emc simulation for automotive ethernet€¦ · automotive ethernet •next generation signal bus...
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EMC Simulation for
Automotive Ethernet
Dr Tamara Monti
Radio Technology SIG ‘EMC – Avoiding the nightmare’ Cambridge, December 4th 2018
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Active Exhaust Noise Suppression
Active Suspension
Active Vibration Control
Adaptive Cruise Control
Adaptive Front LightingAirbag Deployment
Antilock Braking
Autonomous Emergency Braking
Battery Management
Blind Spot Detection
Cabin Environment Controls
Entertainment System
Communication Systems
Convertible Top Control
Cylinder Deactivation
Driver Alertness Monitoring
Electronic Seat Control
Electronic Stability Control
Electronic Throttle Control
Electronic Toll Collection
Electronic Valve Timing
Engine ControlHead-Up Displays
Hill Hold Control
Idle Stop-Start
Instrument Cluster
Intelligent Turn Signals
Interior Lighting
Lane Departure WarningLane Keeping Assist
Navigation
Night Vision Systems
On-Board Diagnostics
Parking Systems
Precrash Safety
Rear-view Camera
Regenerative Braking
Remote Keyless Entry
Security Systems
Tire Pressure Monitoring
Traction Control
Traffic Sign Recognition
Transmission Control
Windshield Wiper Control
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Powertrain
• Latency: < 10 µs
• Bandwith: Low
• CAN
• FlexRay
Chassis
• Latency: < 10 µs
• Bandwith: Low
• CAN
• FlexRay
Body & Comfort
• Latency: < 10 ms
• Bandwith: Low
• CAN
• LIN
ADAS
• Latency: < 250 µs
• Bandwith: 50 Mbps per camera
• FlexRay
• MOST
• LVDS
• Ethernet
Infotainment
• Latency: < 10 ms
• Bandwith: High and growing
• Ethernet
In Vehicle Communication Standards
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Scope of EMC/EMI
kHz Inverter, Voltage Regulators MHz
Radio, Communication Systems
GHzDigital electronics, Radar
The ability of an electrical system to work
• in its electromagnetic environment
• without influencing the surrounding devices (emissions)
• or being influenced by surrounding equipment (susceptibility)
EMC compliance is crucial to all products!
• Susceptibility and emissions are a well regulated area
• Automotive OEM impose strict standards on components
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Conducted Emission Limits
From:
A GENERIC AUTOMOTIVE (TIER1)
EMC TEST STANDARD Martin O’Hara
The Automotive EMC Network, P.O. Box
3622, Newport Pagnell, MK16 0XT
http://www.autoemc.net/
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EMC Simulation in the Design Process
EMC at all Stages of the Design Process
• multiple troubleshooting iterations
• high effort and costs to correct
• delayed time to market
Cost of
change
Time
Requirements Concept Product DevelopmentManufacturing
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Simulation Model
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Field Circuit Coupling
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3D Full-Wave Solution
Finite Element Method
Frequency Domain
Adaptive Meshing
0-200 MHz in 60 samples
26 Ports
3h15m on dual Xeon E5-2643
28 GB RAM
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Decaps
IC
Signal Path
Connector
LISN
Reference
PCB as
Termination
IC
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PRBS Signal & Spectrum
PRBS Signal PRBS Spectrum
Ideal differential driver
Use as source for AC simulation
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BroadR vs. CAN
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Common and Differential Mode
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Modes on Differential PairCalculate the differential and common mode impedance
using a waveguide port
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Modes on Differential Pair
Differential 101 Ohm Common 35 Ohm
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Common and Differential Mode
Ideal Excitation
1V differential
1V common mode
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Current at Driver – 33 MHz
Differential ModeCommon Mode
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Current at Connector – 33 MHz
Differential ModeCommon Mode
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Common Mode
Differential to Common Mode Conversion
• Created due to non-ideal symmetry
• Only the common mode contributes to conducted emission
Timing
• Jitter and skew in signal generation
• Depends on the silicone
• No access for the electronic designer
Geometry
• Routing Constraints
• Connectors and cable bonding
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Conducted Emission
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Only ConnectorEmission at LISN N
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Cable Reference
Emission at LISN N
Emission at LISN N
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Cable SeparationEmission at LISN N
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Power Cables SidewardsEmission at LISN N
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Connector PinoutEmission at LISN N
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Untwisting at ConnectorEmission at LISN N
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Bad PCB Layout + Connector + UntwistingEmission at LISN N
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Countermeasures
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Common Mode Choke
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Common Mode ChokeCommon Mode at Rx IC
Emission at LISN N
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Common Mode
Differential to Common Mode Conversion
• Created due to non-ideal symmetry
• Only the common mode contributes to conducted emission
Timing
• Jitter and skew in signal generation
• Depends on the silicone
• No access for the electronic designer
Geometry
• Routing Constraints
• Connectors and cable bonding
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Signal Skew
0.1 ns skew
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Signal SkewEmission at LISN N
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Signal SkewEmission at LISN N
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Choke PositioningCommon Mode at Rx IC
Emission at LISN N
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Ferrite Clamp – Untwist longEmission at LISN N
beginning end
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ShieldingEmission at LISN N
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ShieldingEmission at LISN N
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Radiated Emission
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Radiated Emission Workflow
Far field probes All probe resultsWorst case envelope
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Cable ReferenceElectric Field @ 1m
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Connector PinoutEmission at LISN N
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Untwisting at ConnectorEmission at LISN N
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Power Cables SidewardsEmission at LISN N
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Bulk Current Injection
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15 TEST PROBE: Fischer Custom Communications F-130aFreq. range: 10kHz – 400MHz
http://www.fischercc.com
BCI Clamp
„Circuit Modeling of injection Probes for Bulk Current Injection“ by F. Grassi et al, IEEE Transactions on Electromagnetic Compatibility Vol. 49, Issue 3, 2007.
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BCI ReferenceDifferential Signal at IC
300 mA injection
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BCI ReferenceDifferential Signal at IC
300 mA injection
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BCI Connector PinoutDifferential Signal at IC
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BCI UntwistingDifferential Signal at IC
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BCI UntwistingDifferential Signal at IC
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Summary
Automotive Ethernet
• Next generation signal bus
• Higher frequency content
Emission Simulation
• Early design stage
• Full-wave 3D coupled to circuit simulation
Results
• Understanding common mode is the key
• Layout can have significant effect on emission
• Untwisting of the TWP at the connector has a substantial effect on emission and susceptibility
• Not all countermeasures are efficient
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