MultiphaseProduct Selection Guide

Product Line Overview

Integrated design platforms that enable customers to add energy-conserving features that achieve lower operating energy costs and manufacturing Bill of Material (BOM) costs.

•Appliances

•Audio

•Display

•Industrial

•Lighting

•SMPS

Product Line

Energy Saving Products

Optimized power management sys-tem solutions that deliver bench-mark power density, efficiency and performance in enterprise power.

Enterprise Power

Automotive grade power manage-ment solutions qualified to meet the needs of 12V, 24V and HE/EV applica-tions with a zero defect goal.

Automotive

IR continues to lead the industry by offeringpowerMOSFETswith thelowest RDS(on) and widest range of packages up to 250V for a diverse range of applications.

Benchmark MOSFETs

Our discrete components, complex hybrid power module assemblies and rugged DC-DC converters uti-lize leading-edge power technology which, together with demanding environmental specifications help engineers to meet their toughest design challenges.

HiRel

•Servers

•StorageNetworks

•Switchers&Routers

•Workstations

•Notebooks

•GameStations

•Audio

•Computing

•Communications

•MotorControl

•SynchronousRectification

•Space

•Military

•CommercialAviation

•RuggedIndustrial

•Medical

•DirectFET®

•Low-VoltageICs

•SupIRBuck™

•XPhase®

•PowerMonitorIC

•iPOWIR ®

AutomotiveQualified:

•HEXFET®PowerMOSFETs

•IntelligentPowerSwitches

•DriverICs (Low-,Mid-andHigh-Voltage)

•IGBTsforMotorDrives, VariousLoads

•TrenchHEXFET®MOSFETs

•DiscreteHEXFET®MOSFETs

•DualHEXFET®MOSFETs

•FlipFET™

•FETKY®

•RAD-HardMOSFETs

•PowerModules/HybridSolutions

•MotorControlSolutions

•DC-DCConverters

•DigitalControlICs

•High-VoltageICs

•IGBTs

•IRAMIntegratedPowerModules

•IntelligentPowerSwitches

•MERs

Key Products

•ACandDCMotorDrives

•Powertrain/Enginecontrol

•BodyElectronics

•Lighting

•ClassDAudio

•HeavyLoadsandActuators

Applications

Output Power Monitor ICs specifications

Part Number Package Package Size Features

IR3720MTRPBF 10-lead DFN 3mm x 3mm I2C interface

IR3721MTRPBF 10-lead DFN 3mm x 3mm Analog output

Input Power Monitor ICs specifications

Part Number Package Package Size Features

IR3725MTPBF 12-lead DFN 3mm x 3mm Analog output

DirectFETKY™

Part NumberBVDSS

Max. (V)

Application

RDS(on)

VGSMax. (V)

ID

@25°CCase (A)

QGTyp. (nC)

QGDTyp. (nC)

QSWTyp. (nC)

AN-1035 Layout Code

1” SqRthj-a °C/W

Rthj-c °C/W

@ 10VMax. (mΩ)

@ 4.5VMax. (mΩ)

@ 10VTyp.

(mΩ)

@ 4.5VTyp.

(mΩ)

IRF6797TRPBF 25

Sync FET

1.4 2.4 1.1 1.8 ±20 210 50 18 23 MX 45 1.4

IRF6795TRPBF 25 1.8 3.2 1.4 2.4 ±20 160 34 12 16 MX 45 1.6

Low-Voltage DirectFET® MOSFETs

Part NumberBVDSS

Max. (V)

Application

RDS(on)

VGSMax.

(V)

ID

@25°CCase (A)

QGTyp. (nC)

QGDTyp. (nC)

QSWTyp. (nC)

AN-1035 Layout Code

1” SqRthj-a °C/W

Rthj-c °C/W

@ 10VMax. (mΩ)

@ 4.5VMax. (mΩ)

@ 10VTyp.

(mΩ)

@ 4.5VTyp.

(mΩ)

IRF6717MTRPBF

25

Sync FET 1.3 2.1 1.0 1.6 ±20 220 55 19.0 25.0 MX 45 1.3

IRF6716MTRPBF Sync FET 1.6 2.6 1.2 2.0 ±20 180 39 12.0 17.3 MX 45 1.6

IRF6715MTRPBF Sync FET 1.6 2.7 1.3 2.1 ±20 180 40 12.0 17.0 MX 45 1.6

IRF6714MTRPBF Sync FET 2.1 3.4 1.6 2.6 ±20 166 29 8 12.0 MX 45 1.4

IRF6713STRPBF Sync/Ctrl 3.0 4.6 2.2 3.5 ±20 95 21 6.3 9.0 SQ 58 3.0

IRF6712STRPBF Ctrl FET 4.9 8.7 3.8 6.7 ±20 68 12 4.0 5.8 SQ 58 3.5

IRF6709S2TRPBF Ctrl FET 7.8 14 5.9 10 ±20 39 8.1 2.8 3.9 S1 82 7

IRF6710S2TRPBF Ctrl FET 5.9 12 4.5 9 ±20 37 8.8 3.0 4.3 S1 82 9.8

XPhase® Technology Advantages

• SmallestICsizeprovideshighestpowerdensity

• Flexiblenumberofphases

-Costadvantagesforapplicationsrequiringmorethan3phases

-Commondesignscalesforaseriesofdesigns

• GatedriversandcurrentsenselocatedclosetothePowerStage

• SmallandsimplePCBlayout

-Easierlayoutforgatedrivertracesandcurrentsensesignals

-Shortercurrentsensesignaltracesreducenoisecoupling

• ControlICcanbelocatedfarfromthepowerstage -Isolatedfromheatandgatedrivenoise

• Operatesfrom12V-noauxiliarybiasvoltagesneeded

• Industryleadingaccuracyovertemperatureandinputvoltage

• Optimized7Vdriver

THE IR MULTIPHASE ADVANTAGE• Greaterthan90%efficiency

• Highdensity(>100A/inch2)

• Completesolutions

• CostEfficient

• DesignServicesavailable

DirectFET® Silicon Technology Advantagess• 25VBVDSSoptimizedfor12VSynchronousBuckConverters

• Sub1mohmsiliconRDS(on)• Ultra-LowGateResistance

-GateResistanceaslowas0.25Ohmforfastswitchingand excellentCdv/dtimmunity

• IntegratedMonolithicSchottkyDiode

-Reducesbodydiodeconductionandswitchinglosses

-Reducesswitchnoderinging

Multiphase XPhase® IC Product Line

IR3502•IntelVR11.1•5x5mmMLPQ-32

IR3500•VR11.0&AMDPVI•5x5mmMLPQ-32

IR3500V•VR11.1CPUVTT•5x5mmMLPQ-32

IR3523 Dual•VR11.1CPUVTT• DDR3VDDQ•3bitVIDMargining•6x6mmMLPQ-40

IR3505•3x3mmMLPQ-16

IR3507•1PhasePSIMode•4x4mmMLPQ-20

Intel System

IR3514PVI/SVI•VDD•VDDNB•6x6mmMLPQ-40

AMD System

IR3508•2+PhasePSI#•4x4mmMLPQ-20

IR3513•ScalablePOL•Margining•5x5mmMLPQ-32

POL

IR3510•N+1Redundant•E-Fuse/Hot-Swap•OutputORing•5x5mmMLPQ-32

IR3088A•4x4mmMLPQ-20

Control IC

Phase IC

•Dedicated Chipset