exar's quarterly quality and reliability report february · pdf fileexar quarterly...

Exar Quarterly Quality and Reliability Report – February 2013 1

Exar Quarterly Quality and Reliability Report

February 2013


Report Contents:

Outgoing Quality (PPM) Data ................................................................................................................. 4

Quarterly QC Visual PPM Report.......................................................................................................... 5

Quarterly QC Electrical PPM Report .................................................................................................... 6

SPC – Cpk Trends .................................................................................................................................... 7

SPC – Cpk Trends - Assembly ................................................................................................................ 8 Unisem, Indonesia – LQFP................................................................................................................. 8 Unisem, Indonesia – PDIP.................................................................................................................. 9 Unisem, Indonesia – PLCC............................................................................................................... 10 Unisem, Indonesia – SOIC ............................................................................................................... 11 Unisem, Ipoh – 8L NSOIC ............................................................................................................... 12 Unisem, Ipoh – 8L PDIP................................................................................................................... 13 Unisem, Ipoh – SOT223 ................................................................................................................... 14 Unisem, Ipoh – SOT23 ..................................................................................................................... 15 Unisem, Ipoh – MSOP...................................................................................................................... 16 Unisem, Ipoh – TSSOP..................................................................................................................... 17 Carsem M - SOICW.......................................................................................................................... 18 Carsem M – TO220 .......................................................................................................................... 19 Carsem M – TO263 .......................................................................................................................... 20 Carsem M – SOT23 .......................................................................................................................... 21 Carsem M – SC70............................................................................................................................. 22 Carsem M – SSOP ............................................................................................................................ 23 Carsem M – TSSOP.......................................................................................................................... 24 Carsem S – QFP................................................................................................................................ 25 UTAC, China – BGA........................................................................................................................ 26 UTAC, China – QFP......................................................................................................................... 27 UTAC, China – LPCC ...................................................................................................................... 28

Reliability................................................................................................................................................. 29

Operating Life Test Data ...................................................................................................................... 36 GLOBALFOUNDRIES, Singapore – 0.35μ CMOS........................................................................ 30 GLOBALFOUNDRIES, Singapore – 0.6μ CMOS.......................................................................... 31 Episil, Taiwan – 1.2μ CMOS............................................................................................................ 32 Silan, China – 2μ CMOS .................................................................................................................. 33 Silan, China – 5μ CMOS .................................................................................................................. 34 Silan, China – Bipolar....................................................................................................................... 35

Die Stress Data ..................................................................................................................................... 36 GLOBALFOUNDRIES, Singapore – 0.35μ CMOS........................................................................ 36 GLOBALFOUNDRIES, Singapore – 0.18μ CMOS........................................................................ 37 GLOBALFOUNDRIES, Singapore – 0.6μ CMOS.......................................................................... 38


Episil, Taiwan – 2μ CMOS............................................................................................................... 39 Silan, China – 2μ CMOS ................................................................................................................. 40 Silan, China – 5μ CMOS .................................................................................................................. 41 Silan, China – Bipolar....................................................................................................................... 42

Package Stress Data ............................................................................................................................. 43 BGA Families ................................................................................................................................... 43 PDIP.................................................................................................................................................. 44 PLCC................................................................................................................................................. 45 T/S/LQFP.......................................................................................................................................... 46 TO……………………………………………………………………………………………….….47 SOT, TSOT, SC-70........................................................................................................................... 48 MSOP, TSSOP, SSOP, SOIC........................................................................................................... 49 QFN, DFN......................................................................................................................................... 50


Outgoing Quality (PPM) Data

The outgoing quality data are the results of electrical and visual/mechanical inspection on samples of all Exar’s products. The results are measured in parts

per million (PPM).


Quarterly QC Visual PPM Report Quarter: October 1, 2012 to December 31, 2012 Devices: Exar Products Summary: All data is first submission data Total number of lots inspected: 1942

Total number of lots accepted: 1942

Total number of QC samples inspected: 270,103

Total number fail in QC samples: 0

Process average PPM: = Σr/Σn x 106

=0/270,103X106 r = Total number fail in QC samples n = Total number of QC samples inspected

0 PPM


Quarterly QC Electrical PPM Report Quarter: October 1, 2012 to December 31, 2012 Devices: Exar Products Summary: All data is first submission data Total number of lots inspected: 4243

Total number of lots accepted: 4243

Total number of QC samples inspected: 1,292,981

Total number fail in QC samples: 0

Process average PPM: = Σr/Σn x 106

=0/1,292,981X106 r = Total number fail in QC samples n = Total number of QC samples inspected

0 PPM


SPC – Cpk Trends

Data on Cpk and Cpk trends for critical processes of Exar’s assembly subcontractors and foundry fabs are reported in order to assure our customers

that our suppliers have an on-going SPC plan to control and continually improve their critical processes. This also serves as an early warning system which

keeps processes from becoming marginal.


SPC – Cpk Trends - Assembly Unisem, Indonesia - LQFP Unisem, Indonesia SPC Program: 2012 Package Technology: LQFP

0

3

6

9

Cpk

Wire Pull

Cpk 3.87 3.60 3.60 3.90 4.40 3.31

Jul Aug Sep Oct Nov Dec

LSL = 6 gms

0.00

3.00

6.00

9.00

Cpk

Ball Shear

Cpk 3.99 4.00 4.09 4.17 3.62 3.98


LSL = 12 gms

0

3

6

9

Cpk

Plating Thickness Pb-Free

Cpk 2.65 3.63 3.56 4.93 2.81 5.76


LSL = 400μin USL = 800μin

0

4

8

12

Cpk

Coplanarity

Cpk 4.19 3.65 4.22 3.82 4.64 3.02


USL = 2.0 mils


SPC – Cpk Trends - Assembly

Unisem, Indonesia - PDIP Unisem, Indonesia SPC Program: 2012 Package Technology: PDIP

0.00

2.00

4.00

6.00

8.00

Cpk

WirePull

Cpk 4.69 4.94 2.80 2.63 3.55 4.06


LSL = 6 gms

0

2

4

6

8

Cpk

Ball Shear

Cpk 4.14 3.45 4.08 3.02 4.10 4.43

Jul Aug Sept Oct Nov Dec

LSL = 12 gms


SPC – Cpk Trends - Assembly Unisem, Indonesia - PLCC Unisem, Indonesia SPC Program: 2012 Package Technology: PLCC

0

4

8

12

Cpk

Wire Pull

Cpk 2.99 3.56 3.02 4.18 3.40 3.62


LSL = 6 gms

0

4

8

12

Cpk

Ball Shear

Cpk 4.15 4.43 7.09 3.75 3.27 3.50


LSL = 12 gms

0

4

8

12

Cpk


Cpk 5.32 3.8 6.36 2.61 4.48 5.01



0

4

8

12

Cpk

Coplanarity

Cpk 5.66 4.86 3.83 4.98 4.61 3.78


USL = 3.0 mils


SPC – Cpk Trends - Assembly

Unisem, Indonesia - SOIC Unisem, Indonesia SPC Program: 2012 Package Technology: SOIC

0

3

6

9

Cpk

Wire Pull

Cpk 2.51 2.58 2.24 2.24 2.77 2.18


LSL = 6 gms

0

3

6

9

Cpk

Ball Shear

Cpk 2.62 2.58 2.24 2.70 2.74 2.19


LSL = 15 gms


SPC – Cpk Trends - Assembly Unisem, Ipoh – 8L NSOIC Unisem, Ipoh SPC Program: 2012 Package Technology: NSOIC

0

2

4

6

Cpk

Wire Pull

Cpk 1.94 2.18 2.17 2.27 2.17 2.24


LSL = 6 gms

0

2

4

6

Cpk

Ball Shear

Cpk 2.11 2.21 1.94 2.23 2.28 1.98


LSL = 20 gms

0

2

4

6

Cpk


Cpk 1.95 1.82 2.04 1.87 1.79 1.99




SPC – Cpk Trends - Assembly Unisem, Ipoh – 8L PDIP Unisem, Ipoh SPC Program: 2012 Package Technology: PDIP

0

2

4

6

Cpk

Wire Pull

Cpk 1.96 2.28 2.05 2.17 2.11 2.11


LSL = 6 gms

0

2

4

6

Cpk

Ball Shear

Cpk 2.11 2.21 2.16 2.14 2.08 2.08


LSL = 20 gms


SPC – Cpk Trends - Assembly Unisem, Ipoh – SOT223 Unisem, Ipoh SPC Program: 2012 Package Technology: SOT223

0

2

4

6

Cpk

Wire Pull

Cpk 2.19 2.28 2.11 2.10 2.22 2.11


LSL = 6 gms

0

2

4

6

Cpk

Ball Shear

Cpk 2.14 2.21 2.17 2.12 2.31 1.90


LSL = 20 gms


SPC – Cpk Trends - Assembly Unisem, Ipoh – SOT23 Unisem, Ipoh SPC Program: 2012 Package Technology: SOT23

0

2

4

6

Cpk

Wire Pull

Cpk 1.99 1.92 2.09 2.07 2.2 2.11


LSL = 6 gms

0

2

4

6

Cpk

Ball Shear

Cpk 1.93 1.92 2.11 2.1 2.18 2.03


LSL = 20 gms

0

2

4

6

Cpk


Cpk 1.82 1.82 2.42 2.03 2.11 1.77


LSL 400μin USL = 800μin


SPC – Cpk Trends - Assembly Unisem, Ipoh - MSOP Unisem, Ipoh SPC Program: 2012 Package Technology: MSOP

0

2

4

6

Cpk

Wire Pull

Cpk 1.91 1.95 2.02 2.11 2.13 2.09


LSL = 6 gms

0

2

4

6

Cpk

Ball Shear

Cpk 2.07 1.99 1.89 2.05 2.15 2.02


LSL = 20 gms

0

2

4

6

Cpk


Cpk 1.91 2.12 2.09 1.79 1.86 1.89




SPC – Cpk Trends - Assembly Unisem, Ipoh - TSSOP Unisem, Ipoh SPC Program: 2012 Package Technology: TSSOP

0

2

4

6

Cpk

Wire Pull

Cpk 1.94 1.92 1.96 2.06 2.12 2.19


LSL = 6 gms

0

2

4

6

Cpk

Ball Shear

Cpk 1.89 1.95 1.99 2.06 1.96 1.96


LSL = 20 gms

0

1

2

3

4

Cpk


Cpk 1.93 2.20 1.95 2.02 1.85 2.13




SPC – Cpk Trends - Assembly Carsem M - MSOP Carsem M, Malaysia Program: 2012 Package Technology: SOICW

0

3

6

9

Cpk

Wire Pull

Cpk 3.26 3.14 3.18 3.3 3.39 3.08


LSL = 6 gms

0

3

6

9

Cpk

Ball Shear

Cpk 3.58 3.55 3.08 3.68 4.12 3.58


LSL = 20 gms

$0.00

$2.00

$4.00

$6.00

Cpk


Cpk $1.70 1.78 1.71 1.76 1.74 1.79



0.00

4.00

8.00

12.00

Cpk

Coplanarity

Cpk 5.50 4.68 4.35 4.36 4.35 4.35


USL = 1.3 mils


SPC – Cpk Trends - Assembly Carsem M – TO220 Carsem M, Malaysia Program: 2012 Package Technology: TO220

0

6

12

Cpk

Wire Pull

Cpk 8.53 8.99 10.02 10.02 10.02 8.45


LSL = 6 gms

0

4

8

12

Cpk

Ball Shear

Cpk 4.93 4.61 4.68 4.68 4.68 4.05

Apr May Jun Oct Nov Dec

LSL = 20 gms

0

2

4

6

Cpk


Cpk 1.75 1.74 1.76 1.76 1.76 1.78




SPC – Cpk Trends - Assembly Carsem M – TO263 Carsem M, Malaysia Program: 2012 Package Technology: TO263

0

5

10

15

20

Cpk

Wire Pull

Cpk 7.28 7.45 9.03 9.76 15.24 13.76


LSL = 6 gms

0

3

6

9

12

Cpk

Ball Shear

Cpk 4.76 4.84 5.44 6.86 6.18 6.62


LSL = 20 gms

0

2

4

6

Cpk


Cpk 1.75 1.74 1.76 1.76 1.75 1.78



0

5

10

15

20

25

Cpk

Coplanarity

Cpk 17.71 17.71 15.27 14.91 14.97 14.72


USL = 3.0 mils


SPC – Cpk Trends - Assembly Carsem M – SOT223 Carsem M, Malaysia Program: 2012 Package Technology: SOT23

0

3

6

9

12

Cpk

Wire Pull

Cpk 7.07 7.07 7.71 7.51 7.96 7.58


LSL = 3 gms

0.00

2.00

4.00

6.00

8.00

Cpk

Ball Shear

Cpk 3.90 4.01 3.81 3.76 3.78 3.51


LSL = 20 gms

0

1

2

3

4

Cpk


Cpk 1.79 1.77 1.71 1.78 1.74 1.75




SPC – Cpk Trends - Assembly Carsem M – SC70 Carsem M, Malaysia Program: 2012 Package Technology: SC70

0.00

3.00

6.00

9.00

12.00

Cpk

Wire Pull

Cpk 5.30 5.69 5.04 5.35 7.70 8.34


LSL = 3 gms

0

3

6

9

Cpk

Ball Shear

Cpk 2.21 2.98 2.74 2.81 3.04 3.13


LSL = 20 gms

0

1

2

3

4

Cpk


Cpk 1.72 1.75 1.75 1.72 1.75 1.72




SPC – Cpk Trends - Assembly Carsem M – SOT23 Carsem M, Malaysia Program: 2012 Package Technology: SSOP

0

3

6

9

12

Cpk

Wire Pull

Cpk 7.29 7.88 7.80 7.94 8.40 8.17


LSL = 3 gms

0

3

6

9

Cpk

Ball Shear

Cpk 4.83 4.10 4.56 4.65 5.64 3.19


LSL = 13 gms

0

1

2

3

4

Cpk


Cpk 1.72 1.77 1.78 1.74 1.72 1.79




SPC – Cpk Trends - Assembly Carsem S - TSSOP Carsem M, Malaysia Program: 2012 Package Technology: TSSOP

0

3

6

9

12

Cpk

Wire Pull

Cpk 7.66 8.05 7.8 7.64 8.39 8.41


LSL = 3.0 gms

0

3

6

9

Cpk

Ball Shear

Cpk 4.71 5.32 5.12 5.29 5.39 4.96


LSL = 20 gms

0.00

1.00

2.00

3.00

4.00

Cpk


Cpk 1.71 1.74 1.77 1.73 1.72 1.75




SPC – Cpk Trends - Assembly Carsem S - QFP Carsem S, Malaysia Program: 2012 Package Technology: QFP

0

2

4

6

Cpk

Wire Pull

Cpk 3.59 3.81 3.94 3.76 3.91 3.86


LSL = 6 gms

0

2

4

6

Cpk

Ball Shear

Cpk 2.48 2.67 2.75 3.08 2.98 2.65


LSL = 20 gms

0

2

4

6

Cpk


Cpk 2.91 2.63 2.63 2.66 2.68 2.65



0

2

4

6

Cpk

Plating Comp (%Sn)

Cpk 3.4 3.29 3.09 3.08 3.33 3.2


LSL =70% USL = 90%

0.00

4.00

8.00

12.00

16.00

Cpk

Coplanarity

Cpk 6.40 6.50 7.17 7.21 8.79 8.72


USL = 3.0 mils


SPC – Cpk Trends - Assembly ASAT, China - BGA UTAC, China Program: 2012 Package Technology: BGA

0

3

6

9

12

Cpk

Wire Pull

Cpk 8.54 3.66 3.66 3.66 4.50 5.46


LSL = 3 gms

0

5

10

15

Cpk

Ball Shear

Cpk 6.87 5.51 5.51 5.51 5.58 5.58


LSL = 8 grams


SPC – Cpk Trends - Assembly ASAT, China - QFP UTAC, China Program: 2012 Package Technology: QFP

0

3

6

9

Cpk

Wire Pull

Cpk 6.24 6.21 5.36 4.08 5.27 5.1


LSL = 3 gms

0.00

5.00

10.00

15.00

Cpk

Ball Shear

Cpk 6.20 5.05 7.37 5.20 6.70 6.42


LSL = 20 gms

0

1

2

3

4

Cpk


Cpk 2.02 2.32 2.26 2.49 2.15 1.89




SPC – Cpk Trends - Assembly ASAT, China - LPCC UTAC, China Program: 2012 Package Technology: LPCC

0

4

8

12

Cpk

Wire Pull

Cpk 5.09 4.81 5.36 3.95 4.82 5.68


LSL = 3 gms

0

2

4

6

8

Cpk

Ball Shear

Cpk 5.04 4.50 4.78 6.04 1.94 5.50


LSL = 20 gms

0

2

4

6

Cpk


Cpk 2.18 2.83 1.89 2.06 2.00 1.74




Reliability

Reliability data trends of Exar’s wafer fab processes and package types are reported in order to assure our customers that our foundry fabs and assembly

subcontractors are continuing to improve their reliability performance.


Operating Life Test Data CSM, Singapore - 0.35μ CMOS Factory: GLOBALFOUNDRIES, Singapore Process: 0.25μ/0.35μ CMOS

0

0.2

0.4

0.6

0.8

1

PPM

EFR (Early Fail Rate)

PPM 0 0 0 0 02008 2009 2010 2011 2012

Year Sample Size

# Fail PPM

2008 20 0 0

2009 105 0 0

2010 70 0 0

2011 125 0 0

2012 129 0 0

0.00

2.00

4.00

6.00

8.00

10.00

FITs

IFR (Intrinsic Fail Rate)

FITs 5.70 5.30 4.90 4.65 4.442008 2009 2010 2011 2012

Year Sample Size

Device Hours

# Fail

2008 20 20,000 0

2009 105 105,000 0

2010 70 70,000 0

2011 125 125,000 0

2012 129 129,000 0 FIT: Failure in Time; 60% CL, 55°C, Ea = .7eV

IFR: Intrinsic Failure Rate > 168 hours @ the test temperature of 125°C or > 72 hours @ 150°C

IFR: Early Failure Rate < 168 hours @ the test temperature of 125°C or < 72 hours @ 150°C


Operating Life Test Data

CSM, Singapore - 0.6μ CMOS Factory: GLOBALFOUNDRIES, Singapore Process: 0.6μ CMOS

0

0.2

0.4

0.6

0.8

1

PPM


PPM 0 0 0 0 0

2008 2009 2010 2011 2012

Year Sample

Size # Fail PPM

2008 100 0 0

2009 180 0 0

2010 140 0 0

2011 330 0 0

2012 211 0 0

0

1

2

3

4

5

6

FITs


FITs 3.6 3.49 3.00 2.70 2.40 2.382007 2008 2009 2010 2011 2012

Year Sample

Size Device Hours

# Fail

2008 100 100,000 0

2009 180 180,000 0

2010 140 140,000 0

2011 330 330,000 0

2012 211 211,000 0

FIT: Failure in Time; 60% CL, 55°C, Ea = .7eV





, Taiwan – 1.2u CMOS Factory: Episil, Taiwan Process: 1.2μ / 2μ CMOS

0

0.2

0.4

0.6

0.8

1

PPM


PPM 0 0 0 0 0

2008 2009 2010 2011 2012

Year Sample Size

# Fail PPM

2008 319 0 0

2009 1290 0 0

2010 527 0 0

2011 327 0 0

2012 530 0 0

0

2

4

6

8

10

FITs


FITs 7.22 3.80 3.30 3.00 2.61

2008 2009 2010 2011 2012

Year Sample Size

Device Hours

# Fail

2008 319 559,000 0

2009 1290 1,290,000 0

2010 527 527,000 0

2011 327 327,000 0






Silan, Hangzhou PRC – 2u CMOS Factory: Silan, China Process: 2μ CMOS

0

0.2

0.4

0.6

0.8

1

PPM


PPM 0 0 0 0 0

2008 2009 2010 2011 2012

Year Sample Size

# Fail PPM

2008 953 0 0

2009 946 0 0

2010 460 0 0

2011 560 0 0

2012 720 0 0

0

2

4

6

8

10

FITs


FITs 7.06 4.50 3.80 3.20 2.772008 2009 2010 2011 2012

Year Sample Size

Device Hours

# Fail

2008 953 953,000 0

2009 946 946,000 0

2010 460 460,000 0

2011 560 560.000 0






Silan, Hangzhou PRC – 5u CMOS Factory: Silan, China Process: 5μ CMOS

0

0.2

0.4

0.6

0.8

1

PPM


PPM 0 0 0 0 0

2008 2009 2010 2011 2012

Year Sample Size

# Fail PPM

2008 399 0 0

2009 893 0 0

2010 160 0 0

2011 330 0 0

2012 390 0 0

0.00

4.00

8.00

12.00

16.00

20.00

FITs


FITs 14.35 6.90 6.30 5.50 4.30

2008 2009 2010 2011 2012

Year Sample Size

Device Hours

# Fail

2008 399 399,000 0

2009 893 893,000 0

2010 160 160,000 0

2011 330 330,000 0





Operating Life Test Data Silan, Hangzhou PRC – Bipolar Factory: Silan, China Process: Bipolar

0

0.2

0.4

0.6

0.8

1

PPM


PPM 0 0 0 0 0

2008 2009 2010 2011 2012

Year Sample Size

# Fail PPM

2008 721 0 0

2009 989 0 0

2010 560 0 0

2011 320 0 0

2012 432 0 0

0.00

1.00

2.00

3.00

4.00

5.00

FITs


FITs 4.30 3.10 2.90 2.60 2.45

2008 2009 2010 2011 2012

Year Sample Size

Device Hours

# Fail

2008 721 721,000 0

2009 989 604,000 0

2010 560 560,000 0

2011 320 320,000 0





Die Stress Data CSM, Singapore - 0.35μ CMOS Factory: GLOBALFOUNDRIES, Singapore Process: 0.35μ CMOS

0

0.2

0.4

0.6

0.8

1

% Fail

High Temperature Storage1000 Hours, 150°C, Unbiased

% Fail 0 0 0 0 02008 2009 2010 2011 2012

Year Sample

Size # Fail % Fail

2008 75 0 0

2009 170 0 0

2010 165 0 0

2011 180 0 0

2012 99 0 0



0

0.2

0.4

0.6

0.8

1

% Fail


% Fail 0 0 0 0 02008 2009 2010 2011 2012

Year Sample

Size # Fail % Fail

2008 45 0 0

2009 65 0 0

2010 185 0 0

2011 70 0 0

2012 326 0 0



0

0.2

0.4

0.6

0.8

1

% Fail


% Fail 0 0 0 0 02008 2009 2010 2011 2012

Year Sample

Size # Fail % Fail

2008 100 0 0

2009 180 0 0

2010 225 0 0

2011 175 0 0

2012 216 0 0


Die Stress Data Taiwan -2u CMOS Factory: Episil, Taiwan Process: 2μ CMOS

0

0.2

0.4

0.6

0.8

1

% Fail


% Fail 0 0 0 0 02008 2009 2010 2011 2012

Year Sample Size

# Fail % Fail

2008 462 0 0

2009 137 0 0

2010 254 0 0

2011 347 0 0

2012 350 0 0


Die Stress Data

Silan, Hangzhou PRC - 2u CMOS Factory: Silan, China Process: 2μ CMOS

0

0.2

0.4

0.6

0.8

1

% Fail


% Fail 0 0 0 0 02008 2009 2010 2011 2012

Year Sample Size

# Fail % Fail

2008 204 0 0

2009 878 0 0

2010 201 0 0

2011 678 0 0

2012 452 0 0


Die Stress Data

Silan, Hangzhou PRC - 5u CMOS Factory: Silan, China Process: 5μ CMOS

0

0.2

0.4

0.6

0.8

1

% Fail


% Fail 0 0 0 0 02008 2009 2010 2011 2012

Year Sample Size

# Fail % Fail

2008 77 0 0

2009 185 0 0

2010 157 0 0

2011 323 0 0

2012 290 0 0

290


Die Stress Data Silan, Hangzhou PRC -Bipolar Factory: Silan, China Process: Bipolar

0

0.2

0.4

0.6

0.8

1

% Fail


% Fail 0 0 0 0 0 0

2007 2008 2009 2010 2011 2012

Year Sample

Size # Fail % Fail

2008 116 0 0

2009 347 0 0

2010 295 0 0

2011 240 0 0

2012 332 0 0


Package Stress Data

BGA Families Package: BGA Families

0

0.2

0.4

0.6

0.8

1

% Fail

Temperature Cycle

% Fail 0 0 0 0 02008 2009 2010 2011 2012

Conditions: 300/1000 Cycles time points, -65/150°C

Year Sample Size # Fail % Fail

2008 47 0 0

2009 74 0 0

2010 281 0 0

2011 513 0 0

2012 578 0 0

0

0.2

0.4

0.6

0.8

1

% Fail

Pressure Pot/UHAST

% Fail 0 0 0 0 0

2008 2009 2010 2011 2012

Year Sample Size

# Fail % Fail

2008 68 0 0

2009 74 0 0

2010 281 0 0

2011 513 0 0

2012 578 0 0 Conditions: 96 Hours, 130°C, 85% RH


Package Stress Data PDIP Package: PDIP

0

0.2

0.4

0.6

0.8

1

% Fail

Temperature Cycle

% Fail 0 0 0 0 02008 2009 2010 2011 2012

Year Sample Size

# Fail % Fail

2008 135 0 0 2009 225 0 0 2010 237 0 0 2011 195 0 0 2012 339 0 0


0

0.2

0.4

0.6

0.8

1

% Fail

Pressure Pot/UHAST

% Fail 0 0 0 0 02008 2009 2010 2011 2012

Year Sample Size

# Fail % Fail

2008 135 0 0 2009 225 0 0 2010 237 0 0 2011 195 0 0 2012 339 0 0

Conditions: 96/168 Hours, 121°C, 100% RH / or 96 Hours, 130°C, 85% RH


Package Stress Data PLCC Package: PLCC

0

0.2

0.4

0.6

0.8

1

% Fail

Temperature Cycle

% Fail 0 0 0 0 02008 2009 2010 2011 2012

Year Sample Size

# Fail % Fail

2008 90 0 0 2009 45 0 0 2010 225 0 0 2011 180 0 0 2012 187 0 0


0

0.2

0.4

0.6

0.8

1

% Fail

Pressure Pot/UHAST

% Fail 0 0 0 0 02008 2009 2010 2011 2012

Year Sample Size

# Fail % Fail

2008 180 0 0 2009 45 0 0 2010 225 0 0 2011 180 0 0 2012 187 0 0

Conditions: 96 Hours, 130°C, 85% RH


Package Stress Data T/S/LQFP Package: T/S/LQFP

0

0.2

0.4

0.6

0.8

1

% Fail

Temperature Cycle

% Fail 0 0 0 0 02008 2009 2010 2011 2012

Year Sample Size

# Fail % Fail

2008 180 0 0 2009 310 0 0 2010 270 0 0 2011 410 0 0 2012 738 0 0

Conditions: 300/1000 Cycles time points, -65/150°C C

0

0.2

0.4

0.6

0.8

1

% Fail

Pressure Pot/UHAST

% Fail 0 0 0 0 02008 2009 2010 2011 2012

Year Sample Size

# Fail % Fail

2008 225 0 0 2009 321 0 0 2010 270 0 0 2011 410 0 0 2012 623 0 0

Conditions: 96 Hours,130°C, 85% RH


Package Stress Data

O Package: TO

0

0.2

0.4

0.6

0.8

1

% Fail

Temperature Cycle

% Fail 0 0 0 02009 2010 2011 2012

Year Sample Size

# Fail % Fail

2009 855 0 0 2010 1176 0 0 2011 488 0 0 2012 308 0 0


0

0.2

0.4

0.6

0.8

1

% Fail

Pressure Pot/UHAST

% Fail 0 0 0 0

2009 2010 2011 2012

Year Sample Size

# Fail % Fail

2009 855 0 0 2010 1176 0 0 2011 488 0 0 2012 308 0 0

Conditions: 96 Hours, 130°C, 85% RH


Package Stress Data SOT, TSOT, SC-70 Package: SOT, TSOT, SC-70

0

0.2

0.4

0.6

0.8

1

% Fail

Temperature Cycle

% Fail 0 0 0 0 0

2008 2009 2010 2011 2012

Year Sample Size

# Fail % Fail

2008 1780 0 0 2009 1042 0 0 2010 2429 0 0 2011 1383 0 0 2012 1662 0 0


0

0.2

0.4

0.6

0.8

1

% Fail

Pressure Pot/UHAST

% Fail 0 0 0 0 0 0

2007 2008 2009 2010 2011 2012

Year Sample Size

# Fail % Fail

2008 836 0 0 2009 1042 0 0 2010 2429 0 0 2011 1383 0 0 2012 1662 0 0

Conditions: 96 Hours, 121°C, 100% RH / or 96 Hours, 130°C, 85% RH


Package Stress Data

MSOP, TSSOP, SSOP, SOIC Package: MSOP, TSSOP, SSOP, SOIC

0

0.2

0.4

0.6

0.8

1

% Fail

Temperature Cycle

% Fail 0 0 0 0 0

2008 2009 2010 2011 2012

Year Sample Size

# Fail % Fail

2008 2538 0 0 2009 3058 0 0 2010 4689 0 0 2011 3625 0 0 2012 2317 0 0


0

0.2

0.4

0.6

0.8

1

% Fail

Pressure Pot/UHAST

% Fail 0 0 0 0 02008 2009 2010 2011 2012

Year Sample Size

# Fail % Fail

2008 2253 0 0 2009 3189 0 0 2010 4923 0 0 2011 3625 0 0 2012 2317 0 0



Package Stress Data QFN, DFN Package: DFN/QFN

0

0.2

0.4

0.6

0.8

1

% Fail

Temperature Cycle

% Fail 0 0 0 0 0

2008 2009 2010 2011 2012

Year Sample Size

# Fail % Fail

2008 45 0 0 2009 85 0 0 2010 70 0 0 2011 442 0 0 2012 680 0 0


0

0.2

0.4

0.6

0.8

1

% Fail

Pressure Pot/UHAST

% Fail 0 0 0 0 02008 2009 2010 2011 2012

Year Sample Size

# Fail % Fail

2008 25 0 0 2009 220 0 0 2010 70 0 0 2011 442 0 0 2012 449 0 0


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