flexible circuit simple design guide -...

Flexible Circuit Simple Design Guide Flexible Circuit Simple Design Guide

• Flexible Circuit Board Types and Definitions • Design Guides and Rules • Process Flow • Raw Material

INDEXINDEX

Single Side Flexible PCBSingle Side Flexible PCB Single Side Flexible PCB (Cover layer type)

Cover layCover layCover layCover lay

Copper FoilCopper FoilCopper FoilCopper Foil

PolyimidePolyimidePolyimidePolyimide

AdhesiveAdhesiveAdhesiveAdhesive

StiffenerStiffenerStiffenerStiffener

｛｛｛｛ BaseBaseBaseBase

Stiffener

Double Side Tape

FCCL

Cover Lay

Epoxy, Kapton, Polyester 100 Epoxy

Adh: 50~55㎛ 50 Adhesive

25 Polyimide

10 Adhesive 1Mil ½ oz, RA or ED S/S

( Adh: 10~15㎛)

18 Copper

22.5 Adhesive 1/2Mil (Adh: 22.5~25㎛)

12.5 Polyimide

F

P

C

1 Layer

Remark SPEC ( Unit:㎛ ) Layer Structure

Single Side Flexible PCBSingle Side Flexible PCB Single Side Flexible PCB (Solder resist type)

Stiffener

Double Side Tape

FCCL

Solder Resist

Epoxy, Kapton, Polyester 100 Epoxy

Adh: 50~55㎛ 50 Adhesive

25 Polyimide

10 Adhesive 1Mil ½ oz, ED or RA S/S

( Adh: 10~15㎛)

18 Copper

15~20㎛ 17 UV curable ink

F

P

C

1 Layer

Remark SPEC ( Unit:㎛ ) Layer Structure

Solder ResistSolder ResistSolder ResistSolder Resist


PolyimidePolyimidePolyimidePolyimide

AdhesiveAdhesiveAdhesiveAdhesive

Stiffener Stiffener Stiffener Stiffener ((((optionaloptionaloptionaloptional))))

｛｛｛｛ BaseBaseBaseBase

Double Side Flexible PCBDouble Side Flexible PCB Double ( Folder ) side with Air Gap

Copper FoilCopper FoilCopper FoilCopper Foil PolyimidePolyimidePolyimidePolyimide Through HoleThrough HoleThrough HoleThrough Hole


Bonding sheetBonding sheetBonding sheetBonding sheet

1Mil 1/2 oz RA, S/S

( Adh: 10~15㎛)

25 Polyimide

FCCL

Epoxy/Acrylic 25 Epoxy ADHESIVE

18 Copper 10 Adhesive

1/2Mil (Adh: 22.5~25㎛ ) 22.5 Adhesive Cover Lay

12.5 Polyimide

Total Thickness

FCCL

Cover Lay

201

25 Polyimide 10 Adhesive

1Mil 1/2 oz RA, S/S

( Adh: 10~15㎛)

18 Copper 22.5 Adhesive

1/2Mil (Adh: 22.5~25㎛ ) 12.5 Polyimide

F

P

C

2 Layer

Remark SPEC (Unit:㎛) Layer Structure

Double Side Flexible PCBDouble Side Flexible PCB Double sided flexible PCB

Through HoleThrough HoleThrough HoleThrough Hole

Copper FoilCopper FoilCopper FoilCopper Foil PolyimidePolyimidePolyimidePolyimide


Total Thickness

F

P

C

2 Layer

1/2Mil (Adh: 22.5~25㎛ ) 22.5 Adhesive

Cover Lay

10 Adhesive

18 Copper

12.5 Polyimide

151

FCCL

Cover Lay

25 Polyimide

10 Adhesive 1Mil 1/2 oz ED or RA, D/S ( Adh: 10~15㎛)

18 Copper 22.5 Adhesive

1/2Mil (Adh: 22.5~25㎛ ) 12.5 Polyimide


Multilayer Flexible PCB with Air GapMultilayer Flexible PCB with Air Gap


Air Gap Air Gap Air Gap Air Gap ((((No BondingNo BondingNo BondingNo Bonding))))

Copper FoilCopper FoilCopper FoilCopper Foil PolyimidePolyimidePolyimidePolyimide Through HoleThrough HoleThrough HoleThrough Hole


See next page for details

Multilayer Flexible PCB with Air GapMultilayer Flexible PCB with Air Gap

Epoxy/Acrylic 12.5 Epoxy Bonding Sheet

1/2Mil 1/2 oz RA, S/S ( Adh: 10~15㎛)

25 Polyimide

FCCL 18 Copper

10 Adhesive

12.5 Polyimide 1/2Mil (Adh: 22.5~25㎛ )

22.5 Adhesive Cover Lay

22.5 Adhesive 1/2Mil (Adh: 22.5~25㎛ )

12.5 Polyimide Cover Lay

Epoxy/Acrylic 25 Epoxy Bonding Sheet

12.5 Polyimide

10 Adhesive 1/2Mil 1/2 oz RA, S/S

( Adh: 10~15㎛)

18 Copper

FCCL

22.5 Adhesive 1/2Mil (Adh: 22.5~25㎛ )


1/2Mil 1/2 oz RA, S/S ( Adh: 10~15㎛)

12.5 Polyimide

FCCL


18 Copper

10 Adhesive

1/2Mil (Adh: 22.5~25㎛ ) 22.5 Adhesive

Cover Lay 12.5 Polyimide

Total Thickness

FCCL

Plating (20㎛) 377-407

12.5 Polyimide

10 Adhesive 1/2Mil 1/2 oz

RA, S/S ( Adh: 10~15㎛)

18 Copper

F

P

C

4 Layer


Rigid Flex PCB with Air GapRigid Flex PCB with Air Gap See next page for details...


Air Gap Air Gap Air Gap Air Gap ((((No BondingNo BondingNo BondingNo Bonding))))


PolyimidePolyimidePolyimidePolyimide Through HoleThrough HoleThrough HoleThrough Hole


FRFRFRFR----4444

PSRPSRPSRPSR

Rigid Flex PCB with Air GapRigid Flex PCB with Air Gap

Epoxy/Acrylic 12.5 Epoxy Bonding Sheet

0.1mm 1/2oz S/S 100 Epoxy

FR-4 18 Copper

12.5 Polyimide 1/2Mil (Adh: 22.5~25㎛ )

22.5 Adhesive Cover Lay

22.5 Adhesive 1/2Mil (Adh: 22.5~25㎛ )



100 Epoxy 0.1mm 1/2oz S/S

18 Copper FR-4

20 Green Green/Black ( UV ) Solder Resist ink

1/2Mil 1/2 oz

RA, S/S

( Adh: 10~15㎛)

12.5 Polyimide

FCCL


18 Copper

10 Adhesive

Green/Black ( UV cured ) 20 Green Solder Resist ink

Thickness

FCCL

Plating (25㎛)

12.5 Polyimide

10 Adhesive

1/2Mil 1/2 oz

RA, S/S

( Adh: 10~15㎛)

18 Copper

4 Layer


>= 490

Design Guides and RulesDesign Guides and Rules Bonding Sheet Design (Folder area)

NO Adhesive Area

NO Adhesive Area

45O

B/S Design By Drawing

For prevention of defect B/S Design

●● If the border line type of NO ADHESIVE AREA part is vertical, it can cause SHORT or OPEN circuit problem.

●●●●●●●● We prefer to design the Bonding Sheet in the manner that gives a slope of 45 degrees to one of the border lines of LCD mounting area or TAIL part.

(Exception: Single sided type may not be affected)

Design Guides and RulesDesign Guides and Rules Pattern design of Folder Area

1L PATTERN

2L PATTERN

NO Adhesive Area

OUTLINE

1) Purpose : To retain the maximum flexibility by staggering the pattern lines. 2) Method : ① Pattern lines on each layer will be staggered (as much as possible). ② Pattern lines on 1st and 2nd layer are staggered (Refer to diagram beside). ③ Pattern lines on 3rd and 4th layer are staggered (Refer to diagram beside). ④ As result, pattern lines on each layer can be staggered with each other. ⑤ This is to be considered for signal pattern line. 3) Reason : If the pattern of every Layer is located above the same line, it causes decrease of flexibility.

Design Guides and RulesDesign Guides and Rules Silk Screen Specification

1111

2222

3333 4444

5555

1) Purpose : To avoid possible default by understanding silk screen production condition. 2) Method : -1 Text Mark : Customer’s mark, Symbol, Date code; => SIZE 2mm -2 Component Text Mark : Min. 0.7mm, Max. 1.5mm → We may shift the marking position depending on the situation (After discussion with the customer) -3 Insulation Line : ① Line for preventing short circuit between the lands. ② Line thickness : 0.15mm (Standard) ③ Distance between line & land : 0.2mm -4 Land Out-Line : ① Silk screening on the outer line of the land is of no use. ② Prefer to remove unless it is an insulation line (After discussion with the customer). -5 Alignment Line : Follow the customer’s request. -6 Space : Min. 0.2mm between the lines. If it is beyond specification, it will be shifted after approval from customer.

Design Guides and RulesDesign Guides and Rules Pattern line thickness & tolerance of raw material

0.2 0.3 0.09

0.095 (±10%)

1 oz

0.2 0.3 0.075 0.075

(±10%) 1/2 oz

R

(Min. Radius Value)

A

(Space-Pattern/Border)

S (Space-

Pattern/Pattern)

L

(Min. Line) Two layer

type

((((Unit Unit Unit Unit : : : : mmmmmmmm))))

OUTLINEOUTLINEOUTLINEOUTLINE

RRRR

L S A

PATTERNPATTERNPATTERNPATTERN

Design Guides and RulesDesign Guides and Rules Through hole / Pad (Inside )

0.10 0.10 C

0.30 0.45 B

0.10 0.15 A

Laser N.C Mechanical

CNC

±0.15 ±0.3 ±0.3 Tolerance

JIG type Universal

(Manually)

Stiffener

Adhesive

Type


teardrop C

B

A


Stiffener / Tape Area Tolerance

Design Guides and RulesDesign Guides and Rules Tear-drop design

Silk Screen Tolerance

1) Purpose : Prevention of open circuits caused by cracks or disconnections between PAD and pattern. 2) Type : 1. Between Through-Hole PAD and pattern 2. Between lands and pattern 3) Method : Use tear-drop tool editor, input R (size). In the case of impossibility of inputting R, it should be input made manually 4) Exception : Area that can not be input as R will be worked manually (R value disregarded).

Min. 0.2 mm

Min. 0.15 mm

Dimension

A (Min. Width Of Marking)

B (Min. Distance from Land)

Item

A

A

B B

Design Guides and RulesDesign Guides and Rules Cover lay & Solder Resist Formative Dimension

Cover lay Open Area Stiffener Specification


D (Min. Dia. of Circle)

C (Min.Space between Openings)

B (Min.Size of Rectangle)

A (Min.Size of Rectangle)

0.2

0.1

0.2

0.2

0.5

0.5

(within1/3 of ‘B’)

0.5

0.5

Cover lay Solder Resist Item

A

BBBB

DDDD

CCCC

Not PreferredNot PreferredNot PreferredNot Preferred PreferredPreferredPreferredPreferred

Overlap Distance (Minimum 0.15mm)

Design Guides and RulesDesign Guides and Rules Gap from stiffener edge to Hole

Adhesive Specification

AAAA

STIFFENER BBBB

Φ A ≥ Stiffener Thickness A

(Hole Size)

B ≥ Stiffener Thickness (For prevention of cracks)

B

(Distance between hole and edge)

Min. Size Item

OUTLINE

Adhesive Adhesive

OUTLINEOUTLINEOUTLINEOUTLINE

GuidelineGuidelineGuidelineGuideline

Not PreferredNot PreferredNot PreferredNot Preferred PreferredPreferredPreferredPreferred

Design Guides and RulesDesign Guides and Rules Goldfingers design

Stiffener and Pattern Design

± 0.03 “ C “ Dimension Tolerance

(Tolerance of Accumulated Pattern Pitch)

± 0.1 “ A “ Dimension Tolerance

(Misalignment of Punching to Pattern)

± 0.02 “ B “ Dimension Tolerance

(Tolerance of Pattern Pitch)

± 0.05 “ D “ Dimension Tolerance

(Tolerance of Connector Width)

Tolerance Item

stiffener stiffener Not preferredNot preferredNot preferredNot preferred PreferredPreferredPreferredPreferred

Pattern line should be Pattern line should be Pattern line should be Pattern line should be 0.50.50.50.5mm mm mm mm longer than the stiffenerlonger than the stiffenerlonger than the stiffenerlonger than the stiffener’’’’s size s size s size s size to prevent cracksto prevent cracksto prevent cracksto prevent cracks. . . .


Design Guides and RulesDesign Guides and Rules Pattern Cover lay Open Area Specification

MinMinMinMin....0.20.20.20.2mmmmmmmm LAND Cover lay Cover lay Cover lay Cover lay OpeningOpeningOpeningOpening

MinMinMinMin....0.20.20.20.2mmmmmmmm LAND

Cover lay Cover lay Cover lay Cover lay OpeningOpeningOpeningOpening

holeholeholehole Cover lay Cover lay Cover lay Cover lay OpeningOpeningOpeningOpening

MinMinMinMin....0.20.20.20.2mmmmmmmm MinMinMinMin....0.30.30.30.3mmmmmmmm

MinMinMinMin....0.20.20.20.2mmmmmmmm

holeholeholehole

MinMinMinMin....0.20.20.20.2mmmmmmmm Cover lay Cover lay Cover lay Cover lay OpeningOpeningOpeningOpening

Production ProcessProduction Process Single side

Etching (Outer) Etching (Outer)

Positioning (C/L)

Positioning (C/L)

HOT PRESS (Vacuum)

HOT PRESS (Vacuum)

Finish Finish

Post treatment Post treatment

PSR & Silkscreen

PSR & Silkscreen

Press cutting (Body)


Cutting (base) Cutting (base)

BBT BBT

Final Inspection Final Inspection

Dry film Image

Dry film Image

Shipment Shipment

Cutting Cutting

Cover Lay Cover Lay

Press cutting (Mask open) Press cutting (Mask open)

Single Side StructureSingle Side StructureSingle Side StructureSingle Side Structure

POLYIMID + COPPER

COVERY LAY

Production ProcessProduction Process Double side

Shipment Shipment

BBT BBT

Post treatment Post treatment

Final Inspection Final Inspection

Finish Finish

STF&D/T STF&D/T

Covey Lay Covey Lay

Cutting (C/S, S/S)

Cutting (C/S, S/S)

Positioning (C/L) Positioning (C/L)

Drilling Drilling

Copper plating Copper plating

D/F( Image) D/F( Image)

Etching Etching

Cutting (base )

Cutting (base )



BBT BBT

Hot Press (Vacuum) Hot Press (Vacuum)

PSR & Silkscreen

PSR & Silkscreen

Press cutting (mask open) Press cutting (mask open)

Stiffener Stiffener

Double Side StructureDouble Side StructureDouble Side StructureDouble Side Structure

COVERY LAY

stiffener

POLYIMID + COPPER

COVERY LAY

Raw MaterialRaw Material CCL (Copper Clad Lamination)

Cover Lay

1/2mil (12.5㎛)

1mil (25㎛)

Rolled Annealed(RA) or Electro Deposit(ED)

1/3 oz (12㎛),1/2oz.(18㎛), 1oz. (35㎛) Double Sided CCL

1/2mil (12.5㎛)

1mil (25㎛)

Rolled Annealed(RA) or Electro Deposit(ED)

1/3 oz (12㎛),1/2 oz(18㎛), 1oz(35㎛) Single Sided CCL

Base Film (Polyimide) Conductor (Copper) Item

30㎛, 35㎛ 1mil (25㎛)

15㎛, 22.5㎛ 1/2mil (12.5㎛)

Adhesive Polyimide

●●●● Photo Solder Resist Photo Solder Resist Photo Solder Resist Photo Solder Resist ( ( ( ( PI ink PI ink PI ink PI ink ) ) ) ) Thickness Thickness Thickness Thickness 15 15 15 15 ~ ~ ~ ~ 20202020㎛㎛㎛㎛

Solder Resist

Raw MaterialRaw Material Surface Finish

Stiffener

0.6±0.2 ㎛ Tin Plating (Pure Sn)

Ni 2~6 ㎛, Au .0.5㎛ Electro Gold Plating

Ni 1.5~5㎛, Au 0.05㎛ (according to flexibility) Electro-less Gold Plating

0.3±0.1 ㎛ Pre-flux (OSP)

3~10 ㎛ HASL

Thickness Surface Finish TypesSurface Finish TypesSurface Finish TypesSurface Finish Types

50 ~ 188 ㎛ Polyester (Natural, White)

0.2 ~ 1.6 mm FR-4 (Glass Epoxy)

0.5 ~ 1.6 mm XPC-1 (Phenolic Paper)

Aluminum, Stainless Steel... Etc.

25 ~ 225 ㎛ Polyimide

Thickness Stiffener Types

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