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ISO 9001ISO 14001ISO 27001

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W.ELITALIAWEB.IT - INFO@ELIT

ALIAW

EB

.IT

Tel

02.

33

.61.16.26 - Fax 02.26.26.10

.09

Lamella heatsinks– compact lamella heatsinks with a big surface– special design for forced convection– thermotechnical optimal fitted lamellas– precise milled flat semiconductor mounting surface– single and double sided bottom plate made of aluminium

or copper– production according to customer specified demands

Machined heatsinksFluid heatsinks

Lamella heatsinksExtruded heatsink with solder pins

Machined heatsinks– several hundreds of extrusion profiles available– future orientated stockkeeping of heatsink profiles in a

fully automatic honeycomb warehouse– precise milling treatments in highest quality– effective heat spreading by means of heatsinks

with grouted copper areas– designs and modifications according to your demand

Fluid heatsinks– fluid heatsinks for dissipation of big heat flow volumes– compact design with internal lamella structure– thick bottom plates for optimal heat dissipation– I- and U streamed versions– water connection or mounting flange for your special

application– customized treatments and solutions

Extruded heatsinks with solder pins– solid pressed in soldering pins and threaded bolts for a

direct pcb-mounting– for horizontal and vertical mounting position– standard drilling patterns and transistor retaining springs

for various semi-conductive elements– soldering pins with insulation for spacing help– variations and modifications according to drawing

tel. 02.33.61.16.26fax 02.26.26.10.09

[email protected]

art. no. Rth [K/W]

200 [mm]50 100 150

22

24

26

28

30

32

10 1,8

6

SK 646 ...

please indicate: ... 37.5 50 75 100 1000 mm

art. no. Rth [K/W]

200 [mm]

61,

819

50 100 150

24

26

28

30

22

SK 631 ...

please indicate: ... 25 37.5 50 75 100 1000 mm

art. no. Rth [K/W]

200 [mm]

101,

819

50 100 150

18

20

22

24

16

SK 632 ...


art. no. Rth [K/W]

200 [mm]

141,

819

50 100 150

14

16

18

20

12

SK 633 ...


art. no. Rth [K/W]

33 1,8

6

50 100 150 200 [mm]

4

8

12

16

20

SK 634 ...


Standard extruded heatsinksA

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art. no. Rth [K/W]

33 1,8

10

50 100 150 200 [mm]

4

8

12

16

20

SK 635 ...


art. no. Rth [K/W]

33 1,8

14

50 100 150 200 [mm]

4

8

12

16

20

SK 636 ...


art. no.

2,5 22

45

Rth [K/W]

50 100 150

3

4

5

6

200 [mm]SK 626 ...

please indicate: ... 50 75 100 1000 mm

art. no.

59,69

3,9

15

50 100 150

2

4

6

8

10

Rth [K/W]

200 [mm]SK 630 ...

please indicate: ... 37.5 50 75 100 150 1000 mm

art. no. Rth [K/W]

200 [mm]50 100 150

1

2

3

4

5

75

5

45

SK 628 ...



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art. no.

50 100 150

1

2

3

4

5

Rth [K/W]

200 [mm]

90

172,

5

SK 624 ...

please indicate: ... 37.5 50 75 100 150 200 1000 mm

art. no.

50 100 150

1

2

3

4

5

Rth [K/W]

200 [mm]95

70

10,5

SK 645 ...


art. no. Rth [K/W]

200 [mm]100

660

50 100 150

0,5

1,0

1,5

SK 644 ...


art. no.

50 100 150

0,5

1,0

1,5

2,0

2,5

Rth [K/W]

200 [mm]

9,5

34

120SK 625 ...

please indicate: ... 50 75 100 150 1000 mm

art. no.

50 100 150

0,2

0,4

0,6

0,8

1,0

Rth [K/W]

200 [mm]

82

160

10

SK 627 ...

please indicate: ... 50 75 100 150 200 1000 mm


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art. no.

1375

,5

174

Rth [K/W]

200 [mm]50 100 150

0,2

0,4

0,6

0,8

1,0

SK 623 ...


art. no.

830

188

Rth [K/W]

200 [mm]50 100 150

0,4

0,8

1,2

1,6

2,0

SK 629 ...


art. no. Rth [K/W]

200 [mm]

5015

25050 100 150

0,2

0,4

0,6

0,8

1,0

SK 622 ...



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tel. 02.33.61.16.26fax 02.26.26.10.09

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– effective heatsink solutions machined out of solid aluminium material– precise milled flat surfaces with very low surface roughness– for free and forced convection– very small thermal resistance– designs made of copper material, different sizes, dimensions and special designs upon request

art. no.

Rth [K/W]

200 [mm]50 100 150

0,5

1,0

1,5

Rth [K/W]

6 v [m/s]1 2 3

0,40,60,8

100 mm

4 5

0,2

1,0

388

1 3

0,05 100² R z10

100KGR 1 ...art. no.

Rth [K/W]

200 [mm]50 100 150

0,5

1,0

1,5

Rth [K/W]

6 v [m/s]1 2 3

0,4

0,6

0,8

150 mm

4 5

0,2

308

1,5 3

0,05 100² R z10

150KGR 2 ...

please indicate: ... 50 75 100 150 200 1000 mm

material: aluminium EN AW 6082

Heatsinks KGRA

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material:

B

min. 4/max. 20

D

min. 0,8

E

2 / 2.5 / 3 / 4 / 5

F

max. 1500

C

max. 38

A

max. 250

dimensions [mm]

dimensions [mm]please indicate with your order:

possible dimensions:

KGR

C

D E

0,05 100˜ R z10

A

F

B

B D E FCA

depending on the dimension: aluminium EN AW 6060 or EN AW 6082,version in copper upon request

Heatsinks KGR customisedA

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art. no.

50 100 150

2

4

6

8

10Rth[K/W]

200 [mm]

10,3

408

22,8

M38SK 638 ...

please indicate: ... 25 37.5 50 75 84 100 1000 mm

art. no.

50 100 150

2

4

6

8Rth[K/W]

200 [mm]

23

38

820

M312SK 637 ...


art. no.

50 100 150

1

2

3

4

5

6Rth[K/W]

200 [mm]

M330

458

31

M3910,5SK 639 ...


art. no.

50 100 150

1

2

3

4

5

6

7

Rth[K/W]

200 [mm]

30

598

25,6

M38 17

11,4SK 640 ...


please note: profile threads

Extruded heatsinks for lock-in retaining springA

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art. no.

50 100 150

1

2

3

4

5

6Rth[K/W]

200 [mm]

40

56

826

,4

M3

128

SK 641 ...


please note: profile threads

Extruded heatsinks for lock-in retaining springA

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tel. 02.33.61.16.26fax 02.26.26.10.09

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Performance, service life and reliability of electronic semiconductor devices are significantly determined by the thermal load to which the devices are exposed. An exceeding of the maximum operating temperature leads to malfunctions. An exceeding of the permissible junction temperature leads to a destruction of the semiconductor. To make it worse there is an advancing trend in the semiconductor industry for continuous increasing integration- and power densities of electronic devices. For the solution of thermal problems the first question is which kind of heat dissipation has to be considered. For this there are different processes available: by means of free convection (passive) with different heatsink solutions, by means of forced convection (active with help of fans, cooling aggregates) or by means of fluid media (fluid cooling).

However, electronic devices and systems have many different boundary and installation conditions. There-fore the choice of the optimum thermal management is often difficult. There are surely possibilities to find the right heat dissipation concept by using the thermal resistance for calculations or by testing and verifying prototypes directly in the application, but nowadays customer specified mechanical adjust-ments are requested and demanded more than ever. Small mechanical post-machinings, such as additio-nal integrated threads or drilling can be considered in the calculation with safety reserves in the tempera-ture of the thermal resistance, but extensive modifi-cations demand a repeated inspection of the thermal circumstances.

To facilitate the determination of passive heat dissipation concepts Fischer Elektronik offers a computer based thermal simu-lation as a kind of service.

Considered factors in the thermal simulation

With help of the computer based thermal simulation the necessary characteristics of the cooling concept can be determined exactly. Based on physical con-cepts such as mass, energy and impulse the software especially considers the thermal requirements for free or forced convection. Simultaneously the system is alig-ned to thermal dissipation by means of fluid. Moreover the thermal simulation calculates physical effects such as thermal radiation and turbulences. The emission factor of the different surfaces also plays its role. As a result the simulation software delivers a precise cooling solution for the application and is a big help for the decision-making and interpretation of the electronic design.

Advantages of a computer based simulationThe computer based thermal simulation is already used for the prototype development. Herewith the development cycles of heat dissipation concepts is reduced considerably. Unsuitable concepts can be discarded quickly and without big costs of material. A lot of features and options of the simulation system also reduce the temporary and apparatuses efforts compa-red to a conventional simulation in the measurement chamber.

We will be happy to advise you in detail about the theme thermal simulation.

Computer based thermal simulation for optimal cooling concepts

Technical introductionA

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tel. 02.33.61.16.26fax 02.26.26.10.09

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Round and pin heatsinksHeatsinks for LEDs

Heatsinks for all transistor typesHeatsinks and coolers for processors

Heatsinks for all current PL CC, DIL-IC and SMD transistor types– effective heat dissipation at a low profile and low weight– direct mounting of the component by means of a

double-sided adhesive thermal foil or glue– solderable versions of the surface– special packaging such as tape & reel, magazine or tray

upon request

Round and pin heatsinks– streamlined omnidirectional fin geometrie– excellent thermal conductivity due to special aluminium

alloys– suitable for free and forced convection– no direction bounded installation position– flat semiconductor mounting surfaces– contour also as milled parts according to your demands

Heatsinks for LEDs– various heatsink geometries adjusted to all current

LED-types and light-engines– star shaped heatsinks for the use as a LED-lamp housing– LED mounting by means of screws, thermal conductive

adhesive foil or thermal conductive glue– customer specified versions with application based

„thermal management“

Heatsinks and coolers for processors– passive and active product solutions– effective heat dissipation due to optimal conception of

fan and heatsink– long lifetime and high operating safety due to

high quality fans– versions for screw, glue and clip mounting– customer specific solutions and fans

tel. 02.33.61.16.26fax 02.26.26.10.09

[email protected]

– particularly suited for Ball Grid Arrays– heatsink dimensions match the respective BGA-type– can be glued directly on the BGA component– double-sided adhesive thermal conductive foil WLF ...– surface: black anodised

art. no.

v [m/s]

Rth[K/W]

35

30

25

20

15

10

5

00 1 2 3 4 5 6

10 10

6

1,8

ICK BGA 10 x 10WLF ... 10 x 10

art. no.

v [m/s]

Rth[K/W]

35

30

25

20

15

10

5

00 1 2 3 4 5 6

11 11

61,

8

ICK BGA 11 x 11 x 6WLF ... 11 x 11

art. no.

v [m/s]

Rth[K/W]

30

24

18

12

6

00 1 2 3 4 5 6

11

1,8

10

11

ICK BGA 11 x 11 x 10WLF ... 11 x 11

art. no.

v [m/s]

Rth[K/W]

30

24

18

12

6

00 1 2 3 4 5 6

11

14

1,811

ICK BGA 11 x 11 x 14WLF ... 11 x 11

Heatsinks for BGAsA

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art. no.

v [m/s]

Rth[K/W]

35

30

25

20

15

10

5

00 1 2 3 4 5 6

61,

815 15

ICK BGA 15 x 15 x 6WLF ... 15 x 15

art. no.

v [m/s]

Rth[K/W]

30

24

18

12

6

00 1 2 3 4 5 6

15

10

1,815

ICK BGA 15 x 15 x 10WLF ... 15 x 15

art. no.

v [m/s]

Rth[K/W]

30

24

18

12

6

00 1 2 3 4 5 6

1514

1,815

ICK BGA 15 x 15 x 14WLF ... 15 x 15

art. no.

v [m/s]

Rth[K/W] 25

30

20

15

10

5

00 1 2 3 4 5 6

19

6

1,819

ICK BGA 19 x 19 x 6WLF ... 19 x 19

art. no.

19

10

1,819

v [m/s]

Rth[K/W] 25

30

20

15

10

5

00 1 2 3 4 5 6ICK BGA 19 x 19 x 10

WLF ... 19 x 19

art. no.

v [m/s]

Rth[K/W]

25

20

15

10

5

00 1 2 3 4 5 6

19

14

1,819

ICK BGA 19 x 19 x 14WLF ... 19 x 19

Heatsinks for BGAsA

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Heatsinks for BGAsA

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art. no.

v [m/s]

Rth[K/W]

25

20

15

10

5

00 1 2 3 4 5 6

2525

1,8

6

ICK BGA 25 x 25 x 6WLF ... 25 x 25

art. no.

v [m/s]

Rth[K/W]

20

16

12

8

4

00 1 2 3 4 5 6

2525

1,8

10

ICK BGA 25 x 25 x 10WLF ... 25 x 25

art. no.

2525

1,8

14

v [m/s]

Rth[K/W]

20

16

12

8

4

00 1 2 3 4 5 6ICK BGA 25 x 25 x 14

WLF ... 25 x 25

art. no.

0 1 2 3 4 5 6

v [m/s]

Rth[K/W]

20

16

12

8

4

0

29

1,8

6

29

ICK BGA 29 x 29 x 6WLF ... 29 x 29

art. no.

v [m/s]

Rth[K/W]

20

16

12

8

4

00 1 2 3 4 5 6

29

1,8

10

29

ICK BGA 29 x 29 x 10WLF ... 29 x 29

art. no.

v [m/s]

Rth[K/W]

20

16

12

8

4

00 1 2 3 4 5 6

29

1,8

14

29

ICK BGA 29 x 29 x 14WLF ... 29 x 29

tel. 02.33.61.16.26fax 02.26.26.10.09

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Heatsinks for BGAsA

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art. no.

v [m/s]

Rth[K/W]

12

10

8

6

4

2

00 1 2 3 4 5

6,5

2

2222

ICK S 22 x 22 x 6,5weight: 3.5g

art. no.

50 50

3,5

10

Rth[K/W]

v [m/s]

6

5

4

3

2

1

0 1 2 3 4 5

7

ICK S 50 x 50 x 10WLF ... 50 x 50weight: 31.2g

Pin heatsinks

art. no.

3333

1,8

6

v [m/s]

Rth[K/W]

20

16

12

8

4

00 1 2 3 4 5 6ICK BGA 33 x 33 x 6

WLF ... 33 x 33

art. no.

v [m/s]

Rth[K/W]

20

16

12

8

4

00 1 2 3 4 5 6

1,8

10

33 33

ICK BGA 33 x 33 x 10WLF ... 33 x 33

art. no.

v [m/s]

Rth[K/W]

20

16

12

8

4

00 1 2 3 4 5 6

1,8

14

33 33

ICK BGA 33 x 33 x 14WLF ... 33 x 33

tel. 02.33.61.16.26fax 02.26.26.10.09

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– suitable for LEDs:Osram PrevaLED, Philips Lumileds and Luxeon, Prolight Opto, Sharp Mega Zenigata, Vossloh Schwabe Luga Shop and Industrial aswell as all further Zhaga compliant LED modules with a mounting hole spacing of 35 mm

– special designs, surfaces and modifications to customer specification on request

art. no.

50 100 150 200 [mm]

0,5

1,0

1,5

2,0

2,5

Ø 1

00

Ø 3

3 Ø

35

Rth [K/W]

SK 642 ...

please indicate: ... 10 15 20 25 37.5 50 75 100 150 1000 mm

surface: black anodised

– suitable for LEDs:Bridgelux Vero, Citizen CitiLED, Cree XLamp, Edison Edilex, GE Infusion, Megaman Teco, Osram PrevaLED and Soleriq, Philips Forti-mo, Lumileds and Luxeon, Prolight Opto, Sharp Mega Zenigata, Toshiba E-Core, Tridonic Stark, Vexica Lumaera, Vossloh SchwabeLuga Shop and Industrial, Zhaga

– fixing screws for LED modules and holder systems on request– special designs, surfaces and modifications to customer specification on request

art. no.

50 100 150 200 [mm]

0,5

1,0

1,5

2,0

2,5

Ø 1

00

Rth [K/W]

SK 643 ...

please indicate: ... 10 15 20 25 37.5 50 75 100 150 1000 mm


Heatsinks for LEDsA

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tel. 02.33.61.16.26fax 02.26.26.10.09

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– particularly light and compact conception made of aluminium– thermotechnically optimally fitted lamellas– precise milled flat LED mounting surface– adaptable to all common LED modules and seizes– bottom plate for heat dissipation made of copper upon request– customised designs and modifications acc. to drawing

art. no.

Rth = 2,1 K/W

0,8

34,3

5

Ø 65

Ø 81

60

SK LED R 65weight: 132g

art. no.

Rth = 1,35 K/W

0,8Ø 108

37,5

706

Ø 80

SK LED R 80weight: 207g


material: aluminium bottom plate: EN AW 6060; sheet metal: AlMg3

number of plates: 22

Heatsinks for LEDA

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art. no.

50 100 150 200 [mm]

1

2

Rth [K/W]

Ø 8

Ø 2

035 56

56Ø 68,5

0,5

1,5

2,5

SK LED 4 ...


... surfaceSA =black anodisedME =natural colour ano-

dised

... adapter (optional)AD =adapter plate

Heatsinks for LEDsA

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without ADwith AD

tel. 02.33.61.16.26fax 02.26.26.10.09

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– heatsink specially made for flexible and fixed LED Line Modules– insertion possibility of metal sheets and sheets of Plexiglas– complete case with cover panels ➔ G LED ... case catalogue f.case– customer specified designs, lengths and treatments upon request

art. no. 17

14,3

26,5

1,2

9,1

19

4,6

11

11,813,3

1,2

5,1

Ø 2

,8

8,39,7 50 100 150 200 [mm]

12

14

16

18

Rth [K/W]

SK LED 5art. no.

17

14,3

23,5

1,2

6,9

17

4,6

9

11,813,3

1,2

5,1

Ø 2

,8

8,39,7 50 100 150 200 [mm]

14

16

18

20

Rth [K/W]

SK LED 6art. no.

17

14,3

30

1,2

7,3

18

4,6

1011,813,3

1,2

5,1

Ø 2

,8

8,39,7 50 100 150 200 [mm]

10

12

14

16

Rth [K/W]

SK LED 7


... surfaceSA =black anodisedME =natural colour anodised

Heatsinks for LEDsA

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Heatsinks for SMDA

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10 1,8

6

art. no. [mm] Rth [K/W]

ICK SMD O 8 ... 8 73

ICK SMD O 10 ... 10 70

ICK SMD O 17 ... 17 41

art. no. [mm] Rth [K/W]

ICK SMD O 19 ... 19 36

ICK SMD O 25 ... 25 26

please indicate: ... surfaceSA =black anodisedMI =solderable surface

Heatsink specially for Q7 "Embedded-Boards"

45

2,5

22

33

2,526,5

1852

70

2,9

6,5

art. no. Rth [K/W] suitable for processor type

ICK EM 22 4.4 MQ7 Board

75

525

33

2,556,5

1852

70

2,9

6,5

art. no. Rth [K/W] suitable for processor type

ICK EM 25 3.9 Q7 Board

Passive heatsinks for processors

tel. 02.33.61.16.26fax 02.26.26.10.09

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High performance heatsinks– exclusive for forced convection– for radial- and tangential fans– flow-optimized design, best heat dissipation by means

of especially thick bottom plates– precise milled flat semiconductor mounting surfaces– mechanical treatments, special designs and surface

coating for your application

Segment cooling aggregatesMiniature cooling aggregatesHollow fin cooling aggregate

High performance heatsinks

Segment cooling aggregates– modular assembly consisting of different circle- and

length segments– electrical and thermal insulation of the single cooling

segment sections– standard drilling patterns TO 3 and pressfit– segment profile also sold by the meter– other fan types and fan voltages upon request

Miniature cooling aggregates– compact construction for dissipating high power losses

on smallest installation space– heatsink geometries and fixed length optimal adjusted

to the fan being used– homogeneous heat dissipation– mounting of the semi-conductor by means of sliding nut

chanels or specific snap-to-retaining springs fortransistors

Hollow fin cooling aggregate– flow-optimized hollow fin geometry– precise milled flat semiconductor mounting surface,

single- and double-sided– laminar airflow and noise reduction by means of

harmonized chamber systems– additional treatments, modifications and designs

according to customers specifications

tel. 02.33.61.16.26fax 02.26.26.10.09

[email protected]

– made for dissipation of high power within a very small space– fixed length is optimised to the fan– slide-nut channels for M3 nuts for mounting the transistors and circuit boards– other fan types and fan voltages on request

art. no.

0,3 K/W

140 mm

3,1

5,5

1 3,5

4

75

50

25

75 50 15

LAM 1art. no.

0,73 K/W

100 mm

3,1

5,5

1 3,5

4

50

13

50 11

32

32LAM 2

art. no.

0,67 K/W

100 mm

3,1

5,5

1 3,5

4

50

13

50 1132

32

LAM 2 S50 x 50 mm, with axial fanpre-assembled with Molex case 6471 including alarm output, 3 pins; strand length: 70 mm

surface: natural colour anodised

Technical data of the fans

LAM 1 LAM 2 LAM 2type ebmpapst 612 NHH/118 ebmpapst 412 F sepa MFB 40 H 12 HA

dimensions 60x60x25 mm 40x40x10 mm 40x40x10 mm

tension 12 V DC 12 V DC 12 V DC

power inout 2.9 W 0.7 W

max. air volume 56 m3/h 8 m3/h 13.9 m3/h

temperature range -20°C... +70°C -20°C... +70°C -40°C... +85°C

noise level 41 dB(A) 22.1 dB(A) 33 dB(A)

speed 6,800 min-1 5,400 min-1 7,300 min-1

weight 66 g 17 g 13 g

failure rate (L10) L10 < 60,000 h (40°C) L10 < 45,000 h (20°C) L10 < 70,000 h (40°C)

Miniature cooling aggregatesA

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– compact design– homogeneous heat dissipation– mounting possible on any side– powerful axial-fan motor– other lengths, special designs and processing according to customer´s requirements– other surfaces treatment, fan types and fan voltages on request

art. no. 0,15 4 x

10

Rth [K/W]1,61,41,21,00,8

25 50 75 100 125 150

5 V DC12 V DC

3

3024

3024

3

[mm]

LAM 3 ...art. no.

10

Rth [K/W]1,61,41,21,00,8

25 50 75 100 125 150

5 V DC12 V DC

330

30

20

3

24

24[mm]

0,1

2 x

0,15 2 x

LAM 3 K ... with grooves for lock-in retaining spring for transistors THFU art. no.

0,3 4 xRth [K/W]1,21,11,00,90,8

25 50 75 100 125 150

5 V DC12 V DC

[mm]

24 303

3

60,524 246,5 10

LAM 3 D ...


... fan type5 =5 V DC12=12 V DC



... 5 ... 12type Sepa, ball bearing Sepa, ball bearing

dimensions 30x30x10 mm 30x30x10 mm

tension 5 V DC 12 V DC

max. air volume 6.8 m3/h 7.7 m3/h

cur. consumpt. 130 mA 60 mA

temperature range -10°C... +70°C -10°C ... +85°C

noise level 21 dB(A) 27 dB(A)

speed 8,500 min-1 9,100 min-1

weight 8 g 8 g

failure rate (L10) L10 < 95,000 h (20°C)MTBF < 280,000 h (20°C)

L10 > 100,000 h (20°C)MTBF > 400,000 h (20°C)


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art. no. 0,15 4 x

40

1,61,41,21,00,80,60,4

12 V DC24 V DC

Rth [K/W]

25 50 75 100 125 150

5 V DC

4032

4032

3

3

[mm](25)20

LAM 4 ...art. no.

40

4032

40

3

32

1,61,41,21,00,80,60,4

12 V DC24 V DC

Rth [K/W]

25 50 75 100 125 150

5 V DC26

,53

[mm]

0,1

2 x

0,15 2 x

20(25)


0,90,3 2 x

0,80,70,60,50,4

25 50 75 100 125 150

5 V DC

12 V DC

[mm]

32 404

4

80,832 328,8 20

0,2

2 x

R [K/W]

24 V DC

th

LAM 4 D ...


... fan type5 =5 V DC12=12 V DC24=24 V DC



... 5 ... 12 ... 24type ebmpapst 405 ebmpapst 412 JHH ebmpapst 414 JHH



power inout 0.9 W 3.3 W 3.6 W

max. air volume 10 m3/h 24 m3/h 24 m3/h


noise level 18 dB(A) 46 dB(A) 46 dB(A)

speed 6,000 min-1 13,000 min-1 13,000 min-1


failure rate (L10) L10 < 50,000 h (40°C)L10 < 20,000 h (tmax)

L10 < 57,500 h (40°C)L10 < 35,000 h (tmax)

L10 < 57,500 h (40°C)L10 < 35,000 h (tmax)


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art. no.

50

1,41,21,00,80,60,40,2

5042

5042

4,5

4,5 Rth [K/W]

25 50 75 100 125 150 [mm]

5 V DC

12 V DC

24 V DC

0,15 4 x

10(15)

LAM 5 ...art. no.

50

1,41,21,00,80,60,40,2

5042

5042

4,5

4,5 Rth [K/W]

25 50 75 100 125 150 [mm]

5 V DC

12 V DC

24 V DC27

,1

0,2 4 x

(15)10


0,3 2 x

42 504

4

100,542 428,5

10(15)

0,2

2 x

0,80,70,60,50,40,3

25 50 75 100 125 150

5 V DC12 V DC

[mm]

R [K/W]

24 V DC

th

LAM 5 D ...


... fan type5 =5 V DC12=12 V DC24=24 V DC



... 5 ... 12 ... 24type Sepa, ball bearing Sepa, ball bearing ebmpapst



max. air volume 10 m3/h 14.3 m3/h 20 m3/h


speed 3,400 min-1 4,800 min-1 5,000 min-1



failure rate (L10) L10 < 95,000 h (20°C)MTBF < 280,000 h (20°C)

L10 < 95,000 h (20°C)MTBF < 280,000 h (20°C)

L10 50,000 h (20°C)

alarm output with with


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Strangkühlkörper TransistorhaltefedernLED-KühlkörperLamellenkühlkörper

High capacity cooling aggregates– exclusive for forced convection– for radial- and tangential fans– flow-optimized design, best heat dissipation by means

of especially thick bottom plates– precise milled flat semi-conductor mounting surfaces– mechanical treatments, special designs and surface

coating for your application

Lamella cooling aggregates– high power density by big heat exchanging surfaces,

thick multi-wall sheets for best heat dissipation– special formed lamella structures made of aluminium for

maximum heat flow– compact design, very low flow loss– available with or without airflow chamber systems– special solutions according to your demand

High capacity cooling aggregates– very good thermal efficiency– flow-optimized design with radial fans– radial fans up to 1310 m³/h– precise milled flat bottom area for component assembly– optional motor capacitors– cooling profile also available without fan– cover plates for the fin side upon request

Customer specific treatment– mechanical treatment possibilities such as cutting,

milling, drilling, threading and deburring– adhesive protection foils avoid scratching of the milled

flat semiconductor mounting surfaces– assembly and packaging of the cooling aggregates

upon customer request– surface treatments according to your demand

Lamella cooling aggregatesHigh capacity cooling aggregates

High capacity heatsinksCustomer specific treatment

tel. 02.33.61.16.26fax 02.26.26.10.09

[email protected]

High performance cooling aggregate– compact construction by means of connected extruded profiles– excellent efficiency by means of flow-optimised hollow fin structure– powerful axial fans– double-sided precise milled semiconductor mounting surfaces– different width dimensions, customised machinings, surfaces, fan types and fan voltages upon request

art. no.

0,1 100

Rz10

65 ±0

,365 ±0,3

0,1 100Rz10

12 V24/48 V

24/48 V DC 12 V DC

10,7

510

,75

200

0,04

0,08

0,12

0,16

0,24

100

0,20

300 [mm]

Rth [K/W]

LA 28 ... without air flow chamberart. no.

0,1 100Rz10

65 ±0

,3

125 ±0,3

0,1 100Rz10

12 V24/48 V

24/48 V DC 12 V DC

200

0,02

0,04

0,06

0,08

0,12

100

0,10

300 [mm]

Rth [K/W]

10,7

510

,75


0,1 100Rz10

65 ±0

,3

190 ±0,3

0,1 100Rz10

12 V24/48 V

24/48 V DC 12 V DC

200

0,02

0,04

0,06

0,08

0,12

100

0,10

300 [mm]

Rth [K/W]

10,7

510

,75

LA 30 ... without air flow chamber


... fan type12=12 V DC24=24 V DC48=48 V DC


... 12 ... 24 ... 48type ebmpapst 612 JH ebmpapst 614 J/2HHP ebmpapst 618 J/2HHP

dimensions mm mm mm




temperature range -20°C... +70°C -20°C... 75°C -20°C... 75°C


speed min-1 min-1 min-1

weight 100 g 100 g 100 g

failure rate (L10) L10 < 57,500 h (40°C) L10 > 65,000 h (40°C) L10 > 65,000 h (40°C)

Cooling aggregates with axial fanA

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[email protected]

High performance cooling aggregate– additional efficiency enhancement and noise reduction by means of air-technically adjusted airflow chambers– excellent thermal efficiency in connection with powerful axial fans– double-sided precise milled semiconductor mounting surfaces– different width dimensions, customised machinings, surfaces, fan types and fan voltages upon request

art. no.

65 ±0

,3

65 ±0,3 32

0,1 100Rz10

30

60

Rz10

12 V24/48 V

24/48 V DC 12 V DC

200

0,04

0,08

0,12

0,16

0,24

100

0,20

300 [mm]

Rth [K/W]

10,7

510

,75

LA V 28 ... with air flow chamberart. no.

0,1 100Rz10

65 ±0

,3

125 ±0,3

0,1 100Rz10

12 V24/48 V

24/48 V DC 12 V DC

200

0,02

0,04

0,06

0,08

0,12

100

0,10

300 [mm]

Rth [K/W]

10,7

510

,75


0,1 100Rz10

65 ±0

,3

190 ±0,3

0,1 100Rz10

12 V24/48 V

24/48 V DC 12 V DC

200

0,02

0,04

0,06

0,08

0,12

100

0,10

300 [mm]

Rth [K/W]

10,7

510

,75

LA V 30 ... with air flow chamber




... 12 ... 24 ... 48type ebmpapst 612 JH ebmpapst 614 J/2HHP ebmpapst 618 J/2HHP

dimensions mm mm mm




temperature range -20°C... +70°C -20°C... 75°C -20°C... 75°C



weight 100 g 100 g 100 g

failure rate (L10) L10 < 57,500 h (40°C) L10 > 65,000 h (40°C) L10 > 65,000 h (40°C)


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[email protected]

High performance cooling aggregate– compact construction by means of connected extruded profiles– excellent efficiency by means of flow-optimised hollow fin structure– powerful axial fans– double-sided precise milled semiconductor mounting surfaces– different width dimensions, customised machinings, surfaces, fan types and fan voltages upon request

art. no.

0,1 100

Rz10

85 ±0

,385 ±0,3

0,1 100Rz10

200

0,04

0,08

0,12

0,16

0,24

100

0,20

300 [mm]

Rth [K/W] 12/24/48 V DC

1010


0,1 100Rz10

85 ±0

,3

164,6 ±0,3

0,1 100Rz10

200

0,02

0,04

0,06

0,08

0,12

100

0,10

300 [mm]

Rth [K/W] 12/24/48 V DC

1010


0,1 100Rz10

85 ±0

,3

244,2 ±0,3

0,1 100Rz10

200

0,02

0,03

0,04

0,05

0,07

100

0,06

300 [mm]

Rth [K/W] 12/24/48 V DC

1010

LA 33 ... without air flow chamber




... 12 ... 24 ... 48type ebmpapst 8212 JH4 ebmpapst 8214 JH4 ebmpapst 8218 JH4



power inout 39 W 38 W 36 W





weight 200 g 200 g 200 g

failure rate (L10) L10 > 50,000 h (40°C) L10 > 50,000 h (40°C) L10 > 50,000 h (40°C)


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[email protected]

High performance cooling aggregate– additional efficiency enhancement and noise reduction by means of air-technically adjusted airflow chambers– excellent thermal efficiency in connection with powerful axial fans– double-sided precise milled semiconductor mounting surfaces– different width dimensions, customised machinings, surfaces, fan types and fan voltages upon request

art. no.

85 ±0

,3

85 ±0,3

Rz10

38 30

80

0,1 100

Rz10200

0,04

0,08

0,12

0,16

0,24

100

0,20

300 [mm]

Rth [K/W] 12/24/48 V DC

1010


0,1 100Rz10

85 ±0

,3

164,6 ±0,3

0,1 100Rz10

200

0,02

0,04

0,06

0,08

0,12

100

0,10

300 [mm]

Rth [K/W] 12/24/48 V DC

1010


0,1 100Rz10

85 ±0

,3

244,2 ±0,3

0,1 100Rz10

200

0,02

0,03

0,04

0,05

0,07

100

0,06

300 [mm]

Rth [K/W] 12/24/48 V DC

1010

LA V 33 ... with air flow chamber




... 12 ... 24 ... 48type ebmpapst 8212 JH4 ebmpapst 8214 JH4 ebmpapst 8218 JH4



power inout 39 W 38 W 36 W





weight 200 g 200 g 200 g

failure rate (L10) L10 > 50,000 h (40°C) L10 > 50,000 h (40°C) L10 > 50,000 h (40°C)


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Mounting material for semiconductors– mounting disc for discrete devices such as transistors,

capacitors and LEDs– electrically insulating mounting of the transistors– simple and fast assembly– insulating clamping pins for various semiconductors for

increasing the dielectric strength– cover and insulating cap for transistors

Thermal conductive materialGuide rails for PCBs

Mounting material for semiconductors-Mounting material for

mechanical components

Thermal conductive material– large standard programme for thermal conductive pastes

and glues, silicone-, GEL-, and foam foils (Gap Filler),cuts, tapes, tubes and caps

– thermal conductive electrically insulating foils– customer specific productions made in our

in-house punching shop

Guide rails for PCBs– for horizontal and vertical assembly– suitable for sheet thicknesses of 0.5 - 1.85 mm– with and without lock mechanism– slim an wide designs– screwable and snapable versions, extractors with locking

pin fixing– special designs upon request

Mounting material for mechanical components– distance bolts made of metal and plastics with inner or

outer thread– clamp mounting made of aluminium and plastics for

mounting the heatsinks and cases on the mounting railacc. to DIN EN 50022

– anti-vibration device for minimizing the noise andresonance

SEITE E1

tel. 02.33.61.16.26fax 02.26.26.10.09

[email protected]

– thermal conductive foil based on polyester– particularly suitable for silicone-free applications– very good insulating properties– one-sided adhesive layer upon request– cuts and contours according to customer specific drawing specifications

art. no. material thickness [mm]WFPK 09 0.152

WFPK 09version kapton carrier foil with ceramic filled polyester resin double-sided fully coated

colour brown

thermal conductivity 0.9 W/m·K

hardness range 90 Shore A

temperature range -20°C... +150°C

extensibility 40 %

volume resistance 1012 Ω·mdielectric constant 5 [1 kHz]

tensile strength 5,000 psi

tensile strength 5 kN/m

dielectric strength 6 kV

class of flammibility UL 94 V-0

type of delivery cuttings on customer's requirements/ sheet material/ rolled goods

Thermal resistances vs. contact pressure / surface TO 220

pressure [psi] 10 25 50 100 200

thermal resistance WFPK 09 [K/W] 5.64 5.04 4.34 3.69 3.12

thermal impedance WFPK 09 [K-cm²/W] 9.68 7.56 5.93 4.37 2.87

Silicone-free thermal conductive foilsA

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– thermal conductive foil based on polyester– particularly suitable for silicone-free applications– very good thermal and mechanical properties– simplified mounting by means of adhesive layers upon request– cuts and contours made of sheet or roll material as per your specifications

art. no. material thickness [mm]WFP 09 0.229

WFP 09version glass fibre-carrier foil with ceramic filled polyester resin double-sided fully coated

colour brown




extensibility 10 %

volume resistance 1011 Ω·mdielectric constant 5.5 [1 kHz]



dielectric strength 2,5 kV




pressure [psi] 10 25 50 100 200

thermal resistance WFP 09 [K/W] 5.85 5.61 5.13 4.59 4.12

thermal impedance WFP 09 [K-cm²/W] 10.12 8.43 7.06 5.37 3.81


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– thermal conductive foil for silicone-free applications– thermal conductive foil based on polyester– very good insulating properties– one-sided adhesive layer upon request– cuts and contours according to customer specific drawing specifications

art. no. material thickness [mm]WFPK 13 0.152

WFPK 13version kapton carrier foil with ceramic filled polyester resin double-sided fully coated

colour brown




extensibility 40 %

volume resistance 1012 Ω·mdielectric constant 3,7 [1 kHz]







pressure [psi] 10 25 50 100 200

thermal resistance WFPK 13 [K/W] 3.76 3.35 2.75 2.30 2.03

thermal impedance WFPK 13 [K-cm²/W] 6.50 5.00 3.75 2.68 1.88


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– silicone foil with glass fibre reinforcement– free from toxic substances– very good thermal and mechanical properties– one-sided or double-sided adhesive layer upon request– cuts and contours according to customer specific drawing specifications

art. no. material thickness [mm]WFS 09 18 0.178

art. no. material thickness [mm]WFS 09 23 0.229

WFS 09 18 WFS 09 23version silicone foil with glass fibre reinforcement

colour grey




extensibility 54 %




dielectric strength 3,5 kV 4,5 kV




pressure [psi] 10 25 50 100 200

thermal resistance WFS 09 18 [K/W] 6.62 5.93 5.14 4.38 3.61

thermal resistance WFS 09 23 [K/W] 8.51 7.62 6.61 5.63 4.64

thermal impedance WFS 09 18 [K-cm²/W] 11.37 8.87 7.06 5.12 3.37

thermal impedance WFS 09 23 [K-cm²/W] 14.62 11.43 9.06 6.56 4.31

Thermally conductive foil made of siliconelastomerA

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tel. 02.33.61.16.26fax 02.26.26.10.09

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– very good suitable for low tightening torques or spring applications– good electrical insulating properties– optimal contacting between device and heatsink– one-sided adhesive layer upon request– cuts and contours according to customer specific drawing specifications

art. no. material thickness [mm]WFS 16 0.229

WFS 16version silicone foil with glass fibre reinforcement

colour pink




extensibility 20 %



dielectric strength 5,5 kV




pressure [psi] 10 25 50 100 200

thermal resistance WFS 16 [K/W] 3.96 3.41 2.90 2.53 2.32

thermal impedance WFS 16 [K-cm²/W] 5.93 4.68 3.81 2.93 2.56


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– silicone material with glass fibre reinforcement– optimal contacting between device and heatsink– simplified mounting by means of double-sided adhesive layer– automatic assembling possible– cuts and contours according to customer specific drawing specifications

art. no. material thickness [mm]WFS 18 0.203

WFS 18version silicone foil with glass fibre reinforcement

colour blue




extensibility 22 %


tensile strength 238 psi

tensile strength 0.34 kN/m





pressure [psi] 10 25 50 100 200

thermal resistanceWFS 18 [K/W] 1.54 1.52 1.51 1.49 1.46

thermal impedance WFS 18 [K-cm²/W] 2.31 1.75 1.43 1.31 1.25


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– silicone-foil with very good thermal properties– excellent insulating properties– simple and stable handling by means of glass fibre carrier material– one-sided adhesive layer upon request– cuts and contours according to customer specific drawing specifications

art. no. material thickness [mm]WFSA 30 38 0.381

art. no. material thickness [mm]WFSA 30 50 0.508

WFSA 30version silicone foil with glass fibre reinforcement

colour white

thermal conductivity 3 W/m·K


temperature range -60°C ... +200°C


thermal capacity 1 J/g·K





pressure [psi] 10 25 50 100 200

thermal resistance WFSA 30 38 [K/W] 2.05 1.94 1.86 1.79 1.72

thermal impedance WFSA 30 38 [K-cm²/W] 3.31 2.50 2.00 1.75 1.62


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– double-sided coated aluminium foil– good replacement for thermal pastes– electroconductive with wide temperature range– low heat-transmission resistance between device and heatsink– cuts and contours according to customer specific drawing specifications

art. no. material thickness [mm]WFQ 25 0.152

WFQ 25version aluminium foil with double-sided coating

colour black




volume resistance 102 Ω·mdielectric strength electrically conductive




pressure [psi] 10 25 50 100 200

thermal resistance WFQ 25 [K/W] 2.44 1.73 1.23 1.05 0.92

thermal impedance WFQ 25 [K-cm²/W] 3.25 1.88 1.38 0.94 0.75

Thermal conductive foil made of aluminiumA

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– elastomer foam with closed cell structure– good heat conductor e.g. between components, heatsinks and casing parts– electrical insulating– can be compressed even with a low contact pressure– absorbs shocks and vibrations

art. no. material thickness [mm]WSF 08 0.80 ±0.4

WSF 16 1.60 ±0.4

WSF 24 2.40 ±0.8

WSF 32 3.20 ±0.8

WSF 48 4.80 ±0.8

WSF 635 6.35 ±1.2

WSFS 635 6.35 ±1.2

Thermal resistance at 3.2 mm material thickness:compression [%] contact 10 25 50

contact pressure [psi] >1 5 12 34

Rth [K/W] (1 in2 x 3.2 mm) 6 4.5 2.5 1

heat conductivity [W/mK] 0.3 0.4 0.45 0.65

– WSFS 635 double sided adhesive and WSF self-adhesive upon request– according to NASA gas emission requirements

WSF WSFS 635thermal conductivity 0.108 W/m·K (substrate)

compression, 25% 18 psi

extensibility 150 %

tensile strength 120 psi

version non adhesive one-sided self-adhesive

tightness 1.105 g/cm3



dielectric strength 4 kV/mm

class of flammibility UL 94 V-1 (at thickness ≥3.2mm)

type of delivery plates 914x914mm/ cuttings on customer's requirements

Heat conductive silicon foam foilA

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– very soft thermal conductive foil– without any reinforcing layer– optimal balance of bigger unevennesses– thermal conductive foil both-sided adherent– cuts and contours according to customer specific drawing specifications

art. no. material thickness [mm]WFG 15 05 0.508

WFG 15 10 1.016

WFG 15 15 1.524

WFG 15 20 2.032

art. no. material thickness [mm]WFG 15 25 2.540

WFG 15 30 3.175

WFG 15 40 4.064

WFG 15 50 5.080

WFG 15version silicone film without reinforcement

colour black


hardness range 40 Shore 00







Thermal resistances vs. material thickness

material thicknesses [mm] 0.508 1.016 1.524 2.032 2.540 3.175 4.064 5.08

thermal impedance WFG 15 [K-cm²/W] 3 7.5 10 13.13 16.25 21.25 26.25 33.125

Gel thermal conducting foilsA

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– good compressible gap filling material– high thermal conductivity– very good shearing and tensile strength– double-sided natural adhesive layer– cuts and contours according to customer specific drawing specifications

art. no. material thickness [mm]WFGH 30 05 0.508

WFGH 30 10 1.016

WFGH 30 15 1.524


WFGH 30 25 2.540

WFGH 30 30 3.175

WFGH 30version silicone foil with glass fibre reinforcement

colour blue










material thicknesses [mm] 0.508 1.016 1.524 2.032 2.540 3.175

thermal impedance WFGH 30 [K-cm²/W] 1.88 3.75 5 6.88 8.13 10.93


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– very good compressibility– particularly suitable for low contact pressure– double-sided natural adhesive layer– wide temperature range– cuts and contours according to customer specific drawing specifications


WFGH 50 10 1.016

WFGH 50 15 1.524


WFGH 50 25 2.540

WFGH 50 30 3.175

WFGH 50version silicone foil with glass fibre reinforcement

colour violet










material thicknesses [mm] 0.508 1.016 1.524 2.032 2.540 3.175

thermal impedance WFGH 50 [K-cm²/W] 1.25 2.5 3.75 5.18 6.25 8.13


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– two-part fluid gap filling material– high dimensional stability after mounting– automatic dispensation– optimum balance of roughness and unevennesses– other delivery forms and container seizes upon request

art. no. basin contents of deliveryGEL S 18 cartridge 1x 50 ml cartridge / 3x mixer GEL M 18

GEL S 18version two-part fluid gap filling material

colour yellow/ white (A/B)

mixture proportion 1:1

viscosity 25 Pa·s

tightness 2.7 g/cm3






dielectric strength 400 V

durability 6 months @ 25°C

working life at room temperature 60 min @ 25°C

hardening time 300 min @ 25°C / 10 min @ 100°C


type of delivery cartridge with additional mixers

Accessories– more package sizes and container types upon request– store cool and dry

art. no. contents of deliveryGEL M 18 10x mixer für 50 ml cartridge (packing unit 10 pieces)

WLK P 1x applicator gun for 50 ml cartridge


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– strapless (free standing film) changing condition thermal conductive material as a foil– material with phase changing temperature at 48 °C or 52 °C– best thermal conductivity, above the phase change temperature the material flows in all gaps of the impinged device and heatsink– thixotropic, therefore no migration of the material away from the moistened surface– no influence on the thermal conductivity due to thermal cycles– only low contact pressure necessary, as it is no elastomer and therefore ideally suitable for clamp mounting of the devices– not electrically conductive, but no insulator– self-adhesive properties, also suitable for large surfaces– no toxic ingredients– customised cuts upon request– with double-sided protective film

art. no. basin dimensions [mm] material thickness [mm]FSF 20 P plate, protection foil on both

sides300x400x0.2±0.025 0.200

FSF 52 P plate, protection foil on both sides

330x343x0.127 ±0.025 0.127

FSF 20 P FSF 52 Pcolour white

phase change temperature 48 °C 52 °C

tightness 2.9 g/cm3 2 g/cm3

thermal resistance (1 in2, TO 3) at contact pressure of

0.08 K/W0.031 N/mm2

0.03 K/W0.031 N/mm2

thermal conductivity 2 W/m·K 0.9 W/m·K

temperature range ≤+150°C ≤+200°C

adhesive holding force 0.6 N/mm2 0.35 N/mm2

dielectric constant 4,8 [1 kHz] / 4,4 [1 MHz] 3.8 [1 kHz]3.4 [1 MHz]


Phase Change thermal conductive materialA

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– phase change material on a polyamide basis– very good thermal properties– one-sided adhesive layer eases the mounting– particularly suitable for the application of spring clips– cuts and contours upon customised drawing specifications

art. no. material thickness [mm]FSF 15 P 011 0.114

FSF 15 P 012 0.127

FSF 15 P 014 0.140

FSF 15 Pversion electrically insulating phase change material with polyamide reinforcement and one-si-

ded adhesive layer

colour gold

phase change temperature 52 °C



extensibility 40 %







pressure [psi] 10 25 50 100 200

thermal resistance FSF 15 P 011 [K/W] 1.20 1.15 1.11 1.06 1.00



thermal impedance FSF 15 P 011 [K-cm²/W] 1.31 1.25 1.19 1.13 1.06



Phase Change thermal conductive materialA

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– with self-cutting external thread– extternal thread with undercut according to DIN 76-B– different lengths, materials and types of thread upon request– ... please indicate length "L"

D’

L ±0,1

H

D

P P’

art. no. dim. [mm]H D/D' L P P'

GBMS 2550 ... 5.0 ST2,2/M2,5 8 5 5

GBMS 2550 ... 5.0 ST2,2/M2,5 10 5 6

GBMS 2550 ... 5.0 ST2,2/M2,5 12 5 7

GBMS 2550 ... 5.0 ST2,2/M2,5 15/ 20 5 10

GBMS 3055 29 ... 5.5 ST2,9/M3 8 6 5

GBMS 3055 29 ... 5.5 ST2,9/M3 10 6 6

GBMS 3055 29 ... 5.5 ST2,9/M3 12 6 7

GBMS 3055 29 ... 5.5 ST2,9/M3 15/ 20 6 10

GBMS 3055 33 ... 5.5 ST3,3/M3 8 6 5

GBMS 3055 33 ... 5.5 ST3,3/M3 10 6 6

GBMS 3055 33 ... 5.5 ST3,3/M3 12 6 7

GBMS 3055 33 ... 5.5 ST3,3/M3 15/ 20 6 10

GBMS 3060 ... 6.0 ST3,5/M3 8 7 5

GBMS 3060 ... 6.0 ST3,5/M3 10 7 6

GBMS 3060 ... 6.0 ST3,5/M3 12 7 7

GBMS 3060 ... 6.0 ST3,5/M3 15/ 20 7 10

GBMS 4070 ... 7.0 ST4,2/M4 8 8 5

GBMS 4070 ... 7.0 ST4,2/M4 10 8 6

GBMS 4070 ... 7.0 ST4,2/M4 12 8 7

GBMS 4070 ... 7.0 ST4,2/M4 15/ 20 8 10

GBMS 5080 ... 8.0 ST4,8/M5 8 8 5

GBMS 5080 ... 8.0 ST4,8/M5 10 8 6

GBMS 5080 ... 8.0 ST4,8/M5 12 8 7

GBMS 5080 ... 8.0 ST4,8/M5 15/ 20 8 10

GBMS 6010 ... 10.0 ST6,3/M6 10 10 6

GBMS 6010 ... 10.0 ST6,3/M6 12 10 7

GBMS 6010 ... 10.0 ST6,3/M6 15/ 20 10 10

material: brass

surface: 8 µm nickel-plated, solderable

Spacers with internal and external threadA

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Surface refinement– corrosion resistant and decorative anodize layers– lacquerings and durable powder coatings in all current

RAL colours– anti-glare surfaces, Nextel®-Suide Coating– electrically conductive surfaces, chromate VI free– prevention of clamp marks by means of special

contacting systems

Precision machining andhighly decorative surfaces

Decorative aluminium milled parts– time-optimized, automatic stockkeeping of several

hundred extruded profiles for short deliveries– latest CNC machining centres– precise millings for highest quality demands– batch-optimised production processes– special profiles according to your specific demand

Chromium plating and gold plating– chromium plating and gold plating of front panels,

extruded profiles and construction parts– qualitative constant and reproducible, high

quality surfaces– various gloss levels by means of different polishing

processes– processing of brass, aluminium and steel

Development and construction– compentent partner with experience of more

than 40 year– Innovative product development, product-specific

support by means of application engineers– design assistance, feasibility analyses and product

optimizations– construction support and preparation of drawings

tel. 02.33.61.16.26fax 02.26.26.10.09

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Miniature aluminium cases– case as tube or half shell profile with spring and groove– with integrated cooling fins– integrated guide slots for carrying PCB or mounting

plates– D-Sub connectors can be mounted without front panel– cut outs, special lengths and surface treatments

according to customer’s request

Desk consoles and shell cases Combination- and tube cases

Miniature aluminium casesCooling cases

Desk consoles and shell cases – wide product range of flexible designed desk consoles

and shell cases made of aluminium– for non-standardised components, printed circuit

boards and components– with integrated guide slots in grid spacing 1 HP– customised front panel printings– special dimensions, machinings and surface treatments

acc. to your demand

Combination- and tube cases– for all common Eurocard formats with various

combination possibilities– use like bench case or for fastening of mounting rails– wall or ceiling mounting by permanently installed fixing

mounting brackets– integrated external cooling fins for better heat

dissipation– EMC compliant design by electrical conductive surfaces

and sealings

Cooling cases– solid cooling cases made of aluminium– excellent thermal efficiency by means of integrated

cooling fins– inner guide rail for application of 100 mm Eurocards

or non standardised components– additional machinings, modifications and surface

treatments for your particular specifications

tel. 02.33.61.16.26fax 02.26.26.10.09

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contents of delivery:1 = 1 x upper part; 2 = lower part; 3 = 2 x fixing clamp (optional); 4 = 1 x mounting material

– solid case made of 1,5 mm thick aluminium half shells designed for the single board computer Raspberry Pi– easy to install thanks to an easy screwing– ventilation slots in the upper and lower part for an improved heat transport– optional fixing clamps, also fitting to VESA MIS-D 75 x 75– optional heatsink set consisting of heatsink ICK BGA 14 x 14, ICK BGA 10 x 10 and appropriate double sided adhesive thermal

conductive foil WLFT 404– special machinings, further surfaces and colours upon request

71,1 99,2

36,9

84

1,5

59

6,5

29

3

89

1,5

33,5

496

475

7586

584

11

M 2,5

M 2,5

Ø 4,5

art. no. detailsRSP 1 ... Raspberry Pi 2 Model B & Raspberry Pi 3 Model B

please indicate: ... surfaceSA =black anodisedME =natural colour anodisedMS =case profile SA, cover panels MEB =case profile SA, cover panels blue

(similar to RAL 5015)R =case profile SA, cover panels red

(similar to RAL 3001)OG =case profile SA, cover panels or-

angegold (similar to RAL 1028)

... fixing strap (optional)L =with fixing straps

... fixing of mounting rail (optional)KL =fixing of mounting rail

... heatsink set (optional)KS =heatsink set

In addition to standard colours the colours green (similar RAL 6032) and violet (similar RAL 4008) are available for the upper shell.

Shell cases for Raspberry PiA

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Male and female header in press-in mounting– male header, one and two rows, straight version– female header, one and two rows, straight version– shrouded male header, two rows, straight version

Male and female headers in SMD versionMale and female headers for solder

technology (THT)Male and female header in press-in mounting

Multipoint connector

Male and female headers in SMD version– male header, one and two rows with pick and place pad,

horizontal and vertical version– female header, one and two rows with pick and place

pad, horizontal and vertical version– grid spacing: 2,54 mm, 2,00 mm and 1,27 mm– optional selectable type of packaging: bar magazine

and tape and reel

Male and female headers for solder technology (THT)– male header, one and two rows, straight and angled

version with square and precision contacts– shrouded-header with second insulating body– female header, one and two rows, straight and angled

version with stamped contacts or precision contacts– through-hole female headers, one and two rows– grid spacing 2,54 mm, 2,0 mm and 1,27 mm

Multipoint connector– direct multipoint connector for additional circuit board

with a thickness of 0,7 to 0,9 mm– direct multipoint connector for a circuit board thickness

of 1,6 mm

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Technical introduction for the connector catalogueA

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General points Product specified characteristics for the particular article can be found in the category “technical data”! Additional customer specified advice and solution proposals will be supported from the R&D department of company Fischer Elektronik GmbH & Co. KG.

Surface – electroplating processesIn general all contacts are coated with a nickel barrier layer (1.3-3 µm) before they get tinned or gold-plated. This will also apply for selective gold-plated contacts.For the selective coated contacts the complete contact will be nickel-plated including the carrier strip first. After this the contact side will be gold-plated and the solder side tinned, usually in the “dipping method” or “brush method”. Depending on the overall contact length the middle area is exclusively nickel-plated. The layer thickness of the gold-plating is at least 0.2 µm Au, the layer thickness of the tinning is 4-6 µm! Other layer thicknesses are possible upon request. The tinning is done with pure tin. The solderability is guaranteed for at least 1 year after shipment. At appropriate storage in closed packing this period can be increased significantly.

Dimensional toleranceGenerally the DIN ISO 2768m is applied to all products! Moreover following additions have to be noticed:– the length tolerance of contact pins is +/-0.2 mm– the space allowance is +/-0.03 mm, the overall space allowance over 36 pins +/-0.2 mm– the shape tolerance of the insulating body is defined by +/-0.15 mm– the separation of number of pins by means of cutting: +0.6 mm/-0.3 mm– the separation of number of pins by means of sawing: +0.1 mm/-0.4 mm (no standard)

Quality grading in conformity with DIN 41652Depending on the layer thickness of the gold-plating the contacts can be classified in quality classes. A distinction is made in three quality classes:Quality class 1: at least 500 cycles of operation, layer thickness accordingly at least 1.2 µm AuQuality class 2: at least 200 cycles of operation, layer thickness accordingly at least 0.75 µm AuQuality class 3: at least 50 cycles of operation, layer thickness accordingly at least 0.2 µm AuBy tinning contacts max. 10 cycles of operation can be guaranteed by using “tin on tin”.

Precision socket contacsThese contacts are two-piece parts and consist on a sleeve (turned part) and a spring element (stamped part). The spring element (clip) is always gold-plated (depending on the article at least 0.2 µm Au or at least 0.75 µm Au). The sleeve is usually tinned, for some versions also optionally gold-plated (at least 0.2 µm Au).

Contact carrier material made of high-temperature resistant plasticThe plastics used for the male and female headers are mainly high-temperature resistant which means that they are suitable for the use in the reflow soldering technique.This applies primarily for SMD components as well as for plug connectors which are constructed for wave soldering. In the catalogue those products are marked with a 260 °C logo in the header of the particular page.

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Design, matching for BLY ...– are used for interconnections of stacked PCBs– within the total length of the pin the insulator position can be changed as required ... Design specification-sheet– separable! any requested number of contact can be delivered

– one row, □ 0,5 mm

2 0,5(n-1) x 2

1,51,

5

0,55 A

3,6

2

n x 2

Pin 1 Pin 1

2,75

5,5

4,5 20,9 4

art. no. dim. [mm]A

SLY 11 SMD 051 ... 5.1

art. no. dim. [mm]A

SLY 11 SMD 092 ... 9.2

art. no. dim. [mm]A

SLY 11 SMD 133 ... 13.3

please indicate: ... no. of contactsone row 4 - 20

... surface of contactS =selective gold-platedG =gold-platedZ =tin-plated

– two rows, □ 0.5 mm

2 0,5(n/2 - 1) x 2

1,51,

5

0,55 A

3,6

(n/2) x 2

Pin 1 Pin 1

2,75

7,5

6,5 20,9

4

art. no. dim. [mm]A

SLY 12 SMD 051 ... 5.1

art. no. dim. [mm]A

SLY 12 SMD 092 ... 9.2

art. no. dim. [mm]A

SLY 12 SMD 133 ... 13.3

please indicate: ... no. of contactstwo rows 4 - 40

... surface of contactS =selective gold-platedG =gold-platedZ =tin-plated

2.00

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Low profile, fork contact spring– for □ 0.635 mm plug pins– other number of contacts on request

art. no.

Pin 1 Pin 12,54

4,7

0,9

2,55

2,54

0,6

0,8

4,2

0,4

6,9 4,

1

2,5

5,5

n x 2,54

Pin 1

1,5

BL LP 5 SMD ...


... surface of contactS =selective gold-platedZ =tin-plated

... packing (optional)SM =bar magazineB SM =pick and place pad

and bar magazine

Option, for automatic assembly

BL LP 5 SMD ... B SMBL LP 5 SMD ... SM

14

8,5

14

8,5

BL LP 5 SMD ... B

2,54 A

54,

70,

4

0,6

8,4

7,5

art. no.

Pin 1

5,5

2,54

2,54

7,3

0,9

2,55

0,6

6,8

0,46,9 4,

1

5 (n/2) x 2,54

2,54

0,8

Pin 1

Pin 1

1,5

BL LP 6 SMD ...

please indicate: ... no. of contactstwo rows 4 - 40


... packing (optional)SM =bar magazineB SM =pick and place pad

and bar magazine

... packing (option) - additions:BL LP 6 SMD ... SM 6-40 contactsBL LP 6 SMD ... B SM 4-40 contacts


BL LP 6 SMD ... B SM

14

10,5

BL LP 6 SMD ... SM

14

10,5

BL LP 6 SMD ... B

2,54A

7,5

4,7

8,4

0,40,6

7,5

2.54

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art. no.

2,54

2,54 0,9

0,4

9,9

4,1

2,5 n x 2,541,5

0,6

1,45

2,4

1,6 0,8

2,1

5,5

BL LP 7 SMD ...



... packing (optional)SM =bar magazine

... packing (option) - additions:BL LP 7 SMD ... SM 4-20 contacts


BL LP 7 SMD ... SM

14

8,5

2.54

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Precision contacts for □ 0.635 mm and Ø up to 0.85 mm, pin cross section– no capilliary action when soldering due to protected inner contact– separable! any requested number of contact can be delivered

art. no.

5,4

Pin 1

2,5

Ø 0,6Pin 1

n x 2,54

4,6

2,54

3,3

n x 2,54 1

5,2 2,

8

2,54

5,08

Pin 1MK 22 SMD ...


... packing (optional)B SM =pick and place pad and bar magazineB TR =pick and place pad and tape and reel (600pcs/reel)

contact sleeve: tin-plated

contact spring: gold-plated


5

4,6

6,9

Ø 0

,6

7,5

2,543,

3

7

8,5

14

MK 22 SMD ... B SM... B SM... B SM

... B TR

12 Ø 2

4 Ø 1,5

40,4

44

8,1

MK 22 SMD ... 3-13 ... B TR MK 22 SMD ... 14-22 ... B TR

Ø 1,5 4

128,1

68,4

72

Ø 2

2.54

Female headersA

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Precision contacts for pin cross section Ø 0,5 mm– one row– no capilliary action when soldering due to protected inner contact– separable! any requested number of contact can be delivered

art. no.

1

4,8 2,

5

2,54

5,08Ø 1,82

4,2

n x 2,54

Ø 0,5

2,5

2,54

3,3

0,8

5,8

Pin 1 Pin 1 Pin 1

(n-1) x 2,54

MK 23 SMD ...


... packing (optional)B SM =pick and place pad and bar magazineB TR =pick and place pad and tape and reel (600pcs/reel)




MK 23 SMD ... B SM... B SM

... B TR

12 Ø 2

4 Ø 1,5

40,4

44

8,1

MK 23 SMD ... 14-22 ... B TR MK 23 SMD ... 3-13 ... B TR

Ø 1,5 4

128,1

68,4

72

Ø 2

2.54

Female headersA

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– no capilliary action when soldering due to protected inner contact– separable! any requested number of contact can be delivered

art. no.

0,76

2

2,54

1,9

Ø 0

,5

7,2

2

n x 2

24,2

BLY 6 SMD ...


... packing (optional)TR =tape and reel

... packing (option) - additions:BLY 6 SMD ... TR: 2-10 contactsBLY 6 SMD ... TR: 11-20 contacts



Option, for automatic assembly– reel diameter Ø 330 mm

... TR

2,7

5652,4

12

4 1,5

22,5

3228,4

12

4 1,5

2

BLY 6 SMD ... TR (11-20 contacts) (2.200 pcs/reel)

BLY 6 SMD ... TR (2-10 contacts) (2.400 pcs/reel)

2.00

Female headersA

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SLY ... BL LP ... MK 22/222 ... MK 23/223 ...contact material CuSn alloy CuZn-alloy

surface contact /contact sleeve

Ni+≥0.2µm Au/ Ni+4...6µm Sn

Ni+0.2µm Au (se-lective)/ Ni

+2...4µm Sn (mattfinished tin)

Ni+4...6µm Sn

inner contact spring material CuBe-alloy

inner contact spring surface Ni+0,75µm Au Ni+0,25µm Au

type internal spring fork contact 6-fingers 4-fingers

plugability for circuit points □0,5...0,7mm □0,55...0,65mm/Ø0,65...0,85mm

□0,22x0,25mm...□0,4x0,55mm/Ø0,4...0,56mm

insert depth 2...4mm 2.5...3.6mm

insertion / drawing force 1.3N/0.3N 1.8 N/1.4 N

shock resistance 50 g

volume resistance ≤5 mΩ ≤10 mΩvibration resistance max. 15 g

capacity between two adjacent con-tacts

≤ 0,9 pF ≤0,3 pF ≤0,4 pF

nominal current 3 A 1.5 A

nominal voltage 100 V DC 125 V AC 150 V DC 60 V DC

test voltage 500 V 1500 V 1000 V

insulating body material PA 4.6. GF PPS PA 4.6. GF

temperature range -40°C... +163°C/(260°C/10 s)

-40°C... +200°C/(260°C/10 s)

-40°C... +163°C/ (260°C/10 s)


specific insulation resistance >107 Ω·m >1012 Ω >107 Ω·m

Technical data: PCB connectorsA

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BLY ...contact material CuZn-alloy

surface contact /contact sleeve

Ni+4...6µm Sn

inner contact spring material CuBe-alloy

inner contact spring surface Ni+0,25µm Au

type internal spring 6-fingers

plugability for circuit points □0,45...0,5mm/ Ø0,4...0,56mm

insert depth 2.5...3.8mm

insertion / drawing force 1.3N/0.3N

shock resistance 50 g

volume resistance ≤10 mΩvibration resistance max. 15 g

capacity between two adjacent con-tacts

≤0,7 pF

nominal current 2.5 A

nominal voltage 100 V DC

test voltage 500 V

insulating body material PA 4.6. GF

temperature range -40°C... +163°C/ (260°C/10 s)


specific insulation resistance >107 Ω·m

tel. 02.33.61.16.26fax 02.26.26.10.09

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SMD, two rows, shrouded– suitable for female multipoint connector VFL, FLMP, PV– VPE = packing unit (pieces/tube)– plug-in area available in gold-plated or completely tin-plated!– in addition they can be combined with many other ribbon cable connectors in 2.54 mm pitch

B

A

8,9

1,15

6,4

6,4

2,5

4 0,2

1,272,54

4,3 0,5

10,9

9,7

9,2

4

1

2,54

11,1

Pin 1Pin 1Pin 1

9,2

0,6

0,6

art. no. no. of contacts

packing unit

dim. [mm]A B

ASL 06 SMD ... 6 32 15.3 5.08

ASL 08 SMD ... 8 27 17.8 7.62

ASL 10 SMD ... 10 24 20.4 10.16

ASL 12 SMD ... 12 21 22.9 12.70

ASL 14 SMD ... 14 19 25.4 15.24

ASL 16 SMD ... 16 17 28.0 17.78

art. no. no. of contacts

packing unit

dim. [mm]A B

ASL 20 SMD ... 20 15 33.1 22.86

ASL 26 SMD ... 26 12 40.7 30.48

ASL 34 SMD ... 34 9 50.9 40.64

ASL 40 SMD ... 40 8 58.5 48.26

ASL 50 SMD ... 50 7 71.2 60.96

please indicate: ... surface of contactG =gold-platedZ =tin-plated

... packingSM =bar magazineB SM =pick and place pad and bar

magazineB TR =pick and place pad and tape

and reel (300pcs/reel)

... packing (option) - additions:ASL 26 SMD ... B TR: 26 contacts


6

10,9

9,7

2

6,4

8,5

2,54

4,3

ASL ... SMD ... ASL ... SMD ... B SM

10,9

13,2

213

,7

... B SM

... TRASL 26 SMD ... B TR

16

4 Ø 1,5

Ø 2

52,4

56

12,9

2.54

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ASL ...surface contact /contact sleeve

Ni+≥0.2µm Au/ Ni+4...8µm Sn

contact material CuSn alloy

creepage ≥1,1mm VDE0110

air gap ≥0,8 mm VDE0110

nominal current 1 A

nominal voltage 250V AC insulation group A, according to VDE0110

test voltage 500 V AC

insulating body material PPS

temperature range -40°C ... +200°C (260°C / 10s)


specific insulation resistance >107 Ω·m

Technical data: IDC-connectorsA

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1. General provisions Our deliveries are exclusively subject to

the conditions set forth below, which shall be deemed to be explicitly accepted by the purchaser. No conditions which may appear on the purchaser’s order shall be binding on us, even without our express rejection.

2. Quotations and orders Our quotations shall be subject to change wi-

thout notice. This applies also to information contained in price lists, leaflets etc. Delivery dates stated in our quotations or given to the purchaser by any other means are appro-ximate, and we shall endeavour to keep to them. Delays in delivery shall give no right to claims, unless we have explicitly confirmed such delivery dates and an adequate period of grace granted to us has expired. Orders shall only be binding on us when they have been explicitly confirmed in writing, regard-less of the form in which they have been placed with us. Statements made in cata-logues are simply descriptions of goods and under no circumstances do they constitute warranted qualities. Furthermore, the charac-teristics of our samples cannot be regarded as warranted characteristics.

3. Prices Prices shall be valid only when confirmed by

us in writing. They are exclusive of VAT at the current rate and incidentals such as postage and packing, freight, insurance etc.. If deli-very is made more than 4 months after the date of order, we shall be entitled to invoice the price valid at the date of despatch, even though different prices were initially confir-med. The price valid at the date of despatch shall also apply if the order was confirmed without prices being stated. When an or-der on call is placed, partial deliveries shall be invoiced at the price valid at the date of despatch. Any request by the purchaser for subsequent modifications shall entitle us to amend prices.

4. Conditions of payment The invoiced sum is to be paid net within 30

days of date of invoice. If the purchaser is in default with any payment, we are entitled to claim interest for such default at the normal rate of interest charged for current accounts. If we are able to prove that we have incurred greater losses as a result of the delay, we shall be entitled to claim compensation for such damages.

5. Set-off, right to retention Only claims which have been recognised by

us or which have been adjudicated may be offset against our invoices. Any right to a re-tention to be exercised by the purchaser in connection with our claims is explicitly exclu-ded.

6. Delivery Delivery of our goods is explicitly made on

behalf of and at the risk of the purchaser. The risk shall pass over to the purchaser when the ordered goods leave our premises. The same applies if goods are collected in our premises from the point in time at which we notify the purchaser that they are ready for collection. Unless we have received instructions to the contrary from the purchaser, we shall decide at our discretion on the most economical de-livery method without assuming any liability for the chosen means of delivery.

7. Specially manufactured goods The purchaser must take delivery of and pay

for components made according to a sample or a drawing or by special request, unless they have a defect for which we are answera-ble, making the components completely unfit for the purchaser’s purposes. If their fitness for the purchaser’s purposes is only reduced, the purchaser may request a reduction in purchase price but the contract shall not be cancelled.

8. Quantities We are entitled to supply quantities which

are above or below the ordered quantities by up to 10%. Such deviations are usual in this trade and the deliveries are deemed as being in compliance with the contract. If delivery quantities fall below the ordered quantities there shall be no right to subsequent delivery of the missing quantity.

9. Reservation of proprietary rights9.1. All goods supplied shall remain our property

until all of our claims resulting from the busi-ness relationship with the purchaser have been paid in full. The purchaser is entitled to dispose of the purchased goods in the ordi-nary course of business transactions. Reser-vation of proprietary rights also applies to products resulting from processing, mixing up or combining our goods with goods of third parties, in which case we are considered as manufacturers. In the case where our goods are processed, mixed up or combined with goods of third parties, and the proprietary rights of such third parties remain in force, we are entitled to co-ownership according to the proportion of the amount invoiced for such processed goods. In such cases such rights to co-ownership shall be safeguarded by the purchaser.

9.2. The purchaser shall transfer to us here and now, as a security, his claims against third parties resulting from the resale of our goods in full or in the proportion of our co-owner-ship (see subparagraph 9.1). He is entitled to collect the amount of such claims on our behalf until his authorisation to do so by us is revoked or until cessation of his payments made to us. The purchaser is not entitled to assign these claims to third parties.

9.3. The purchaser is not entitled to mortgage or transfer the goods which are subject to reser-vation by way of security.

9.4. The purchaser shall advise us immediately of any seizure of our goods or of any infringe-ment of our rights by third parties.

9.5. In case of a default in payment or a deteriora-tion in his financial situation, we are entitled to request that the purchaser hand over goods subject to reservation to us immediately. Any time-limited claims shall immediately become due.

9.6. If the value of the securities exceeds our claims by more than 20%, securities to a cor-responding amount will be released by us on request at our discretion.

10. Warranty10.1. We expressly point out that all information

and data is given to the best of our know-ledge and belief. The user is solely responsib-le for the proper use of our products and he should check their suitability for the intended application prior to use. Fischer Elektronik do not assume any warranty, whether expressed or implied, for the suitability, function or mer-chantability of their products in specific or ge-neral applications, and they cannot be held liable for accidental or consequential dama-ge due to non-observance of the above.

10.2. Claims for defects can only be considered if the purchaser has complied with his obligati-on to check goods and submit a complaint as per Section 377 of the German Commercial Code [HGB].

10.3. If goods have a defect attributable to us, we are obliged to effect a cure, excluding the purchaser’s right to withdraw from the con-tract or to reduce the purchase price (reduc-tion), unless we are entitled to refuse to ef-fect a cure by virtue of legal regulations. The purchaser shall grant us an adequate period of grace for effecting a cure. A cure may at our discretion be an elimination of the defect (rectification) or the supply of new products.

10.4. If rectification of the defect has failed, the purchaser shall be entitled to request a re-

duction in the purchase price (reduction) or to withdraw from the contract. Rectification shall be deemed to have failed after the second attempt has been unsuccessful, unless further attempts are reasonable in view of the object of the contract and it is reasonable to expect the purchaser to tolerate them.

10.5. The purchaser’s right to assert further claims for damages shall remain unaffected by this.

10.6. The purchaser’s warranty claims shall be subject to a time limit of 12 months from the delivery of the goods to the purchaser, unless we have fraudulently concealed the defect. In this case, the legal regulations shall apply.

10.7 The purchaser’s claims for damages shall be subject to a time limit of 12 months from the delivery of the goods. This does not ap-ply if we, our legal representatives or other vicarious agents are responsible for death, personal injury or physical harm, or if we or our legal representatives have been grossly negligent, or if our vicarious agents have ac-ted with intent.

10.8. Contractual penalties which have been ag-reed between our customers and their custo-mers cannot be imposed upon us unless we have been notified of them and have agreed to them in writing prior to accepting an order.

11. Withdrawal When delivery in accordance with the con-

tract is not possible for reasons beyond our control, we shall be entitled to withdraw from the contract. Such withdrawal shall not entitle the purchaser to assert any right against us.

12. Export clause We shall not be obliged to reimburse dama-

ges suffered by the Customer or other persons arising from delays in delivery or it being completely impossible to deliver as a result of statutory or official export restrictions, unless we act with intent or gross negligence.

The Customer’s duty to pay the agreed remu- neration shall not be affected by disruptions in our performance as a result of export re-strictions. We shall be entitled to withdraw from the contract if, after the contract is sig-ned, our performance is disrupted as a result of export restrictions.

13. Partial validity clause Should one or more provisions in these T&Cs

be or become invalid, the validity of the re- maining provisions shall not be affected as a result. The invalid provision shall be replaced with a new valid provision which fulfils the same legal and economic objective if at all possible.

14. Place of fulfilment, place of jurisdiction applicable law14.1 The place of fulfilment and place of jurisdic-

tion as well as all disputes arising between us and the purchaser shall be our principal place of business in Lüdenscheid.

14.2 The relationship between the parties to the contract shall be regulated solely in ac-cordance with the law in force in the Federal Republic of Germany. The regulations of the UN CISG shall not apply.

Status as at: 07.11.2016

The latest T&Cs shall apply at all times. They may be downloaded www.fischerelektronik.de

Terms and conditions of business

tel. 02.33.61.16.26fax 02.26.26.10.09

[email protected]

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Fischer Elektronik GmbH & Co. KGNottebohmstraße 28 · 58511 LüdenscheidGERMANYFon +49 2351 435-0Fax +49 2351 45754E-mail info@fi scherelektronik.deWebsite www.fi scherelektronik.de

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