epic™ soft pads...• higher slurry holding capability leads to lower particle and scratch defects...
TRANSCRIPT
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© 2014 Cabot Microelectronics Corporation
Epic™ Soft Pads Cabot Microelectronics Approach
March 2014
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© 2014 Cabot Microelectronics Corporation
Outline
Need of soft pads – Driving force – defects
Challenges of soft pads – Usable pad life – Process stability – rate, selectivity, topography – Batch to batch variation
CMC approach to soft pads – Why thermoplastic pads? – Manufacturing technology advantage
Pads for barrier application – Test results for pad stability and defects
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© 2014 Cabot Microelectronics Corporation
Why Soft Pads?
Defects: Particle and scratches – Slurry: complex designs to control selectivity for topography
• New designs, new materials, new requirements • Pad first or slurry first – difficult choice
– Pad should be capable to remove residue and avoid scratch • Challenge is how to achieve integration requirement while maintaining
low defects Process knobs for pads – Shore hardness – measure of resistance to indentation
• Softer material leads to lower defects, but poor topography – Material hardness – resilience, modulus
• Higher resilience and lower modulus helps lower defects – Pore structure – slurry holding capability, compressibility
• Higher slurry holding capability leads to lower particle and scratch defects – Abrasion resistance – pad life
• Pad life should be similar to hard pad/bulk polish step
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© 2014 Cabot Microelectronics Corporation
Pad Design Concepts
Pad
Material
Shore hardness Scratch
Topography
Compressibility Rate
Abrasion resistance Pad life
Conversion
Surface Rate stability
Defects
Pore structure Slurry holding
Defects
Groove types Slurry transport
Debris transport
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© 2014 Cabot Microelectronics Corporation
Why Thermoplastic?
Thermoset vs. Thermoplastic – For soft material, differences of TPU vs. TSU are small – cross linking
absent in both cases – No metal contamination, or additives in thermoplastic material – (Isocyanate)1 mole + (diol + Polyol)1 mole polyurethane
• Tight stoichiometry control of components will lead to non-cross linked TPU
– Hydrolysis resistant, low abrasion
CMC Foaming Technology – Non-chemical blowing agent technology – Solid State Foaming
• CO2 saturated sheet is removed and is exposed to foaming conditions (above Tg)
• Microcellular structure is formed as a result of system responding to CO2 escape (nucleation and growth)
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© 2014 Cabot Microelectronics Corporation
CMC Pads Portfolio
F99 F66 F33
F12 F9 F8 F6 F3
F7 F5 F2
F11 F10 F4 F1 / D100
25D 50D 60D 72D
Low (<20%)
Medium (20%-40%)
Very High (>60%)
Poro
sity
High (40-50%)
42D Toolinc.com Good
Defectivity
Good PE
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© 2014 Cabot Microelectronics Corporation
CMC Soft Pad Portfolio
Resin
Porosity
Low 10 ± 5
Medium 30 ± 5
High 70 ± 5*
Pore size
Small 20 ± 10
Medium 40 ± 10
Large 60 ± 10
Surface
Smooth
Low roughness
Grooves
XY
Conc.
Combo
87 A, 70A Window: FullVision®
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© 2014 Cabot Microelectronics Corporation
D2xx Process Flow
TPU Resin
Top Pad Foam &
Sheeting
Platen Adhesive
Lamination Die-cut Window
Insertion (optional)
Polycarbonate substrate Lamination Lamination Adhesive Window Resin Injection Mold
Window
Packaging (Box )
Cleaning, Bagging
Quality Data Verification (CoA)
Ship
Grooving Surfacing Topside
Surfacing Backside
Extrusion
Start
Optional
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© 2014 Cabot Microelectronics Corporation
Defectivity vs. Porosity
Higher porosity pad has lower storage modulus and higher compressibility.
– Better defects, higher rate
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© 2014 Cabot Microelectronics Corporation
Polishing Rate Stability
High porosity pads lead to high rate and lower defects – Ideal candidate for barrier process – Stable and long pad life
Fujibo H700042D HP42D F17 ES325D F12 ES3
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Scra
tch
Coun
t
25D F12 ES342D F17 ES342D HPFujibo H7000
Pad
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© 2014 Cabot Microelectronics Corporation
FullVision™* Window
Window Technology – Unique window installation technology – TPU advantage – Welded windows, 100% leak tested – Capable to match pad resin hardness with FV window – UV stabilized material to ensure stable performance over pad life – Window hardness – match to pad resin hardness
*Trademark of Applied Materials, Inc.
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© 2014 Cabot Microelectronics Corporation
D200 42D HP XSEM
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© 2014 Cabot Microelectronics Corporation
Thank You