ev group corporate overview - semi.org | evgroup.pdf · ev group corporate overview ... jp, kr, cn...
TRANSCRIPT
www.EVGroup.com
EV Group
Corporate Overview
Dr. Thomas Uhrmann, Director of Business Development, [email protected]
SEMI Packaging Tech Seminar – Vila do Conde, June 18th, 2015
www.EVGroup.com EV Group Confidential and Proprietary
Equipment supplier for the semiconductor and MEMS industry
2000+ equipment installations
Privately held company founded in 1980
Headquartered in Austria - subsidiaries in USA, JP, KR, CN and TW
Worldwide Sales and Customer Support Network
Internal process development
20% of revenue is invested into R&D annually
Our philosophy Our mission
st
in serving next generation application
in semiconductor technology
Quick Introduction to EV Group
www.EVGroup.com EV Group Confidential and Proprietary
Product Categories
EVG is a global supplier of:
Wafer Bonders
Aligners
Coaters / Developers
Temporary Bonders / Debonders
Cleaners
Inspection / Metrology Systems
EV Group holds the dominant share of the market for wafer bonding equipment
and is a technology leader in lithography for advanced packaging and
nanotechnology.
3
www.EVGroup.com EV Group Confidential and Proprietary
EV Group Vision and Mission: Triple i
Enabling our customers to successfully commercialize their
new product ideas Invent With our equipment and processes, we constantly
bring to market emerging applications and
develop new technologies in partnership
with our customers.
Innovate Faster than others, we develop new technologies
and processes through constant innovation and
continuous improvement.
Implement Our equipment is designed for high volume
industrial production. We implement cost efficient
large-scale manufacturing technologies for
new value-added products to supply our
customers’ industries.
www.EVGroup.com EV Group Confidential and Proprietary
EV Group Global Presence
Fully owned subsidiaries
Representatives
EV Group Inc. Tempe, AZ
EV Group Inc. Albany, NY
EV Group Korea Ltd.
Seoul EV Group Japan KK
Yokohama
EV Group Japan KK
Fukuoka
EV Group Taiwan Ltd.
EVG-Jointech Corp.
Chung-Li
EV Group China Ltd.
Shanghai
EVG Headquarters
St. Florian / Inn, Austria
www.EVGroup.com EV Group Confidential and Proprietary
Manufacturing Solutions
6 6
3D IC CMOS Image Sensors High Brightness LEDs
Logic / Memory MEMS Devices Microfluidics
SAW Devices SOI Wafers Photonics
www.EVGroup.com EV Group Confidential and Proprietary
EV Group Process Support and Development
Customer demonstrations
Process development
Joint R&D with partners
Small volume pilot line production
IP management
Process technology licenses
Process training
www.EVGroup.com EV Group Confidential and Proprietary
Platform Example for JDP with Customers
NILPhotonicsTM Competence Center
Competence
NILPhotonicsTM
Center
Master Templates
• SU-8 Mastering
• Wide network of stamp
suppliers
• S&R Mastering Metrology Infrastructure
• SEM, AFM,
• Interferometry
• Wide network of
metrology providers
Process Development
Definition and development
of customized processes
• UV-NIL
• Hot Embossing
• Micro-contact Printing
Sample Processing
EVG offers:
• Manufacturability
Demonstrations
• Small production run imprint
services
• Scale-up to pilot line
production
Pilot Line Production
For seamless transition from R&D
to production, EVG offers pilot line
production services as well as
process transfer to customer
designated volume manufacturing
sites
Materials Know-How
Based on its extensive process
related know-how, EVG offers
optimization of soft-stamp and
imprint resin interaction to meet:
• Applications requirements
• Layout requirements
• Productivity and low Cost of
Ownership (CoO)
www.EVGroup.com EV Group Confidential and Proprietary
Technological Highlights for Packaging
Temporary Bonding for Advanced Packaging
Mature and optimized high-volume-manufacturing platform for Temporary Bonding
Open Adhesive Platform – multiple
adhesives, multiple sources
Material evaluation program for adhesive
performance qualification
Lithography Solutions for Advanced Packaging
Thick photoresist processing for bumping
applications (10 – 200 µm)
Permanent dielectric passivation layers
(BCB, PI coating)
Thin resist layers for lithographic RDL
patterning (conformal coating)
TSV processing (Via insulation /
passivation, polymer via-filling)
www.EVGroup.com EV Group Confidential and Proprietary
Technological Highlights Te
ch
no
log
ica
l H
igh
lig
hts
Fusion & Hybrid Bonding 3x improvement in wafer-to-wafer alignment
New SmartView®NT2 with better than 200nm (3σ) alignment
accuracy
50% increased throughput NanoFill™ / NanoSpray™ Technology
Joint developments with customers enabling new devices with nano
imprint technology
EVG®580 ComBOND® Room temperature covalent bonding
Conductive / oxide-free interfaces
Minimum bulk lattice damage
NILPhotonics Competence Center
Joint development platform with customers enabling new devices
with imprint technologies
www.EVGroup.com EV Group Confidential and Proprietary
Data, design and specifications may not simultaneously apply; or depend on individual equipment configuration, process conditions and materials and may vary accordingly. EVG reserves the right to
change data, design and specifications without prior notice. All trademarks, logos, website addresses or equipment names that contain the letters or words "EVG" or "EV Group" or any combination thereof,
as well as the following names and acronyms are registered trademarks and/or the property of EV Group: ComBond®, CoverSpinTM, EZB®, EZ Bond®, EZD®, EZ Debond®, EZR®, EZ Release®, GEMINI®,
HERCULES®, HyperIntegration®, IQ Aligner®, LowTempTM, NanoAlign®, NanoFillTM, NanoSprayTM, NIL-COM®, NILPhotonicsTM, OmniSpray®, SmartEdge®, SmartView®, The Triple "i" Company Invent-
Innovate-Implement®, Triple i®. Other product and company names may be registered trademarks of their respective owners.
Thank you for your attention!