(dBc
)
–6
1195 G34
–24 –18 –12 –9–27 –21 –15
–20
–25
–30
–35
–40
TA = 85°C
TA = –40°C
TA = 25°C
LT5503
95503fa
For more information www.linear.com/LT5503
Typical perForMance characTerisTics
RF Output Power and LO1 Feedthrough 1.9GHz Matching
Small-Signal Conversion Gain and IIP3 1.9GHz Matching
LO1IN and MIXRFOUT Return Loss 1.9GHz Matching
RF Output Power and LO1 Feedthrough 2.4GHz Matching
Small-Signal Conversion Gain and IIP3 2.4GHz Matching
LO1 and MIXRFOUT Return Loss 2.4GHz Matching
MIXEN Input Current vs Enable Voltage (MIXEN = VCC2)
VCC2 = 3VDC, MIXEN = high, DMODE = low (LO2 ÷ 2mode), TA = 25°C, unless otherwise noted. (Test circuit shown in Figure 2.)(Mixer)
RF OUTPUT FREQUENCY (MHz)1650
RF O
UTPU
T (d
Bm)
–12
–14
–16
–18
–20
–22
0
–10
–20
–30
–40
–502050
5503 G35
1750 1850 1950 2150
OUTPUTPOWER
LO1FEEDTHROUGH
LO2IN = 480MHz AT –18dBmLO1IN = fRF –240MHz AT –12dBm
LO1 (dBc)
RF OUTPUT FREQUENCY (MHz)1650
CONV
ERSI
ON G
AIN
(dB)
6
4
2
0
–2
–4
–3
–6
–9
–12
–15
–182050
5503 G36
1750 1850 1950 2150
IIP3
SMALL-SIGNALCONVERSIONGAIN
LO2IN = 480MHz AT –18dBmLO1IN = fRF –240MHz AT –30dBm/TONE
IIP3 (dBm)
FREQUENCY (MHz)1100
RETU
RN L
OSS
(dB)
0
–5
–10
–15
–20
–25
–301700 2100
5503 G37
1300 1500 1900 2300 2500
LO1IN
MIXRFOUT
RF OUTPUT FREQUENCY (MHz)2250
RF O
UTPU
T (d
Bm)
–12
–14
–16
–18
–20
–22
0
–10
–20
–30
–40
–502650
5503 G38
2350 2450 2550
LO1FEEDTHROUGH
OUTPUT POWER
LO2IN = 750MHz AT –18dBmLO1IN = fRF –375MHz AT –12dBm
LO1 (dBc)
RF OUTPUT FREQUENCY (MHz)2250
CONV
ERSI
ON G
AIN
(dB)
6
4
2
0
–2
–4
–3
–6
–9
–12
–15
–182650
5503 G39
2350 2450 2550
IIP3
SMALL-SIGNALCONVERSIONGAIN
LO2IN = 750MHz AT –18dBmLO1IN = fRF –375MHz AT –30dBm/TONE
IIP3 (dBm)
FREQUENCY (MHz)1450
RETU
RN L
OSS
(dB)
0
–5
–10
–15
–20
–25
–302050 2450
5503 G40
1650 1850 2250 2650 2850
LO1
MIXRFOUT
MIXEN VOLTAGE (V)1.8
INPU
T CU
RREN
T (µ
A)
3.2 4.6 5.3
300
270
240
210
180
150
120
90
60
30
5503 G41
2.5 3.9
TA = 85°C
TA = –40°C
TA = 25°C
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pin FuncTionsBQ– (Pin 1): Negative Baseband Input Pin of the Modulator Q-Channel. This pin is internally biased to 1.4V, but can also be overdriven with an external DC voltage greater than 1.4V, but less than VCC – 0.4V.
BQ+ (Pin 2): Positive Baseband Input Pin of Modulator Q-Channel. This pin is internally biased to 1.4V, but can also be overdriven with an external DC voltage greater than 1.4V, but less than VCC – 0.4V.
GC1 (Pin 3): Gain Control Pin. This pin is the least signifi-cant bit of the 4-step modulator gain control.
MODIN (Pin 4): Modulator Carrier Input Pin. This pin is internally biased and should be AC-coupled. An external matching network is required for a 50Ω source.
VCCMOD (Pin 5): Power Supply Pin for the I/Q Modulator. This pin should be externally connected to the other VCC pins and decoupled with 1000pF and 0.1µF capacitors.
VCCRF (Pin 6): Power Supply Pin for the I/Q Modulator Input RF Buffer and Phase Shifter. This pin should be externally connected to the other VCC pins and decoupled with 1000pF and 0.1µF capacitors.
LO1 (Pin 7): Mixer 1st LO Input Pin. This pin is internally biased and should be AC-coupled. An external matching network is required for a 50Ω source.
VCCLO1 (Pin 8): Power Supply Pin for the Mixer LO1 Cir-cuits. This pin should be externally connected to the other VCC pins and decoupled with 1000pF and 0.1µF capacitors.
DMODE (Pin 9): Mixer 2nd LO Divider Mode Control Pin. Low = divide-by-2, High = divide-by-1.
MX+ (Pin 10): Mixer Positive RF Output Pin. This pin must be connected to VCC through an external matching network.
MX– (Pin 11): Mixer Negative RF Output Pin. This pin must be connected to VCC through an external matching network.
MIXEN (Pin 12): Mixer Enable Pin. When the input volt-age is higher than VCC – 0.4V, the mixer circuits supplied through pins 8, 10, 11 and 15 are enabled. When the input voltage is less than 0.4V, these circuits are disabled.
MODEN (Pin 13): Modulator Enable Pin. When the input voltage is higher than VCC – 0.4V, the modulator circuits supplied through pins 5, 6, 16 and 17 are enabled. When the input voltage is less than 0.4V, these circuits are disabled.
LO2 (Pin 14): Mixer 2nd LO Input Pin. This pin is internally biased and should be AC-coupled. An external matching network is not required, but can be used for improved matching to a 50Ω source.
VCCLO2 (Pin 15): Power Supply Pin for the Mixer LO2 Circuits. This pin should be externally connected to the other VCC pins and decoupled with 1000pF and 0.1µF capacitors.
VCCVGA (Pin 16): Power Supply Pin for the Modulator Variable Gain Amplifier. This pin should be externally connected to the other VCC pins through a 47Ω resistor and decoupled with a good high frequency capacitor (2pF typical) placed close to the pin.
MODOUT (Pin 17): Modulator RF Output Pin. This pin must be externally biased to VCC through a bias choke. An external matching network is required to match to 50Ω.
GC2 (Pin 18): Gain Control Pin. This pin is the most sig-nificant bit of the 4-step modulator gain control.
BI+ (Pin 19): Positive Baseband Input Pin of the Modulator I-Channel. This pin is internally biased to 1.4V, but can also be overdriven with an external DC voltage greater than 1.4V, but less than VCC – 0.4V.
BI– (Pin 20): Negative Baseband Input Pin of the Modulator I-Channel. This pin is internally biased to 1.4V, but can also be overdriven with an external DC voltage greater than 1.4V, but less than VCC – 0.4V.
Exposed Pad (Pin 21): Circuit Ground Return for the En-tire IC. This must be soldered to the printed circuit board ground plane.
LT5503
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block DiagraM
0°90°
5503 BD
MIXER BIAS CIRCUITS
MODULATOR BIAS CIRCUITS
LO1BUFFER
RFBUFFER
CONTROLLOCIC
VGA
V-I V-I
÷2LIM LIM÷1
21 10 11 9
7
8
4
5
2 1 20 19
16
17
18
3
13
12
15
14
6
BQ+ BI+BQ–
MX+ MX– DMODEGND(BACKSIDE)
BI–
VCCMOD
VCCVGA
MODOUT
GC2
GC1
MODEN
MIXEN
VCCLO2
LO2
VCCRF
MODIN
VCCLO1
LO1
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TesT circuiT
20
19
18
17
16
15
14
13
12
11
LO1IN
LO2IN
1
2
3
4
5
6
7
8
9
10
LT5503
5503 F01
1
2 34
5C9
C138.2pF
C438.2pF
MIXRFOUT
T1
BQ–
BQ+
GC1
MODIN
VCCMOD
VCCRF
LO1
VCCLO1
DMODE
MX+
BI–
BI+
GC2
MODOUT
VCCVGA
VCCLO2
LO2
MODEN
MIXEN
MX–
C5 C6
C10
C201000pF
C161µF
C181µF
L6L5
MODEN
MIXEN
C151µF
C171µF
C221000pF
C12.2pF C7
C2
C190.01µF
C23
C14100pF
C3
GC1 GC2
MODRFINMODRFOUT
C11
C121000pF
C210.01µF
C4
VCC2
VCC1
VCC1
QB
Q
IB
I
L3
L4
DMODE
R247Ω
R1L1
L2
NOTE: VCC1 AND VCC2 POWER THE MODULATOR AND UPMIXER SECTIONS RESPECTIVELY.
GND
21 (BACKSIDE)
Application Dependent Component Values1.2GHz Matching (Modulator Only) 1.9GHz Matching 2.4GHz Matching
L1 33nH 22nH 18nHL2 12nH 5.6nH 2.7nHL3 12nH 4.7nH 2.7nHC2, C3, C7 39pF 15pF 8.2pFC10 2.7pF 1.8pF 1.2pFC23 n/a 1.5pF 1.5pFR1 240Ω 390Ω 390ΩC4 n/a 15pF 8.2pFC5, C6 n/a 1.8pF 2.2pFC9 n/a 15pF 2.7pFC11 n/a 2.2pF 1.2pFL4 n/a 6.8nH 4.7nHL5,L6 n/a 5.6nH 2.2nHT1 n/a LDB211G9010C-001 LDB212G4005C-001 Figure 1. Test Schematic for 1.2GHz, 1.9GHz and 2.4GHz Applications
TesT circuiT
LT5503
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applicaTions inForMaTionThe LT5503 consists of a direct quadrature modulator and a mixer. The mixer operates over the range of 1.7GHz to 2.7GHz, and the modulator operates with an output range of 1.2GHz to 2.7GHz. The LT5503 is designed specifically for high accuracy digital modulation with supply voltages as low as 1.8V. It is suitable for IEEE 802.11b wireless local area network (WLAN), MMDS and wireless local loop (WLL) transmitters.
A dual-conversion RF system requires two local oscillators to convert signals between the baseband and RF domains (see Figure 2). The LT5503’s double-balanced mixer can be used to generate the LT5503 modulator’s high frequency carrier input (MODRFIN) by mixing the systems 1st and 2nd local oscillators (LO1 and LO2). In this case, a band-pass filter is required to select the desired mixer output for the modulator input. The mixer’s RF differential output produces –12dBm typically at 2.45GHz and the modula-tor MODIN pin requires ≥ –16dBm, driven single-ended. This allows approximately 4dB margin for bandpass filter
loss. The balanced output from the modulator is applied to a variable gain amplifier (VGA) that provides a single-ended output. Note that the modulator can also be used independently of the mixer, freeing the mixer to be used anywhere in the system. In this case, MODRFIN will be driven from an external frequency source.
Modulator Baseband
The baseband I and Q inputs (BI+/BI– and BQ+/BQ–) are internally biased to 1.4V to maximize the input signal range at low supply voltage. This bias voltage is stable over temperature, and increases by approximately 50mV at the maximum supply voltage. The modulator I and Q inputs have very wide bandwidth (120MHz typical), making the LT5503 suitable for even the most wideband modulation applications. For best carrier suppression and lowest distortion, differential input drive should be used. Single-ended drive is possible too, with the unused inputs AC-coupled to ground.
5503 F02
90°0°
0°
90°
÷2÷1
÷2
1ST LO 2ND LO
D/A
D/A
A/D
A/D
LT5502LT5506
LT5500
LT5503
LNA
I
I
Q
Q
VGA
Figure 2. Example System Block Diagram for a Dual Conversion System
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applicaTions inForMaTionAC-Coupled Baseband. Figure 3 shows the simplified circuit schematic of a high-pass AC-coupled baseband interface.
5505 F03
18k
18k
0.8pF
0.8pF
0.8pF
0.8pF
BQ+
BQ–
BI+
BI–
CCPL
CCPL
CCPL
CCPL
Q
QB
I
IB
LT5503
Figure 3. AC-Coupled Baseband Interface
Figure 4. DC-Coupled Baseband Interface
With approximately 18k of differential input resistance, the suggested minimum AC-coupling capacitor can be determined using the following equation:
CCPL =
1(18 •103 • π • fC)
where fC is the 3dB cut-off frequency of the baseband input signal.
A larger capacitor may be used where the settling time of charging and discharging the AC-coupling capacitor is not critical.
DC-Coupled Baseband. The baseband inputs’ internal bias voltage can be overdriven with an external bias circuit. This facilitates direct interfacing to a D/A converter for faster transient response. In this case, the LT5503’s baseband inputs are DC biased by the converter. The optimal VBIAS is 1.4V, independent of VCC. In general, the maximum VBIAS should be less than VCC – 0.4V. The DC load on each converter output can be approximated using the following equation where IINPUT is the current flowing into a modulator input:
IINPUT =
VBIAS −1.4V9kΩ
Figure 4 shows a simplified circuit schematic for in-terfacing the LT5503’s baseband inputs to the outputs of a D/A converter. OIP and OIN are the positive and negative baseband outputs, respectively, of the converter’s I-channel. Similarly, OQP and OQN are the positive and negative baseband outputs, respectively, of the converter’s Q-channel.
5505 F04
18k
18k
0.8pF
0.8pF
0.8pF
0.8pF
BQ+
BQ–
BI+
BI–
LT5503IINPUT
IINPUT
IINPUT
IINPUT
OIP
OIN
OQP
OQN
D/A
Modulator RF Input (MODRFIN)
The modulator RF input buffer is driven single ended. An internal active balun circuit produces balanced signals to drive the integrated phase shifter. Limiters following the phase shifter output accommodate a wide range of MODRFIN power, resulting in minimal degradation of modulation gain/phase accuracy performance or carrier feedthrough. This pin is easily matched to a 50Ω source with the simple lowpass network shown in Figure 1. This pin is internally biased, therefore an AC-coupling capaci-tor is required.
Modulator VGA (Variable Gain Amp)
The VGA has two digital selection lines to provide a nominal 0dB, 4.5dB, 9dB and 13.5dB attenuation from the maximum modulator output power setting. The logic table is shown below:
ATTENUATION
GC2
LOW HIGH
GC1 Low 0dB 9dB
High 4.5dB 13.5dB
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applicaTions inForMaTionPin 16 should be connected externally to VCC through a low value series resistor (47Ω typical). To assure proper output power control, a good, local high frequency AC ground for Pin 16 is essential. The MODOUT port of the VGA is an open collector configuration. An inductor with high self resonance frequency is required to connect Pin 17 to VCC as a DC return path, and as a part of the output matching network. Additional matching components are required to drive a 50Ω load as shown in Figure 1. The amplifier is designed to operate in Class A for low distor-tion performance. The typical output 1dB compression point (P1dB) is –3dBm at 2.45GHz. When the differential baseband input voltages are higher than 1VP-P, the VGA operates in Class AB mode, and the distortion performance of the modulator is degraded. The logic control inputs do not draw current when they are low. They draw about 2µA each when high.
Mixer LO1 Port
The mixer LO1 input port is the linear input to the mixer. It consists of an active balun amplifier designed to operate over the 1.4GHz to 2.4GHz frequency range. There is a lin-ear relationship between LO1 input power and MIXRFOUT power for LO1 input levels up to approximately – 20dBm. After that, the mixer output begins to compress. When operated in the recommended –14dBm to –8dBm input power range, the mixer is well compressed, which in turn creates a stable output level for the modulator input. As shown in Figure 1, a simple lowpass matching network is required to match this pin to 50Ω. This pin is internally biased, therefore an AC-coupling capacitor is required.
Mixer LO2 Port
The mixer LO2 port is designed to operate in the 50MHz to 1000MHz range. The first stage is a limiting amplifier. This stage produces the correct output levels to drive the internal divider circuit reliably, with LO2 input levels down to –20dBm. The output of the divider then drives another stage, which in turn switches the nonlinear inputs of the double-balanced mixer. Note that the mixer output will produce broadband noise if the LO2 signal level is too low. The input amplifier is designed for a good match over the entire frequency range. The only requirement (Figure 1) is an external AC-coupling capacitor.
Mixer Output Ports (MX+/MX–)
The mixer output is a differential open collector configura-tion. Bias current is supplied to these two pins through the center tap of a balun as shown in Figure 1. Simple lowpass matching is used to transform each leg of the mixer output to 25Ω for the balun’s 50Ω input impedance.
The balun approach provides the highest output power and best LO1 suppression, but is not absolutely neces-sary. It is also possible to match each output to 50Ω and couple power from one output. The unused output should be terminated in the same characteristic impedance. In this case, output power is approximately 2dB lower and LO1 suppression degrades to approximately 15dBc. A schematic for this approach is shown in Figure 6 where inductors LB+ and LB– supply bias current to the mixer’s differential outputs, and resistor RTERM terminates the unused output.
Figure 5. 50Ω Mixer Output Matching Without a Balun
1.9GHz 2.4GHz
L5,L6 5.6nH 2.7nH
C5, C6 1.8pF 0.68pF
C9 15pF 8.2pF
5503 F05
10 11
RTERM51Ω
LB+
MX+ MX–
LB–VCC
L5
C5C9
CBYPASS
C6
L6
MIXRFOUT
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applicaTions inForMaTionEVALUATION BOARD
Figure 6 shows the circuit schematic of the evaluation board. The MODRFIN, MODRFOUT and MIXRFOUT ports are matched to 50Ω at 2.45GHz. The LO1IN port is matched to 50Ω at 2.1GHz and the LO2IN port is internally matched.
A 390Ω resistor is used to reduce the quality factor (Q) of the modulator output and deliver an output power of –3dBm typically. A lower value resistor may be used if the desired output power is lower. For example, the output power will be 3dB lower if a 200Ω resistor is used.
Inductors with high self-resonance frequency should be used for L1 to L6.
For simpler evaluation in a lab environment, the evaluation board includes op amps to convert single-ended I and Q input signals to differential . The op amp configuration has a voltage gain of two; therefore the peak baseband input voltage should be halved to maintain the same RF output power. The op amp configuration shown will maintain acceptable differential balance up to 10MHz typically. It is also possible to bypass the op amps and drive the modulator’s differential inputs directly by connecting to the four oversized vias on the board (V1, V2, V3 and V4).
Figure 6 also shows a table of matching network values for designs centered at 1.9GHz and 1.2GHz.
Figure 7 shows the evaluation board with connectors and ICs. Figure 8 shows the test set-up with the upconverting mixer and IQ modulator connected in a transmit configura-tion. Refer to the demo board DC365A Quick Start Guide for detailed testing information.
RF Layout Tips:
• Use 50Ω impedance transmission lines up to the matching networks, use of a ground plane is a must.
• Keep the matching networks as close to the pins as possible.
• Surface mount 0402 outline (or smaller) parts are recommended to minimize parasitic inductances and capacitances.
• Isolate the MODOUT pin from the LO2 input by putting the LO2 transmission line on the bottom side of the board.
• The only ground connection is through the exposed pad on the bottom of the package. This exposed pad must be soldered to the board in such a way to get complete RF contact.
• Low impedance RF ground connections are essential and can only be obtained by one or more vias tying directly into the ground plane.
• VCC lines must be decoupled with low impedance, broadband capacitors to prevent instability.
• Separate power supply lines should be used to isolate the MODIN signal and other stray signals from the MODOUT line. If possible, power planes should be used.
• Avoid use of long traces whenever possible. Long RF traces in particular can lead to signal radiation and degraded isolation, as well as higher losses.
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applicaTions inForMaTion
Figure 6. Evaluation Circuit Schematic for 1.2GHz, 1.9GHz and 2.4GHz Applications
1
2
3
4
5
6
7
8
9
10
123456
121110987
20
19
18
17
16
15
14
13
12
11
LO1IN LO2IN
5503 F06
1
2 34
5*C9MIXER
OUTT1
BQ–
BQ+
GC1
MODIN
VCCMOD
VCCRF
LO1
VCCLO1
DMODE
MX+
BI–
BI+
GC2
MODOUT
VCCVGA
VCCLO2
LO2
MODEN
MIXEN
MX–
*C5 *C6
*C10
C201000pF
C181µF
*L6*L5
C411µFOPT
C421µFOPT
C394.7µF
C171µF
C334.7µF
C270.01µF
C324.7µF
C221000pF
C12.2pF
*C7 C190.01µF
*C23
*C2
C14100pF
*C3
MODRFIN
MODRFOUT
*C11
C121000pF
C210.01µF
C138.2pF
*C4
VCC2
VCC3
VCC2
VCC2
VCC1
VCC4
VCC4
VCC4
VCC4
VCC1
*L3
*L4
R247Ω
*R1*L1
*L2
21
C450.1µF
C244.7µF
C438.2pF
R42.7k
R82.7k
R720k
R620k
R520k
V1
E1
E4
E3
E2
V2 V4
V3
GND
J2
J7
J1 J4
J5
J6J3
LT5503
–
+
–
+
–
+
–
+
R356Ω1%
R2549.9Ω
R2110k1%
R2310k1%
R13510Ω1%
C344.7µF
R1256Ω1%
R16510Ω
1%
R15510Ω
1%
R14510Ω1%
5
6
5
6
7 7
8 8
U2-1LT1807
U2-2LT1807
U3-1LT1807
U3-2LT1807
4 4
2 2
3 3
1 1
C35, 39pF C36, 39pF
C38, 1pFC37, 1pF
R19510Ω1%
R2649.9Ω
R2749.9Ω
R17510Ω1%
C404.7µF
C151µF
C161µF R28
49.9Ω
R18510Ω1%
R20510Ω1% R22
10k1%
C290.01µF
C284.7µF
R2410k1%
SW1
Q-IN
R2910Ω
I-IN
*Application Dependent Component Values 1.2GHz Matching (Modulator Only) 1.9GHz Matching 2.4GHz MatchingL1 33nH 22nH 18nHL2 12nH 5.6nH 2.7nHL3 12nH 4.7nH 2.7nHC2, C3, C7 39pF 15pF 8.2pFC10 2.7pF 1.8pF 1.2pFC23 n/a 1.5pF 1.5pFR1 240 390 390C4 n/a 15pF 8.2pFC5, C6 n/a 1.8pF 2.2pFC9 n/a 15pF 2.7pFC11 n/a 2.2pF 1.2pFL4 n/a 6.8nH 4.7nHL5,L6 n/a 5.6nH 2.2nHT1 n/a LDB211G9010C-001 LDB212G4005C-001
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QIN IIN
GND
GND
VCC4
VCC2 VCC3
VCC1
V2V1
V3 V4
LT1807 LT1807
LT5503IC
MODRFIN
LO1IN
MODRFOUT
LO2IN
MIXRFOUT
5503 F07
123456
applicaTions inForMaTion
Figure 7. LT5503 Evaluation Board Layout
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applicaTions inForMaTion
QIN IIN
GND
GND VCC2 VCC3
VCC4
V2V1
V3 V4
LT1807 LT1807
LT5503IC
MODRFIN
LO1IN
MODRFOUT
LO2IN
MIXRFOUT
5503 F08
–
+
–
+
–
+
–
+
90°
0°DUAL SIGNALGENERATOR
SIGNALGENERATOR 1
SIGNALGENERATOR 1
123456
POWER SUPPLY 2
POWER SUPPLY 3
POWER SUPPLY 1
POWER SUPPLY 4
SPECTRUMANALYZER
EXTERNAL 3dBATTENUATOR PAD,OR 2.45GHz BPF
Figure 8. Test Set-Up for Upconverting Mixer and I/Q Modulator Transmit Chain Measurements.
LT5503
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For more information www.linear.com/LT5503
package DescripTion
FE Package20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663 Rev K)Exposed Pad Variation CB
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
FE20 (CB) TSSOP REV K 0913
0.09 – 0.20(.0035 – .0079)
0° – 8°
0.25REF
RECOMMENDED SOLDER PAD LAYOUT
0.50 – 0.75(.020 – .030)
4.30 – 4.50*(.169 – .177)
1 3 4 5 6 7 8 9 10
DETAIL A
DETAIL A IS THE PART OFTHE LEAD FRAME FEATURE
FOR REFERENCE ONLYNO MEASUREMENT PURPOSE
111214 13
6.40 – 6.60*(.252 – .260)
3.86(.152)
2.74(.108)
20 1918 17 16 15
1.20(.047)MAX
0.05 – 0.15(.002 – .006)
0.65(.0256)
BSC0.195 – 0.30
(.0077 – .0118)TYP
2
2.74(.108)
0.45 ±0.05
0.65 BSC
4.50 ±0.10
6.60 ±0.10
1.05 ±0.10
3.86(.152)
MILLIMETERS(INCHES) *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE FOR EXPOSED PAD ATTACHMENT
6.40(.252)BSC
FE Package20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663 Rev K)Exposed Pad Variation CB
DETAIL A
0.60(.024)REF0.28
(.011)REF
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For more information www.linear.com/LT5503
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
revision hisToryREV DATE DESCRIPTION PAGE NUMBER
A 10/15 Obsolete Product 1, 2
LT5503
225503fa
For more information www.linear.com/LT5503 LINEAR TECHNOLOGY CORPORATION 2001
LT 1015 REV A • PRINTED IN USALinear Technology Corporation1630 McCarthy Blvd., Milpitas, CA 95035-7417(408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com/LT5503
relaTeD parTsPART NUMBER DESCRIPTION COMMENTS
LT5500 RF Front End Dual LNA Gain Setting +13.5dB/–14dB at 2.5GHz, Double-Balanced Mixer, 1.8V ≤ VSUPPLY ≤ 5.25V
LT5502 400MHz Quadrature Demodulator with RSSI 1.8V to 5.25V Supply, 70MHz to 400MHz IF, 84dB Limiting Gain, 90dB RSSI Range
LT5504 800MHz to 2.7GHz RF Measuring Receiver 80dB Dynamic Range, Temperature Compensated, 2.7V to 5.5V Supply
LTC5505 300MHz to 3.5GHz RF Power Detector >40dB Dynamic Range, Temperature Compensated, 2.7V to 6V Supply
LT5506 500MHz Quadrature IF Demodulator with VGA 1.8V to 5.25V Supply, 40MHz to 500MHz IF, –4dB to 57dB Linear Power Gain
LTC®5507 100kHz to 1GHz RF Power Detector 48dB Dynamic Range, Temperature Compensated, 2.7V to 6V Supply
LTC5508 300MHz to 7GHz RF Power Detector SC70 Package
LTC5509 300MHz to 3GHz RF Power Detector 36dB Dynamic Range, SC70 Package
LT5511 High Signal Level Up Converting Mixer RF Output to 3GHz, 17dBm IIP3, Integrated LO Buffer
LT5512 High Signal Level Down Converting Mixer DC-3GHz, 20dBm IIP3, Integrated LO Buffer
LT5515 1.5GHz to 2.5GHz Direct Conversion Demodulator 20dBm IIP3, Integrated LO Quadrature Generator
LT5516 0.8GHz to 1.5GHz Direct Conversion Quadrature Demodulator
21.5dBm IIP3, Integrated LO Quadrature Generator
LT5522 600MHz to 2.7GHz High Signal Level Mixer 25dBm IIP3 at 900MHz, 21.5dBm IIP3 at 1.9GHz, Matched 50Ω RF and LO Ports, Integrated LO Buffer
LTC5532 300MHz to 7GHz Precision RF Power Detector Precision VOUT Offset Control, Adjustable Gain and Offset Voltage