Faculty of MicrosystemElectronics and Photonics

Wrocław, Poland

Wrocław University of Technology

Wrocław University of Technology was founded in 1945 when a group of Polish academic teachers, mostly from Lvov, arrived in Wrocław, then in ruins in the wake of the last siege of World War II. The university was housed in the buildings of the former TechnischeHochschule Breslau which had existed since 1910. The first lecture was held on the 15th of November 1945 and since then, that day has been celebrated as the university's anniversary.

• The university campus is situated 1.5 km from the city center and occupies a large area splendidly located on the bank of the Odra river.• The university consists of 12 faculties and 27 institutes• The total enrolment amounts to 32,000 part and full-time students.• The total academic staff amounts to 1900, including 320 professors and associated professors.• The university also has three branches in the other major cities of Lower Silesia.• University is managed by a rector and five vice-rectors of research, education, student affairs, development and general affairs. They are elected by the staff for three-year terms and may be re-elected only once.• The highest governing body within the university is the senate, which consists of 70 persons (rector, five vice-rectors, 12 deans, 12 students and 40 eligible staff representatives).• Students have their own self-government, which controls most of the student affairs.

Wrocław University of Technology

The UNIVERSITY consists of the following twelve faculties:1. Faculty of Architecture2. Faculty of Civil Engineering3. Faculty of Chemistry4. Faculty of Electronics5. Faculty of Electrical Engineering6. Faculty of Mining Engineering7. Faculty of Environmental Engineering8. Faculty of Computer Science and Management9. Faculty of Mechanical and Power Engineering 10. Faculty of Mechanical Engineering11. Faculty of Basic Problems of Technology12. Faculty of Microsystem Electronics and Photonics

The university conducts extensive research in many fields of engineering as well as basic studies, for example:• Mathematics: theory of probability, mathematical statistics, functional analysis, differential equations • Chemistry: physical chemistry of solids, organic and inorganic synthesis, quantum chemistry• Physics: solid-state physics (semiconductors, ferroelectric, thin films, surface physics) and optics • Biology: biochemistry and microbiology, biodegradation and biotechnological processes• Electronics: control systems, robotics, microelectronics, optoelectronics, microsystems, photonics;• Computer science: information processing, computer networks, expert systems and artificial intelligence• Electrical engineering: high voltage engineering, distribution and utilization of electrical energy• Materials and raw materials: extraction, utilization of inorganic wastes and synthesis of new materials • Bioengineering: bioreactor, biotechnology and bioengineering processes, biomechanical engineering• Environmental control and ecological threats discrimination: protection technologies, waste utilization• Mechanical engineering: solids and fluid mechanics, materials engineering, biomechanical engineering• Thermal and power engineering: thermodynamics and fluid dynamics, heat transfer, energy recovery

Faculty of Microsystem Electronics and Photonics

The Faculty began its activity on the 1st of January 2002 (previously Institute of Microsystem Technology,in the Faculty of Electronics).

It employs 61 academic teachers, including 10 full professors, 51 associated and assistant professors and currently 29 PhD students.

The total enrolment amounts to 780 students (Ist, Iind

and IIIrd years)

The Faculty is divided into five departments:• Chair of Microelectronics and Microsystems• Chair of Advanced Electronic Engineering• Chair of Surface Engineering • Chair of Electronics and Photonics• Faculty Division of Microelectronic Structures

The principal research areas of the Faculty are directed towards:

microelectronics and microsystems

photonics

diagnostics

technology

Faculty of Microsystem Electronics and Photonics

Microelectronics and

microsystems

development of microsensors and microsystems for environmental and chemical applications,

silicon micromechatronics and microsystems (litography, etching, bonding, micromachining techniques), deposition of thin films by various methods,

thick and thin film circuits process technology and characterisation of device structures for microwavedigital ASIC design,hybrid microelectronics,interconnecting and packagining electronic circuits (assemblies, materials, prototyping

methods),

Pt heateralumina substrate

Au electrodes

sensitive layer

Laboratory of Nanotechnology and Semiconductor Structures

MOCVD II

GaAsAlGaAs

GaInNAs

Characterization Device technology

• Photoluminescence• X-ray diffractometry• dopant profiling C-V, PVS - Bio-

Rad• mercury probe• photoreflectance spectroscopy• LBIC

•Schottky diode•MESFET•HEMT•HFET•MMIC

Microwaves devices Optoelectronics

•detectors PIN, MSM

•light-guides

•modulators

MOCVD I

AIIIN

Silicon Micromechanics Group

The main works:

• Intelligent transducers for 100 –60 kPa pressure based on silicon micromechanical piezoresistivepressure sensors structures

• Development of micromechanical technologies

• Total Analysis Microsystems (Chemical Microsystems)

• Integrated gas chromatographs

• Bio-chips, lab-on-chips

Thick-Film Microsystems Laboratory

The major areas of interest in the Laboratory includes:• investigation of physicochemical and electrical properties of thick film integrated elements fabricated by Low Temperature Cofired Ceramics (LTCC) technique,

• application of laser for fine line patterning and structuring of LTCC tapes,

• investigation of tape processing (lamination, sintering),

• modelling of temperature and stress field in LTCC and thick-film structures,

• application of high voltage pulses for trimming and stability tests of LTCC components,

• processing and basic electrical properties of surface and buried integrated micro passive components (resistors, conductors, capacitors, inductors, varistors, thermistors)

• LTCC sensors, microsystems, microheaterand microcooling systems,

• LTCC packaging for MEMS

Solid State Laboratory

Main technological results

• gas sensors

• humidity sensors

• sensors data analysis (sensors matrix measurements, neural networks & fuzzy logic processing, discrimination and quantification of gas mixtures)

Pt heateralumina substrate

Au electrodes

sensitive layer

Sub-micrometer Structures Manufacturing Group

Main field of interest:

• Field electron emission phenomena.

• Field electron cathodes manufacturing and investigation.

• Modelling of the electrical fields and trajectories of the electrons in microwave electronic tubes.

Examples of completed projects:

• new designs of the ion sources,

• research into ion-substrate interaction (including computer simulation),

• analytical method of temperature determination for superfine needles,

• plasma etching device computer-controled,

• investigation of liquid metal ion sources using X-ray methods.

Division of Microelectronics Structure

The current subject of interests :

• microelectronics passive structures.

• microsensors.

• thin-film materials for new generations of microsensors and high sensitive transducers.

Results:

Several new resistive as well as conductive and dielectric multilayersfor hybrid microcircuit application have been developed. The layers have been the subject of numerous patents. It is to mention, among the others, microminiature AI-AI2O3-Me capacitive structures of the CAP-CAP type, operating in microwave circuits up to 20 GHz. The other example are fast responding gas flow sensors developed by the group from the earliest stage of design till the final low-series manufacturing

Digital ASIC Design Laboratory

Fields of interest:

• Microprocessors/cores peripherals

• Floating point calculations/algorithms

• Data processing modules (CRC, block ciphers)

• Data transmission protocols (SDH, SONET)

Key activities:

•Education - VHDL (Hardware Description Language)

•Digital ASIC design

•FPGA programming

•IP modules design in VHDL

•Electronic Design Automation tools

Laboratory of Microbonding Technology

The main activity directions

Assembly methods applied in electronics• resistance welding and micro-welding, • thermo-compression, • ultra-sonic welding, • thermo-sonic welding, • soldering, • adhesive bonding – dielectric, conductive

and anisotropic adhesives, • eutectic bonding of semiconductor

structures, • wireless bonding: flip-chip and beam lead,

Research and construction projects in the field of precision mechanics and micro-mechanics

Laboratory for Interconnecting and Packaging Electronic Circuits

The basic activity involves

• interconnecting and packaging microelectronic circuits (developing and improving of dice attachment methods: flip-chip, chip-on-board, chip-scale-package, semi-flip-chip, twin-chips and so forth)

• investigation of new materials for green, polymer as well as micro and nano-scale electronics

• numerical prototyping, optimization and multi-physics simulations of the microelectronic devices and packages

• thermo-mechanical material properties characterization in reference to micro-scale and nano-scale

• microelectronic devices and packages reliability evaluation and assessment

Faculty of Microsystem Electronics and Photonics

Photonics

photovoltaics and solar cells (PV modules assembling/encapsulation, design and monitoring of PV systems)optoelectronics, including integrated optics and fiber waveguides, design, fabrication and measurements of photonics devices and systemsprocess technology and characterisation of device structures for optoelectronics,

Optical fiberMicrowave stripline

Conducting epoxyAllundum substrateSMA connector

Microwave packagesilicon v-groove

Laboratory of Photonics Systems

Research activity:

• Design and characterization of fiber optics

• optoelectronic waveguide devices and systems,

• MOEMS structures,

• photonics device packaging Optical fiberMicrowave stripline

Conducting epoxyAllundum substrateSMA connector

Microwave packagesilicon v-groove

Strip waveguide.4 µm

Laboratory of Nanotechnology and Semiconductor Structures

MOCVD II

GaAsAlGaAs

GaInNAs

Characterization Device technology

• Photoluminescence• X-ray diffractometry• dopant profiling C-V, PVS - Bio-

Rad• mercury probe• photoreflectance spectroscopy• LBIC

•Schottky diode•MESFET•HEMT•HFET•MMIC

Microwaves devices Optoelectronics

•detectors PIN, MSM

•light-guides

•modulators

MOCVD I

AIIIN

SolarLab

Current SolarLab’s activities

• Standard characterization of PV modules and cells

• PV modules assembling/encapsulation

• Indoor climatic tests of PV modules

• Longterm outdoor monitoring of PV modules and charaterization in terms of cumulative energy and/or charge

• Design and monitoring of PV systems

European project

Advanced Facade and RoofElements Key to Large ScaleBuilding Integration of Photovoltaic Energy „AFRODITE”

Faculty of Microsystem Electronics and Photonics

Diagnostics

surface investigation of solid by the appropriate methods of scanning electron microscopy, topographic contrast TOPO, material contrast COMPO, EBIC technique

X-ray investigation of material microstructure

application of the RHEED method (Reflection High - Energy Electron Diffraction) for the evaluation of surface quality of semiconductors

low energy scanning electron microscopy (LESEM),

low vacuum and environmental scanning electron microscopy (LVSEM, ESEM).

near-field scanning microscopy.

advanced electrical and structural investigations of microelectronic materials such as polymers, electrically and thermally conductive adhesives, LTCC, etc

Laboratory of Electron-Beam Surface Investigation

The field of interest of the Lab workers includes:

• surface investigation of solid by the appropriate methods of scanning electron microscopy,

• digital acquisition and processing of microscopic images,

• examination of the defects in semiconductors by Deep Level Transient Spectroscopy method,

• application of the RHEED method for the evaluation of surface quality of semiconductors (Si, GaAs) and investigation of structural changes in GaAs epitaxial layers after ion implantation,

• investigation of the electrophysicalcharacteristics of the implant isolation on GaAs.

Laboratory of Electron Optical Instruments

The main field of the Lab team activity is charged particle optics and its applications in technological and scientific instruments, including:

• design and investigations on electron optical systems,

• acquisition of quantitative information in scanning electron microscopy (SEM) by proper signal detection and processing,

• low energy scanning electron microscopy (LESEM),

• low vacuum and environmental scanning electron microscopy (LVSEM, ESEM).

X-Ray Crystallography Laboratory

MRD-DIFFRACTOMETER PHILIPSequipped with:•High resolution opticsincident beam - Bartels Ge 4-crystal monochromator.diffracted beam - Bonse-Hart Ge 2-crystal collimator. (rocking curves, reciprocal space maps)

•Parallel beam opticsincident beam - slit mechanism with height and width adjustment.diffracted beam – parallel plate collimator, graphite monochromator.

layer(s)

substrate

Z

transmision scan

XX

surface scan

edgescan

Laboratory of Scanning Probe Microscopy, Nanostructure and Nanometrology

Research activity:

• Investigation of micromechanical surface parameters with calibrated Atomic Force Microscopy (AFM CD measurements),

• Nanopotentiometry with Electrostatic Force Microscopy (EFM),

• Nanolithography with combined Shear force-tunneling microscope,

• Investigation of thermal behaviour of micro- and nanosystems with Scanning Thermal Microscopy (SThM),

• Scanning Nearfield Optical Microscopy (SNOM) experiments on optoelectronic systems,

• Synthesis and analysis of microsystem nearfield detectors,

• Characterization and calibration of micro- and nanosystems with fiber optic measurement systems,

• Design and application of modular Scanning Probe Microscopy instrumentation,

• Software design for data aquisition, analysis and process control.

Faculty of Microsystem Electronics and Photonics

Technology

vacuum technology (developing of high and ultra-high vacuum, vacuum measuring magnetron sputtering)

ion technology (ion etching, surface morphology investigation, ion implantation, theoretical description of the distribution of implanted ions, design of ion sources)

electron beam technologies (surface modification, welding)

Vacuum Technology Laboratory

The Group is able to perform research works in the field of:

• vacuum measurements, • desorption rate measurements, • methods of developing of high and ultra-

high vacuum, • design of large volume vacuum systems,

• unconventional applications of high vacuum technology.

• magnetron sputtering sources for thin films deposition,

• know-how of thin film technology, • development and service of high vacuum

devices

Ion Techniques Laboratory

Field of research:

• deposition of thin films by various methods of ion plating,

• ion etching,

• surface morphology investigation,

• ion implantation, theoretical description of the distribution of implanted ions,

• design of ion sources.

Laboratory for Interconnecting and Packaging Electronic Circuits

The basic activity in the field of electron beam technology:

• elaboration of new technologies of electron beam welding and brazing as well as electron beam surface modification of materials,

• application of design of experiments (DOE) for improvement of electron beam technological processes, quality management using statistical process control (SPC),

• investigation of high power electron beams, designing of electron beam guns, measuring of electron beam parameters (e.g. emittance, power density, active zone shape and dimensions),

• designing of electron beam technology machines.

Education

The following specialties are available in the Faculty of Microsystem Electronics and Photonics:

Microsystems (MSc degree course) - supervised by Chair of Surface Engineering

Participation in didactic curricula• Lectures: 40.9 – 43.7%• Laboratory practices: 23.2 – 25.6%• Non-technical courses: 13.4%• Preparation of diploma thesis and topical

seminar: 12.6%• Classes, projects and seminars: 6.7 – 9.1%

Optoelectronics and Fiber Waveguide Technique (MSc degree course) - supervised by Chair of Electronics and Photonics

Electronics, Photonics, Microsystems (four-semester part-timedegree course for graduate engineers wishing to complete their education and to obtain an MSc degree)