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Qualification Testing Reverse Engineering

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llows us to identify problems and see inside the package.

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Page 1: Fersht Inc. Electronics/Photonics Packaging

Qualification Testing Reverse Engineering

Page 2: Fersht Inc. Electronics/Photonics Packaging

BGA De-Layering

Page 3: Fersht Inc. Electronics/Photonics Packaging
Page 4: Fersht Inc. Electronics/Photonics Packaging
Page 5: Fersht Inc. Electronics/Photonics Packaging
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Page 7: Fersht Inc. Electronics/Photonics Packaging

PCB De-Layering

Page 8: Fersht Inc. Electronics/Photonics Packaging
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Page 10: Fersht Inc. Electronics/Photonics Packaging
Page 11: Fersht Inc. Electronics/Photonics Packaging

BGA Cross Sectioning

Page 12: Fersht Inc. Electronics/Photonics Packaging
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Page 14: Fersht Inc. Electronics/Photonics Packaging
Page 15: Fersht Inc. Electronics/Photonics Packaging

Cross Sectioning -

Ceramic Package

Page 16: Fersht Inc. Electronics/Photonics Packaging
Page 17: Fersht Inc. Electronics/Photonics Packaging

Cross Sectioning Optical Lens

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Cross Sectioning -

Bond Wires

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Cross Sectioning-

Fiber Optics Connector

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Page 26: Fersht Inc. Electronics/Photonics Packaging

X-Ray&

De-Cap Die

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