fazia days, bologna 10-12/feb/2010, wg8, emanuele vanzanella (mechanics & cooling), alfonso...

FAZIA DAYS, Bologna 10-12/feb/2010, WG8, Emanuele Vanzanella (mechanics & cooling), Alfonso Boiano (electronics)

ELECTRONICS HOLDER & COOLING SYSTEM

Side cooling and support plate (4 mm thick Cu)

Cooling circuit (D=8, d=6, Cu)

Electronic card Al shelf (2 mm thick)

1st step: Design of the mechanical prototype



The heat due to each FEE card (according to P.Edelbruck) is simulated by a dummy card, with suitable resistors mounted in the right places.

2nd step: design of the electronic card



prototype (Naples machine shop)

3rd step: machining and assembling

solid model design


ELECTRONICS HOLDER & COOLING SYSTEM4th step: experimental setup (in air)

flowmeter Cooling water termometers

Power supply

Incoming cold water

Outgoing hot water



Hottest point (bottom side) <55°C

Al shelf temperature from 45°C to 50°C

5th step: temperature measurements (IR camera)

Resistor temperatures <70°C

Average temperature (top side): <60°C


ELECTRONICS HOLDER & COOLING SYSTEM5th step: (ctd)

Cu plate hottest point (external side): 40°C

Cu temperature ranges from 35°C to 28°C.

The temperature of the cooling water tube is around 30°C



Electronic card temperature (top side) 60 °C

Electronic card temperature (bottom side) 55 °C

Al shelf temperature 50 °C

Cu plate temperature 40 °C

Cooling tube temperature 30 °C

Incoming water temperature 16 °C

Outgoing water temperature 20 °C

Cooling water flow 0,5 l/m

Summary of the test

T=5 °C

T=5 °C

T=10 °C

T=10 °C

T= 4 °C

6th step: result analisys

T=20 °C

in good agreementwith the design values for vacuum operation


ELECTRONICS HOLDER & COOLING SYSTEMnew prototype (under construction)

same holes as before. 6 mm thick Cu plate. grooves, closed by welded straps, for water flow. 10 vertical pipes

The water flow inside the Cu plate is meant to increase the heat exchange between Cu and water.

FAZIA DAYS, Bologna 10-12/feb/2010, WG8, Emanuele Vanzanella (mechanics & cooling), Alfonso Boiano (electronic cards)


Electronic card temperature (top side) 60°C

Electronic card temperature (bottom side) 55°C

Shelf temperature 50°C

Side copper plate temperature 40°C

Cooling tube temperature 30°C

Incoming water temperature 16°C

Output water temperature 20°C

Cooling water flow 0,5 liters/min.

The goal is to reduce the temperature gradient between the Cu plate and the cooling water by circulating the water inside the plate. Further the inlet water temperature will be lowered (around 4 °C).

T=5 °C

T=5 °C

T=10 °C

T=10 °C

T=10 °C… or moreT=15 °C… or less

fazia days, bologna 10-12/feb/2010, wg8, emanuele vanzanella (mechanics & cooling), alfonso...

Documents

cooling water tube

inlet water temperature

lmfazia days

cfazia days

thick cu plate

support plate

temperature gradient

vertical pipesthe water