environmentally benign manufacturing wtec study sponsored by nsf delcie r. durham national science...
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Environmentally Benign Manufacturing
WTEC Study sponsored by NSF
Delcie R. DurhamNational Science Foundation
December 2000
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Manufacturing
The manufacturing enterprise requires the integration of the appropriate scientific, engineering, and mathematics disciplines with design objectives within a systems framework where the desired outcome is a viable product or service.
Product realization, integrated product and process development, concurrent engineering are all aspects of the manufacturing enterprise. Economics, energy and environmental issues define viability.
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Industrial Ecology
Seeks to analyze and control materials flows across regional or national boundaries to reduce resource depletion and environmental effects.
is defined to encompass diverse disciplines such as engineering, environmental health sciences, life-cycle analysis (LCA), economics, social sciences, and public policy.
Is macro in nature.
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productionproduction
distributiondistribution
dismissaldismissal
useuse
recyclingrecycling
designdesign VIRTUAL VIRTUAL PRODUCTIONPRODUCTION
PHYSICALPHYSICALPRODUCTIONPRODUCTION
REVERSEREVERSEPRODUCTIONPRODUCTION
maintenancemaintenance
© CNR-ITIA
Sustainable Production Model - EU
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MANUFUTURING - EU
VFVF PFPF
Phys. Phys. FactoryFactory
Virtual Virtual FactoryFactory
....................
....................
Producers ofProducers offinal goodsfinal goods
ProducersProducersof of subassembliessubassemblies
Suppliers of raw materials and componentsSuppliers of raw materials and components
Virtual Virtual FactoryFactory
Phys. Phys. FactoryFactory
CONTEXT
CO
NTEX
T
© CNR-ITIA
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Environmentally Benign Manufacturing (EBM)
Environmentally benign manufacturing is involved with the technologies, the operational practices, the analytical methods and strategies for sustainable production within the industrial ecology framework. (Sheng, Durham, Wellek)
Specifically addresses the development and implementation of benign materials processing to meet the challenges of sustainable materials flow in a use and reuse environment
It also addresses systems consideration of re-manufacturing, reuse, and recycling in total waste-stream management.
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Life Cycle Analysis
Product Development and Design
Recycling and Disposal
Produce Use
Product Packaging and Distribution
Acquisition of raw materials, components, andsub-assemblies
ProductManufacture
taken from Richards and Frosch, 1997
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Product manufacture
• Minimize emissions• Minimize wastes (solid, fluid)• Conserve water, energy, materials• Reduce toxicity, exposure• Substitute more benign materials• Substitute more benign processes• Assure worker health and safety• Find new uses for wastestreams
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Recycling and disposal
• Design for reusability• Design for remanufacturability• Design for separability• Design for disassembly• Design for recyclability• Design for diposability
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State of International Environmental Performance Standards
In the electronic equipment manufacturing, IEC* has concerns with:
the primitive state of LCA pollution prevention environmental impact assessments design for disassembly
IEC - International Electrotechnical CommissionInformation from The Ecology of Industry, NAE, Manufacturing, Laudise & Gradel
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EBM Panel Mission Advance understanding of EBM Establish baseline and document best
practices;– Policy, practice,and motivation
– infrastructure and technology,
– methodologies and metrics,
– goals and assessments
– research
Identify research opportunities Promote international cooperation
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EBM Panelists
• Timothy Gutowski
(Chair)
• Cynthia Murphy
(Co-chair)
• David Allen
• Diana Bauer
• Bert Bras
• Thomas Piwonka
• Paul Sheng
• John Sutherland
• Deborah Thurston
• Egon Wolff
• Delcie Durham (NSF)
• Fred Thompson (NSF)
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Focus Areas
Metal Processing
Polymer Processing
– thermoplastics and
thermosets,
– composites
Applications
– automobiles
– electronics
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Sca
le o
f O
rgan
izat
ion
al C
once
rn
Scale of Temporal Concern
Sin
gle
Pro
duct
Lif
e C
ycle
X Products
One Manufacturer
Society
Manufacturing
Use
Disposal
Product Life Cycle
Human Lifetime
Civilization Span
X Manufacturers
Manufacturing Use Disposal
1: Environmental Engineering 2: Pollution Prevention 3: Envir. Conscious D&M 4: Design for the Environment 5: Life Cycle Design 6: Industrial Ecology 7: Sustainable Development
21
3,4,5
6
7
Potential Scope of EBM
• So where and what is EBM?
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Sites Visited: Japan
• Fuji Xerox• Hitachi PERL• Horiba, Ltd.• Kubota• MITI/Mechanical Eng.
Lab.• MITI/AIST/NIMC• Nagoya University• NEC Corporation• Nippon Steel
Corporation• NIRE
• New Earth Conference & Exhibition
• NRIM• PVC Industrial
Association• Sony Corporation• Toyo Seikan Kaisha• Toyota Motor
Corporation• University of Tokyo• Institute for Industrial
Science
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Sites Visited: EuropeBelgium, Denmark, Netherlands, Germany,
Sweden, Switzerland
• Corus Holland• DaimlerChrysler• Denmark Tech. U.• EC Environmental
Directorate• EC Research and
Technical Development• Excello• Fraunhofer, Aachen• Fraunhofer, Berlin• Fraunhofer, Stuttgart
• ICAST • IVF• MIREC• Siemens• TU Aachen• TU Berlin• TU Delft (Ministry of
Environment, Lucent Tech., Phillips)
• Univ. of Stuttgart• Volvo
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Sites Visited: U. S.
• Applied Materials• Caterpillar• CERP• Chaparral Steel/Cement• DaimlerChrysler• DRI• DuPont• Federal Mogul• Ford
• Interface
• GM• IBM• Interface• Johnson Controls• MBA Polymers• Metrics Workshop• Micro Metallics• NCMS
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R & D ActivitiesPreliminary Assessment
ActivityRelevant Basic Research (>5 years out) Polymers Electronics Metals Automotive/Transportation SystemsApplied R&D ( 5 years out) Polymers Electronics Metals Automotive/ Transportation Systems
Japan
US
Europe
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Industrial Activities -Relative Competitiveness
ActivityISO 14000 CertificationWater ConservationEngergy conservation/CO2 emissionsDecreased releases to air and waterPost Industrial solid waste reduction/recyclingPost-consumer recyclingMaterial and Energy inventoriesAlternative material developmentSupply chain involvementEBM as a business strategyLife-cycle activities
Japan
US
Europe
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Government Activities Relative Competitiveness
Activity Japan US Europe
Take-back legislation — Landfill bans Material bans LCA tool and database development Recycling infrastructure Economic incentives Regulate by medium Cooperative /joint efforts with industry Financial and legal liability
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Preliminary Findings of WTEC Study
Future needs: products designed for re-use better reprocessing technologies introduce EBM as part of being “lean” rather
than new integration of financial and environmental
systems re-use / life prediction modeling accounting system for the “value” of EBM in
processing / design selection
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Design for Environment - Focus Areas
Materials of concern– Reduction– Elimination/substitution
Design for disassembly and reuse– Assembly technology and materials– Reduction in number of materials used– Reduction in use of coatings and other
inseparable materials configurations Volume reduction
– Manufacturing– Products (EOL disposition)
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Japanese LCA Working Groups
Inventory Committee– Collect process emission data across industries for CO2, CH4,
HFC, PFC, N2O, SF6, NOx, SOx, particulate, BOD, COD, phosphorus, nitrogen, suspended solids.
– Develop methodology for attributing emissions for recycling and disposal.
Database Committee– Construct internet-accessible database with procedures for
maintenance and data updating. Assessment Committee
– Develop damage functions for category endpoints.– Develop a weighting methodology appropriate for Japan.
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Reuse
US: Reuse is pursued primarily when it makes
business sense. Most reuse is done by third party
remanufacturers. Automobile parts, manufacturing equipment
are well established remanufacturing infrastructures.
Electronic industry does not have a reuse mindset (yet).
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Reuse Cont’dJapan: “Inverse Manufacturing” seems to be well known
phrase in many companies. Electronic companies are thinking about using “inverse
manufacturing” and service industry paradigm (rather than being product sales oriented) to their advantage.
Still, “classical” remanufacture and reuse problems persist
• set-up of reverse logistics network is challenging• need for better reprocessing technologies• products not designed for reuse - designers need re-
education• radical new concepts still in laboratory stage• Profitability can still be a problem
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Silicon Valley Encourages Chemical Reduction
The Silicon Valley Manufacturing Group has created a pilot program for area manufacturers to reduce the amount of chemicals they are using in their factories. The group will demonstrate a business model that uses third party "chemical management services" (CMS) firms to help manufacturers cut costs and optimize the use of chemicals.
One semiconductor company using a chemical service provider cut its chemical use by 50 percent, adds Chemical Strategies Partnership, a non-profit organization that promotes third-party chemical services. "When managers appreciate the hidden costs of chemical use - inventory, liability, waste, tracking, disposal -- they see how CMS can benefit them."
SOURCE: Manufacturing News Daily, October 20, 2000
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Electronics - Overview
• Electronics industry tends to be proactive (worldwide)– Life-cycle Assessment (LCA)– Design for Environment (DFE)– End-of-Life Management (ELM)
• Industry culture of minimization, cost-reduction, and increased efficiency are all compatible with EBM
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Electronics - Overview cont’d
• Used to inserting and integrating new designs, technologies, and equipment– Average product life span of 18 to 24 months– Complete capital equipment turn-over every 5
years
• Expert at managing and analyzing large amounts of data (legacy of quality movement)
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Component and PWB Manufacture
Wafer fabrication– Reduction in water use– PFC (perfluoro compound) emissions
IC Packaging and assembly– Pb solder– Flame retardants– Material waste (especially thermosets)
PWBs– Water reduction– Plating solutions– Flame retardants
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Materials and Environmental Concerns -
Integrated Circuits
Wafer fabrication
Product materials: Si, SiO2, Al, ± CuEBM Issues: Water, energy, gas
emissions (especially PFCs - perfluoro compunds)
Chip packaging
Product materials: Polymers, Ceramics, Ni/Au alloys, Cu, Au
EBM Issues: Energy, metal-bearing liquid waste, flame retardants,
material waste
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Wafer Fabrication
Large, highly capital intensive manufacturers Equipment driven Small feature size (sub-micron) requires
extremely clean processes Deposition of very thin layers is done using
gaseous processes Key concerns are qualification of new materials,
reduction in PFC emissions, reduction in energy and water usage (SIA Roadmap)
NSF Engineering Center, SEMATECH
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Materials and Environmental Concerns - Printed Wiring
Boards
PWB fabrication
PWB (board-level) assembly
Product materials: Ceramic, epoxy-glass, or other polymers;
Cu, Pd, Pb, AuEBM Issues: Water, energy,
flame retardants, Pb finishes, plating solutions
Product materials: Pb/SnEBM Issues: Energy, Pb
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PWB Fabrication Many manufacturers of varying size, both independent
and captive; moderately capital intensive Material and process driven Relatively small features (3 to 4 mils) require clean
environment Plating baths use large amounts of water and complex
chemistries (organic and inorganic compounds) Lamination of multiple layers is very energy intensive Several PWB projects under EPA’s DfE Program and
DARPA’s Environmentally Conscious Manufacturing Program
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PWB (Board-level) Assembly
Capital intensive Use of Pb solder dominates
environmental concerns Soldering processes can be very energy
intensive and are higher for Pb-free solders
Trim waste (epoxy-glass ± copper) can be 50% of the total material budget
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Materials and Environmental Concerns - Computer System
Product materials: NiCdEBM Issues: Cd, life/efficiency
CRT
Batteries
Storage Media
Final Assembly
Product materials: Glass, Pb, phosphors, steel, Al, CuEBM Issues: Energy, Pb
Product materials: Al or glass, Ni, Mg
EBM Issues: recyclability
Product materials: Al or glass, Ni, Mg
EBM Issues: recyclability
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Displays Large units are manufactured overseas Glass formation is energy intensive Biggest concern is end of life, due to Pb
content in glass Flat panel displays (FPDs) are replacing
cathode ray tubes (CRTs) and may introduce new issues
Study is currently underway under EPA’s DfE program
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Final Assembly Materials and design are biggest issues Take-back legislation in Europe is helping
define needed infrastructure for recycling Desire to increase recycled content in
housings - typically formed using thermal plastics such as ABS, PC, or PC/ABS
Non-brominated flame retardants for ABS a challenge
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End of Life Management Interest being driven by
– Take back legislation in Europe– Material bans in Europe (Pb, halogenated FRs)– Landfill bans and labeling laws in US (e.g., CRTs, Hg)– Leasing agreements (increased producer responsibility)
Reuse– Limited to systems less than 36 - 60 months old– Component harvesting economic only in tight markets
Three primary materials commodities / issues– Plastics / separation, contamination, high cost-to-value
ratio– Glass / Pb and FPDs– Metals / decreasing volume, especially precious metals
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Japan Findings Highly responsive to activities in Europe
– Elimination of halogenated flame retardants– Pb-free solders
ISO 14000 certification is a focus New recycling law to require 50% recycling
of computers starting April, 2000 Using alternative PWB technologies
(microvias) that are inherently less water, energy, and material intensive processes while providing better performance
Sites visited: Hitachi , Sony
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Europe Findings Take-back legislation and WEEE (Waste
Electrical and Electronic Equipment) Directive– Recycling– Material alternatives (Pb and non-brominated FRs)
Dutch have a well-developed infrastructure for collecting and recycling computers– Glass and metals are re-introduced into the material stream– Plastic is incinerated
“Green” products offered in parallel with conventional, but with a price differential
Sites visited: MIREC, Siemens
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United States Findings Responding to activities in Europe
– Take-back– Pb-free solder– Non-brominated flame retardants
Emphasis on metrics and supply chain management Recycling activities in partnership with OEMs (HP,
IBM) or sponsored by government agencies (DoC, DoE, and DoD
Focus on recycling rather than incineration of plastic
Sites visited: IBM, Applied Materials, DuPont (electronic materials), MBA polymers, Micro Metallics
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US Activities
Professional associations and consortiums– IEEE - ISEE - esp. LCA, DFE, EOL– IPC - PWBs – EIA (focused on industry-wide DFE and on
unified responses to policy and legislation - esp. WEEE)
– MCC (Environmental programs - roadmap, PWBs, software)
– SIA / SEMATECH (roadmap, ESH as a major thrust area)
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US Activities Cont’d
Government programs– NSF - EBM center (ICs), current EBM panel– DARPA - ECM program - focus on PWBs
including bio-laminate, fully-additive circuitry, permanent resists
– EPA DfE - PWB z-axis metallization, computer displays
– DoE, DoD, DoC, EPA - Electronics recycling
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Challenges - Pb-free Solder
Pb-free solders require higher temperatures– Need capacitors and resistors that can withstand
increased temperatures– Need substrates that withstand increased temperatures– More energy intensive and lower yield (higher waste)
Much more complex alloys– More difficult to maintain uniform composition– May be more difficult to recycle or disassemble to allow
recycling of boards
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Challenges - Pb-free Solder
Unclear that Pb-free solders are actually more environmentally friendly– material extraction, increased processing difficulties,
ease of recycling
Best solution may be completely new attachment technologies (e.g., adhesive flip-chip)
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Challenges - Flame Retardants
Elimination of brominated flame retardants is due to concern with dioxin formation upon incineration– Unclear whether this actually occurs– May occur only in older, lower temperature units
Alternatives for thermoplastics exist (including choice of plastic)– Non-organic fillers may affect mechanical properties– Unclear that alternatives are more environmentally benign
Currently no known alternatives for thermosets; may be solved by alternative PWB technologies
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EXAMPLE : DESIGN FOR ENVIRONMENT FOR CMP PROCESS
Semiconductor
manufacturer
Equipment supplier
OEM
Regulatory pressure
Resource scarcity
Cost effectiveness
Technological advantage
Process integrity
Specifications
Motivating factors
EXAMPLE
Organization
• Process environmental targets
• Need for treatment equipment
• Treatment System configuration and requirements
Source: Applied Materials
Interface issues
A. Communication Issues1. Results are transferred, not analysis.2. Boundaries of analyses are different for different players4. Interactions between different groups across players (eg: EHS in Manufacturer to Process groups in equipment supplier, Process groups in Manufacturer to EHS groups in supplier, developmental groups in OEM)B. Difference in drivers1. Ideal solution for Semiconductor Manufacturer is different from Equipment Supplier and OEMC. System integration issues1. Influence of environmental solutions on systems is not well understood. Environmental, cost and performance parameters are intertwined.
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Economic drivers
Technology
Regulations and incentives
• Point-of-use pollution prevention processes
• Use of novel materials with environmentally benign characteristics
• Reduction of energy use in processes and products
• Product design-for-environment
• Design of products and materials for ease of recyclability
• New metrics for environmental performance
• Regulations on airborne, wastewater and solid discharges
• International standards (e.g., ISO 14000)
• Eco-labeling incentives• Industry agreements
and roadmaps
• Marketing incentives• Total life-cycle cost for
product stewardship• Waste disposal and
abatement cost reduction
• Revenue streams from demanufacturing
• Reduction in liability and risk management cost
CONCEPTUAL
SUCCESSFUL DEPLOYMENT OF ECM PROGRAMS REQUIRE CROSS-CUTTING INNOVATIONS THAT ADDRESS SEVERAL DIMENSIONS
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ebmchallenge.ppt3/24/00
The Challenge to Move from “Compliance” to The Challenge to Move from “Compliance” to Benign Products and Benign ProcessesBenign Products and Benign Processes
Life cycle analysis tools in existence provide Life cycle analysis tools in existence provide few alternativesfew alternatives
Original manufacturing lacks in-process Original manufacturing lacks in-process analytical capability that permits early analytical capability that permits early intervention and correctionintervention and correction
Lack of process technology to produce Lack of process technology to produce components with minimal wastecomponents with minimal waste
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ebm5steps.ppt3/20/00
Five Steps to Achieve Zero EmissionsFive Steps to Achieve Zero Emissions
Product design wherein all raw materials are Product design wherein all raw materials are used used in the finished productin the finished product Industrial “clusters” that use the waste from Industrial “clusters” that use the waste from oneone facility as the raw material for its facility as the raw material for its productsproducts Higher efficiencies in energy generation and Higher efficiencies in energy generation and
consumptionconsumption Incentives that promote the use and Incentives that promote the use and consumptionconsumption of benign technologies and of benign technologies and productsproducts Change in lifestyle and consumption that are Change in lifestyle and consumption that are lessless wasteful wasteful