How to Build an ARDUINO

from Scratch

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38 ksps Delta-Sigma ADCThe ADS1262 is a 10/5 channel, 38 ksps delta-sigma ADC with an integrated PGA, reference and internal fault monitors. This device provides complete, high-accuracy, one-chip measurement solutions for hte most-demanding sensor applications, including weigh scales, strain gauge sensors, thermocouples, and resistance temperature devices (RTD)...Read More

135 W Compact Switching Power AdapterThe WSZ848MC is a highly efficient desktop switching power adapter with compact design switchmode technology. The adapter is recommended for use use with medical, information technology, and general purpose equipment to the following standards:UL 60601-1 / 60950-1, CSA 22.2 601-1 / 60950-1, TUV EN 60601-1 / 60950-1, CE LVD directive, and cUL Mark... Read More

GPTG Products Exclusively Available at Digi-KeyGlobal Power Technologies Group (GPTG) announces its exclusive global distribution agreement with Digi-Key on its low cost silicon carbide semiconductors. GPTG is a full service low cost Silicon Carbide Semiconductor manufacturer for the commercial power market. With this partnership, GPTG will be able to reach a broader set of customers...Read More

High Isolation Differential Current Sensor ICsAllegro MicroSystems, LLC rolled out two new current sensor ICs that are economical and precise solutions for AC or DC current sensing. These devices are ideal for use in industrial, commercial, and communication systems that require very high voltage isolation. These devices are not for use in automotive applications. Both the ACS724KMA (5 V) and the ACS725KMA (3.3 V) are available in a very small package that is ideal for space-constrained applications while saving cost due to reduced board area...Read More

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eDrive Testing SolutionHBM presents its innovative eDrive testing solution that allows synchronous, dynamic and continuous acquisition of mechanical and electrical signals. Additionally, this testing solution covers live analysis. It consists of HBM T12 torque transducer, HBM GEN3i data acquisition system, HBM QuantumX 1609B temperature satellite (optional)...Read More

IoT Ingenuity in the Sports and Auto IndustryIBM has helped Honda build IoT-connected Formula One (F1) cars using IBM’s Watson Internet of Things (IoT) technology. The newly improved F1 cars has the capability to apply data and analytics in real-time to improve performance, fuel efficiency, and real-time racing decisions...Read More

Digital Power Monitor with MarginingThe ISL28023 is a precision digital power monitor with margining. It is a bidirectional high-side and low-side digital current sense and voltage monitor with a serial interface. The device features a bus voltage sense range from 0 V to 60 V, a 0.05% voltage gain error, a 0.05% current gain error, and an internal temperature sensor accuracy. It monitors power supply current, voltage and provides the digital results along with calculated power. The auxiliary input provides an additional power monitor function...Read More

3 A Precision Laser Diode DriverThe PCX-7401 is an air-cooled, bench-top current source featuring separate pulse and bias current adjustment designed to drive diode lasers, bars and arrays up to 3A with a bias (simmer) current up to 0.5A at 15V maximum forward voltage. Leveraging the proven design of the popular and successful PCX-7420 high power laser diode driver, the PCX-7401 expands IXYS Colorado’s product offerings to enable a new range of lower-current laser diode applications for research, laboratory, scientific and industrial applications....Read More

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100 V H-Bridge PWM Motor AmplifierThe MSK4205 is a 100 V, 30 A H-bridge PWM motor driver/amplifier. This device can be used as a drop in replacement for the APEX SA03 in applications that do not utilize the thermal limit feature. All of the drive/control circuitry for the lowside and highside are internal to the device. The clock input stage divides the internal oscillator frequency by two, which provides the switching frequency of 22.5KHz...Read More

UV Curable System with Optical ClarityThe UV10TKLO-2 is a one-component UV-curable system epoxy modified system for high performance bonding, sealing, and encapsulations. It meets NASA low outgassing specifications, and offers very good temperature resistance profile.

The system can be used in low vacuum environments without concerns about contamination of adjacent electronic, electro-optic or optical parts. Critical devices are protected to ensure optimum reliability...Read More

Li-Ion Charge Management ControllerThe MCP73826 is a single cell lithium ion charge management controller. Safe and fast charging of a single lithium ion cell is possible when using an external PMOS transistor. An overall system accuracy of 1% ensures that the cell capacity is fully utilized without cycle life degradation. The external resistor of the device can set charge current...Read More

Triple Play with TDK-Lambda Power SupplyMouser Electronics, Inc. announced the availability of TDK-Lambda’s CTU75 series of power supplies. The power supply is based on a two-power converter topology and features 75 W triple-output, and low profiles AC/DC power supply that supports zero minimum load operation.

The TDK-Lambda CUT75 Series Power Supplies, available from Mouser Electronics, feature a 64 percent smaller design, lighter weight, and up to 85% better efficiency than the earlier generation of TDK JWT75 power supplies...Read More

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3-State Translating TransceiverThe STR4A100 series are off-line PWM controllers with integrated sensing MOSFET intended for switching power supplies. The device features rent-mode type PWM control, random switching function, slope compensation function and leading edge blanking function...Read More

Flyback Switcher IC for Consumer ElectronicsPower Integrations rolled out its InnoSwitch™-CE ICs, a new clade of its InnoSwitch family of off-line CV/CC flyback switcher ICs. The new devices are optimized for consumer electronics applications where government regulations for Total Energy Consumption (TEC) are of utmost importance...Read More

Wi-SUN Compatible Wireless ModuleThe BP35A1 is a 920 MHz, low power Wireless Smart Utility Network (Wi-SUN) compatible module feauting a built-in 32 bit high power microcontroller designed for ideal embedding in a variety of HEMS devices. The device has also a built-in antenna that eliminated the need for high frequency designs, as is certified by the Radio Law...Read More

Socionext Europe Announces New PresidentSocionext Europe (SNEU) is pleased to announce the appointment of Mr. Toshihiko Tanaka as its new President, effective 1st April 2016. He will also assume the role of President for Socionext Embedded Software Austria (SESA), a subsidiary of SNEU...Read More

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How to Build an Arduino from Scratch

Sponsored by

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For this installment of TechXposed,

we show how to build an Arduino

from scratch. After downloading

the Arduino Eagle files from

Arduino’s official site, we sent the

boards to be manufactured and

purchased all the required parts

from onlinecomponents.com.

We recently acquired a low-priced Chinese laser cutter and used it and an overhead transparency to make a solder paste stencil. Using the cream layer from our Eagle file, we output an image we were then able to import into the software. We found that, by far, the best method was to fill in the holes in the image, instead of solely having an outline of the holes. From there, we set the program to engrave, not cut, which works fairly well for making the small holes.

Next, we line up the stencil and the board properly. Using some double-sided sticky tape, we tape the PCB onto a flat surface. Place the transparency over the board, carefully lining it up with the holes. Duct tape on all four corners holds the stencil firmly in place. Once everything is secure, paste can be applied. Using a simple

Laser cutter

Solder paste stencil

LIne up the stencil and the board

Place solder paste into the holes in the stencil

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putty scraper, push the solder paste into the holes and give the solder paste a flat top.

Now we can place the parts of the Arduino. First, we’ll place the reset button, which is tied to the reset pin on the microcontroller, the ICSP programmer, and the reset pin in the headers. There are two varistors on the board, attached to the two data lines of the USB, helping keep the lines clean from excess voltage without affecting the data signals. Between these two varistors is a 22-ohm resistor array put in series with the data signals to act as termination resistors. A PTC, or resettable fuse, is placed in series with the incoming power from the USB to trip if the board pulls too much current, protecting your computer’s USB.

Next is an Atmega 16U2 that acts as a USB to serial converter, which makes a place to simply hook a USB up to the board without worrying about an FTDI cable. The QFN is also one of the more difficult parts to solder, as the pads are tiny and a very precise balance is needed between enough solder paste to make the connection but not so much that it will bridge. The alignment, however, is relatively easy, as it self-adjusts during reflow to line up on the pads more exactly.

We then have a dual op-amp. One op-amp acts as a buffer for a voltage divider and controls the 3 point 3 volt LDO, and the second op-amp controls the communication status LED. There is also an LDO that accepts the 7 to 12 V input via the barrel jack and drops it down to 5V. This is directly followed by the LDO that drops the 5V down to 3.3V. The last surface mount device is a final diode to make sure that there isn’t any current flow back into the barrel jack.

Push the solder paste into the holes

Remove the stencil

One by one, place the parts of the Arduino

Very carefully, put the board into the reflow oven

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We now very carefully put it into our cheap reflow oven which, other than the awful smell it produces, works rather well. Inside the oven, if you look closely, you can see the solder flowing and changing, becoming very shiny. You’ll also see the small passives moving a bit as they get sucked onto the pads better, though sometimes this results in tombstoning or other issues. The larger devices, such as the electrolytic capacitors, take more time to heat up and flow.

Now we’ll finish up with the through hole devices. For the first part of this step, we put on the 16 megahertz crystal that the USB to serial microcontroller uses. We then need to trim the leads before moving on. Next comes the the socket that the DIP package microcontroller sits in, followed by the headers. Finally, we drop the USB and the power connector on and the project is complete.

The time and effort to assemble a single board this way is non-trivial. However, it’s a great way to learn more in depth about the electronics that are out there and get some practice with prototyping assembly techniques.

To watch the video, click the image above

Inside the oven you can see the solder flowing and changing, becoming very shiny

The board will be very hot, so remove carefully

Finish up with the through hole devices

Trim the leads before moving on

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For this Arrow New Product Insights, we’ll highlight some of the features and benefits of Microchip’s PIC microcontrollers and dsPIC ® digital signal controllers.

Microchip’s PIC MCU ecosystem is built to deliver the best user experience, accelerating development, enabling seamless transitions between platforms, and delivering innovative peripherals to enhance design capabilities.

The PIC microcontroller family allows developers to quickly scale designs up or down as the design evolves, requiring higher performance, lower power, or additional functions, saving the time and cost of designing in new hardware and recoding for new platforms. This is due to the common design ecosystem that covers the full 8- to 32-bit

PIC® Microcontrollers

performance spectrum and protects the investment in code development.

Scalability is further facilitated by the availability of pin-compatible, drop-in replacement hardware bridging product families. PIC MCUs and dsPIC DSCs also integrate innovative peripherals to implement complex functions, simplify development and reduce total solution footprint and cost.

To support development with all of its MCUs and DSCs, Microchip provides free award-winning tools as part of its NetBeans-based MPLAB® X IDE, MPLAB Code Configurator (MCC) and MPLAB

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Harmony Integrated Software Framework. MPLAB X IDE is also extensible via third-party plug-ins and software and integrates seamlessly with programmers, debuggers, simulators, and emulators. All of this is supported by free code libraries, webinars, application notes, and reference designs. This tight integration between a comprehensive hardware and software ecosystem helps developers deliver their products to market faster and at a lower cost.

PRODUCT FEATURES

• MPLAB X IDE

» Supports all MCUs and DSCs

» Free C compilers, software libraries

• MPLAB Code Configurator (MCC)

» Graphical programming environment

» Automatic peripheral/function configuration and code generation

• MPLAB Harmony Integrated Software Framework (ISF)

» Code abstraction

» Libraries, drivers, system services, middleware, third-party code

» RTOS integration

MPLAB® X IDE Desktop

For more information on the latest products, visit Arrow.com.

KEY FEATURES

• 8-bit, 16-bit, 32-bit PIC MCUs

• 16-bit dsPIC® DSCs

• Flexible memory technologies

• Upward compatible architecture

• Core Independent Peripherals

• Configurable Logic Cell

• Intelligent Analog

• Peripheral Pin Select

• Peripheral Trigger Generator

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Qualmark Accelerated Environmental Stress Screening

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Environmental Stress Screening (ESS) is critical for ensuring the reliability of electronic systems. The goal of ESS is to make a marginal product fail before shipment. Marginal products have one or more latent failure modes. These modes become apparent in a relatively short time in the form of warranty claims and dissatisfied customers.

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ESS utilizes a variety of stresses to exercise as many potential failure modes as possible. The most important failure modes are:

1. Failures accelerated by high temperature dwell.

2. Failures accelerated by rapid thermal change rates—traditional ESS does not have rapid thermal change rates.

3. Failures accelerated by hot and cold dwells.

4. Failures accelerated by vibration—traditional ESS usually does not include vibration.

5. Failures only accelerated by a combined thermal and vibration stress environment—this is also something that traditional ESS does not include; AccESS does incorporate a combined environment.

INFANTMORTALITY

RATE

Each failure mode is a subset of the product’s infant mortality rate. Although in the past simple high temperature dwells were considered sufficient for ESS, modern electronic products are far more susceptible to stresses from thermal cycling and/or vibration.

Qualmark AccESS solutions, such as HawQ or Typhoon, save money by completing ESS in 1/5th the time. The combined stresses of rapid thermal and repetitive shock vibration increase infant mortality detection This means your product will undergo an ESS that meets or beats the most stringent screening requirements more rapidly than is possible with traditional equipment and gets your product on the truck and out the door in record time.

AccESS offers ramp rates up to 60°C per minute, far faster than the conventional

ESS utilizes a variety of stresses to exercise as many potential failure modes as possible.

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5°C to 20°C per minute rates. The benefits are twofold: first, faster ramp rates mean thermal cycles complete faster. Second, quicker temperature transitions induce more thermal stress and therefore fewer cycles are needed compared to an equivalent test with slower ramp rates

Limit testing can be used to further accelerate ESS. By identifying and fixing product design issues, the temperature range between hot and cold dwells can be safely increased without causing hard fails. As a result, each temperature cycle induces relatively more thermal stress, which again saves screen time.

Qualmark AccESS solutions mean faster product validation through reduced ESS time . . . and time savings is cost savings. For more information, visit Qualmark.com.

AccESS offers ramp rates up to 60°C per minute, far faster than the conventional 5°C to 20°C per minute rates.

Click this image to watch a video on Qualmark’s Accelerated Environmental Stress Screening process.

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I N S I G H T SPR DUCT

A.E. Petsche, a leader in interconnect components traditionally serving the aerospace and defense industry has expanded their reach into the rail industry. Today we are proud to present our TE connectivity Rail products; we will be focusing on 9 rail products including Wire and Cable, Connectors and Terminals, and Cable Identifiers.

Rail & Rolling Stock

INTERCONNECT PRODUCTS Available from A.E. Petsche

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A.E. Petsche, a leader in interconnect components traditionally serving the aerospace and defense industry has expanded their reach into the rail industry. Today we are proud to present our TE connectivity Rail products; we will be focusing on 9 rail products including Wire and Cable, Connectors and Terminals, and Cable Identifiers.

The 100E series of signal wire and cable from TE Connectivity is zero-halogen, small-size, and both flexible and non-wrinkling making it perfect for low voltage applications. The 100E meets approvals of EN50306-2, -3, and -4, and has a continuous operating wire temperature range from -55 Celsius to 125 Celsius. This cable is available from 1 to 4 conductors and has a voltage rating of 300 volts.

The 100G series of signal wire and cable comes with a halogen-free polymer insulation rated at 750 volts.

This cable is available with conductors ranging from 1 to 9 and with wire sizes ranging from 0.15 sqmm, using 19 strands of wire, down to 4.00 sqmm which uses 56 strands of wire. The high number of wire strands makes the wire very flexible. For single core cables the part number includes a designator for determining cable color in accordance with Mil Standard 681.

TE’s 400R series of signal wire and cable is in the family of rail approved 600 volt wires and cables. This series of cable is available in cores of single, double, triple, and quad with an operating temperature range from -65 Celsius to 125 Celsius. And, while operating at 125 Celsius the cable’s life span is 10-years, but at 110 Celsius the life span is increased three-fold to 30-years. Conductor sizes range from 26 gauge down to triple-ought, and the outer jacket colors are available from codes 0 to 9 using Mil Standard 681.

100E 400R100G

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In addition to rail cable and wiring, A.E. Petsche also offers high-speed data cables.

The line of AMPOWER terminals, splices, and quick disconnects from TE are ideally suited for power generation and distribution in rail, mass transit, power transmission and military markets. Their reliable technology of mechanical compression crimping eliminates variables common to other crimping methods, such as melting temperatures, flux composition, entrapped gases, or oxidation. These connecting solutions are made from either high-quality seamless copper tubing or high-quality brass bar stock along with tin or silver plating which makes for high conductivity and corrosion protection.

TE’s M12 cable connectors include features of 360-degree EMI and RFI shielding along with torsion and vibration-proof cable strain relief. These connectors are available in 4, 5, or 8 poles, have a temperature rating of -20 Celsius to 85 Celsius, have operational voltage options of either 30VDC or 50VDC, and can transmit up to 10 giga-bits-per-second. The angled M12 cable connector 90-degree flex is especially suited for harsh conditions due to the crimp termination for both the signal contact and the cable shield. With data transmission rates up to 100 mega-bits-per-second this special design of 8 cable exit options provides the flexibility to solve any installation condition.

The CIRP series cylindrical connectors are based on the latest performance requirements of Mil-C-5015. These connectors represent proven electrical capability where durability is most important. Features include threaded couplings and single key polarization representing maximum simplicity in design. Typical applications include Rolling Stock, Sub Systems Equipment, infrastructure & signaling and Maintenance, Repair & Overhaul.

AMPOWER M12 CIRP series

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In addition to cables and connectors, A.E. Petsche also offers wire and cable identification sleeves. TE’s HX-SCE series are low-fire hazard heat shrinkable sleeves which are cut and organized into a ladder format. Typical applications include mass transit, rail, aerospace, marine and industrial.

The ZHD-SCE series of heat shrinkable sleeves are the next generation of cable identification solutions. They are unique in the sense that they are both low-fire-hazard AND diesel resistant. Until now heat shrink cable identifiers were either one or the other—but never both—which makes them the first and only heat shrink cable identifiers of their kind on the market today. They have a temperature range of -55 Celsius to 125 Celsius, sleeve diameters from 2.4mm to 38.1mm, and a shrink ration of 2:1.

For more information on the latest TE Connectivity products offered through A.E. Petsche visit our website at aepetsche.com/te.

For more info on the latest products, join us for the next Arrow New Product Insights. Visit Arrow.com.

HX-SCE ZHD-SCE

MYLINK

MYLINK

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ZF Electronic Systems Energy Harvesting Switches

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ZF Electronic Systems Energy Harvesting Switches

ZF Systems, renowned for their high quality switches, has created energy harvesting RF switches specific for industrial automation. Using the energy created by the mechanical actuation of the switch, these compact generators can power RF transmitters that can wirelessly communicate with special receivers to perform preset functions. This completely eliminates the need to run complex wiring to the switch, also allowing greater flexibility of placement, without the constraints of wiring accessibility.

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To be truly useful, these switches need to successfully accomplish three things.

First, they need to be truly standalone. By using the energy of the switch actuation, this eliminates the typical trade-off of the inconvenience of being hardwired versus the inconvenience of worrying about battery life in transmitters. Placement limitations are significantly reduced, upkeep is completely eliminated, and peace of mind is increased that the switches will work when needed, no matter the circumstances.

Second, they need to be robust. Each time a switch is used, it generates up to three messages, pseudo randomly spaced, to ensure the message reaches the receiver. These switches are also rated for one hundred thousand actuations in bi-stable mode and one million actuations in monostable mode, meaning that in most cases, they will outlive the facilities they’re used in.

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Third, they need to be versatile. Available as either a rocker or pushbutton switch, or even as a standalone generator, users can find the interface they need for their applications. The receiver is also flexible, and can be paired with multiple switches or, if desired, multiple switches can be paired with it. The receiver also comes with different outputs, RS232, RS485, SPI, and USB 2.0 so that can seamlessly integrate into any infrastructure type. Finally, all transmitters and receivers can function at either 868 megahertz or 915 megahertz, allowing them to be used anywhere in the world.

ZF Systems’ energy harvesting RF switches are perfect for applications such as building automation, industrial automation, smart homes, and lighting. To learn more about these switches and how they can help solve your switching challenges, please visit cherryswitches.com.

Click the image to watch a video on Energy Harvesting RF Swtiches

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Thick Film Heaters

Ohmite

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Ohmite has researched, developed, and applied thick film technology for power and high voltage resistors for over fifty years. These applications require the ability to dissipate heat, and now Ohmite is taking that experience and knowledge and applying it to generating and directing heat. Many applications need more than just a heater, requiring heat to be applied evenly across a surface, or to apply heat in certain areas, but not others. Ohmite partners with customers to leverage their expertise in thermal analysis and design and the special printing techniques they’ve developed to direct heat precisely where the customer needs it.

Heat in certain areas, but not others

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Thick film heaters can be placed near uninsulated metal without a risk of shorting or arcing, have a small, low-profile footprint, and many different substrates can be used based on the application need. Ohmite has also developed the unique ability to produce traces with variable width, enabling very evenly distributed heat patterns.

Screen printing thick film heaters results in very predictable, uniform heat distribution, and can be done using a variety of substrate materials, shapes, and patterns while remaining cost competitive with previous technologies. Ohmite’s process supports variable trace thickness to easily create areas with different heating characteristics. Ohmite R&D engineers are continuously testing different combinations to provide customers with baselines to work from to meet the needs of different applications. Ohmite is also able to screen print NTC or PTC thermistors in the heater circuit to shutdown the heating element once a predetermined surface temperature has been reached.Variable trace thickness

Uninsulated Metal

Screen printing thick film heaters

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Thick film heaters are able to address a wide range of applications due to their performance and flexibility, currently supporting voltages up to 240 VAC and power up to 1000 W. These include small, low-power devices such as security camera lens defoggers and personal hair products just as well larger and more demanding applications such as large food and beverage warmers, automotive battery warmers, or deposition chamber dryers.

For more on Ohmite thick film heaters or to start working on your next design, go to Ohmite.com.

Click this image to watch a video on Ohmite thick film heaters.

Security camera lens application

Automotive battery warmer application

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