experiences of small electronics companies to underpin circular … · 2015-12-10 · experiences...
TRANSCRIPT
© Fraunhofer IZM
Experiences of Small Electronics Companies to Underpin Circular Economy Approaches by Means of Simplified Life Cycle Indicators
Karsten Schischke, Fraunhofer IZM
12.10.2015 Karsten Schischke
Dept. Environmental and Reliability Engineering
© Fraunhofer IZM
Content
Fraunhofer
Introduction / Background
SME Mentoring Programme
Circular Economy Business Cases
Conclusions
© Fraunhofer IZM
Overview Fraunhofer Gesellschaft
Information Technology Light & Surfaces Life Sciences Micro Electronics Production Defense & Security Materials &
Components
67 institutes 23,000 employees approx. 2 billion €
turnover approx. 70% contract
research
© Fraunhofer IZM
Mission Fraunhofer IZM Bringing Microelectronics into Application
© Fraunhofer IZM
Screening Life Cycle Assessments and review of LCA
Material efficiency indicators and assessments
Reverse engineering studies
Eco-benchmarks, indicators and energy efficiency metrics
Application of bio-based materials
Eco-design directive: Preparatory studies and compliance testing
Critical substances (“beyond RoHS”): supply chain management and substitution
Technology monitoring and policy consulting
Environmental assessments and eco-design The em issions of greenhouse gases over the w hole product life cycle is one indicator to verify, how "green" a product is. W ith our
business m odel and product design approach w e intend to m inim ise the footprint of our products.
The production of electronics parts and com ponents is very energy
intensive and thus also contributes significantly to greenhouse gas
em issions. Identifying the com ponents w ith the highest carbon footprint
in production guides us in our design decisions and our refurbishm ent
strategy.
Despite the selection of energy efficient com ponents for
our products, the use phase is still m ost dom inant in
term s of greenhouse gas em issions, actually due to the
long lifetim e. Pow er consum ption in the various m odes
contributes to global w arm ing. Adapt your use patterns to
Total Life Cycle
-100 0 100 200 300 400 500
Manufacturing (raw m aterials and product ion)
Repair / Replacem en t over l i fet ime (new spare parts usage)
Use
Material Recycling
Component Reuse
To tals
65,0
19,0
359,3
-11,3
-4,1
427,9
MakeMeEcoPC
kg CO2-eq.kg CO2-eq. / lifetime
Housing
12%
Display
19%
Printed
Circuit Board
Assemblies
1%Memory
12%Processor
3%
Storage
39%
Power
Supply
5%
Battery
0%
others
9%
Carbon Footprint - Production
Power off
0,1%
Power sleep
0,4%
Power long
idle
27,8%
Power short
idle
71,7%
Carbon Footprint - Use
12.10.2015 Karsten Schischke
Dept. Environmental and Reliability Engineering
© Fraunhofer IZM
Introduction Project background
LCA to go - Boosting Life Cycle Assessment Use in
European SMEs (2011-2014)
1) Analyse needs among SMEs to quantify life cycle impacts
2) Develop a tool to simplify the analysis for SMEs
3) Run a mentoring programme to educate SMEs
2011
2012/13
2014
12.10.2015 Karsten Schischke
Dept. Environmental and Reliability Engineering
© Fraunhofer IZM
Introduction SME survey 2011
What are/will be your main drivers to undertake an environmental
assessment? (electronics sector, n=28)
12.10.2015 Karsten Schischke
Dept. Environmental and Reliability Engineering
© Fraunhofer IZM
Introduction SME survey 2011
requests for LCA data, recyclability assessments, and
total cost-of-ownership are rare, but they do occur
companies also mentioned a severe current interest in
lifetime, reuse and service aspects
Two main target groups identified:
1) Product developers and manufacturers with a clear
“green agenda”, and
2) Companies in the reuse, repair and refurbishment
business extending the lifetime of electronics
products
12.10.2015 Karsten Schischke
Dept. Environmental and Reliability Engineering
© Fraunhofer IZM
Introduction Simplified Environmental Assessments
Background research
Identify most relevant sub-assemblies,
cut-off the rest (generic overhead applies)
Housing - Back cover
Metal Frame (front panel)
Display
Passive Components
(SMDs)
Mainboard - Large ICs (CPU,
memory)
Mainboard – Substrate Materials
External Power Supply - THT
capacitors and coils
Sheetmetal Manufacturing
PCB Processing
Housing 21,0%
Display 26,5% Mainboard
Assembly 25,0%
EPS 5,7%
HDD 3,4%
60 kg
Carbon footprint PC production
12.10.2015 Karsten Schischke
Dept. Environmental and Reliability Engineering
© Fraunhofer IZM
Input parameters production phase
CPU application type / number of cores
mainboard area
connectivity
RAM capacity
HDD or SSD capacity
battery capacity
display size
power supply: rated output
Introduction Simplified Environmental Assessments
12.10.2015 Karsten Schischke
Dept. Environmental and Reliability Engineering
© Fraunhofer IZM
Modelling of other life cycle phases
Lifetime scenario
Use scenario
Energy consumption (Energy Star)
Repair scenario (component replacement)
Scenarios for reuse / recycling / disposal
Introduction Simplified Environmental Assessments
12.10.2015 Karsten Schischke
Dept. Environmental and Reliability Engineering
© Fraunhofer IZM
Motivating factors among 18 mentored SMEs
External communication (11x)
“Green DNA“ / Environmentalism (6x)
Ecodesign (3x)
Compliance (3x)
Costs (1x)
Mentoring Programme Findings – Electronics Sector
12.10.2015 Karsten Schischke
Dept. Environmental and Reliability Engineering
© Fraunhofer IZM
Motivating factors among 18 mentored SMEs
Some company statements
“communicate the effect of resource
savings and GHG reduction through
lifetime extension”
“anticipate a kind of educational
role“
“company is passionate about
saving resources”
Mentoring Programme Findings – Electronics Sector
12.10.2015 Karsten Schischke
Dept. Environmental and Reliability Engineering
© Fraunhofer IZM
Case study: Metech Recycling Ltd.
mid-size company, one of the largest electronics recycling, refurbishment and resale enterprises in Wales
Disassembly of electronics devices at
Metech is done manually and largely also
non-destructive (component reuse)
Circular Economy Business Cases
12.10.2015 Karsten Schischke
Dept. Environmental and Reliability Engineering
© Fraunhofer IZM
Case study: Metech Recycling Ltd.
Mentoring example: refurbishment of a Fujitsu Desktop-PC, total extended lifetime of 8 years, DRAM
and hard disk drive have to be replaced once
Findings:
carbon footprint of the initial material acquisition and
manufacturing phase: 110 kg CO2-eq.
refurbishment operations: transports are less relevant
for the total carbon footprint as long as larger batches
are transported regionally
Circular Economy Business Cases
12.10.2015 Karsten Schischke
Dept. Environmental and Reliability Engineering
© Fraunhofer IZM
Case study: Metech Recycling Ltd.
Findings (cont’d):
computer reuse saves 8% of the carbon emissions on per-year-of-use-
basis (including use phase impacts)
Circular Economy Business Cases
12.10.2015 Karsten Schischke
Dept. Environmental and Reliability Engineering
© Fraunhofer IZM
Case study: Paxpring B.V.
designs and delivers complete packaging
solutions
customers from the ICT sector
observed trend: clients ask for LCA
evidence, but have got only a limited
understanding what Life Cycle
Assessments actually are and what the
results might tell
Circular Economy Business Cases
12.10.2015 Karsten Schischke
Dept. Environmental and Reliability Engineering
© Fraunhofer IZM
Case study: Paxpring B.V.
Mentoring example: Develop a carbon footprint calculator for packaging design
Findings:
Highly useful at pitches with clients, when presenting design alternatives
Design example small sleeve:
High carbon footprint: mixed corrugated board / plastic foil option
Moderate carbon footprint: bleached or unbleached corrugated board
alternative yields a similar carbon footprint
Low carbon footprint: folded cardboard package
Circular Economy Business Cases
12.10.2015 Karsten Schischke
Dept. Environmental and Reliability Engineering
© Fraunhofer IZM
Case study: Circular Devices
Start-up in Finland
idea: modular smartphone (“Puzzlephone”)
concept: 3 modules - display, battery,
electronics
Circular Economy Business Cases
12.10.2015 Karsten Schischke
Dept. Environmental and Reliability Engineering
© Fraunhofer IZM
Case study: Circular Devices
Mentoring exercise:
How to underpin the product
concept with environmental
arguments?
Assessment of a
conventional smartphone
Circular Economy Business Cases
12.10.2015 Karsten Schischke
Dept. Environmental and Reliability Engineering
© Fraunhofer IZM
Case study: Circular Devices
Findings and key message: Don‘t let the battery or
the display determine product lifetime!
Circular Economy Business Cases
housing and internal structural
elements 3%
display 5% Printed
Circuit Board Assemblies
6%
RAM memory 12%
processor 30% flash memory
16%
connectivity 3%
power supply 4%
battery 12%
miscellaneous parts 9%
26,5 kg CO2-eq.
12.10.2015 Karsten Schischke
Dept. Environmental and Reliability Engineering
© Fraunhofer IZM
Conclusions
SMEs which potentially can benefit from a quantification of product life
cycle impacts are those with a relevant impact on the supply chain, use
phase and/or end-of-life and match one or several of the following
categories: specifying or even designing an end-product,
making choices regarding material and component selection,
having influence on process performance / efficiency with an impact on energy or material consumption elsewhere in the life cycle,
being involved in activities (and decisions) influencing lifetime and reuse of products,
being under market (legislative) pressure to provide relevant partial life cycle data to customers or where the perceived “green” features of a product / material require a solid knowledge in this domain.
12.10.2015 Karsten Schischke
Dept. Environmental and Reliability Engineering
© Fraunhofer IZM
Conclusions (cont‘d)
communication of Circular Economy business models requires facts and figures
simplified Life Cycle Assessments / Carbon Footprint calculations are useful tools for external communication and to guide business decisions / strategies
½ day of mentoring is sufficient to bring SMEs up to speed (backed by investment in substantial background research upfront)
12.10.2015 Karsten Schischke
Dept. Environmental and Reliability Engineering
© Fraunhofer IZM
Thanks for your attention!
Karsten Schischke
Fraunhofer IZM
Gustav-Meyer-Allee 25
13355 Berlin, Germany
www.izm.fraunhofer.de
LCA to go (www.lca2go.eu) has received funding from the European Union's Seventh Programme for research, technological development and demonstration under grant agreement No 265096.
23.09.2015 Karsten Schischke
Dept. Environmental and Reliability Engineering
© Fraunhofer IZM
CARE Innovation, Europe
EcoDesign, Japan
Going Green – A Co-Operation of the
World‘s Leading Conferences
Program Overview
Tue, Sept 6 Technical Tours, e.g. Guided IFA-Tour, Get Together
Wed-Fri, Sept 7-9 Conference Programme
Location Dahlem Cube / Seminaris CampusHotel, Berlin
Chairman Prof. Dr. Klaus-Dieter Lang
Schedule Call for Papers September 2015
Website www.electronicsgoesgreen.org
organized by
September 6-9, 2016 · Berlin, Germany
Emerging Green, USA
ISSST, USA