embodiment 1: large die 를 위한 새로운 tmv 구조 tsv version tvm rdl for die backside...
DESCRIPTION
Embodiment 1: Large die 를 위한 새로운 TMV 구조 TSV version TVM RDL for die backside metallization. RDL. TSV. Embodiment 2: Method for large Die size TMV Narrow pitch I/O with Post or Stud. Stud or Post. Grinding. interposer. No laser via. RDL. Embodiment 3: - PowerPoint PPT PresentationTRANSCRIPT
© 2010 Amkor Technology, Inc. Amkor Proprietary Business Information 23 4 20年 月 日, USER ID
• Embodiment 1:
– Large die 를 위한 새로운 TMV 구조
TSV version TVM RDL for die backside
metallization
1
TSVTSV
RDLRDL
© 2010 Amkor Technology, Inc. Amkor Proprietary Business Information 23 4 20年 月 日, USER ID
• Embodiment 2:
– Method for large Die size TMV
Narrow pitch I/O with Post or Stud
2
Grinding
Stud or Post
No laser via
No laser via
interposerinterposer
RDLRDL
© 2010 Amkor Technology, Inc. Amkor Proprietary Business Information 23 4 20年 月 日, USER ID
• Embodiment 3:
– Top ball pad 를 마스킹후 Chip attach 공정 UF 공정 실시
No risk of RBO Maximize die size No risk of contamination on ball
pad
3
underfilling
Film Striping
film