electronic products - may 2011 (true pdf)

PRODUCTSPRODUCTSNo-nonsense tools for the busy EEMAY 2011

In This Issue...

electronicproducts.com

A Hearst Business Publication

PRODUCTSElect ronic

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Lighting &Optoelectronics

SPECIAL

Cooling Devices Automotive Electronics Forum Motors & Controls

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Vol. 53, No. 12 MAY 2011CONTENTS

11PRODUCT UPDATEDc/dc converters

69OUTLOOKGiant batteries aid green power

COVER STORYLIGHTING & OPTOELECTRONICS

33 In this Special, we present information on how to select and apply some of the latest advances in solid-state lighting, look at advances in optical mouse technology, and explore advanced technologies for mobile device color displays

35 A systems approach to solid-state lighting

40 Detecting and managing faults in LED lighting

44 Illuminating capacitor choices

49 Optical mouse technology:Here to stay, still evolving

54 Why lifetime color consistency is important for LEDs

60 Higher display performance for next-gen mobile devices

FEATURES

16 Cooling DevicesPCB-cooling techniques and strategies for IC packages

20 Motors & ControlsThe basics of motors and motor control

25 Technology RoundtableAutomotive Electronics Forum

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DEPARTMENTS

6 Viewpoint: Who are we?

8 Product of the Year Story Behind the Story: TI’s CSD86350Q5D Power Block:Diligence gets cutting-edge designs to market

11 OUTLOOK (Technology News)◾ Giant batteries aid green power ◾ Sensor Expo shows state-of-the-art in MEMS, e-harvesting, wireless nets ◾ Battcon: Battery reliability or liability◾ What’s new at IMS2011 ◾ EDS 2011: ‘Refine. Re-energize. Refocus’

64 Product Application:Industrial/automation electronics

66 Product Roundup:Packaging and EMI/RFI shielding

69 Product Update: Dc/dc converters

NEW PRODUCTS77 Power Sources

82 Test & Measurement

87 Integrated Circuits

91 Components & Subassemblies

93 Design & Development Tools

94 Optoelectronics

95 Packaging & Interconnections

66Product Roundup: Packaging and EMI/RFI shielding

what’s ONLINE...electronicproducts.com

Want to see what the Editors are thinking? www2.electronicproducts.com/ElectronicProductsBlogs.aspx

Electronic Products Magazine (USPS 539490) (ISSN 0013-4953)—Published monthly by Hearst Business Communications Inc./UTP Division, 50 Charles Lindbergh Blvd., Suite 100, Uniondale, NY 11553. Periodicals postage paid Uniondale, NY and additional mailing offices. Electronic Products is distributed at no charge to qualified persons actively engaged in the application, selection or procurement of electronic components, instruments, materials, systems and subsystems. The publisher reserves the right to reject any subscription on the basis of information submitted in order to comply with audit regu-lations. Paid subscriptions available: U.S. subscriber rate $65 per year, 2 years $110. Single issue, $6.00. Information contained herein is subject to change without notice. No responsibility is assumed by the publisher for its accuracy or completeness.

Postmaster: Send address changes to Electronic Products, PO Box 3012, Northbrook, Il 60065-3-12. Phone 847-559-7317 ©2011 by Hearst Business Communications Inc./UTP Division. ALL RIGHTS RESERVED Publications Mail Agreement Number 40012807. Return Undeliverable Canadian Addresses to: Station A PO Box 12, Windsor, ON N9A 6J5

What's Inside?: Motorola XOOM MZ600 mobile tablet

High-efficiency solar inverters in North America Eltek-Valere

Power film caps improve dc/dc converter performance in green energyTPC, division of AVX

The basics of motor and motor control — part 2Maxim Integrated Products

McAdams Ellipse and color consistency Cree

and much more!

ELECTRONIC PRODUCTS http://electronicproducts.com MAY 2011 5

ELECTRONIC PRODUCTS http://electronicproducts.com MAY 2011

Who are we?

W’re increasingly involved with industrial and ro-botic designs; we can’t get enough datasheets, product information, and technical articles;

we’ve engineered to the nth degree our time spent on the phone, on e-mail, on the Internet, or in meetings to get the information we need; we still can’t find a practical use for social media; we have far too many designs being can-celled; we love learning about new technologies, and we just simply can’t get enough of Digi-Key.

Those were some of the findings in our sixth Design Engineer and Supplier Interface Study, which we believe presents “a highly accurate and reliable portrait of design engineer attitudes, perceptions, and behaviors.”

That’s a grand statement indeed. So, you’ll need a qualifier. Specifically, the study is focused on engineers’ need for product information and other services, as well as how and when we interface with suppliers and how we see the quality and value of that interface.

That would explain why we don’t talk too much about being overworked, underpaid, underappreciated, depreciat-ed, outsourced, insourced, downsized, globalized, commod-itized, ostracized, and probably overly dissected, catego-rized, classified, and communitized.

But, as my colleague Steve Cholas would say, “It’s all good!” Steve leads the charge on the annual survey and has been in the biz forever so he knows what he’s doing and the context in which he’s doing it. As a shout-out to Steve, it’s worth noting that he’s a finalist for the MINS 2011 Sales Executive Hall of Fame for B-to-B media, to be announced in June. Congrats Steve! He’ll be taking the SI Study, as we call it, on the road in the coming days and weeks, includ-ing EDS at the end of May in Las Vegas. Be sure to catch him there!

So why is it all good? While all surveys are to be viewed with a critical eye as data can be minced and presented six ways to Sunday, I like this particular survey exactly because it doesn’t deal with existential angst over jobs, career, iden-tity, salary, outsourcing, and the average potential for hair loss. Instead, Study, focuses in a practical manner on what

you’re doing, what information you need, and how well manufacturers and suppliers are meeting those needs.

So, was it fate that I got the final results on my way back from a visit to Digi-Key, the supplier that ended on top of almost every category, from broadest selection, to online resources, pricing, and on-time delivery?

I don’t know, and you don’t have time for me to get too existential about it. Suffice to say, my head was still spin-ning from a tour of the plant. It’s incredible. They’ve pro-cess-engineered the heck out of it! Through a computer-ized system controlling 1.2 miles of conveyers running at 250 ft/min with 120 parts stations, a part can be on its way to you before you’ve hung up the phone with the support desk. Usually it’s 15 minutes from initial call to shipping.

Before it’s sent (and UPS and FedEx have stations on-site) it’s weighed six times, because when you’re sending 13,000 packages per day, ever ounce counts when it comes to postage. Just FYI: the record is 16,100 packages in a single day. And it runs day and night. So, from its head-quarters in Thief River Falls, MN, the company can get your part (and it does single parts, down to the smallest resistor) to almost anywhere in the world in 57 hours.

So what does all this tell us about who we are? Well from my own point of view, I of course had to test the system, so I asked one of our own contractors, Jon Gabay, a fellow engineer, to do a design using Digi-Key parts and write it up, from start to finish. His first reaction was amazement at just how fast the response from Digi-Key was. We’ll have more on the final design (a USB interface to an MCU’s UART) at a later date.

So, we proved the system does work. But what I really enjoyed about the experiment was that in the end it was engineers testing a system that fellow engineers had al-most perfected. It was irony, or Karma, I’m not sure which, but in the final analysis we see things, test things, and make them even better. Or, invent an alternative. That’s what we do, and who we are.

Of course, do not try this at home. I used to try to show my wife how do do things better. Bad idea. If you like, we can discuss that or the SI Study, off the record. Call or e-mail anytime at 516-567-7640 or [email protected].

Patrick Mannion

And why is it all good?

?

VIEWPOINTVIEWPOINT

The industry-leading MOSFET offers new packaging, small footprint, high frequency, and low cost

TI’s CSD86350Q5D Power Block:

Diligence gets cutting-edge designs to market

PRODUCT OF THE YEARThe STory Behind The STory

EDITORIAL STAFF 516-227-1300 FAX: 516-227-1444

Director of Content Patrick Mannion 516-227-1381 • [email protected]

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Senior Editor Paul O’Shea Power Sources, Power Management, Discrete Semiconductors, Circuit Protection, Cooling Devices 941-359-8684 • [email protected]

Editor Christina Nickolas Analog/Mixed-Signal ICs, Analog EDA Software, Oscillators, Electromechanical Switches, Prototyping Tools, Microwave Components 516-227-1459 • [email protected]

Technical Editor Jim Harrison Digital ICs, Boards & Peripherals, Development Tools, Motors & Controls 415-456-1404 • [email protected]

Editor Richard Comerford Test & Measurement, Optoelectronics, Sensors & Transducers, Enclosures, Cabinets, Chassis 516-227-1433 • [email protected]

Assistant Editor Christina D’Airo Passive Components, Interconnections, Wire and Cable, Materials 516-227-1383 • [email protected]

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Directory Coordinator Fran Panzica

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Electronic products

The Texas Instruments CS-D86350Q5D Power Block syn-chronous MOSFET has some

impressive specs including >90% ef-ficiency at 25 A, but then you would expect that of an Electronic Products Magazine Product of the Year winner. TI found that its customers wanted these very high efficiencies as well as high frequency, density, and ease of use for their newest power converters, especially in space-constrained server applications. The power consumed by servers and the expense associated with cooling them are significant, so being able to deliver improved effi-ciencies in a small foot print results in significant operating benefits. The Power Block package not only enabled faster switching frequencies or higher efficiencies for the same frequency, but also reduced space by one-half for the equivalent discrete product. It also provided a simplified PCB board layout and featured an excellent ther-mal solution by having a ground

based lead frame.The Power Block design team had

to meet significant challenges on three fronts to be successful with the product. First, it was a new package structure so they had to consider all the manufacturing and field reliabil-ity requirements and then configure materials and process flows to make it cost effective. Next, they had to eliminate as many of the package in-terconnect parasitic resistances and inductances that would detract from the performance. Finally, the team had to coordinate and develop the new MOSFET platform to meet the reliability needs and electrical per-formance requirements — and make it cost effective. It took a mere 18 months for a team of 15 people from several disciplines including package design, silicon device/process design, system and applications, quality/re-liability, test, and marketing to get the job done.

Paul O’Shea

Ten of the 15 members represent the Power Block team who needed only 18 months to develop the Power Block synchronous MOSFET platform. Rear Row, left to right Phil Bechtold, Chris Kocon, Juan Herbsommer, David Jauregui, Simon Molloy, Ron Feiller; Front Row, left to right John Duh, Jonathan Noquil, Shuming Xu, Ozzie Lopez.


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News about Products... Product Technology... Product ApplicationsOUTLOOK


Giant batteries aid green power

20-foot-tall redox flow batteries could provide 20 MWh

Green energy would be greatly helped along if we just had some storage capability for periods when it is dark or there is no wind. One possible solution is a

redox flow battery that can supply energy for up to 2,000 households. Several Fraunhofer Institutes (www.fraunhofer.de) are working jointly on these fluid batteries of the future.

The experts‘ long-term goal is to build a handball-court-sized battery installation 20 feet tall with a capac-ity of 20 MWh — enough to provide power to roughly 2,000 households through a long winter‘s night or a cloudy day. “The process already works reliably,” notes Dr. Christian Dötsch, business unit manager for Energy Efficiency Technologies at UMSICHT, one of the participating institutes. “The challenge lies in the enlargement of these plants.”

Redox flow batteries are large-scale vanadium-based liquid batteries in which chemical vanadium bonds alternately pick up and emit electrons along membranes. Because these batteries use only vana-dium bonds and not two different fluids at the same time, as in other systems, impurities are eliminated. “This makes it possible to build very robust and durable batter-ies,” emphasizes Dr. Tom Smolinka, in charge of coordi-

nating the work at the Fraunhofer Institute for Solar En-ergy Systems.

The vanadium charges and discharges in tiny reaction chambers. Several of these chambers are arrayed in stacks to increase output. Currently, the membranes — and hence the individual cells — have a surface area roughly equal to

that of a DIN A4 sheet of office pa-per. One of the challenges is to en-sure that the vanadium fluid flows smoothly through these large mem-branes and past the felt-like carbon electrodes in the cells themselves. Fraunhofer researchers are using flow simulations to further improve the design of the cells. A 20-kW plant is scheduled to go into operation at the end of next year. The researchers hope to cross the megawatt thresh-old in roughly five years.

Research on this type of battery has been going on for more than 25 years. Ashlawn En-ergy in Alexandria, VA, Renewable Energy Dynamics (RedT) in Ireland, Cellstrom GmbH in Austria, Cellenni-um in Thailand, and Prudent Energy in China are all working on some form of vanadium redox battery and some have units up to 100 kWh available now.

Jim Harrison

The redox flow stack prototype with a 1-kW output.

Sensor Expo shows state-of-the-art in MEMS, e-harvesting, wireless nets

With over 125 exhibiting companies to date, in-cluding over 20 companies that haven’t previ-ously exhibited, this year’s Sensors Expo will fo-

cus on a host of state-of-the-art sensor technologies, including MEMS, energy harvesting, and wireless solutions for networking sensors. The conference, which will be co-located with the Embedded Systems Conference (ESC) Chi-cago, runs from Monday, June 6 to Wednesday, June 8.

The all-day pre-conference symposia on Monday will cover MEMS commercialization, energy harvesting and storage, and performance-based sensor selection. The conference formally commences at 9:00 a.m. on Tuesday when Hugh Herr, biomechatronics researcher at MIT Me-dia Labs delivers his keynote address, “The New Era of Human 2.0: New Minds, New Bodies, New Identities.” Herr describes Human 2.0 as an era in which technology merges with our bodies and minds to forever change our

concept of human capability. His biomechatronic experi-ence is not only academic but also firsthand; in a recent interview in Forbes magazine, he said, “The fact that I’m missing lower limbs is an opportunity. Between my re-sidual limb and the ground, I can create anything I want. The only limits are physical laws and my imagination.”

Conference sessions will run from 10 a.m. to 4 p.m. on both Tuesday and Wednesday. Sessions include new tracks on mobile sensing, cutting-edge technologies, and novel ap-proaches to measurement and detection. The Expo Hall will be open to all attendees on Tuesday from 10 a.m. to 5 p.m. and Wednesday from 10 a.m. to 3 p.m.

Richard Comerford

The Sensors Expo & Conference will be held Monday, June 6 through Wednesday, June 8 at the Donald E. Stephens Conven-tion Center in Rosemont, IL. For information about attending, visit www.sensorsmag.com/sensors-expo.

OUTLOOK


Battcon: Battery reliability or liabilityThe Battcon International Stationary Battery Confer-

ence is a three-day, noncommercial, technical event for storage battery users from a broad range of in-

dustries. It also features a two-day trade show packed with storage power-related vendors, plus optional seminars.

Users, manufacturers of batteries and battery test equipment, installers, researchers, and standards and

safety experts attend the conference to learn about and discuss the latest industry developments. The conference runs Monday to Wednesday, May 16 to 18, 2011, at the Swan and Dolphin Resort, in the Orlando, Florida area.

The registration fee gives you three days of presentations (papers, panels, workshops), the two evening trade show, three nights hotel, two dinner receptions, breakfasts, lunch-

es, and the conference proceedings.

Battcon offers three preconfer-ence seminars that focus on battery basics, advanced techniques, or a special topic. These optional Sun-day seminars let you brush up on skills, discover new directions the industry is taking. Papers and pan-els address manufacturing, mainte-nance, and testing issues and are of particular interest to data center, power, telecom, and UPS industry personnel.

Some of the presentations:Lithium ion batteries for stationary applications: A safety perspective.Changing the utility way of doing business: An update on the upcoming changes of NERC PRC-005.Thomas Edison had it right when he said that his nickel-iron batteries would last 100 years.New concepts in battery monitoring and maintenance at nuclear plants.Energy storage for utility applica-tions: Leveraging commercial lithi-um-ion polymer batteries.Comparing apples and oranges: Guid-ance on the adoption of new tech-nologies.Battery and subsystem elements of an HVDC system for the telecommu-nications and data networks. First, do no harm.New rules sparked by fires aboard air-craft are imminent. Is your company prepared to avoid getting burned?Early warning of fire and hydrogen gas threats in battery spaces.

Paul O’Shea

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•

•

•

•

•

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For more on Battcon at the Swan and Dolphin Resort in Lake Buena Vista, FL, call 888-828-8850 or 407-934-4000, or visit www.battcon.com.

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OUTLOOK


EDS 2011: ‘Refine. Re-energize. Refocus’

Visit us at sensors expo 2011, booth 915!

EDS 2011 will take place on May 24 through 26 at the Paris and Bally’s Hotels in Las Vegas, NV. With the theme of “Refine. Re-energize. Refocus,” this year’s

show is generating buzz in anticipation of its new conference floor, as well as some other big, planned announcements.

In lieu of seminars this year, EDS is offering several events open to all registrants. On Monday, May 23, from 4:30 to 6:00 p.m. at the Champagne Ballroom at the Paris Hotel, there will be an All Industry preview and introduc-

tion of the new EDS location for 2012. On Tuesday, May 24, from 4:30 to 6:00 p.m. in the Champagne Ballroom, EICA will host a reception, and on Wednesday, May 25, from 6:30 to 8:00 a.m., the Champagne Ballroom will be the venue for an ERA breakfast meeting.

Christina D’Airo

For more on EDS 2011, May 24 to 26 at the Paris/Bally’s Hotel complex, visit www.edsc.org.

What’s new at IMS2011This year’s IEEE Microwave Theory & Techniques So-

ciety (MTT-S) International Microwave Symposium (IMS2011) will be held in Baltimore, MD. from Sun-

day, June 5 through Friday, June 10. IMS2011 will cover developments in microwave technology from nano de-vices to system applications with a Microwaves for the World theme. As always, technical paper sessions, interac-tive forums, plenary and panel sessions, workshops, short courses, industrial exhibits, application seminars, histori-cal exhibits, and a wide array of other technical activities will be offered.

There are a few changes this year. The plenary session, which traditionally opens the symposium, will be held

early in the evening of Monday, June 6. The change to a Monday evening was made to accommodate longer lunch breaks between the technical sessions that will allow at-tendees better access to the Industrial Exhibits and the Interactive Forum.

New this year is a double-blind review process for sub-mitted papers. The reviewers will not be apprised of the authors’ names or institutions in the submitted manu-script; such information must be deleted from the manu-script by the authors before submission.

News-related items plus products shown at this show will be covered daily on eebeat.com.

Christina Nickolas

PCB-cooling techniques and strategies for IC packagesA good thermal PCB design can make the difference between

a well-functioning system and a potential thermal disasterBY SANDRA HORTONPackaging EngineerTexas Instrumentswww.ti.com

A semiconductor manufacturing company has little control over the system in which its parts

are used. However, the system in which the IC is mounted is critical to overall device performance. For cus-tom IC parts, the system designer of-ten works closely with the manufac-turer to ensure that the system will meet the thermal requirements of a high-powered device.

This early interaction ensures that the IC will meet the electrical and performance criteria, as well as func-tion well within the customer’s ther-

mal system. Many large semiconduc-tor companies sell devices as catalog parts with no contact point between the manufacturer and the final appli-

Fig. 1: PowerPAD design showing thermal path.

Cooling DevicesCooling Devices

cation. For these cases, the companies offer a few general guidelines to help achieve a good passive thermal solu-tion for the IC as well as the system.

Exposed padA common semiconductor package type is the exposed pad or Power-PAD-style package. In this package, the die is mounted to a metal plate called the die pad. This die pad sup-ports the die during fabrication and serves as a good thermal path for the heat to travel away from the device.

When the exposed pad of the package is soldered to the PCB, the heat canquickly travel out of the package and into the PCB. The heat is then dissipated through the PCB layers and into the surrounding air. It is common for exposed-pad-style packages to conduct approximately 80% of the heat though the bottom of the package and into the PCB. The remaining 20% of the heat is dissi-pated from the device leads and sides of the package. A nominal amount of heat, less than 1%, is dissipated from the top of the package. For

these exposed-pad packages, a good thermal PCB design is important to ensure proper device performance.

Thermal performanceThe first area of PCB design where thermal performance can be improved is in PCB device layout. Whenever possible, high-power components should be separated from one another on the PCB. This physical separation

of high-power components allows the maximum amount of PCB area around each high-power component to aid in heat transfer.

Care should also be taken to sepa-rate temperature-sensitive compo-nents from any high-power compo-nents on the PCB. Whenever possible, high-power components should be located away from the corners of the PCB. A more central PCB location

PCB-cooling techniques and strategies for IC packages

Fig. 2: Impact of component

placement on thermal

performance. The component at the

corner of PCB has a higher die

temperature than the centrally located

component.


Fig. 3: An example of a dog-bone-style land pattern for a dual-inline package.

makes it possible to maximize board area around high-power components for thermal dissipation.

Figure 2 shows two identical semi-conductor devices: components A and B. Component A, located at the corner of the PCB has a die-junction temperature that is 5% hotter than that of component B, the more centrally lo-cated component. The corner location of component A is thermally limited due to the decreased board area imme-diately adjacent to the component available for thermal dissipation.

The second area, and most ther-mally critical aspect of PCB design, is construction. A general rule of thumb is the more copper in the PCB, the bet-ter the thermal performance of com-ponents in the system. Mounting a semiconductor device on a huge block of liquid-cooled copper is ideal. Since this mounting option is impractical for most applications, other PCB changes can be used to improve ther-mal performance.

For most applications today, the overall size of the system is shrink-

ing, which is having a negative im-pact on thermal performance. A larger PCB has more area for heat transfer as well as more flexibility to provide adequate space between high-power components.

Whenever possible, maximize the number and thickness of copper ground layers in the PCB. Ground lay-ers are typically high in copper mass and serve as excellent thermal paths to spread heat across the full area of the PCB. Routing layers also serve to increase the overall percentage of cop-per available for heat transfer.

However, the routing is often

electrically — and thermally — isolated, limiting its im-pact as a potential thermal

dissipation layer. Routing the device ground to as many ground

layers as electrically possible also helps to maximize heat transfer. Thermal vias located in the PCB be-low the semiconductor device help to carry heat down into the buried layers of the PCB as well as to the backside of the board.

The top and bottom layers of the PCB are prime locations to improve thermal performance. Using wider traces for routing away from high-power devices provides a heat path for thermal dissipation. A dedicated heat-spreading plane is an excellent way to dissipate heat on a PCB. A heat-spreading plane is typically lo-cated on the top or backside of a PCB and is thermally connected to the device with direct copper connec-tion or thermal vias.

In the case of inline packages (packages with leads on only two sides), the spreading plane can be lo-cated on the topside of the PCB and

Cooling Devices


have a “dog-bone” shape (a profile as narrow as the package in the center with larger connected copper area away from the package). For a quad package (leads on four sides), the spreading plane must be located ei-ther on the backside or buried within the PCB.

For dual-inline packages, dog-bone-style land patterns

can be used to dissipate heat.

Increased spreading plane size is an excellent way to improve thermal performance of a PowerPAD style package. Varying the spreading plane size can have significant impact on thermal performance and is often included in product datasheets in table format.

However, it can be difficult to quantify the impact of additional copper on a custom PCB. Some web-

based calculators exist that allow the user to select a device and vary the copper land pad size to estimate the impact on thermal performance for a non-JEDEC PCB. Tools such as these highlight the impact of PCB design on thermal performance. For quad-packages, the topside land pad is of-ten limited to just the area below the exposed pad of the device, in this in-stance, buried or backside layers are the preferred method for additional cooling. For dual-inline packages dog-bone-style-style land patterns can be used to dissipate heat.

Finally, a larger PCB housing sys-tem can be used for cooling as well. Screws used to mount the PCB can serve as efficient heat flow paths to the system chassis when the screws are thermally connected to spreader and ground planes. The number of screws should be maximized to the point of diminishing returns when compared to transfer effect and cost. Metal PCB stiffening plates can pro-vide an additional cooling area when connected to the heat-spreading plane. For applications where the

PCB is enclosed in a housing or other enclosure, a cavity filler material provides improved thermal perfor-mance over an air-filled enclosure. Cooling solutions such as fans and heat sinks are also common ways to cool a system, but often require ad-ditional space or design modifica-tions to optimize cooling potential.

Selecting a good IC device and package solution is only a small part of a well-designed thermal system. The thermal performance of the IC depends heavily on the PCB and the ability of the encompassing thermal system to quickly move heat away from the IC device. By implementing some of the passive cooling methods highlighted above, it can be possible to greatly improve the thermal per-formance of a system.

Sandra Horton is a packaging engineer at Texas Instruments.

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The basics of motors and motor control

An overview of industrial motors and control approachesBY SOHAIL MIRZAManager, ApplicationsMaxim Integrated Productswww.maxim-ic.com

Electric motors are said to con-sume nearly 50% of the world's electricity. Industry is focused

on replacing inefficient constant-speed drives and motors with micro-processor-driven variable-speed units. New motor-control technolo-gy could reduce energy consumption by 30%.

While variable-speed controllers and motors cost a bit more, the fore-casted energy savings and increased motor functionality should offset those initial expenses within a few

Motor & Controls

Fig. 1: A single-channel gate driver for high-current power conversion FETs.

years. The dc, brushless dc, and ac induction motors are the popular types today, each with their own unique characteristics, but they all operate on the same basic electro-magnetic principles.

DC motors: low cost and accurateA dc motor was among the first motor types put to practical use, and it is still popular where low initial cost and good performance are required. In its simplest form, the stator is a permanent magnet and the rotor car-ries an armature winding connected to a mechanical commutator. The magnet establishes the field flux, which interacts with the arma-ture current to produce torque. The motor's speed is controlled by adjust-ing the dc voltage applied to the ar-mature/commutator.

Depending on the application, a full-bridge, half-bridge, or just a step-down power converter is used for the supply to drive the armature. A num-ber of companies now make gate driver ICs like the MAX15024/MAX15025 that ease converter de-sign problems. The MAX15024’s source-and-sink output transistors

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Motors & Controls

have independent outputs allowing control of the exter-nal MOSFET’s rise and fall time. An integrated adjustable

LDO voltage reg-ulator provides gate-drive ampli-tude control and optimization and the chip can sink an 8-A peak cur-rent and source a 4-A peak current (see Fig. 1).

To meet speed and accuracy re-quirements for dc

motors, a microprocessor-based closed-loop control sys-tem and information about rotor position are essential. A

Fig. 2: The MAX9621 connects the Hall-Effect sensors to low-voltage MCUs and protects the sensors from supply voltage transients.

Fig. 3: Rotor and stator of an induction motor.

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82.55x241.indd 3 22.03.11 12:36


Motors and motor control

Hall-effect sensor with an interface like the MAX9621 dual-channel de-vice can deliver accurate rotor posi-tion (see Fig. 2). The IC provides sup-ply current and ESD/overvoltage protection for the Hall circuit.

AC induction motors: simplicity and ruggednessIn an ac induction motor, the stator carries a three-phase winding and the rotor is a simple “squirrel cage" design with copper or aluminum bars that are short-circuited at both the ends by cast-aluminum end rings (see Fig. 3). The absence of rotor windings and brushes makes this motor especially reliable.

When operated from 60 Hz, the induction motor operates at a con-stant speed, but with power electron-ics and a microprocessor-based con-troller the motor's speed can be varied (see Fig. 4). The variable-speed drive consists of an inverter, signal conditioner, and MCU-based con-trol. Many companies make half-bridge drivers like the MAX15024/

MAX15025 that can control the in-verter power FETs independently.

Precise measurement of rotor current, rotor position, and rotor speed are necessary for efficient closed-loop control of an induction motor. Maxim and other vendors offer many high-side and low-side current amplifiers, Hall-effect sen-sors, and simultaneous-sampling A/D converters to accurately measure these parameters in the harshest en-vironments.

A popular closed-loop control technique called vector control de-couples the vectors of field current from the stator flux so that the cur-rents can be independently con-trolled to provide a fast transient response.

BLDC yield high reliability and high output powerA brushless dc (BLDC) motor offers more output power per frame size, compared to induction and dc motors. The stator of the BLDC motor is quite similar to that of the induction motor. The BLDC motor's rotor, however, can take different forms but it is always built from permanent magnets.

Air-gap flux is fixed by the magnet

and is unaffected by the stator current. Once again, the BLDC motor needs some form of rotor position sensing. A Hall-effect device embedded in the stator is commonly used. And again, the MAX9621 Hall interface chip keeps designs simple and incorporates the logic required to provide both po-sitional and directional outputs.

We continue this article online at

http://bit.ly/ic5dUy

Industry is focused on replacing

inefficient constant-speed drives and

motors with micro-processor-driven

variable-speed units


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technologyroundtable

We conducted a telephone fo-rum with six automotive industry experts to take a

look at the current and future state of the industry as it relates to safety issues and standards. We also touched a bit on how electronic de-vices are being impacted by the earthquake in Japan, what the future holds for the market, and HEV adop-tion and power challenges.

Safety issuesElectronic Products: What trends do you see in your area related to safety?

Jeff Kohnle (Marketing Manager for the Mixed Signal Automotive Business of Texas Instruments with a particular focus on Asia): A couple of the fastest growth areas that we’re seeing today would be in passive and active safety. Under

passive would be the emerging markets where you’re seeing more implementa-tion and more inte-gration of systems to provide such ap-plication. Part of that trend is the

movement away from more discrete-based systems to more highly inte-grated systems. And then just the general metric of growth that we’re seeing in Asia in general across the automotive electronics spectrum.

On the active-safety side, we’re also seeing a lot of dynamics. Again this is all double-digit growth across the globe. And this would be more of your adaptive cruise control and lane-departure warning and those types of active-safety systems tying in back to the body-control module itself, as well as further levels of inte-gration and consolidation of systems within cars.

Mark Rettig (Director of Global Mar-keting for Automotive, Molex): I kind of agree with that. If you look from the

Automotive Electronics Forum

active side, in some cases with govern-ment mandates and consumer de-mand especially, from a Molex stand-

point we’re seeing certainly more sen-sors coming into the vehicle.

Certainly that has a lot to do with the number of air-bags that are being placed in vehicles.

At one point, you have the driver air-bag and then the passenger. But now you have up to seven, possibly eight, airbags per vehicle.

Also you have more cameras com-ing in now. The rear backup camera is now being mandated in a lot of re-gions as it is in the U.S. And you have those cameras now from analog to digital. And going from analog to digital you have to go to a higher-speed interface, utilizing LVDS tech-nology and/or Ethernet technology. So we find that to be a very large growth area not only in the U.S., but also in China and in India. For ex-ample, the government in India is now mandating airbags in all vehi-cles. So you’re going to see a lot of growth in this area in all regions across the globe.

Cherif Assad (Global Marketing Manager for Powertrain in HEV, Freescale Semiconductor): For Freescale today, safety is one of the megatrends in the automotive market. Of course, it’s im-portant when you consider that 1.2 million people are killed today on the

road every year. This is something that becomes an auto re-tailer’s responsibili-ty. Most of the peo-ple killed are from the emerging econ-omies of China and India because they

probably lacked driving experience. But anyway, as it was mentioned

by the persons from TI and from Mo-lex regarding mandating, this is com-

ing, and to be deployed in the next coming months and years over there.

So, having said that, we also ob-serve the safety aspect. Of course, there is the airbag and we didn’t speak about braking. But you have to also consider active safety. And we will also be looking to the next gen-eration, which is called the ADAS, which stands for Advance Driver As-sisted System. And we see high growth in that area.

David Jacquinod (IPS (Intelligent Power Switch) Application and Product Manager, International Rectifier): In the past year, a lot of new electronic sys-tems, such as ABS or electrical power

steering, have come to automobiles. The ABS systems, for ex-ample, include more and more functions to assist the driver, such as electronic stability control. And this requires

more and more powerful systems with a higher electrical consumption.

Most of the systems are using pow-er semiconductor switches inside, and the trend for the power semiconduc-tor industry is to provide very low RDS(on) with a very high current rating in addition to excellent reliability. This is a major challenge in silicon technology and packaging.

Michael Worry (CEO, Nuvation): I think there are huge opportunities for continued advancements in ro-botic intelligence. Years ago we de-clared that computers are better than humans in braking. And ABS is gen-

erally considered standard on a mod-ern vehicle.

We’ve already proven today that fully autonomous cars can navigate urban roads. And I really think within

the next decade it will be fully proven that computers are safer than human

CONVENED AND MODERATED BY CHRISTINA NICKOLAS



Automotive Electronics

drivers. You know, robots don’t get tired, they don’t get drunk, they don’t run red lights, they don’t have road rage. Not that robots are going to be completely perfect, but they will be proven shortly to be safer than humans.

I think that’s going to occur prob-ably within the next five years of so. Then it becomes a political question. You know: How long will we grand-father in that frankly unsafe humans are still allowed to drive?...

Impact from JapanElectronic Products: I recently saw that IHS iSuppli News commented on the Japanese earthquake. They said that the earthquake has impact-ed the production of basic electronic raw materials such as silicon wafers used to make semiconductors, creat-ing a rippled effect throughout the globe. So I was wondering what your perspective on the current state of the industry is and how the earth-quake will affect the production of new devices.

Jeff Kohnle: I think it’s safe to say that at this point a lot of assessment is still going on relative to individual companies, supply chains, as well as suppliers into those companies and other dynamics that are in place. TI is continuing to assess what is necessary at this particular point. We do have products that are impacted at one of our manufacturing facilities there. That facility is materially fine though we are working through some of the infrastructure systems that support the plant. And at this point going for-ward we’re continuing to assess any other type of supply issues.

Cherif Assad: Freescale does have one fab which is located in Sendai. And this fab has not been damaged because it was inland, far away from the coast. So because of the infra-structure and communication disrup-tion it’s complicated to restart the fab that you see today. So we are still as-sessing the facility, and we are, of course, in close communication with our customers as to where they are standing. And we feel safe today, but we are continuing to strive to contin-ue and maintain the supply chain, even if it will be tight.

Electronic Products: What tech-nical challenges do all these new technologies in the car today present

to the design engineer?Michael Worry: Having recently

built an electric car, one of the largest challenges we see is the power elec-tronics and noise that comes from a lot of these electronics. Looking at fi-nancial, economic, and environmen-tal trends, I think we’re all going to be driving electric vehicles 5 to 15 years from now. And I think that’s a huge opportunity for electrical engineers like us to build technologies inside of them. However, combining a lot of these really advanced digital electron-ics right next to these extremely noisy power electronics is a challenge that hasn’t been fully solved yet. And I think the industry is still working through it.

“How long will we grandfather in

that frankly unsafe humans are still

allowed to drive?”

Mark Rettig: As innovative technol-ogies are coming to the connected ve-hicle, the demand for high current, high voltage, and high speed are in-creasing as well. OEMs have an inter-esting challenge as they move from 5 Mbits to 3 Gbits. High-voltage and high-current systems don’t typically integrate well, as high amperage and high voltage tend to interfere with high-speed systems. As we move for-ward, it will be interesting as to how the OEMs will manage this within their electrical bus.

Cherif Assad: I think what is impor-tant, but has not been said is the intro-duction of ISO26262, which is going to regulate all the safety in the car. Ac-tually, IEC61508 is applicable in gen-eral for safe integration levels (SIL), like braking.

And we will be moving to IEC26262. So this is becoming very important for the OEMs as well as the Tier 1. The reason being that we are handling high voltage, and, as it was mentioned, power electronics. But beyond that we are also handling some safety content and we need, for instance, the processor to handle the data in a safe way.

So we have to introduce some safe-

ty mechanisms which are taking care of that, and which help in the overall system to bring some safety features to the car. That is an important aspect.

Typically we see a major trend, for instance, we started already with brak-ing. We introduce microcontrollers with dual core architectures with dif-ferent mechanism of functionality what we call lock-step mode (LSM) or dual parallel mode (DPM).

The idea is that those two cores will run in parallel. And at different levels of the cores, the microcontroller archi-tecture checks if everything is going okay, or if we are reporting any failure or any fault...

Jeff Kohnle: It’s just a quick com-ment. I certainly agree with the statements that have been made on this topic with regard to the design for the safety aspect of things at the system level. It does drive a different level of behavior or activity with how we may interact with the Tier 1’s, and ultimately with the OEMs from a total system implementation level because we do have to approach it from that perspective. And ensur-ing that we do have whatever neces-sary redundancy etc. is required in these systems. So it does drive a dif-ferent level of activity.

Cliff De Locht (Product Line Man-ager, Image Sensor Solutions, Melexis):

[Note: Cliff joined us at this time and a sidebar related to his comments to the first question will be posted online.] Design for functional safety is contained in the ISO26262 specifica-

tion, where specific automotive safety integrity levels (ASILs) are defined, ranging from ASIL A: not safety criti-cal to ASIL D: highly safety critical. This functional safety approach is similar to the ISO quality standards approach in the sense that it impacts not only one aspect in the design-to-manufacturing process, but covers the complete process from chip design to module assembly and operation.

Melexis is already manufacturing a number of sensors that are ASIL compliant and the demand from our Tier 1 customers is increasing every year for showing ASIL compliancy. That can be ASIL B up to ASIL D grade, depending on the required level of


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safety needs.Jeff Kohnle: Just to add to the broad-

er concept of what current designers and engineers are having to work with is the overall theme of efficiency as well. And that would apply to any sys-tem to include safety or any other system in a car where there obvious-ly is a major push to remove any type of weight in a car. And so that comes down to things as simple as a pack-age and the application of that pack-age. So whatever considerations may be applied...

Standards — what’s next?Electronic Products: Have you seen any new standards and what is their impact? How do standards affect your business?

David Jacquinod: The regulation of pollution and fuel consumption re-duction is the main driver for power switches in the automobile. Some ex-amples are of an electronic system to reduce fuel consumption, electrical power steering, electronic engine in-cluding HVAC fan, LED lighting and also a stop-and-go system or so-called micro hybrid car.

All those systems have an impor-tant switch content. For example, a stop-and-go system requires a power switch for the starter, a dc/dc converter to maintain the voltage on the board net during the cranking, and a battery switch. All those systems are able to drive current way above 100 A.

Cherif Assad: Yes, the CO2 emis-sion level is actually the issue that will help introduce HEV cars. The micro-hybridization mentioned ear-lier is one way to lower emissions and consumption.

The other way is engine downsiz-ing, which is very important. And the reduction of consumption as per the standard regulation (CAFÉ, Euro VI. And upon doing that we need some processing capabilities, which are far beyond what we do see today.

This is why we believe that the au-tomotive market is a new place to in-troduce multicore architecture to handle the engine management, for instance.

And the other point is, of course, to take into account the software. And this software should operate in a safe mode and then we are back to the second aspect. Today some safety mechanisms are more related to a

watchdog function, but in the future there will be functional safety-spe-cific assignments to the application.

Michael Worry: ...Nuvation is a custom electronics design services company, so we apply standards from the perspective that allows us to reuse IP and accelerate product de-velopment. At the same time we en-courage and applaud our customers for differentiating their products with custom features because it cre-ates more custom engineering op-portunities. So we see it both ways.

The most obvious standard to point at recently is a standard charging plug for electric vehicles. J1772 is the new standard for how electric vehicles re-charge. And prior to that coming into place, the standard was really defined by each automotive manufacturer, which didn’t allow standardization and caused the proliferation of electric vehicle chargers. Now that there is a standard in place it allows a lot more infrastructure to be put in place to en-able electric and hybrid vehicles.

Cherif Assad: This is interesting be-cause I think the charger will be em-bedded or not in the car. If we consider the interface for the charger with the smart grid, I think there is another el-ement which is not defined. And where we are still trying to define what will be the communication level be-tween the car and the charger as sim-ply as that.

So, the connector itself is defined under J1772 for North America. But there will be a different one in Japan (JARI) and a different one in Europe as well.

So anyway, the other point as I said was regarding the power line communications (PLC). This is some-thing that is still under progress and we are looking forward to having this standardized. So yes, there is a direct impact on standardization to define our products.

Jeff Kohnle: Just to build upon what Cherif and Michael were just talking about, I certainly agree that legislation to Michael’s point can be a good thing for our collective busi-ness interest, particularly with the new standards or new requirements that may be coming out going for-ward. A good example would be the dialogue in China on implementa-tion of a tire-pressure-monitoring system standard. That actually has

some great potential for many of us.Another area would be newer

emerging regional requirements, for example, the possibility of standard-izing backup cameras systems, or a backup object detection system (UPA) for safety to identify children and other objects behind the cars...

Michael Worry: Building on some of the comments that have been said here, I think the next really cool standard which would enable a lot of technology development and power advantages would actually be a dis-charging standard...

Electronic Products: Now let’s talk about challenges related to the new electric plug in hybrid technology.

Cherif Assad: There are new chal-lenges: the first of course is to bring the HEV car to the same level as the combustion engine car in terms of price. So having said that, today the technology which is available is not probably the best optimized in terms of cost. Power electronics is probably still behind the target of the OEMs.

But beyond the power of electron-ics you also have the battery — the high-voltage battery which still needs a lot of R & D and improve-ment regarding the density of kilo-watt hour per kilogram.

So this is major because we were talking about reducing the weight of the car. If you have this battery on top, you will increase the weight of the car.

So it’s a contradiction, but at the end of the day I believe there will be significant progress in the coming years. I have seen some presentations from SBLimotive (Samsung Bosch Li-motive JV) and A123 that within the next five years the density will dou-ble, and the projection would be that every five years it will be doubling.

So what is important beyond that is to handle the overall energy man-agement of the car. I’m not saying battery management. Yes, of course, there should be some battery man-agement, but beyond that it will be the overall energy management into the car to be handled.

And that will require some spe-cific component with some high-ac-curacy measurements and isolation with a processing capability beyond what exists today.

David Jacquinod: Electric and hy-brid vehicles in fact are a combina-


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tion of two technical areas: automo-tive and high-power electronics. So far, high-power electronics are being used in the industrial world. But im-plementing such solutions in auto-motive forced the designer to have a totally different technical approach. And in this market we can see that the major players in the electric ve-hicle are the historical automotive suppliers and not the high-power electronics companies.

And I think this is because the major technical challenge is the me-chanical implementation of the power switches. There are space and thermal constraints.

Therefore the semiconductor com-panies have been working on new package approaches like modules with all the power switches in one package. Another thing is battery management which is also very challenging because we have to implement electronic in-side the battery pack.

Jeff Kohnle: I certainly would agree with those past comments regarding the competitive cost structure of electric cars themselves as well as some of the challenges of batteries.

And there are other variables as well, such as the general charging in-frastructure as well as some regional concerns about the widespread use of electric cars. Infrastructure — the elec-trical distribution system — is an im-portant design consideration as well as constructive standards that are able to be able to drive that activity.

And, of course, tying into the cars and making them competitive to the existing cars is to allowing people to make economic decisions going for-ward beyond cost is also working on improving the range of these cars. And that plays into a variety of areas of technology that enable new devel-opments going forward.

Michael Worry: And having re-cently built an electric car we cer-tainly learned a lot about the tech-nology challenges. And I’ll touch on both technology challenges and ed-ucational challenges.

So on the technology side what we found was, because you know, it’s a relatively new industry there is a lack of standard components and subsystems out there in the industry in order to enable what’s needed for an electric vehicle.

We were unable to find a battery

management system that met our needs, so we designed our own.We were unable to find a dc/dc convert-ers that met our needs, and so we de-signed our own. We were unable to find a driver interface that could in-terface with all these different sys-tems. And wanting feedback for the driver about what’s going on, we ended up building our own...

...I have already touched on ear-lier on many of the RF challenges and power issues involved with this. Our vehicle is running at 350 Vdc with hundreds of amps of current — surge currents over 1,000 A that will actually cause cell phone calls to drop and the wireless links to get broken. So there is more work to be done to have all the systems play nice together...

“We have seen things improve greatly over the

last 6 to 12 months. ...I think we see

a pretty optimistic future.”

How the future looksElectronic Products: How does the automotive market look financially, and what do you think it’s going to be in the future?

Cherif Assad: Actually, we see a good recovery of the market. We will monitor the Japanese earthquake impact effects through the second half of this year. But the fundamen-tals are good and solid. And the mar-ket is there, the opportunities are there. And we see a constant growth coming up. So we are pretty confi-dent in that area of automotive to-day.

Mark Rettig: I agree. We have seen things improve greatly over the last 6 to 12 months. And we think they’ll continue to improve. I think like Ja-pan we may still have some bumps in the road to get over. But I think we see a pretty optimistic future.

Jeff Kohnle: I would just again reit-erate the same point that was just mentioned by the last two gentle-men. I certainly would agree that we

continue to be on the rebound here and we do have to comprehend some of the shorter-term logistical issues related to the earthquake.

But, in general, things are very positive and we have some emerging markets that have continued to grow very aggressively.

Michael Worry: My consistent ex-perience running an engineering company is that consumers are going to continue to demand lifestyle im-provements. Businesses are going to continue to demand improved effi-ciency. Governments are going to continue to legislate stricter environ-mental and safety standards...

Cherif Assad: We mentioned about the market shift with the new re-quirements on safety and car electri-fication. But another element that should be integrated and which is coming up very soon is what we call connectivity. And people will really require to have their Internet con-nection in their car.

We see some major telecom com-panies looking at that market inter-ested in automotive in order to imple-ment the infrastructure to have this V2X communication (Vehicle to X) between the car and the infrastruc-ture, or car to car.

It’s a change of mentality. In the past people used to have some nice car for their family, for their prestige. In the future, staying connected will be more important...

Cliff De Locht: So also from the sensor side we see a positive evolu-tion of the markets. The electronics content in cars is increasing for rea-sons that were already mentioned, like multimedia/communication, ac-tive safety, greener cars, hybrids, and EVs, etc.

So we confirm steady sensor market growth since I would say the crisis one to one and a half year ago. As we see continues and steady growth in sensor sales and we see that multiple markets drivers grow the electronics content in cars in general.

The automotive future is looking bright, not only from a business per-spective in terms of car volumes and electronics content growth, but also from a safety perspective, and also from an environmental perspective with much greener cars being built every year.


© 2010 Agilent Technologies, Inc.

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A systems approach to solid-state lighting 35

Detecting and managing faults in LED lighting 40

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Why lifetime color consistency is important for LEDs 54

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SPECIALLIGHTING & OPTOELECTRONICS

Complete solid-state lighting (SSL) solutions require techni-cal expertise in myriad tech-

nologies — several distinct, high-level areas are easily identified (see Fig. 1). Knowledge in one area can be unique and the successful applica-tion of that know-how must be brought together at the systems level. Only in this way can an optimum lighting solution — one that takes into account the interaction between the technologies — be achieved.

Color countsMost EEs are already familiar with such key LED performance metrics as luminous efficacy (generally given in lm/W), total power consumption, and maximum current capability and its associated luminous output. But for SSL success, designers must also understand Correlated Color Temperature (CCT), Color Rendering Index (CRI) or Color Quality Scale (CQS).

Established by the Commission Internationale de l’Eclairage (CIE), a color-rendering index (CRI) rates how well a light source’s illumination of sample patches compares to the illu-mination from a reference source. The reference source is typically an incandescent lamp which approximates the ideal black body source and yields a CRI of 100 against which other light sources are measured. This is a somewhat subjective analy-sis that attempts to accommo-date the tri-chromic nature of human vision.

With the advent of LED sources, the need has arisen for

A systems approach to solid-state lighting

To achieve optimum solutions, designers and manufacturers of SSL fixtures must rely on expertise in myriad technologies

a color reference measurement tech-nique to correct chromatic satura-tion deficiencies in the CRI method. A Color Quality Scale (CQS) is being developed at the National Institute of Standards & Technology (NIST) to address the problems of the CRI for solid-state light sources and to better communicate color quality to con-sumers. As opposed to the single number CRI, the CQS results in a composite number that more accu-rately defines a lamp’s ability to ren-der colors in a manner pleasing to most consumers.

Another important LED parame-ter is its correlated color temperature (CCT), specified in Kelvin. The CCT provides a relative color appearance of a white light source when com-pared to a theoretical black body source. As a comparison, natural daylight often referenced as 5,000K (referred to as cool white), incandescent bulbs are approxi-mately 2,700 to 3,000K (referred to as warm white), and fluores-

cent bulbs are typically 2,700 to 5,500K. White LEDs are also identi-

fied as warm, neutral, and cool based on CCT ratings.

Even though solid-state lighting is produced in very sophisticated pro-cessing facilities, there are many vari-ations between the LEDs produced, even during the same run. Variations in forward voltage occur throughout the production simply due to normal statistical distributions inherent in all products. To provide repeatable and dependable systems, the LEDs must be electrically sorted based on this forward voltage.

A similar sorting is done to ac-commodate variations in the color of the blue LED chips and phosphor chemistry and density. This sorting results in the “bins” in which all LEDs are offered. The quality pro-ducer of LED systems will take all of

BY ROB RIXVice President, LightingTE Connectivitywww.te.com

Fig. 1: It take the multiple elements above to design a complete SSL system solution.

Fig. 2: The above patterns of light from typical LEDs must be shaped by secondary optics to meet the demands of applications from narrow task lighting to broad general illumination.


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these differences into account as the LEDs are matched for consistent col-or and performance.

Secondary optics’ challengesLEDs are mounted on a flat surface and emit light from the top and sides in a hemispherical pattern (see Fig. 2). In addition to the primary optics that protect the LED chip in its de-vice-level package, secondary optics provide greater functionality at the

system level. The selection of the correct optic is based on efficiency, color shift, application requirements and cost.

Secondary optics optimize the distribution of the LED light for spe-cific applications, such as down lighting, flood (broadly disbursed) lighting, or focused (spot) lighting. To accommodate these different dis-tribution profiles, some system man-ufacturers offer interchangeable op-tics to achieve different distributions with the same package. With prop-erly designed optics, light efficien-cies can exceed 90% within the tar-get illumination area.

Driving LEDsThe primary function of the driver module is supplying a controlled power level over the operating tem-perature range for the LED or LEDs in order to maintain a consis-tent light output. Power for the driver comes from the AC sup-ply and the driver converts this AC input into a controlled DC current or voltage for most ap-plications. Since the driver’s power requirements detract from the overall efficiency of the SSL system, very low power con-sumption drivers must be used for the most efficient lighting. (Note: lu-minous efficacy published by LED manufacturers typically refers only

to the LED and does not include driver or optical losses.)

Functions provided by a typical LED driver module (see Fig.3) include protection features such as tempera-ture protection, current detection and power factor correction (PFC), as well as several system level func-tions. Input control/communica-tions provides the ability to interface not only with ac line or 0-10 Vdc dimmers, but also facility manage-

ment systems and other emerging electronic controls such as daylight harvesting, occupancy detection, ambient light sensing and more.

Interconnects in SSL systemsInterconnects (cables and connec-tors) have been a critical but unad-dressed challenge for SSL systems. As system designers have found in elec-tronic systems of all types, wiring and connections are unique in a consumer electronics product com-pared to an industrial product or a personal computer.

Wiring and connectors have a sig-nificant impact on the cost, manu-facturability, operation, and overall reliability of SSL systems. Early ver-sions of SSL use solder connections, but they cause several problems in-cluding limiting the flexibility of the design for future upgradability. In-

terconnects have system design im-plications and complexity well be-yond the traditional lamp holder and lighting socket.

A standardized approach to con-

nectors and wiring not only provides a cost-effective solution, it can pre-vent assembly problems of inade-quately mated connectors, and read-ily identify/avoid mistakes through color coding and keyed design fea-tures (see Fig. 4). With a system-level approach to SSL interconnects, more than two wires are required, since more than power must be connected throughout the fixture.

The new Energy Star standards dif-ferentiate between fixtures where the source and the systems are the sepa-rable or integral. There are different levels of performance associated with each. Integral designs cannot be up-graded or replaced. As a result, inte-gral designs have to perform 20 to 30% better than other systems. Avoid-ing solder interfaces in the connec-tors is one means of achieving inter-changeability, increased reliability and future upgradability.

Interconnects certainly represent an opportunity for improving solid-state lighting and, if properly de-signed, can result in:

Rapid growth / adoption of SSL.Rapid platform / fixture / lumi-naire innovation.The economies of modularity.

Protection, thermal issuesFault protection is a requirement for successful implementation and prob-lem avoidance for any electronic cir-cuitry and solid-state lighting is no exception. Since an SSL fixture is an electronic and not an electrical as-sembly, the protection requirements are much more sophisticated.

Typically, an LED driver module in-cludes some level of protective circuit-ry to handle common faults that can occur in electronic systems, such as over-temperature, over-voltage, shorts, and, for dc circuits, reverse polarity.

Most LEDs are po-larity-sensitive devices that require a dc volt-age source. However, even ac LEDs need much greater protec-tion than ordinary electrical devices. In addition to standard

electronic circuit protection, SSL can be exposed to extreme surge condi-tions, such as power-line lightning strikes. Any power-line-coupled tran-sients can reduce LED lifetimes, and,

••

•

Fig. 3: As seen in this functional block diagram for a typical SSL driver, the functions provided go beyond simply prooviding the appropriate current.

Fig. 4: The standardized approach to SSL component interconnection of the NEVALO system uses keyed connectors and color-coded cables.




in the worst case, result in immediate failure.

Adequate thermal protection for tempera-ture-sensitive LEDs re-quires localized temper-ature measurements. The measurements are needed to support a suf-ficiently quick response, including shut down if necessary, to limit exces-sive temperature and thereby avoid stressing LEDs or contributing to early-life failure.

In systems with sev-eral LED subassemblies, each subassembly can be a point of potential overtemperature failure. In such systems, temperature detection at a single, centralized location is in-sufficient.

The systems approachThe complexity of the various areas just discussed and the broad range of expertise required to address each of them has been a barrier to entry into

SSL, especially for small to medium-sized lighting fixture suppliers. The design process for light fixture/lumi-naire manufacturers can be greatly simplified with an integrated system.

Ideally, the systems would pro-vide lighting-fixture manufacturers with a plug-and-play solution, in-cluding all the components required to convert from incandescent or flu-orescent to solid-state lighting (see

Fig. 5). This approach would enhance the lighting de-signer’s capability with flexible choices of light out-put and color, and the abil-ity to focus and distribute light in different places.

In addition to the com-ponents and design meth-odology, a complete sys-tems approach should include a toolbox to bridge the technology gap, allow-ing lighting fixture suppli-ers to easily design high-ef-ficiency SSL fixtures with confidence.

With the appropriate overall systems design methodology, luminaire manufacturers can avoid the extensive engineering and qualifi-cation — and familiarity — with mul-tinational differences — needed to embrace this new technology. Instead, manufacturers can focus on light fix-ture esthetics and performance, with the confidence that the technology inside their fixtures works and meets industry regulations.

Fig. 5: A systems approach to SLL can result in integrated components like those above that facilitate implementation of different types of SSL systems. A wall sconce and typical NEVALO LN24x100 system is at the top, and a track light and NEVALO CN58 socket is at the bottom.

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AAL406 LED Fault Monitor and BypassFeatures• Open and Short LED Sensing• Latching SCR ‘Crowbar’ for Open LED Bypass• Architecture to Support Unlimited Cascade

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No matter how hard en-gineers try to prevent it, parts fail. LEDs are

no exception, and with the cost and reliability expectations of LED light-ing solutions, avoiding system down-time from shorts or opens can be critical. Since LEDs are normally used in strings of multiple LEDs, an open-circuit LED causes the entire string to go dark.

Moving equipment and traffic to repair a traffic light can be a costly exercise. Lighting failures for sys-tems dispersed in a building or over a geographical area can go unno-ticed, creating hazards for security and safety. Solutions that monitor lighting systems for failures in order to increase uptime or decrease down-time are thus critical for positive cus-tomer perception and rapid adoption of LED lighting solutions.

Detection and monitoringManaging faults first requires their detection, the most basic step for maintenance of lighting system functionality. With LEDs, voltage is the most easily measured parameter for detecting an individual LED’s sta-tus. Used for fault sensing, the on-state LED voltage serves to detect ei-ther open or shorted LEDs.

As already described, the open-circuit failure of a single LED can ex-tend beyond the loss of lighting for a single device, extending to the loss of an entire string of LEDs based on typical configurations used for light-ing. In contrast, a short can leave the other LEDs functional, reducing the likelihood of detection, though leav-ing the impression of an unreliable

Detecting and managing faults in LED lighting

How to avoid system downtime when there is an open LED failuresystem for those viewing the failure.

Active monitoring and detection can provide system management where failures are quickly detected

and repaired for minimal impact on functionality and downtime. For ef-fective fault detection, sensing must be extended to each individual LED in the lighting fixture. This requires a solution to interface with multiple

LEDs, while communicating the sta-tus or a detection of a failure to cir-cuits and systems beyond the LED where a fault occurs.

Given the varying lengths of LED strings in use in myriad applications, a flexible, multichannel IC solution is needed. The solution must be able to work across an arbitrary range of string voltages (as this depends on the number of LEDs in the string) and a wide range of LED operating currents. It must be able to communi-cate the occurrence of a failure re-gardless of where it occurs within the string, and have a scheme whereby fault signals can be combined from multiple strings.

The most straightforward approach is to use locally powered circuits for detection, which in turn use a cascad-ed current signal as a fault indicator. Within the string, an IC solution can be designed such that the chip at the top of the string gets its fault current from the main LED power bus, and sends it’s on/off fault current indica-tion to the chip below it in the string. At the bottom of the string the fault/no-fault current is put into a circuit that provides the final indication de-sired by the application. A cascaded multichannel example is shown in Fig. 1, using the AAL406 LED Fault Moni-tor and Bypass Protection IC.

One bad LED spoils the stringAn open LED causing the loss of a whole string of LEDs within a fixture is a significant problem. One method of maintaining functionality of the string is to provide a bypass path around the open LED, allowing the rest of the string to continue opera-tion. The simplest LED bypass is a two-pin SCR wired across the LED. As SCR gate trigger voltages are around 1V, too low to use directly, a

BY GEORGE RASKOApplications EngineerASIC Advantagewww.asicadvantage.com

Fig. 1: The most straightforward approach is to use locally powered circuits for detection, which in turn use a cascaded current signal as a fault indicator


www.micrel.com© 2011 Micrel, Inc. All rights reserved. Micrel and Innovation Through Technology are registered trademarks of Micrel, Inc.All other trademarks are property of their respective owners.

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zener is added to raise the trigger volt-age (see Fig. 2).

If the LED opens, the voltage across it rises until the SCR gate voltage is reached and it fires, which then pro-vides a latched path around the open LED. (LEDs use dc voltage and current, so they don’t need the added complex-ity of a TRIAC for bypass.) The SCR will stay active until the current drops below the SCR’s specified holding cur-

rent. This is ideal for dc string current, which is the usual situation for LEDs. When there is PWM on/off dimming of the string, the SCR resets and refires each PWM cycle, thus not impacting functionality while also decreasing power dissipation.

The stated approach has some lim-itations and requirements on the ap-plication to ensure proper operation. The LED string needs to be fed by

something resembling a current source, where the LED voltage will rise if an open circuit occurs. Addi-tionally, the voltage rise has to be greater than the trigger voltage of the bypass function. Also, the current path to the string should have some limit on instantaneous current, as SCRs fire quickly and LEDs present a relatively low load impedance. An ex-ample concern would be for failure of the SCR if it turns on to a large ca-pacitance bus, with low resistance in its current path. Implementation of such a bypass and monitor solution in an IC can enable fault manage-ment of multiple SCRs by one pack-age. The LED voltage, sensed for fir-ing of the open LED bypass SCR, is also used to provide fault sensing of shorts or opens.

The IC-based cascaded current fault detection/reporting scheme de-scribed earlier is shown schematically in Fig. 3. Note that one downside is that this approach will not integrate seamlessly with PWM dimming. When the string current is off/zero due to the PWM signal, the detec-tion/reporting is in an ambiguous state, as the voltage/current across/through the LEDs is varying widely. An extra circuit at the bottom of the cascade could be used to use the PWM signal to latch the fault reporting while the LEDs are active/on, and to ignore/hold the fault status when the PWM signal is forcing the string cur-rent to zero.

Thermal concernsAs with any electrical circuit, there are packaging and thermal issues to

Fig. 2: The simplest LED bypass is a two pin SCR wired across the LED. As SCR gate trigger voltages are around 1V, too low to use directly, a Zener is added toraise the trigger voltage



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Wise useof illumination like …

References1. AAL406 Datasheet (latest version

available at www.asicadvantage.com).

2. AAL406 Demo Board Booklet.

Fig. 3: Shown is an IC-based cascaded current fault detection/reporting scheme

consider. Note the on-chip SCRs have an on-state voltage of about 1 V (posi-tively correlated with current, nega-tively correlated with temperature). This means that, at 0.3-A current, they dissipate 0.3 W.

Getting the heat out into the am-bient air is vital for reliability. Typical plastic IC packaging is not sufficient for the power levels described above. The IC packaging in this application

requires measures to be taken for thermal management, without need-ing extraordinary measures. As a spe-cific example, the AAL406 has three SCRs and fault sensing built into a surface-mount SOIC 8-pin package. The package’s thermal performance is excellent due to the exposed metal tab in the bottom, which is thermally coupled to the internal die. By put-ting a PCB copper pour underneath

the chip, and soldering the tab to top-side copper, a large improvement in heat removal is realized.

Standard plated via holes should be used to connect the top-side cop-per to bottom-side copper beneath the IC to improve thermal transfer. In the worst-case condition, in the cases of multiple SCRs with higher-current loads, the thermal requirements can be more severe. In these instances, mounting them on a common sink, such as IMS (insulated metal sub-strate), is a likely solution. The extent of heat sinking required depends on the expectations of handling for fail-ures versus repair, the handling of op-erating currents under normal opera-tion versus occurrence of a failure, operating temperature range, cost considerations and other such system design and operating concerns.

Detecting and managing faults in LED lighting


With a new focus on green technology and eco-friend-ly products, American

households and companies are now familiar with light-emitting diodes (LEDs). The market for these prod-ucts is extensive; practically any tra-ditional method of lighting can be replaced with an LED.

With their ability to provide effi-ciency and longevity, LEDs represent the cutting edge of new energy tech-nology, but a simple misstep in the design can cause their life to end pre-maturely. As this market is still evolv-ing, many engineers do not realize that the wrong capacitor in the LED circuit can cause the light to fail long before the expected lifetime. That is because some capacitors, when sub-

jected to very high voltages, will stop working. For that reason, it is crucial to choose the right capacitor.

Components for LED lighting de-sign must be selected carefully to en-sure that they meet the lifetime and energy-efficiency requirements of the end products. These require-ments can be demanding — LED

Illuminating capacitor choices

How selecting the right capacitor can increase the lifetime of your LED

lighting designlighting products may have an ex-pected lifetime of more than 40,000 hours. Therefore it is critical that all parts of the circuit can meet these requirements.

Ceramic capacitors in this type of circuit can be subject to high voltag-es and conditions unlike those usu-ally seen in other domestic appliance applications. These conditions can adversely affect the lifetime of ce-ramic capacitors, which can mean they fail before their expected mini-mum lifetime. This article explains the root of this problem and makes recommendations for ensuring ce-ramic capacitors do not shorten the lifetime of LED lighting products.

Typical conditions in LED circuitryA typical LED lighting circuit is shown in Fig. 1. The capacitors select-ed for C1, C2, and C3 should be safety-

recognized devices rated to 250 Vac. C6 is the snubber capacitor for the di-ode; parts rated to withstand 250 to 630 Vdc are needed and these can have the X7R temperature character-istic. For C7, the snubber capacitor of the field-effect transistor (FET), a higher voltage rating of 630 Vdc to 1 kVdc is necessary, and it is recom-

BY NAOYUKI KOBAYASHISenior Product ManagerMurata Electronicswww.murata.com

speciallighting & OptOelectrOnics

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Fig. 1: A typical LED lighting circuit.

Fig. 2: Typical voltage waveform across C4 and C5.

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The typical working voltage signal across these two capaci-tors is the full-wave-rectified waveform shown in Fig. 2. Ca-pacitors with a X7R TC that are rated up to 250 Vdc are often incorrectly chosen for C4 and C5. The problem is that when high-dielectric-constant ca-pacitors like these are subjected to full-wave-rectified voltages, they succumb to the elec-

trostrictive effect, which can cause fatal cracks in the dielectric material.

The electrostrictive effect applies to all EIA Class II dielectric materials (these are ceramics with a high TC or with a high content of barium tita-nate (BaTiO3). When an ac voltage is applied, the capacitor effectively stretches and shrinks in the different dimensions, as shown in Fig. 3. Me-chanical distortion and stress con-centrate around the edge of the ex-ternal electrode of the capacitor. If the ac voltage is large, and the mate-rial has sufficient dielectric proper-ties, cracks can form under the exter-nal electrode over time, which can lead to catastrophic short-circuit fail-ure of the component.

Mitigating the electrostrictive effectThere are a number of ways in which the electrostrictive effect can be mit-igated with the use of specially de-signed capacitor structures.

The first factor to take into ac-count is the thickness of the dielec-tric material between the inner elec-trodes of the capacitor. This has a direct effect on the magnitude of the electrostrictive phenomenon. When designing high-voltage capacitors, it is essential to ensure the dielectric layer is thick enough to reduce the chip capacitor’s internal mechanical stresses.

Secondly, the structure of the in-ner electrodes can contribute to the electrostrictive effect. Typical inner electrode structure is shown in Fig. 4a. By comparison, Fig. 4b shows one type of electrode structure of high-voltage capacitors. The center area of this structure (marked red in the fig-ure) is not active and is therefore free from the effects of this phenome-non. This is sometimes referred to in the component industry as floating electrode structure.

Fig. 3: The electrostrictive effect.

speciallighting & optoelectronics

mended that the U2J tempera-ture compensated capacitor be used. C8 is the smoothing capac-itor for the secondary circuit for which any 100-V-rated part should be sufficient.

The capacitors in the circuit subject to the harshest condi-tions are C4 and C5, which act as ac smoothing or noise filter ca-pacitors for the primary circuit.

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Fig. 4: Inner electrode structure.

Additionally, the thickness of the outer layer of the dielectric (the “dummy” layer) can influence the formation of cracks. This layer is where cracks usually begin, so in-creasing its thickness, and thereby its mechanical strength, can help reduce the chance of cracks forming and in-crease the lifetime of these products.

Lastly, the properties of the di-electric material itself can play an important part, since it is only high-dielectric-constant materials that ex-perience the electrostrictive effect. Companies such as Murata carefully consider the properties of its materi-als to ensure that products specified for high voltage are constructed from suitable dielectric materials.

To address the reliability issues ef-fecting C4 and C5 and increase the lifetime of the capacitors in C4 and C5, Murata recommends using either of the following options insurface-mount and leaded construction. As mentioned previously, these recom-mendations are based on effects of the high-voltage, full-wave-rectified wave (greater than 250 V) to which the C4 and C5 capacitors are exposed.

Based on the voltage requirements of the plans, Murata recommends choosing capacitors with a 630-Vdc rating for designs having ac voltage ratings of 100 to 240 Vac. Due to the effects of electrostriction, it is rec-ommended that for designs where the peak-to-peak voltage (Vp-p) is more than 50 V, a 630-Vdc part be used. For plans where the peak-to-peak voltage is less than 50 V, a 250-Vdc option can be considered. Cases sizes for ceramic capacitors parts that meet these conditions are generally 1210, 1812, and 2220.

For designs with an ac voltage of 277 V, it is suggested that the design use a 1-kV option. Case sizes for ce-ramic parts with the 1-kV rating can range from 1812 to 2220. The capaci-tance values that are generally need-ed for C4 and C5 are 0.047, 0.1, 0.22, 0.47, and 1 µF. There are a wide range

of solutions in both SMT and through-hole technologies to best suit the design constraints of your design.

Overall, the con-ditions experienced by ceramic capacitors

in LED lighting circuits should not be underestimated. It is Murata’s ex-

perience that selecting the wrong capacitor can adversely affect the lifetime of the end product due to crack formation in the dielectric ma-terial of these capacitors. When de-veloping this type of product, engi-neers should take care to ensure they use adequately rated chip ceramic ca-pacitors, with superior structure to mitigate the electrostrictive effect described above.

Illuminating capacitor choices



It would be difficult to go through the day without seeing evidence that the touch interface has be-

come the most popular way of inter-acting with smartphones. Indeed, Apple’s introduction of the iPhone in 2007 has been credited with so-lidifying the use of touchscreens on mobile phones and other portable consumer electronics. So common-place and natural is touch, that it has found its way as a human-machine interface into PC peripherals such as the mouse, keyboard, and track pad.

Some may think the latest touch-screen devices to hit the market — tablets, slates, netbook convertibles, and to a lesser extent, notebooks — will signal the end of the ubiquitous computer mouse, but this is not like-ly. For all the benefit that an intuitive touchscreen provides with certain ap-plications, tasks requiring more in-tensive user input — such as typing or editing — are typically accom-plished faster and more accurately us-ing a physical keyboard and mouse.

Tablets are ideal for browsing the internet, watching videos, and read-ing, but the lack of a mechanical key-board makes them more suited as con-tent consumption devices. As with mobile phones, the virtual keyboard and associated user interface is not as easy to use when generating any sig-nificant amount of content. This is evident by the fact that docking sta-tions are sold with tablets that connect to traditional mice and keyboards.

Computer touchscreens, albeit of the resistive type, have been in exis-tence for decades and have coexisted with the mouse and other peripher-als. Even as touch technology mi-

Optical mouse technology: Here to stay, still evolving

Touch in tablets, netbooks, and other portable electronics won’t sound the death knell for mice, which offer unique capability

grates to multitouch capacitive, the mouse and keyboard will remain the most efficient means of input and therefore will continue to be around for many years to come.

It started on the surfaceOf course, mouse technology has not stood still in recent years, nor is it likely to slow development. The first commercially viable LED-based opti-cal mouse changed the computing world, as it displaced the mechanical ball mouse along with the mouse pads they required to aid in smooth operation. The nonmechanical opti-

cal mouse could track more accurate-ly and at a much higher resolution.

As innovative as the LED optical navigation engine was, users soon realized it could not track well on very smooth surfaces. To solve that problem, the next-generation optical navigation engine was invented by replacing the LED with a vertical-cavity surface-emitting laser, or VC-SEL (see Fig. 1). The coherent nature of the collimated laser light, along with the specular optics, allowed this sensor to track on more surfaces compared to the LED-based mouse sensor.

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The PC mouse has become so commonplace that, when it doesn’t work on all surfaces, the user is surprised. This is particu-larly evident when attempting to use either an LED or standard la-ser mouse on glass. The ability to track on glass has long been her-alded as the pinnacle of optical navigation technology. It took many years of development, but the first track-on-glass engine was released to the market in 2009.

The desktop goes mobileOptical navigation technology has evolved to keep up with the way consumers use their comput-ers. Today, with mobile comput-ing platforms far exceeding ship-ments of desktop PCs, users find themselves computing in remote locations where glass, granite and other reflective tabletop surfaces are present.

While it was once thought that such trends would lead to a significant drop in mouse usage, unit volumes have actually enjoyed growth. Many

users still prefer to carry a mouse to use, rather than using the built-in lap-top track pad, because of improved re-sponsiveness, accuracy, and immunity to false touches.

With mobility comes the need for

Optical mouse technologySPECIALLIGHTING & OPTOELECTRONICS

long battery life. In the last two years, most of the major mouse manufacturers promote battery life as a selling feature because longer battery life appeals to the environmentally conscious con-sumer. To support the green ef-fort, the optical navigation sys-tem must be capable of consuming less current and operate at lower supply voltages.

One source of power reduction is the choice of LED illumination. Red LEDs have historically been used because the sensor’s pixel ar-ray was most sensitive at the 630-nm wavelength. However, the red LED is not very efficient, and con-tributed to shorter battery life for the mouse.

IR LEDs (870 nm) with lower forward-bias voltage enable usage with lower supply voltages, and

in turn, reduce the power consump-tion of the overall optical navigation solution. Both the IR LED and the mouse sensor can use the same 1.8-V power supply. This leads to greatly ex-tended operating life; for example,

Fig. 1: The early LED-based optical navigation system used in mice (top) did not track well on very smooth surfaces, resulting in development of the laser-based navigation engine (bottom) which tracks on more surfaces.


8.125x10.75_HighRel_MedMil.indd 1 4/11/11 2:30 PM

the Avago ADNS-2080 and 3000 navigation sensors offer over one year of operation from a single AA battery.

Component integrationAs technologies mature, the tendency is to vertically inte-grate more of the solution into a single IC to help reduce the overall size, complexity, and power consumption. The earli-est mouse sensor solutions consisted of a separate naviga-tion sensor, illumination source (LED or laser), and lens. For corded mice, a separate USB MCU was also required to com-municate to the host PC. And, for cordless mice, a separate MCU and radio was required. Over time, the packaged LED or laser was integrated into the sensor package, the USB MCU was integrated into the navigation sensor, and radio manufacturers combined the discrete MCU and radio.

For wireless mice, the choice between radio protocols depends on the desired performance, value, and cost of the mouse. The use of 27-MHz radios is largely being replaced by 2.4-GHz proprietary technology, as the cost of the high-er-frequency standard has come down to the point where performance of 2.4-GHz technology outweighs its price premium.

Both 27-MHz and 2.4-GHz radios require dongles to complete the wireless communication link to the host computer. Bluetooth is another 2.4-GHz option that is dongleless; as a standard protocol, a mouse equipped with a Bluetooth radio can communicate with all laptops with built-in Bluetooth without the need for a separate dongle. Bluetooth radios used to be the most expensive wireless solution, but its price has fallen to a point where it com-petes with 2.4-GHz proprietary technology. A laser sensor with integrated Bluetooth can greatly reduce problems with interoperability and pairing. Integrated solutions can also help simplify dealing with the sensor/radio interface, and reduce power consumption.

Table 1 summarizes the relative performance and merits for each of the radio protocols.

Going forwardThe changing user environment that has driven innova-tion over the past decade will continue to do so. In fact, as Google TV and other digital living room technologies become more popular, 3D motion control devices, already available today, may become more mainstream.

Choices between LED- or laser-based sensors, wired or wireless protocols, and discrete or vertically integrated so-lutions will continue to result in various combinations of performance and cost. But with all of these options at their disposal, mouse manufacturers can offer a broad spectrum of computer mice, differentiated so that they can appeal to every market segment.

Optical mouse technology


protocol overall performance

power consumption

ease-of-Design

Value: cost

27 MHz Low Least efficient Moderate Low

2.4 GHz proprietary High Most efficient Simple Moderate

Integrated Bluetooth High Efficient Simplest High

Table 1. Relative comparison of the wireless protocols most commonly used in cordless mice


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Why lifetime color consistency is

important for LEDs

LEDs also give designers a whole new palette of color, and, by enabling ad-vanced digital control and the possi-bility of environmental sensing, de-liver a multi-dimensional, interactive experience. With most all LED pack-age options available for all colors, LEDs bring a whole new dimension of

LEDs provide excellent color ren-dering and uniformity of light, and thereby achieve a high light

quality for most lighting applications.

Targeting the smallest binning quadrangle is the first step in maintaining lighting

consistency over the life of an SSL fixtureBY MICHAEL GODWINDirector of Visible LEDsOSRAM Opto Semiconductorswww.osram-os.com

Fig. 1: The American National Standard Institute (ANSI) chromaticity specification defines binning regions (black) based on the CIE 1931 x,y color space. The regions correspond approximately to seven-step MacAdam ellipses (lavender), which define compact fluorescent color space.

Fig. 2: fine binning of white LEDs (orange lines) is segmented to correspond with the ANSI quadrangles (black lines). Each bin fits inside a three-step MacAdam ellipse (blue ovals), representing the limit of color difference that can be perceived by the human eye, to accommodate applications where precise color matching is critical.



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possibilities to lighting and design not possible with conventional fluorescent or incandescent lighting.

With expensive durable goods such as automobiles and major appliances, har-monizing the color between many finished products and within several applica-tions of a product is no

Fig. 3: The fishbone diagram shows the factors that can affect color consistency over time.


Why lifetime color consistency is important for LEDs

small task. Understanding how LED color is measured and specified makes this possible.

Binning for color consistencyAs semiconductor prod-ucts, white LEDs are sorted, in a process known as bin-ning, to ensure consistency of color and quantity of

light so that designers can specify pre-cisely the color and brightness they need for their particular applications. Targeting the smallest binning quad-rangle at the LED initial test point (t0, or beginning of the life cycle) is a criti-cal requirement to maintaining light-ing color consistency in the finished assembled products.

Selecting a realistic shippable bin region that is both economical and consistent for the application require-ments can help ensure the design color consistency for the life of a product. Color binning selection is one of the most important decisions designers need to factor into their LED lighting design.

How are bins specified? In 1931, the CIE (Commision Internationale de l’Eclairage, or International Commis-sion on Illumination) established a standard with respect to human color vision (CIE 1931 x,y) that defines the color metrics critical to consistent light-ing quality. The standard is rather com-plicated and involved; for instance, metrics must be measured at a uniform luminance level, because the human eye sensitivity to color is reduced as the brightness of any light source is in-creased. However, American industry has established its LED color measure-ment standards based on the CIE 1931 x,y standards metrology (see Fig. 1), so it is important to understand the full spectrum of standards for color.

Early in 2008, the American Na-tional Standard Lighting Group (ANSLG) published “Specifications for the Chromaticity of Solid State Light-ing Products” (ANSI_NEMA_ANSLG C78.377-2008). This standard specifies the range of chromaticities recom-mended for general indoor lighting with LED products, and ensures that the white-light chromaticities of the products can be communicated to us-ers. This standard applies to LED-based SSL products incorporating control


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electronics and heat sinks. The pace of change with solid state

lighting is rapid, requiring the design-er to pay close attention to the initial color and illumination at t0 and final color and illumination at t50K. (The end of the serviceable product life is considered 50,000 hours.) Precisely controlling LEDs with smaller LED color bins can help ensure color con-sistency in the lighting application (see Fig. 2).

Designers should pay special atten-tion to the shippable binning limits of LED suppliers. Although it is techni-cally possible to refine the bin size to very small areas, the manufacturer’s ability of a to consistently ship an am-ple supply of LEDs from any bin, throughout the product life cycle needs to be considered.

Color lifeWhile the LED industry has advanced its understanding of lumen deprecia-tion, there is still a need to develop a common understanding of the color shift of light sources and systems over time. With pre-defined stress and ac-celeration factors, LED fixtures can shift in color over time. The high out-put of phosphor-converted white LEDs based on high energy blue (450 to 470-nm) emitters can degrade plas-tic materials, causing a long-term color shift in the fixture.

With lighting products, it is impor-tant to consider the system degrada-tion modes over the entire product life cycle. It is well understood and docu-mented that the reliability of LEDs far exceeds the reliability of conventional discharge, fluorescent, incandescent, and halogen light sources. This is mostly due to the enhanced robust-ness of a solid state semiconductor de-vice, which is not subject to the classic infant mortality mechanism of a fila-ment or a glass-seal product.

However, maintaining consistency in color over the usable service life of a product is very important. A com-mercial lighting installation using LEDs may include tens to hundreds of fixtures with hundreds to thou-sands of LED emitters, making con-sistency of color critical to delivering the most consistent appearance and optimum aesthetic appeal over time.

Color consistency is influenced by many factors. It is, of course, linked to the precision of the initial binning, but color can shift over time, depending on

Fig. 4: LEDs like the OSLON Black (right) and

SSL Series (below) are examples of fine white

color binned LED packages that have different optical

and thermal characteristics suited for various

applications.


such factors as envi-ronmental condi-tions (humidity, ambient tempera-ture), material selec-tion (LED packag-ing, optic materials), operating current and voltage applied to the LED, and electronic controls and components.

To maintain col-or consistency over the life cycle of a product, lighting designers should continue to evaluate and control the brightness and color at t0 and also understand the interactive effects of materials to maintain consis-tency through product life cycle. The so-called fishbone reliability diagram (Fig. 3) can be a useful guideline for evaluating potential reliability vari-ables in LED lighting fixture design. Product designers and engineers must consider all interactive elements, such as man, material, machine, process, and environmental factors, and all the

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potential degradation mechanisms that can oc-cur from the luminaire’s initial t0 to final t50K life expectancy.

With proper binning controls, LEDs can provide excellent color con-sistency and light uniformity. White fine binning is critical to application designs where precise color matching is crucial to the product design and appearance (see Fig. 4). Designers should pay close attention to the shippable binning limits of their LED supplier. Ensuring a supply of consis-tently binned LEDs will also help en-sure color consistency over a product’s lifecycle.

Why lifetime color consistency is important for LEDs



In just five years, the entire infra-structure of mobile phones has ad-vanced significantly — and so have

the users’ expectations. Now there are 3G and 4G networks, enhanced mo-bile operating systems, and high-speed baseband processors talking to huge memories. All these advances have given rise to smartphones with apps that demand WVGA (800 x 480) and even qHD (960 x 512) displays to opti-mize the user experience.

As savvy users scrutinize device performance and demand more fea-tures, an ongoing challenge in devel-oping next-gen mobile devices is how to incorporate the most advanced dis-plays, components, and applications, while simultaneously improving pow-er efficiency. Fortunately, new tech-nology is being widely adopted to sat-isfy both display quality and power requirements.

A display’s impact on powerAlong with its RF section, a smart-phone’s display is its main power con-sumer. Both OLED and LCD can con-sume significant power. In the case of OLED, the displays consume power only at the pixels that are lit, so e-mail and predominantly white applications consume more power.

For LCDs, the primary consump-tion is in the backlight unit (BLU). Today’s mobile display BLUs use white LEDs. Light is carefully collected in a light guide but, to achieve improved BLU uniformity, losses are experi-enced; light is also lost due to internal reflection as it enters the back of the LCD display.

Every display has a pair of polariz-ers that absorb at least half of the light.

Higher display performance for next-gen mobile devicesAdvances in networks, chips, and operating systems demand

lower-power displays that optimize the user experience

The display backplane is comprised of an array of FETs and busbars that all absorb light. Additionally, color filters can absorb about half of the light, ab-sorbing all except one color passing through that filter.

For low-resolution devices like TVs, the LCD panel’s light transmission can be about 10%. As we migrate to higher resolution for smartphones and tablet PCs, aperture ratio is further re-duced for still lower optical efficiency.

New video and data-centric appli-

cations such as text, e-mail, and navi-gation, keep the display turned on a significant percentage of the time. So user expectations are now heightened, not only for improved quality displays, but for reduced power consumption that will not handicap the device with a heavy battery or shorter battery life.

The eye and the displayLegacy RGB stripe displays used every possible way of grouping of red, green, and blue subpixels together into a sin-

BY JOEL M. POLLACKExecutive Vice President, Nouvoyancewww.nouvoyance.com

Fig. 1: The RGB stripe pattern on the top displays the finest pattern of black and white lines within the space of six columns, but the PenTile RGBW technology on the bottom displays the same pattern of black and white lines in only four columns.

Fig. 2: In the JEITA measurement method, the power consumption for PenTile RGBW with DBLC can be lower than both legacy RGB stripe as well as legacy RGB stripe with CABC. Applications with more white content favor PenTile technology.


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gle unit. This does not correspond to the way images are experienced by the combination of eye and brain re-ferred to as the humans visual sys-tem, or HVS. The HVS experiences images as concentrations of energy and it can resolve the position of this energy for green light with much fin-er accuracy than for blue light. As a result, one can move the center of blue light away from the pixel loca-

tion, preserving chrominance, but with no penalty to how the image is seen. The methodology is possible with subpixel rendering.

Taking advantages of the strengths and weakness of the HVS enables re-duction in the number of subpixel dots, without diminishing the num-ber of pixels, since pixels are simply the center of an energy well, where we perceive the position of any given

pixel. The key to execution of subpix-el rendering is in the design of math-ematical algorithms that can faith-fully represent that which the HVS needs to sense.

Unlike legacy LCD displays that use an RGB stripe layout, the technology known as PenTile RGBW uses a propri-etary layout with an eight-subpixel re-peat pattern (Fig. 1) to accomplish sub-pixel rendering. The white (W) subpixels are actually clear allowing the white light of the BLU to pass without attenu-ation by a color filter. The other key dif-ference in the technology is reduction to one-third fewer columns, allowing columns to be one-third wider and thus increasing light throughput.

Despite the reduction in the num-ber of columns, it is still possible to retain the same resolution of the equivalent RGB stripe panel. This en-ables the display to meet and exceed the rigorous standards of the Video Electronics Standard Association (VESA) for display resolution, mea-suring the contrast modulation ratio of black and white lines.

PenTile technology requires image processing; each image is analyzed for edges, such as those of fine text. Using HVS knowledge, PenTile incorporates adaptive filtering algorithms that light up individual pixels to further en-hance the perception of the sharpness of fine lines and high-contrast edges. Through the use of such techniques, text will look crisp and sharp.

Although every flat-panel display has a pattern that can be visible to those who have sufficiently high vi-sual acuity, such pattern visibility shouldn’t be confused with clarity of text or fine line graphics. The PenTile pattern may look different than RGB stripe, but definition for black and white text is demonstrably as crisp as legacy RGB stripe technology.

Visual, power enhancementEngineers have pursued several mea-sures to enhance power efficiency in RGB stripe panels. One such measure has been to move from amorphous silicon to low-temperature polycrys-talline silicon (LTPS) backplanes for improved aperture ratio. Another has been to sense the peak lumi-nance in an image, and globally dim the backlight as the transmission of the display is increased to reduce the power consumption; this technique


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Displays.aspx

is referred to as content adaptive backlight control (CABC). For images such as video, where there is less peak luminance, such measures can be very effective and often increases the contrast by enhancing blacks.

In contrast, PenTile RGBW can pro-vide brilliant whites, allowing specu-lar reflections — the mirror-like reflec-tion of light — to be enhanced and much more representative of what is seen in nature. At the same time, the human vision system can interpret highly saturated colors when shown concurrently with such brilliant whites as dark. This simultaneous con-trast effect is particularly noticeable for yellow. To compensate for this phe-nomenon, PenTile technology ana-lyzes each image not only for peak brightness, but also for highly saturat-ed colors. When such colors are pres-ent, the luminance of white is main-tained while extra power is provided to the saturated colors to preserve the perception of color accuracy.

While this technique might seem to increase power consumption, it can be combined with a variant of CABC: dynamic backlight control (DBLC). DBLC takes into account both peak lu-minance as well as the occurrence of highly saturated, high luminance col-ors and performs global dimming ad-justments that have the benefit of cut-ting power, while increasing as well as enhancing contrast. With this mode, clipping artifacts can be less than for RGB stripe’s CABC, since white is rare-ly ever clipped for PenTile displays whereas for RGB stripe both white and saturated colors all have the potential of clipping artifacts. The Japan Elec-tronics and Information Technology Industries Association (JEITA) stan-dard, an industry metric for compar-ing power consumption, proposes a usage model that blends various pat-terns to represent real world experi-ence (see Fig. 2).

PenTile solutions have been used in more than 70 mobile products to date including digital cameras, phones, MP3 players, GPS systems, and other cutting-edge products like the Motor-ola Atrix. All commercial 4.1-in. and smaller VGA and WVGA OLED dis-plays use PenTile technology.

Long-term display outlookFueled by the success of the Apple iPad, the industry expects strong

growth in tablet PCs soon. Compet-itive products from Samsung and others have begun to increase the display resolution to further im-prove the utility of such designs.

These trends test the power effi-ciency of such products. As the in-dustry seeks innovative technology to incorporate into new mobile de-vices, a technology that offers the ability to greatly improve display

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Industrial applications need a broad variety of compo-nents, and here we’ll look at a few especially interesting ones.Silicon Labs (www.silabs.com/industrial) has a number of

interesting ICs pertaining to industrial control. The compa-ny’s low-power MCUs come with sub-GHz wireless trans-ceivers and capacitive touch-sense. Factory and industrial automation applications involve monitoring temperature, strain, voltage, current, distance, pressure, and flow, and harsh operating environments demand extreme care in in-terfacing. Silicon Labs’ multichan-nel Si84xx digi-tal isolators pro-vide high-voltage isolation (1-, 2.5-, and 5-kV isola-tion) in small

form factors, enabling precise measurement and control in harsh environments. The digital isolators use a novel RF isolation architecture fabricated in standard CMOS in one-to-six-channel configurations one-third the size of opto-coupler solutions, and they reduce BOM cost.

The Si84xx digital isolators, Si82xx isolated gate drivers, and Si85xx cur-rent sensors have patented isolation and high-voltage technology and are often used in industrial switch-mode power supplies. The industrial-grade C8051Fxx MCUs operate up to 125°C and have CAN 2.0B and LIN 2.1 inter-faces, a precision oscillator, and a 12-bit A/D converter. They run on a 1.8 to 5.25-V supply.

Small motors (less than 300 W) are used in a wide variety of industrial ap-plications, and their high-voltage mo-tor controllers require reliable isola-tion to protect both staff and equipment. Silicon Labs’ combined MCU and isolator products offer high integration and reliable low-power operation (see Fig. 1). They offer mo-tor control reference designs for dc, brushless dc, and stepper motors.

Analog Devices (www.analog.com/circuits) has launched an updated ver-sion of its Circuits from the Lab (CftL) reference circuits design support pro-

Fig. 2: Gate driver ICs include a charge

pump and voltage regulator.

pRODUCT application

Fig. 1: Motor control can be

highly integrated.


gram with ana-log, RF, and mixed-signal system designs. Unlike refer-ence designs that may skim

the surface of many different applications, ADI’s more than 150 reference circuits provide comprehensive documenta-tion that may include a range of time-saving items such as test data, sche-matics, BOM data, layout files, device drivers, and evaluation hardware. The detailed yet easy-to-understand build-ing blocks are designed and tested for quick system integration to help engi-neers save days or weeks of research and design time.

Atmel (www.atmel.com) has launched the ATA6843 and ATA6844 gate driver ICs for automotive BLDC motor-control applications — but I don’t see what they wouldn’t fit some industrial apps just as well. The three-phase drivers operate at chip temper-atures of up to 200°C and support motors with Hall sensors as well as sensorless designs. They yield 200-mA peak current for each output driver. The chips include a charge pump to provide gate voltages for high-side drivers and to supply the gate of the external battery reverse-protection NMOS FET (see Fig. 2). They feature a watchdog timer, a LIN port, and comprehensive protection and diagnostic functions, such as monitoring of overtemperature, overvoltage, undervoltage, short-cir-cuit conditions, and charge-pump failures. They cost just $2.10 ea/10,000.

RS-485 is still used in a broad ar-ray of industrial applications, and Bourns (www.bourns.com) has devel-oped an advanced three-stage protec-tion solution for RS-485 ports that includes TVS diodes, Transient Block-ing Unit (TBU) devices, and one or more gas discharge tubes (GDTs), as shown in Fig. 3. TVS diodes provide overvoltage protection. To protect the TVS diode array against ac power cross events or large transients as well as overcurrent protection for the RS-485 driver, a TBU fast current limiter is placed in each line.

The TBUs provide sub-microsec-ond protection by transitioning to a protected state with very high imped-

Industrial/automation

ance within 1 μs if the line current should exceed 100 mA. Finally, to protect the TBU devices from high-voltage tran-sients, a MOV-10D201K is placed on the line side of the node. These MOVs are designed to coordinate with the TBU device to provide extremely fast voltage protection. If sustained power cross events are anticipated, an additional fuse may be placed in each line to open in case of sustained MOV operation.

Jim Harrison

Fig. 3: Advanced design protects RS-485 ports.

Clare, an IXYS Company78 Cherry Hill DriveBeverly, MA 01915 978-524-6768

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In order for any electronic device to run efficiently, it’s important to make sure that they are prop-

erly shielded against harmful EMI/RFI interference. Many products to-day can be found with protection built right in.

Released late last year, the Neme-sis Series of miniature circular con-

nectors from ITT Industries (www.ittcannon.com) provides 360° EMI shielding. The 73.00 x 19.50-mm connectors are fully sealed to IP67/IP68 specifications and also feature

PRoducTRoundup

pogo pin/pad and breakaway tech-nologies, guaranteeing over 10,000 mating cycles.

Available with RoHS-compliant black zinc nickel or electroless nickel plating, the connectors suit a range of consumer, medical, and industrial handheld and mobile devices.

Premo (www.grupopremo.com) re-cently released its FEdc Series EMc filters, which reduce conducted emis-sions toward and EMI radiation from the solar panel in PV inverters. The filters offer ratings from 25 to 1,500 Adc; without terminals they offer up to 150 Adc, and with screw con-nections up to 1,500 Adc. M a x i m u m operational volt-age is 1,200 Vdc. The filters are also avail-able without capaci-tor to ground.

The RoHS-compliant filters meet EN60939 and uL1283 EMc require-ments and are also suited for dc ap-plications, such as fuel cells and batteries.

A recent addition to the datamate series from Harwin (www.harwin.com), the S-Tek hi-rel connectors have single-piece, machined-metal backshells that protect against EMI/RFI interference in I/o applications. The backshells are designed to attach to a wide variety of standard metallic braids and enable the shield braid to be connected through the backshell to the PcB ground plane. The S-Tek connectors are available in female cable-to-PcB-mount and female ca-ble-to-panel-mount configurations in sizes including 6, 10, 14, 20, and 26 positions.

Shielded enclosuresLast month, Verotec (www.verotec.us) unveiled its Veroshield 19-in. EMc-screened rack cases. The enclosures were designed so users could easily mount a wide range of electronic, electric, and electro-mechanical gear in an enclosure with good EMc per-formance (typical attenuation ex-ceeds 110 dB to 10 MHz.)

The company says the cases — which are available in three sizes: 1u x 10.4 in. deep and 2u and 3u x 14.4 in. deep — are particularly useful in larger 19-in. rack-mounted systems where only some elements require elevated levels of protection. The units are not only inexpensive— a 1u enclosure costs less than $99 in single quantities — but can also be used to provide screening for desk-top systems.

In March, Verotec introduced the diplomat family, a group of stylized enclosures that include EMc-capable units suitable for housing stand-alone systems, 19-in. caseframes for

ITT’s Nemesis Series miniature circular connectors

PREMO’s EMC filters for PV applications

Harwin’s Datamate S-Tek hi-rel connectors


Packaging & EMI/RFI shieldingsecure the lid to suit applications where interior access is required on a regular basis. Available with a natural or black epoxy powder coated finish, the units are supplied in two versions, standard and watertight, in sizes rang-ing from 2.36 x 2.17 x 1.02 in. to 10.83 x 6.89 x 2.46 in.

To learn more about the technical aspects of choosing shielding for en-

closures, see “Selecting EMP protec-tion for enclosures” by Praveen Po-thapragada, chief Engineer, Equipto Electronics (www2.electronicproducts.com/S-article-farc_equipto_apr2011-html.aspx). The article shows you how to calculate the correct level and ma-terials you need.

Christina D’Airo and Richard Comerford

direct mounting of boards and mod-ules, and as vertical tower units. Available off-the-shelf in 3, 4, 6, and 9u heights and depths of 12.7, 16.6, 20.6, and 24.5 in., they are intended for medical technology application, the research environment, and as housings for desktop instruments.

In February, optima EPS (www.optimaeps.com) began offering cabi-nets based on its M-series that are fully tested to MIL-STd-461d speci-fications for EMc. units in the series have a steel or aluminum frame, shielded door handles, wrap-foam gasketing around the door with con-ductive adhesives, EMI filters, cop-per gasket fingers, and steel-mesh gasket strips.

optima can also provide cre-ative EMc solu-tions for ad-vanced shielding requirements. For example, it can incorporate tin-plating or other conductive metal surfaces with su-perior electrical continuity properties to help reduce offending radiated emissions. The company can provide a minimum electric field attenuation of 60 dB from 100 kHz to 1 GHz, using cost-effective materials.

Early in the year, Hammond Man-ufacturing (www.hammondmfg.com) added nine sizes to its 1550 family of die-cast alu-minium enclo-sures. designed to provide robust mechanical pro-tection and good EMc attenuation, the enclosures use tapped holes and machine screws to

Verotec’s Diplomat enclosures

Optima EPS’s EMC-tested M-series enclosures

Hammond Manufacturing’s 1550 series die-cast aluminium enclosures

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Example Application

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ProductUPDATE

Dc/dc converters

2-, 3-W converters offer remote on/off controlthe tdr series of high-density dc/dc converters measure 0.74 x 0.50 x 0.35-in. and feature remote on/off capability. the converters consist of eight families offering a choice be-

Dc/dc converters suit railway appsthe ccr050 series dc/dc converter target railway applications and satisfy the majority of rolling-stock dc power applications with a single unit. the converters accept a very wide nominal input voltage range from 24 to 110 Vdc (16.8 to 137.5 Vdc full range) and provide up to 50 W output. the nominal output voltage is 24 Vdc with alternative output voltages available. Efficiency levels are >85% at 72-V input voltage.

the dc/dc converters comply with the EN50155 re-quirements for railway applications, including EN 50121-3-2, EN55011 and EN 61373. the converters feature re-verse input voltage protection, overvoltage protection,

1-W dc/dc converter features 89% efficiencythe AM1d-rZ series of 1-W dc/dc converters feature 80 models with efficiency rates as high as 89% and load reg-

ulation of 6%. the converters feature in-put voltages of 5, 12, 24, and 48 Vdc and single- and dual-output voltages of ±5, ±9, ±12, and ±15 Vdc with 1−s short-circuit protection.

Housed in a SIP7 package (19.50 x 6.00 x 9.50 mm), the dc/dc converters pro-

vide an operating temperature range from –40° to 85°c at full load without derating, they offer 1,000-Vdc I/o isola-tion or 3,000 Vdc with load regulation of 6% and 50 mVp-p ripple and noise. ($3.47 ea/1,000 — available now.)Aimtec, Montreal, Quebec, CanadaInformation 888-9AIMTEC (924-6832)www.aimtec.com

tween 2 or 3 W, have 2:1 input ranges from 4.5 to 9, 9 to 18, 18 to 36, 36 to 75 Vdc or 4:1 input ranges from 4.5 to 18, 9 to 36, or 18 to 75 Vdc.

the converters come in SMd or dIP packages, and fea-ture regulated single or dual outputs ranging from 5 to 15 Vdc; 1,500 Vdc isolation; and an operating temperature from –40° to 85°c. the devices have an efficiency from 80% to 84% typ and cuL60950-1 safety approvals. (From $16 ea/500 — available now.)PowerGate, Sunnyvale, CAInformation 866-588-1750 [email protected]


permanent short-circuit protection and inrush current limitation. operating temperature range is –40º to 70ºc without derating. they are available in open frame or housed in a metal enclosure. the open-frame version measures 105 x 100 x 35.5 mm. (contact company for price and availability.)Martek Power, Torrance, CAInformation 310-202-8820 [email protected]

DC/DC–AC/DCConverters– Rated up to 150 Watts– UL, cULRecognized, CEApproved– Isolations to 6kV for Medical Applications– ROHS Compliant– Short Lead Times– High MTBF Rates– Continuous Short Circuit Protected– Website with Product Locator

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Encapsulated converter suits extreme applicationsthe Pdc 765 series industrial dc/dc converter delivers up to 1-kW output power. It is encapsulated in a thermally conductive MIL-grade silicon rubber compound to en-sure resistance to high levels of shock, vibration and moisture. the converter is suitable for use in industrial, transportation, oil and gas, min-ing and other extreme environments. A railway version that complies with EN 50155 for electronic equipment used on railway rolling stock is also available.

the dc/dc converter delivers outputs of 12/83, 24/41, 48/21 or 110 Vdc/9 A, and accepts 48 Vdc (42 to 60-Vdc range) or 125 Vdc (90 to 145-Vdc range) sup-ply voltages. cooling is via base plate by conduction. the unit operates in a −40° to 60°c cold-plate temperature range at full specification. the converter measures 155 x 72 x 269 mm and weighs 4 kg. (contact [email protected] for pricing and availability.)Absopulse Electronics, Carp, Ontario, CanadaCarole Lombard 613-836-3511 [email protected]

ProductUPDATE

Dc/dc converters


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Don’t let a small budget chain you to low performance power supplies or tie you to vendors with lousy service. At MicroPower Direct we keep our costs down and pass the savings on to our customers. Get great customer service, fast on-time deliveries and ex-perienced technical help on well over 4,000 standard, high performance DC/DC converters, AC/DC switching power supplies, POL switching regula-tors and high brightness LED drivers. New products, like those at right, are being introduced regularly. And all are offered at very low cost.

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DIN converters offer 9.5 to 75-V inputsThe DPX series dc/dc converters mount onto DIN rails and are available with 2:1 and 4:1 input voltage ranges from 9.5 to 75 V, providing 40 to 60-W output. The con-verters suit industrial and commercial applications such as process control, factory automation, and test and mea-surement, as well as for alarm and security systems.

The dc/dc converters are available with single, dual, or triple outputs. The single-output models feature 5-, 12- or 15-V output, the dual-output versions have ±12- or ±15-V outputs, and the triple-output models provide a 5-V main with either ±12- or ±15-V outputs. The single-output models can be adjusted ±10% of its nominal output via a front-pan-el mounted potentiometer. Typical operating efficiencies are up to 86%. (From $121.50 ea/100 — available now.)TDK-Lambda Americas, San Diego, CAMel Berman 619-628-2859 [email protected]/lp

Nonisolated converters feature 120-A outputThe expansion of the VRPx series of single-inline-package PoL converters includes 30-, 90-, 100-, 110-, and 120-A

MFG. CO. INCMFG. CO. INC

800-542-3355www.calex.come-mail: sales @ calex.com

From FactoryStandards

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Innovative DC/DC Solutions from 1 to 400 Watts

Mini PoL regulators provide 1-A outputThe SRM7810 series of miniature PoL-switching regula-tors provides up to 1 A of output current. These convert-ers replace linear regulators for board level applications that require miniature size. Two standard models operate

modules. These nonisolated dc/dc converters deliver 3 to 120-A output current. Operating at efficiencies of up to 95% over an input range from 4.5 to 13.8 V, the open-frame series offer an output voltage trim range from 0.5 to 5.1 Vdc.

The fixed-frequency PoL converters feature an integrated heat sink and in-cludes output current monitoring and power state indicator pins for phase drop-ping and high efficiency during light-load states. The converters are compatible with Intel VRM11.1 requirements. They suit networking and tele-communications equipment, servers, workstations, com-puters, and peripherals. The device modules switch at 400 or 500 kHz. (Ea/prod qty: 30-A module, $9.35; 90-A, $17.20; 100/110/ 120 A, $18.35 — available now.)Bel Fuse, Jersey City, NJInformation 800-235-3873 [email protected]

PRODUCTUPDATE


Dual-input power module suits ATCA appsThe 2.3 x 1.45 x 0.58-in. IPM300 300-W dual-input power module for Ad-vancedTCA (ATCA) boards is a rugged

quarter-brick with dual-redundant, hot-swap –48-V inputs with EMI filtering. The module includes ORing, inrush control and protection, and power management functionality. When com-bined with a variety of dc/dc convert-ers, it provides a power solution for tele-com, server, and storage applications.

The power module features an in-

Wide-input-V PoL converters feature iLGA packageThe Okami series OKL-T/1-W12 PoL dc/dc converters suit embedded appli-cations. They are designed in an in-spectable land-grid-array (iLGA) pack-age that allows easy access for testing and inspection of the solder joints.

The PoL dc/dc converters provide maximum 1-A output current, a nominal 12-VIN input voltage, with a 2.9 to 14-Vdc input voltage range. They suit applications requiring an ultrawide input range and low output current including servers and wire-less equipment, LED signage, and power amplifiers. The 12.4 x 12.4 x 4.57-mm converters feature program-mable output voltage from 0.9 to 5.5 Vdc. They offer UVLO, output short-circuit protection, and overcurrent protections. They feature an 800-kHz switching frequency and can drive up to 200-µF ceramic capacitive loads. (Call 508-339-3000 or http://tinyurl.com/OKL-T-1-W12-price for price and availability.) Murata Power SolutionsMansfield, MAInformation [email protected]

over an input range of 4.75 to 20 Vdc, providing regulated outputs of 3.3 or 5 Vdc and 93% efficiency. All models feature protection for overload and overtemperature, and continuous short-circuit protection.

The PoL regulators are packaged in a miniature SIP case that measures 0.45 x 0.30 x 0.40 in. They feature an industry-standard pinout and meet UL 94V-O specifications. The regulators operate from –40° to 70°C with no de-rating or heat sinking required. Derat-ed operation to 85°C is specified. The MTBF for both models (per MIL HDBK 217F) is greater than 2.0 megahours. ($5.75 ea/100 — available now.) MicroPower DirectStoughton, MASteve Forrester 781-344-8226 [email protected]

Dc/dc converters


put voltage range of –36 to –75 Vdc, suitable for both –48- and –60-Vdc power distribution. It offers 3.3- and 5.0-Vdc isolated management power for housekeeping functions. The module provides power management features re-quired by PICMG 3.0 specifications, has an auxiliary boost supply for charging external holdup capacitors, and is programmable from 50 to 95 Vdc. A built-in I2C serial bus interface can be used for monitoring and reporting and features programmable alarm thresholds. It features an operating temperature range from –40° to 85°C. ($64.77 ea/prod qty — available now.) Emerson Network Power - Embedded PowerCarlsbad, CA Information 760-930-4600www.PowerConversion.com

1-40 Watt DC/DC

Converters

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10 Watt QMH Series • 1” x 1” package

• 4:1 Input • Remote On/Off

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20 Watt QMJ Series • 1” x 1” package • 4:1 Input • Remote On/Off • Trim

40 Watt TMH Series • 2” x 1” package • 2:1 Input • Remote On/Off • Trim

NewNew

New

Dc/dc converters feature DIP, SMT packagingThe RGW3 and RGUW3 series of 3-W dc/dc converters are available in both 0.74 x 0.50 x 0.33-in. DIP and SMT packages

and weigh 0.16 oz. The RGW3 series oper-ates over 2:1 input voltage ranges from 4.5 to 9, 9 to 18, 18 to 36, or 36 to 75 Vdc. The RGUW3 operates over 4:1 input volt-age ranges from 4.5 to 18, 9 to 36, or 18 to

75 Vdc. These two series have 3.3-, 5-, 9-, 12- , and 15-Vdc single-output models and ±5-,

±12-, and ±15-Vdc dual-output models.Standard features for both dc/dc converter series in-

clude efficiency up to 83%, 1,600-Vdc I/O isolation (3,000 Vdc is optional), remote on/off, 100-kHz switching fre-quency, and continuous short circuit protection. They operate over an ambient temperature range of -40°C to +85°C without derating. (Ea/large qty: RGW3 single out-put, $12.50 ea; RGW3 dual output, $12.95; RGUW3 single output, $13.50; RGUW3, $14.20 — available now.)Wall Industries, Exeter, NHRuss Berube 603-778-2300 [email protected]

20-W dc/dc converter has 4:1 input rangeThe TEN 20WIR series are 20-W dc/dc converter modules featuring 4:1 input voltage ranges in a 2 x 1-in. package. The input voltage ranges are 9 to 16, 18 to 75, and 43 to 160 Vdc.

The dc/dc converters meet EN 50155 requirements and target railroad and transportation systems applica-tions. Standard features include remote on/off, over-voltage protection, undervoltage lockout, and short-cir-cuit protection. Typical applications are in wireless networks, telecom/datacom, industry control systems, and measurement equipment. The operating tempera-ture range is –40° to 85°C. (From mid $30 ea/large qty

PRODUCTUPDATE


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High-rel dc/dc converters offer 300 Wthe high-reliability high-density Mi-croVerter uV-164 series dc/dc con-verters feature a 200 to 300-W out-put available in 3/4-brick for-mat. the con-verters feature –40° to 100°c operation (–55°c optional), with cur-rent sharing, remote sense, switching frequency synch option, and trimmable output for rugged and extreme applications.

the uV-164 converters are avail-able with higher power and efficien-cy, the same pinout, and the identical trim function as the previous Micro-Verter converters. they are available with SnPb, SnPb solder, or lead-free roHS options. the series includes au-tomated assembly, employs low-ca-pacitance insulated metal substrate technology, and uses the company’s fourth-generation planar transformer technology. (contact [email protected] for pricing and availability.)Astrodyne, Mansfield, MAInformation [email protected]

Converters offer 10-kV isolation barrierthe rEc 3.5 and rEc 6 families of dc/dc converters are available in a dIP24 case that offers a patent-pend-ing technology that helps break the 10-kV isolation barrier. the devices feature triple-isolated transformer windings that have a smaller size than typical converters and have a winding capacity that has been re-duced by a factor 3 down to 20 pF.

these new converter families

have power ratings of 3.5 and 6 W and provide a 20% higher power rating compared to their predeces-sors and offer 86% efficiency. the maximum ambient operating tem-perature without derating and with convection cooling is 85°c for the rEc 3.5, and 75°c for the rEc 6. they also feature short-circuit and

overload protection and conform to EN, cSA, and cB specifications. (contact Jordi torrebadell at [email protected] for price and availability.)Recom Power, Brooklyn, NYJordi Torrebadell [email protected]

— available now.)Power Sources UnlimitedWrentham, MASales [email protected]

Dc/dc converters



NEWPRODUCTS

GlobTek’s ex-panded power linenow includes mul-tiple families ofWall Plug-in &Desktop Level VPower Supplies.Designs have reg-ulated outputsvoltage from: 3.3-48 Vdc in 0.1V increments, up to 90W. Features:O.C., S.C., O.V., Thermal Protection; meets mul-tiple International Safety Agency for ITE &Medical applications. All Models carry agencies’logos and CE-Mark. GlobTek offers a 5-yearwarranty.GlobTek, Inc., N.J. Sales [email protected]://www.globtek.com

GlobTek’s series of “Smart” Li-On chargers offers a compact &cost effective, solution forcharging GlobTek* Lithium-Ion and Lithium

Polymer batterypacks. Features:single or multiplebay cradle, customcharging schemes,battery conditionbefore bulk charg-ing, programmablecharge timer back-up, charge status

LEDs. Multiple bay chargers have the option ofan MCU incorporated for battery identification,status & temperature using HDQ fromBQ27000. *or equalGlobTek, Inc., N.J. Sales [email protected]://www.globtek.com

GlobTek’s Li-On Battery Packs are comprisedof single or multiple cells rated 3.7V up to5200 mAh each. Cells can be packaged withSeiko S-8232AKFT-T2 control chip protec-tion & TIBQ27000 basedfuel gauge circuitryincluded. Addi-tional features:protection fromShort Circuit, Overvoltage, Over cur-rent, Under Voltage, Overcharge, Over dis-charge, Over Temperature. The packs are aPolycarbonate/ABS mixture frame or case,contacts made of nickel & frames designs aresealed in an ET label material. Modified andCustom Designs are also available on all ofthe above. GlobTek, Inc., N.J. Sales [email protected]://www.globtek.com

Level V Ad_Layout 1 10/29/2010 7:47 AM Page 1

1-W dc/dc converters offer four outputsThe LCP100E series miniature 1-W dc/dc converters are drop in upgrades

for DCP01-type c o n v e r t e r s . Eight standard models operate from 5- or 12-Vdc inputs, providing regu-lated single

outputs of 5, 9, 12, or 15 Vdc. Stan-dard features include short-circuit protection, 1,500-Vdc input/output isolation.

The dc/dc converters are packaged in 0.77 x 0.42 x 0.18-in. cases. The SMT-mountable package is compati-ble with most automated manufac-turing equipment. Each model is specified for operation over the in-dustrial operating temperature range of –40° to 85°C (ambient). The con-verters target industrial process sys-tems, test equipment and instrumen-tation, data processing equipment, robotic systems, and board-level power distribution subsystems. ($5.05 ea/100 — available now.)MicroPower Direct, Stoughton, MASales 781 [email protected]

Compact supplies feature 40-A, 24-V outputThe SDN-C DIN-rail power supplies, available in 20 and 40 A, 24-V out-put, are approximately 50% smaller than its power supply of the previous generation, and feature three-phase 380 to 480-V in-puts, along with vi-sual diagnostic LEDs to indicate I/O status. Applica-tions include in-dustrial machine control, DeviceNet, process control, conveying equipment, material han-dling, vending machines, amuse-ment park equipment, and semicon-ductor fabrication equipment.

The DIN-rail supplies provide stan-dard screw terminal connections, have a metal outer case, and deliver

full power from −25° to 60°C. They have a five-year limited warranty. (From $502.64 each for 20-A three-phase supply — available now.)SolaHD, Rosemont, ILInformation 877-999-7652www.solahd.com

Open-frame supplies suit LED signage appsThe 100-W ZPSA series of compact open-frame ac/dc power supplies have a 1.3-in. profile and an indus-try standard 3 x 5-in. footprint. The supplies suit LED signage and light-ing applications, point-of-sale equip-ment, datacom, video/audio routers and test & measurement equipment.

These 100-W supplies provide s i n g l e - o ut p ut voltages from 5 to 48 Vdc and of-fer up to 90% typical efficien-cy, and accept a wide input voltage range of 90 to 264 Vac at 47 to 440 Hz or from 120 to 370 Vdc. They are suited to convec-tion or air-cooled environments from 0° up to 70°C, with derating. They feature overvoltage and short-circuit protection, and are offered in an open-board configuration with Molex input/output connectors. (From $40 ea/250 — available now.)TDK-Lambda AmericasSan Diego, CASales 619-575-4400FAX 619-429-1011www.us.tdk-lambda.com

LED drivers suit harsh environmentsThe BPWXL series of 4-, 6-, and 10-W constant current LED drivers offer 350-mA constant current operation with 1% regulation over the entire input voltage range from 100 to 308 Vac at 50/60 Hz. The drivers have cold-starting circuitry tested to −55°C. The LED drivers are based on a patented circuit designs incorpo-rating a custom ASIC controller.

The ruggedized LED driver mod-ules meet NEMA 6P / IP67 moisture and submersion and satisfy the re-quirements for outdoor architectur-

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Power Sources

edited by paulo’sheaSee more online at electronicproducts.com/ps

al, building and low-bay garage LED lighting. The LED drivers are rated for 3,000-Vac isolation and feature inherent overcurrent, short-circuit (shorted-string), overload, and open-circuit (string-break) protection. All modules are specified for full-rated pow-er over the −40° to 85°C temperat ure range. The nominal efficiency is 80%. (From $15 ea/large qty – avail-able now.)Bias Power, Buffalo Grove, ILInformation [email protected]

UPS suits mission-critical appsThe Model ES UPS features condi-tioned, continuous backup power and suits mission-critical applica-tions. It is available in 4,500 to 15,500-VA single-phase sizes. The unit is a double-conversion UPS that provides extended battery backup without the need for additional en-closures, and is available with an in-ternal computer-grade isolation transformer.

The UPS features a color, high-res-olution LCD touchscreen monitor that provides quick access to the elec-trical parameters, system status, diag-nostics, and event logs. It also offers input and output voltage configura-tions, a secure maintenance bypass system, full network communications capabilities, user-specified output dis-tribution receptacles and/or breakers, and an intelligent battery manage-ment system. (Contact 248-528-3700 for price and availability.)Controlled Power, Troy, MISuzanne Hooley [email protected]

Industrial, medical supplies offer 600-W peakThe FCM400 series of single-output 400-W ac/dc power supplies provide 600-W peak for 0.5 s and suit industrial

and medical ap-plications. They have an enclosed fan, measure 6 x 4 x 1.93 in., and have a power den-sity of 13.9 W/in.3

and a typical efficiency of 85%.The 400-W power supplies feature

an input range from 80 to 275 Vac, and have six models with nominal outputs of 12, 15, 24, 28, 36, or 48 Vdc. An output trim allows an ad-justment of ±10%. The series meets the electrical safety standards of both IEC 60601-1 / UL 60601-1 for medical equipment and IEC 60950-1 / UL 60950-1 for industrial and IT equipment. ($0.50/W in large qty — available now.)XP Power, Sunnyvale, CADuane Darrow [email protected]

Converters suit telecom infrastructureThe 1/8th-brick SQL48T20033 and the 1/16th-brick SSQL48T20033 dc/dc converters are rated at 20 A, pro-vide an adjustable 3.3-V isolated out-put and operate over the full 36- to 75-V telecom input voltage range. They suit telecom and datacom sys-tems targeting access, backbone, net-working equipment and cellular in-frastructure. The converters are

DOSA compliant, with outstanding thermal performance for use at ele-vated temperatures or in applications with reduced airflow.

The converters withstand a 100-V input transient for 100 ms, meet EN 60950 basic insulation requirements, are UL94 V-0 flammability rated, op-erate down to no load conditions and will start up into pre-biased loads. They are fully protected including hiccup-mode overcurrent, output overvoltage, input undervoltage lock-out and overtemperature shutdown. The dc/dc converters optional base-plate feature is ideal for extreme envi-ronmental applications found in 3G and 4G/LTE wireless communication deployments. Evaluation models are available now. (Call 978-728-5974 for price and availability.)Power-One, Camarillo, CASteve [email protected]

ErP Level V wall-mount supplies suit EUThe EPSA series low-power wall-mount external power supplies target the Eu-ropean market. These fixed-blade so-lutions come with either European or United Kingdom blades and meet the


NEWPRODUCTS

PCB mounting (PMAS) or chassis mounting (PCMAS). The PMAS di-mensions are 50.8 x 50.8 x 20.0 mm, and the PCMAS measurements are 84.0 x 51.0 x 22.0 mm. The modules are vacuum encapsulated, prepared for applications in Class 1 and/or 2 environments, and com-ply with the Low Voltage Directives as well as the EN standards for CE conformity. They are approved to EN 60601-1 and can be used for medical applications. (Contact Sales for price and availability.) MTM Power , Canton , MA Sales 774-565-3800 [email protected] www.mtm-power.com

Programmable 1,200-W supply suits telecom apps The DS1200DC-3 is a dc-input 1200-W bulk front-end power supply for systems that use distributed power ar-chitectures. It suits systems that are co-located with telecom and central office applications operating from 48-V battery plants and has a –40 to –72-Vdc input voltage range. The sup-

Encapsulated power modules offer 15-W output The PMAS/PCMAS15 series primary switched ac/dc power modules offer 15-W constant-output wattage, are short-circuit protected, need no ground load and have a stand-by power. The encapsulated power sup-plies feature ac/dc input ranges from 90 to 264 Vac and 100 to 353 Vdc. They are available with the single output voltages of 5, 12, 15, 24, and 48 Vdc.

The ac/dc power modules suit

energy related products (ErP) Europe-an energy efficiency regulations for external power supplies.

The wall-mount supplies are sin-gle-output devices offered in 6-, 12-, and 18-W configurations and support 5- and 12-V output voltages. They fea-ture overvoltage, overcurrent, and short-circuit protection. (From $7.97 ea/100 — available now.) CUI , Tualatin , OR Sales 800-275-4899 [email protected] www.cui.com/

Open-frame converters target railway The Powertron JL series open-frame dc/dc converters are conduction-cooled units that are rated up to 50 W and offer full EN50155 compli-ance. They accept typical railway in-put voltages and provide outputs be-tween 5 and 110 Vdc.

The dc/dc converters and the mounting plate have a footprint of 135 x 85 mm. They feature efficien-cies approaching 90%. The conduc-tion cooled versions help minimize

temperature rise within the host equipment. They are designed for

continuous op-eration at am-bient tempera-tures of up to 75°C without derating. (Con-tact 310-202-

8820 for price and availability.) Martek Power , Torrance , CA Information 310-202-8820 [email protected] www.martekpowerabbott.com

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Power converters suit 3G and 4G/LTE stationsThe Orca JRCW450 family of isolated dc/dc fully regulated board-mounted power amplifier modules target cel-lular base stations, remote radio

ply has a main 12-Vdc output that can deliver up to 100 A continuously, and has an auxiliary always-on out-put for powering standby circuitry. It is digitally programmable via an I2C interface and is PMBus compliant.

The bulk front-end power supply is housed in a 1U x 2U plug-in rack-mounting module and features 85% efficiency at half load, and a power density of 21.7 W/in.3. It has an oper-ating temperature range from −10° to 55°C and has a built-in cooling fan with automatic speed control. The supply offers 3.3- or 5-Vdc auxil-iary outputs that are rated at 6 and 4 A, respectively. (Contact company for price and availability.)Emerson Network Power - Embedded Power, Carlsbad, CAInformation 760-930-4600www.PowerConversion.com

heads, distributed antenna systems, and WiMAX controllers. The stan-

dards-based DOSA half-brick converter modules provide 450-W output pow-

er, with 36 to 75 VIN and 32 or 48 VOUT.

The converter achieves >94% ef-ficiency and features the proprietary Tunable Loop technology that al-lows users to optimize dynamic re-sponse and reduce the quantity, type, and size of the capacitors in circuit board applications. The pow-er amplifiers suit harsh environ-mental conditions, with operation up to 100°C in sealed environmen-tal conditions. (From $39 ea/large qty — available now.)Lineage Power, Dallas, TXInformation 888-546-3243www.ge.com/lineagepower

Power supplies offer 4 to 15-kW outputThe Sorensen SG Series of program-mable high-power dc power sup-plies offer four new output voltage

offerings of 10, 15, 20, and 30 Vdc. These units have output power specifications ranging from 4 to 15 kW. The 20-Vdc model supplies up to 750 A in a standard 3U package, while the 10-Vdc 12-kW unit can deliver up to 1,200 A in a 3U form factor.

The dc power supplies feature voltage and current slew rates, and up and down programming. They have power factor correction with three-phase 208-, 400-, and 440/480-Vac input with the stan-dard unit supporting both 50/60-Hz and 400-Hz ac-input frequency. All of the models in the SG Series are available with either Sorensen Gen-eral-purpose Intelligent (SGI) con-trol or Sorensen General-purpose Analog (SGA) control. SGI controls enable sequencing, constant power mode, and save/recall of common setups. Units with SGA control have simple front panel analog controls or remote analog control and fea-tures 10-turn potentiometers for setting voltage and current, as well as front-panel OVP preview/adjust-ment and reset. (Contact company


NEWPRODUCTS

250-W supplies feature medical approvalsThe PPWAMD250 series medical desktop power supplies provide 250 W in a 7.42 x 4.1 x 2.36-in. package. They are approved to UL60601-1, CSA22.2 No. 601.1, and EN60601-1 medical standards and comply with

E N 5 5 011 / F C C Class B radiated and conducted EMI standards.

The desktop power supplies

feature no-load standby power of ≤0.5 W, have an average efficiency of ≥87%, and comply with Efficiency Level V requirements. They operate from 90 to 264-Vac input and offer seven single-output models ranging from 12 to 48 Vdc. They offer a with-stand voltage from input to output of

Power supply suits mil, aero, automotive appsTargeting military, aerospace, and automotive applications, the PS9501Powerficient 95 is a rugged power supply that delivers 2.5-kW output with efficiency >95%. The supply features voltage-boosting ca-pabilities that deliver 270-Vdc output from 28-Vdc inp ut. The product is available off-the-shelf or can be cus-tomized.

The power supply has an input voltage range from 22 to 32 Vdc and an operating temperature range from −40° to 70°C. It has an overload ca-pability of 2.75 kW at 25°C for 1 h. Regulation is ±5% worst case of line, load, and operating temperature. The 28-lb supply measures 278 x 196 x 256 mm. (Contact 804-467-9060

for price and availability.)API Technologies, Windber, PAInformation [email protected]

4,000 Vac and leakage current of 228 mA max at 264-V input. (From $100 ea/large qty — available now.)Power Partners, Hudson, MAPower Partners [email protected] 1-kW dc/dc supply suits

harsh appsThe TVS1001 ruggedized 1,000-W dc/dc power supply features two patent-ed F501 dc/dc converters that perform under the harsh conditions in mili-tary applications. It offers step-up or step-down conversion. The electronic circuits are sealed and withstand ex-posure to harsh dust environments and are cooled with a mechanically isolated field replaceable fan unit.

The converter features a 11 to 36-V input range to suit vehicle-mounted military and nontactical, fixed, and mobile communications and security systems. The unit can be configured over a range of standard or custom-ized output voltages. (Contact com-pany for price and availability.)Powerstax, Hampshire, U.K.Information 0-11-44-1252-407800www.powerstaxplc.com

for price and availability.)Ametek Programmable Power San Diego, CACraig [email protected]


Power Sources

HIGHLIGHTS

Said to be the industry’s fastest logic analyzer, the U4154A AXIe-based logic analyzer module combines state capture speeds of 4 Gbits/s on 68 channels and 2.5 Gbits/s on 136 channels with the ability to reliably capture and display data on the industry’s smallest eye openings — as small as 100 ps by 100 mV. The instrument and its accurate probes and analysis software let engineers working with high-speed ASICs, ADCs, FPGAs, and DDR memory systems make essential measurements.

The instrument’s timing zoom capability permits si-multaneous state and timing measurements with 80-ps resolution and 256-ksample memory depth over a 20-µs time span. The trigger sequencer’s 2.5-Gbit/s speed al-lows reliable, flexible triggering.

The logic analyzer’s exclusive eye-scan capability gives a quick overview of signal integrity on all signals of a DDR system without an oscilloscope, in a fraction of the time it takes using alternative methods. Also, the in-strument runs the B4622A DDR2/3 protocol-compliance

and analysis tool to auto-mate measurements on deep DDR bus traces and provide an overview of system performance.

A broad range of com-patible probing solutions, including DDR BGA probes and interposers as well as soft-touch probes for midbus probing, are available. The logic analyzer module is compatible with the M9502A two-slot AXIe chassis, and multiple modules can be combined on a single time base and trigger sequencer. Further, multiple modular systems can be combined for time-correlated measurements on multiple buses in a system. (From $115,500 for 136 channels, with chassis and probe cables; probes are priced separately — avail-able now.) Agilent Technologies , Santa Clara , CA Sales 800-829-4444 www.agilent.com

AXIe logic analyzer sets new speed record

CompleteTest Benchfor AC, DC & RF testing

This complete lab package includes instruments from DC to RF for everything you need to getstarted. The triple output power supply and the 5 ½ digit DMM offer LXI (Ethernet) and USB communication and are perfect fits for a modern lab. The arbitrary waveform generator and scope enable you to work with and emulate a variety of signals, components, and systems. With the spectrum analyzer you can inspect signals in the frequency domain to test transmitted signals, bandwidth, and spurious emissions.

To set up your bench, call 877-4-RIGOL-1 or visit RIGOLNA.com/Test

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RIGOL_TestBenchAd_EP3_11_Layout 1 2/11/11 11:26 AM Page 1

NEWPRODUCTS edited by richardcomerford

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High-power SMU simplifies LED, alternative-energy testing Specifically designed for characterizing high-power electronics, the Model 2651A SourceMeter source-measure unit (SMU) provides source and mea-surement current ranges from 100 nA to 50 A — the widest current range available in such instruments — pulsed power of 2,000 Wdc (±40 V, ±50 A), and continuous power of 200 Wdc (±10 V@±20 A, ±20 V@±10 A, ±40 V@±5 A. Having this measurement ca-pability is critical to designers for ap-plications such as testing high-b r i g h t n e s s LEDs, power semiconductors, dc/dc converters, electric vehicle batteries, alterna-tive-energy generators, and other high-power materials, components, mod-ules, and subassemblies.

In a single full-rack enclosure, this latest instrument in the 2600A series provides flexible four-quadrant voltage and current source/load capability, coupled with precision voltage and current meters. A choice of digitizing or integrating measurement modes permits precise characterization of both tran-sient and steady-state behavior. Independent A/D converters — one for current and the other for voltage — define each mode and run simultaneously.

The digitizing measurement mode’s two 18-bit A/D converters can cap-ture up to 10 6 readings/s for waveform capture and measuring transient characteristics with high precision. Like previous 2600-series meters, the SMU offers an integrating measurement mode, using two separate 22-bit A/D converters for precise measurement of the very low currents and volt-ages common in next-generation devices. It can make precise measurements of signals as low as 1 pA and 100 μV at speeds up to 1 μs/reading.

The instruments are also designed so two units can be tightly connected using the TSP-Link system, Connected in parallel, they provide a continu-ous combined current range to 100 A — two-and-one-half to five times greater than the nearest competing solution. In series, voltage ranges are similarly expanded, to 80 V. Embedded Test Script Processor (TSP) software lets users address multiple units so that they act as a single instrument, and the built-in trigger controller can synchronize all linked channels to within 500 ns. The embedded Test Script Builder application supports creation, editing/debugging, running, and managing TSP scripts.

TSP Express, an LXI-based I-V test software utility that is also embedded in the instrument, delivers basic to advanced tests in three simple steps: connect, configure, and collect. A LabVIEW driver is included too, and test results can be viewed on a connected computer in either graphical or tabu-lar format, and exported to a .csv file. ($13,700 — available this month.) Keithley Instruments , Cleveland , OH Information 800-688-9951 [email protected] www.keithley.acrobat.com/p50501284/

24-bit DAQ is a USB plug-n-play board or box A USB plug-and-play device, the DT9826 multifunction data acquisi-tion module combines 16 simultane-ous 24-bit analog measurement chan-nels — each with its own 24-bit Sigma-Delta ADC — with 16 digital I/O lines, two 32-bit counter/timer

channels, and one 32-bit tachometer input channel. It is available as a board for OEM embedded test appli-cations or in a metal BNC-connection

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box for easy sensor connections. The DAQ supports throughput

rates to 41.6 ksamples/s per channel and total throughput rates (simulta-neous analog input, digital I/O, counter/timer, and tachometer) over 830 ksamples/s. Digital inputs, coun-ter timers, and the tachometer can be synced with the analog measure-ments. A ±500-V galvanic isolation barrier prevents ground loops, and drivers and software compatible with Windows XP/Vista/7 are included. (From $1,295 ea / OEM qty — avail-able now.) Data Translation , Marlboro , MA Information 800-525-8528 [email protected] www.datatranslation.com

Test & Measurement

Software supports LTE TDDTo support the time-division-duplex (TDD) mode of 3GPP Long Term Evolution (LTE), the LTE TDD Mea-surement Suite (3030 option 108) for PXI 3000 Series modular instru-ments provides device manufactur-

Net analyzer software eases measurement of satellite-link group delay, phase linearitySolving a difficult, persistent prob-lem in satellite system test, the ZVA-K10 software option for ZVA and ZVT high-end network analyzers ac-curately measures group delay and phase linearity on satellite links us-ing two network analyzers located at separate sites. Unlike all other com-mercial test methods, the network analyzers do not need to access the local oscillator when measuring fre-quency-converting devices.

With increasing transmission rates placing more stringent de-mands on transmission quality, pre-cise measurement of group delay and phase linearity is vital. Users can perform accurate measurements on up- and down-converters, as well as on complete transmission systems or individual components such as transmitters, receivers or mixers.

Rather than rely on long, lossy, motion-sensitive RF cables to con-nect widely separated input and out-put to an analyzer, the new test method lets users connect one net-work analyzer to the transmit port and one to the receive port. The two network analyzers communicate and synchronize the test sequence via a LAN connection. The ZVA stimulates the DUT with a two-tone signal and

ers with advanced test capability to rapidly characterize the performance

of LTE TDD chip-sets, hand-sets, and te r m i na l d e v i c e s .

The combination of the new soft-

ware and the LTE frequency-divi-sion-duplex (FDD) measurement suite permits comprehensive RF parametric testing.

The LTE TDD software supports all uplink and downlink configura-tions including the special subframe configuration of 3GPP 36.211 sec-tion 4.2. LTE analysis is supported for uplink (SC-FDMA) transmissions for all 1.4 to 20-MHz bandwidths and modulation types QPSK, QAM16 and QAM64. In addition to numeri-cal measurement results, the suite provides trace displays for spectrum emission mask, CCDF, constellation plots, EVM vs. carrier, and EVM vs. symbol. EVM analysis for uplink sig-nals is supported for PUSCH, SRS, and PUCCH. (Contact sales for pric-ing and availability.)Aeroflex, Plainview, NYSales [email protected]

15 Jonathan Drive, Unit 4, Brockton, MA 02301-5566Tel: (508) 580-1660; Fax: (508) 583-8989

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“Quality” inTest and Measurement

Since 1949

Features Front Panel Channel Control

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• •

•

• •

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• •

Independent Filter Channels

One Band-Pass/Band-Reject Channel

• • BNC Input and Output Connectors AC/DC Coupling

Tunable Filter DeliversPerformance Needed For

Anti-Aliasing Requirements

Engineered and Manufactured in U.S.A.

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The Krohn-Hite Model 3382 Filter provides the performance andflexibility needed for today's complex anti-aliasing applications.Tunable from 0.1Hz to 200kHz, each channel provides independentcontrol of cutoff frequency, filter response, low-pass and high-passfunctions, differential and single-ended input configuration, pre andpost filter gain, and ac/dc coupling. One and four channel models arealso available.


NEWPRODUCTS

900-, 960-W supplies are priced economically Five switch mode dc power supplies — models 1900, 1901, and 1902, and models 1693 and 1694, — are all un-der-$600 models whose features suit them for R&D, production, service, and education. The 960-W 1900, 1901, and 1902 models offer con-

Temp/RH meter works with wireless probe The RH511 series handheld tempera-ture / relative humidity meter is avail-able with an optional wireless temper-ature/humidity sensor probe. Able to measure temperature from −100°C to 1,000°C and RH from 2% to 98%, the rugged meter can also accept two K-type thermo-couple inputs and has a triple LCD display of humidity/ ambient, infrared, or thermo-couple temperatures.

Built-in laser sighting (dot/circle switchable) helps aim the product correctly for IR temperature measure-ments. Other capabilities include min/max/hold functions, data log-ging of up to 40,000 data points, and dew-point, wet-bulb, and moisture-content measurements. A USB inter-face and Windows-based software al-low connection to a PC for reporting and analysis. (From $355; $399 with wireless probe — available now.) Omega Engineering Stamford , CT Information 203-359-1660 [email protected] www.omega.com/pptst/RH511.html

stant current mode auxiliary output, rotary encoder knobs for precise lev-el setting, and user-d e f i n e d presets for quick re-call of common test parameters. They also have remote sensing to compensate for voltage drops due to load lead resistances.

The lightweight, compact 900-W 1693 and 1694 models provide volt-age output from 1 to 15 V at 60 A and 1 to 30 V at 30 A, respectively, re-mote sensing terminals, and an aux-iliary output. All models have an analog remote control terminal for external adjustment of output volt-age or current and three-digit LED displays for both voltage and cur-rent. The instruments also have over-temperature and over-voltage protec-tion, and current foldback circuitry to prevent overloading. (1693 or 1694, $479; 1900, 1901, or 1902, $599 — available now.) B&K Precision , Yorba Linda , CA James Schada 714-921-9095 [email protected] www.bkprecison.com

measures the phase difference be-tween the two carriers at the input and the output. From the phase dif-ference, it calculates the group delay and the relative phase of the DUT’s transfer function. Any changes in the local oscillator’s frequency and phase have an identical effect on both carriers and are eliminated by the difference measurement; they do not, therefore, affect measurement accuracy. ($7,745 — available now.) Rohde & Schwarz , Columbia , MD Customer Support North America 888-837-8772 [email protected] www.rsa.rohde-schwarz.com

©2011 Measurement Computing Corporation 10 Commerce Way, Norton, MA 02766

[email protected]

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2,3-GHz spec analyzers start under $3,000 For benchtop or field use, DSA1000 and 1000A series 2- and 3-GHz spec-trum analyzers start at $2,999, weigh less than 15 lbs, and are available with optional 3-hr battery packs. The analyzers’ simplify their use with an 8.5-in.-screen, auto-functions, and the ability to save and recall setups, traces, and test states. DSA1000A units are aimed at high-end measure-ment, DSA1000 at basic test.

Minimum resolution bandwidth is 10 Hz, phase noise is −88 dBc/Hz at 10 kHz, DANL is −148 dBm, and overall uncer-

tainty is less than 1 dB. Units are available with 1-Gbyte internal mea-surement storage, and interfaces sup-ported include USB, VGA, and LXI-C. An optional USB-GPIB adapter is also available. (From $2,999 — avail-able now.) RIGOL Technologies Oakwood Village , OH Information 440-232-4488 [email protected] www.rigolna.com


Test & Measurement


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A Positive Pathway One of the greatest challenges that

medical and healthcare device manu-facturers face when developing new products is obtaining FDA approval. Not only must they adhere to their strict regulations while designing, but they must also wait several months, some-times years, for 510(k) approval in the United States – which basically means that today's patients will not benefit from today's cutting-edge technology.

But that may change in the near future.

Earlier this year, the U.S. FDA's Cen-ter for Devices and Radiological Health (CDRH) proposed the "Innovation Pathway," a review program created to help bring breakthrough medical de-vices to the market faster. The program is just one part of the CDRH's "Medical Device Innovation Initiative," a broader effort that seeks to encourage the devel-opment of cutting-edge technologies among medical device manufacturers and strengthen the nation's research infrastructure for developing break-through technologies and advancing quality regulatory science.

To date, the FDA has already accept-ed a submission from the Defense Ad-vanced Research Projects Agency (DAR-PA) to review a brain-controlled, upper-extremity prosthesis designed to restore near-natural arm, hand, and finger function to patients suffering from spinal cord injury, stroke or am-putation.

While the new Initiative sounds promising there are questions abound. Will this new program bring products to market faster? Or will it bring new bu-reaucratic hurdles? The FDA says that it could conduct premarket reviews of products in the Innovation Pathway within 150 days, nearly half the time it currently takes. Is this a realistic, suffi-cient amount of time? At this point in time, the FDA has yet to hear public feedback. Personally, I am curious to hear how this Pathway pans out over the next year or so. What do you think?

Christina D’Airo

Beamforming in medical ultrasound BY DANIEL KREINDLER, Samplify Systems,Santa Clara, CA www.samplify.com

Beamforming is a comon signal processing tech-nique used to create directional or spatial selectivity of signals sent to or received from an array of sensors or antennae. These arrays can be found in many different devices that transmit and receive either electromag-netic or acoustic waves. Thus, beamforming is em-ployed in such varied applications as radio-astronomy, radar, wireless communications, sonar, seismography, and medical and industrial ultrasound. Ultrasound beamforming is unique among these various applica-

tions. In order to achieve high-quality ultrasonic images, received beams must be focused dynamically, and the aperture of the array must be amplitude-weight-ed (apodized) dynamically as well.

Wireless communication challenges in healthcare BY ANNE HUANG and LEO ESTEVEZ, Texas Instruments, Dallas, TX www.ti.com

Wireless connectivity is increasingly pervasive in many new markets as mo-bile phones, consumer elec-tronics, and portable devic-es converge. Although Wi-Fi, ZigBee, ANT and Bluetooth wireless technol-ogies are poised to spur new consumer healthcare markets, there are some wireless challenges designers should consider as various wireless technologies are introduced into the home.

Connected personal health with the increasing incidence of chronic diseases, healthcare providers and employers are exploring new ways to motivate con-sumers to conveniently manage their conditions. With increasing consumer awareness of increasing financial responsibility for personal health, more and more consumers are investing in wireless health and fitness technologies for themselves and “aging independently” technologies for their parents.

Choosing optical coatings for medical displays BY JEFF BLAKE and RICHARD PAYNTONDontech, Doylestown, PA www.dontech.com

Electronic displays are widely used in the health-care industry for diverse applications such as pa-tient monitoring, medical imaging diagnostics, ar-chiving medical records, and EMT response. Because display image quality and reliability are critical to both the clinical and diagnostic integrity of patient care, design engineers are challenged to meet a wide range of optical, electrical and me-chanical performance standards.

The SMK9130 development kit allows designers to evaluate and use Samplify’s AutoFocus beamformer.

For more on Project Medical, visit www.electronicproducts.com/

projectmedical

ANT is designed to allow coexistence in the time domain between multiple independent channels.

Graphical representation of how a simple, single-layer AR coating ( /4 optical thickness) with low, 1.38 refractive index creates destructive interference.

HIGHLIGHTS

USB 3.0 controllers bridge to PCI Express The USB3380 and USB3382 SuperSpeed USB 3.0 peripheral controllers bridge to PCI Express 2.0, matching the high-per-formance 5-Gbit/s bus speeds. The USB3382 features two PCIe Gen2 x1 ports while the USB3380 has one port.

The devices come with USB Duet tech-nology providing fast PC to PC intercon-nect for the tablet and mobile PC data synchronization and sharing and use a 10 x 10-mm QFN package with 88 or 136 pins. The 3382’s root complex and switch provides configurations for x1 or x2 upstream or downstream ports. ($7 to $8 ea/volume qty — samples available 2nd qtr.) PLX Technology , Sunnyvale , CA Information 408-774-9060 www.plxtech.com

Low-power 16-bit MCUs have 24-bit A/Ds Targeting utility metering applications, the MSP430AFE2xx series (MSP430AFE221 to MSP430AFE253) low-power 16-bit MCUs have a single-phase metrology analog front end (AFE) that supports 0.1% accuracy over a wide 2,400:1 dynamic range. The devices have up to three 24-bit sigma-delta A/D converters along with up to 16 Kbytes of flash and 512 bytes of RAM.

The nine versions of the device have SPI and UART interfaces, a 16-bit timers/PWMs, a watchdog, and a hardware multiplier. They operate at 1.8 to 3.6 V at up to 12 MHz and take only 220 μA at 1 MHz, 2.2 V. Standby mode takes just 0.5 μA. (From $0.80 ea/1,000 — available now.) Texas Instruments , Dallas , TX Information 800-477-8924 www.ti.com

Low-power 16-bit MCUs have 24-bit A/Ds


NEWPRODUCTS

Short-range modules measure less than a dime Smaller than a dime, the WLS-series modules — consisting of the WLS1270, WLS1271, and the WLS1273 — include W-Fi and Blue-

tooth technology in a single SoC and an RF front-end circuit plus dc/dc converter. The WLS1270 is IEEE 802.11b/g/n-compliant part and measures 9.2 X 8.4 x 1.35 mm.

Measuring 9.2 X 8.4 x 1.35 mm, the WLS1271 is IEEE 802.11b/g/n compliant, Bluetooth 2.1 plus EDR, Power Class 2 compliant. The WLS1273 is IEEE 802.11a/b/g/ and 11n compliant, Bluetooth 2.1 plus EDR, Power Class 2 compliant and measures 11.4 X 9.4 x 1.4 mm. They are FCC and/or ETSI certified. The WLS evaluation kits currently sup-port Linux and Android operating systems. ($40 ea; WLS-Series Evalua-tion Kits sell for $576.92 — samples available now.) RFM , Dallas , TX Sales 972-233-2903 www.rfm.com/contact_php/map.php www.rfm.com

Low-power op amps offer high performance Offered in 14-pin SO packages, the PS13004/14 current feedback opera-tional amplifiers are quad-configu-ration devices, with four identical amplifiers on a single chip. The

PS13004 features a small signal band-width of 280 MHz and slew rate of 1,100 V/μs with the ability to drive 65-mA outputs and yet only requir-ing 3.3 mA of static supply current.

By comparison, the PS13014 is op-timised for a higher bandwidth of 450 MHz and slew rate of 1,500 V/μs. This part can also drive 65-mA out-puts, but the additional performance does incur the slightly higher static supply current of 5.2 mA. Both de-vices exhibit a gain flatness to within ±0.1 dB; 60 MHz for the PS13004 and 120 MHz for the PS13014. The de-vices are supported by comprehen-sive datasheets and evaluation boards. (Contact Sales for pricing — samples available now.) Plessey Semiconductors Plymouth , United Kingdom Sales 858-324-1086 [email protected] www.plesseysemi.com

Clock jitter family offers industry’s lowest phase noise The LMK04800 family of clock jitter cleaners — including the LMK04808, LMK04806, LMK04805 and LMK04803 — feature the industry’s lowest phase noise and rms jitter per-formance: 111 fs from 12 kHz to 20 MHz, and a wideband noise floor of –162 dBc/Hz at 184 MHz output fre-quency. This level of phase noise en-hances the performance of systems used in wireless and wired commu-nications, test and measurement, medical imaging, software defined radio (SDR), and digital broadcast ap-plications, while reducing overall bill of materials (BOM) cost.

The family is optimized for gener-ating different frequencies up to 1.5 GHz for clocking ADCs, DACs, SerDes, and FPGAs. With integrated

features such as holdover, switcho-ver, multiple inputs, digital delay, analog delay, odd/even dividers, and 12 programmable output format drivers, the LMK04800 ICs are high-ly flexible and configurable to sup-port a variety of different architec-tures. They are housed in 64-pin LLP packages. ($9.15 ea/1,000 — avail-able now.) National Semiconductor Santa Clara , CA Sales 408-721-5000 [email protected] www.national.com

Integrated Circuitsedited by christinanickolas, jimharrison and paulo’shea

See more online at electronicproducts.com/ic

analog/MiXeD Signal

Triple op amp targets –55° to 225°C appsThe CHT-RUBY triple operational amplifier offers a built-in voltage ref-

erence for reli-able operation from –55° to 225°C. The three operational am-plifiers can easily be configured as an instrumenta-

tion amplifier with external resis-tors, while the 5-V voltage reference can provide up to 25 mA for com-plete bridge excitation in high tem-perature sensor applications.

Additional features include a gain bandwidth of 1.3 MHz typ, an input offset voltage of ±2.5 mV typ, and a supply range from 6 to 20 V with a low current consumption of 600 µA per amplifier at 225°C. The voltage reference provides initial accuracy of ±2% and high stability with tempera-ture of less than 500 μV/°C. (From $219.40 ea/200 — samples available now.)CISSOIDMont Saint Guibert, BelgiumSales +32 10 48 92 [email protected]

Dc/dc regulators power high-current appsThe iP1837 and iP1827 iPowIR volt-age regulators suit POL applications including servers, netcom, data stor-age, and telecom equipment requir-

ing high current. They integrate a control MOSFET, s y n c h r o n o u s FETKY, bootstrap diode, bootstrap

capacitor and internal over-current protection in a 7.7 x 7.7-mm LGA wireless package.

The voltage regulators feature dif-ferential voltage sensing, +/- 0.5% reference voltage, over-voltage pro-tection, dead time trim, and body braking to optimize transient re-sponse. The iP1837 and iP1827 are pin compatible for 25- and 35-A ap-plications and offer a 1.5 to 16-V in-put voltage range and a programma-ble frequency up to 1.5 MHz. (Ea/100,000: iP1837, $5.90; iP1827, $4; reference design kit, $94 — avail-able now.)International RectifierEl Segundo, CASales 310-252-7105www.irf.com

Full-bridge PWM controllers integrate MOSFET gate driversSaid to be the industry’s first full-bridge pulse width modulation (PWM) controllers to integrate all four primary-side bridge MOSFET gate drivers, the LM5045 and LM5046 target quarter- and eighth-brick power modules used in a vari-ety of high-input-voltage communi-cations infrastructure applications. The LM5045 PWM controller imple-ments a conventional full-bridge to-pology power converter using either current mode or voltage mode con-trol. The LM5046 PWM controller implements a phase-shifted full-bridge topology for applications re-quiring zero-voltage switching to minimize EMI.

The PWM controllers are offered in thermally enhanced 5.0 x 5.0 x 0.8-mm LLP and 4.4 x 9.7 x 0.9-mm TSSOP packages. These full-bridge controllers operate on the primary side of an isolated dc/dc converter

with input voltage up to 100 V. They provide 2-A high- and low-side gate drivers for the four external bridge MOSFETs in addition to the control signals for the secondary-side syn-chronous rectifier MOSFETs and an internal high-voltage startup regula-tor. (Ea/1,000: LM5045, $2.25; LM5046, $2.45 — available now.)National SemiconductorSanta Clara, CASales [email protected]

Buck dc/dc converter targets PoL designsThe MIC26400, MIC26600, and MIC26950, members of the Super-Switcher II family of integrated MOS-FET buck regulators, target high-power-density dc/dc PoL applications. The devices operate with an input supply voltage range from 4.5 to 26 V and deliver an output current of 5, 7, and 12 A, respectively. The family incorporates the company’s Any Ca-pacitor technique that provides ca-pacitance independent of output ESR.

The family of buck regulators drives dc/dc loads at >95% efficiency, with ±1% accuracy, and output ad-justable down to 0.8 V. They operate at 300-kHz switching frequency and feature an enable pin for very-low-power shutdown, internal soft start, undervoltage lockout, internal com-pensation and protection features such as prebias safe startup, over temperature protection, foldback current limit, and short-circuit pro-tection. (Ea/1,000: MIC26400, $1.82; MIC26600, $2.20; MIC26950, $2.77 — available now.)Micrel, San Jose, CASales 408-944-0800www.micrel.com

PWMs target smart meters, LCD displaysThe NCP1234 and NCP1236 family of fixed-frequency pulse-width mod-ulation (PWM) current-mode con-trollers target ac/dc adapter applica-tions for laptop computers, LCD displays, printers, and household consumer electronics. They integrate multiple features such as overpower compensation, brownout (NCP1236 only) and ramp compensation with-out increasing power dissipation or adding external components.

The PWMs are available in 65- or 100-kHz frequen-cy options, with capability to auto-matically recover or latch off the de-vice during a fault condition. High-voltage dynamic self-supply (DSS) technology enables direct connection to the line voltage eliminating the need for startup re-sistors. They are housed in an SOIC-7 package. ($0.35 ea/10,000 — avail-able now.)ON Semiconductor, Phoenix, AZSales 602-244-6600www.onsemi.com

Crypto authentication IC uses SHA-256The ATSHA204 cryptographic au-thentication device includes a 4.5-Kbit EEPROM and a hardware SHA-256 accelerator. The low-power device operates from 2.0 to 5.5 V from –40° to 85°C and has an op-tional temperature sensor.


NEWPRODUCTS

Power ManageMent

Digital

HDMI switch IC handles four inputsThe PS461 HDMI switch has four re-ceivers and one transmitter, enabling TVs to select from among four HDMI inputs. The 100-pin TQFP-packaged chip takes less than 800 mW and has nonvolatile memory for four HDMI or DVI EDIDs (extended display iden-tification data).

The IC can preauthenticate all four HDMI inputs using HDCP (high-bandwidth digital-content protection) cipher engines and an encryption key, reducing delay to less than 1 s when switching be-tween inputs. It supports HDMI 1.4a, has adaptive receiver equalization,

8-bit low-power MCUs have enhanced CAN I/OThe PIC18F66K80 series of 8-bit CAN

m i c r o c o n -trollers feature 1.8 to 5.5-V op-eration and a sleep current of less than 20 nA. They also pro-

vide one ECAN port, a 12-bit A/D converter, and an mTouch capacitive touch-sensing interface.

The MCUs have a low-power 300-nA watchdog timer, run-mode cur-rents down to 3.8 µA, and come in 44- and 64-pin TQFP and QFN pack-ages. They have an 8 x 8 single-cycle hardware multiplier, 32 or 64 Kbytes of flash and 3.6 Kbytes of SRAM, plus a 1-Kbyte EEPROM. (From $1.84 ea/10,000 — samples available now.)Microchip TechnologyChandler, AZSales 480-792-7200www.microchip.com

The IC’s enhanced security fea-tures to protect the EEPROM content include an active metal shield, inter-nal memory encryption, secure test modes, glitch protection, and volt-age-tamper detection. The chip’s ac-tive supply current is 1 mA with a 3.3-V supply. The chip comes in SOT-3, SOIC-8, UDFN-8, and TSSOP-8 packages with either a single-wire or I2C interface. (From $0.41 ea/1,000 — available now.)AtmelUSA, San Jose, CASales [email protected]

and supports up to WUXGA 1080p with component depth of 8/10/12 bits/color. ($1.55 ea/high volume — available now.)Parade TechnologiesSan Jose, CACustomer Support [email protected]/

DSP Effects

2-in4-out


Integrated Circuits

Features

• Pin compatible solutions for 4A, 6A, and 9A

• Best in class effi ciency over entire load range

• Fully featured and protected for easy on-board implementation

• Wide input voltage range 1.5V to 21V

• Integrated controller, bootstrap diode, control FET and Sync FETKY

• Programmable frequency up to 1.5MHz

• ± 1% accurate 0.7V reference voltage

Begin your design with IR's online design tool atmypower.irf.com/SupIRBuck

for more information call 1.800.981.8699 or visit us at www.irf.com

4x5mm Family Shrinks SupIRBuck™

Footprint By 33% Up To 9A

Part Number IOUT (A) Reference Design

IR3853M 4 IRDC3853

IR3856M 6 IRDC3856

IR3859M 9 IRDC3859

Efficiency ComparisonVIN- 12V VOUT- 1.8V Frequency-600kHz

IOUT (A)

94

92

90

88

86

84

82

80

780 1 2 3 4 5 6 7 8 9

Effic

ienc

y (%

)

IR3853 IR3856 IR3859

SupIRBuck™ integrated regulators save energy, space and system cost for your POL design

THE POWER MANAGEMENT LEADER

Specifi cations

HIGHLIGHTS

MEMS microphone has footprint under 1 x 1 mm Thanks to a combination of design and manufacturing techniques brought together through corporate acquisi-tion, the AKU230 monolithic MEMS microphone resides on an 0.84 x 0.84-mm die. With a 0.70-mm 2 footprint that is 30% smaller than any previ-ous mic, it is believed to be not only the smallest fully integrated microphone, but also the smallest fully inte-grated MEMS device of any type. The tiny size opens new possibilities for single- and multiple-microphone designs in thin consumer devices such as palm-sized video cam-eras, laptops, netbooks, and tablet computers.

The microphone — which puts MEMS microphone membrane, amplifier, and sigma-delta converter on a single CMOS die — has a range of 50 Hz to 22 kHz and an output that is a pulse-density-modulated (PDM) sin-gle-bit digital output stream, which enables multiplex-ing of stereo data on a single wire. Response is highly linear (THD of 2% typ), sensitivity is typically −26 dBFS at 1 kHz and 94 dB SPL, and the SNR is 56 dBA typ.

The device is available in a robust 3.76 x 4.72-mm-foot-print LGA package so it can fit into pre-existing designs and, at just 1.25-mm tall, it is also 30% thinner than pre-vious digital microphones, suiting it for even thinner form factors. ($1.30 ea / 10,000 — available now.) Akustica , Pittsburgh , PA Information 412-390-1730 [email protected] www.akustica.com


NEWPRODUCTS

Fiber-optic transceivers handle Fibre Channel, Ethernet The AFBR-54D7APZ fiber-optic transceiver addresses 8-Gbit/s Fi-bre Channel for storage applica-tions, while the AFBR-703SNZ targets next-generation 10-Gbit/s Ethernet equipment. Both feature the new mini-SFP+ form factor.

The transceivers have an 850-nm vertical-cavity sur-face-emitting laser (VCSEL) and PIN detector and provide compatibility with Fibre Channel and IEEE 802.3ae 10GBASE-SR specifications. The 54D7APZ takes 825 mW maximum; the AFBR-703SNZ 1.0 W max and 600 mW typ, from 3.3-V supplies. (Ea/10: AFBR-54D7APZ, $120;

Oscillator series offers low jitter The ABLJO/ABLJO-V series of oscillators are guaranteed to hold better than 0.10 ps of rms jitter over 12-kHz to 20-MHz bandwidth from the carrier. Designed with third-overtone crystal technology, these devices are ideally suited for RF circuitry, requiring exceptional close-to-the-carrier jitter performance.

Supply voltage is 3.300 V typ and phase noise (100-MHz carrier) is –144 dBc/Hz typ at 10-kHz offset. The part comes in a 9.2 x 14 x 5.5-mm SMT package. (Ea/100: 100 MHz, $11.15; 156.25 MHz; 200 MHz, $15.60 — available now.) Abracon, Rancho Santa Margarita , CA Information 949-546-8000 [email protected] www.abracon.com

Mini thermistors have fast response Suited for space-limited applications, the NTCALUG03 series mini-lug NTC thermistors feature a 65-mm 2 mount-ing space and a response time of ≤4 s. The thermistors operate at temperatures from –40° to 125°C, and feature electrical resistance values at 25°C (R25) of 10, 12, or 47 kΩ, with tolerances of ±2% and ±3%.

The devices have a 5.5-mm ring tongue that can be mounted with M2 screws or American studs #1 to #2 and are available with an optional 1.5-mm pitch ZHR-2 con-nector, and customizable lead lengths and screw sizes. (Fromt $0.55 each, $0.71 with the ZHR-2 connector — 12 weeks ARO.) Vishay Intertechnology , Malvern , PA Paulo Adabo 402-564-6400 [email protected] www.vishay.com

Components & Subassembliesedited by p.o’shea, c.nickolas, r.comerford and c.d’airo

See more online at electronicproducts.com/cs


NEWPRODUCTSAFBR-703SN, $180 — available now.)Avago Technologies, San Jose, CA800-235-0312 [email protected]

Tiny oscillators use little currentSuited for small and portable devices, the F100 HCMOS oscillator family is available in 1.8-V (F110 series), 2.5-V (F140 series), and 3.3-V (F130 series) options and a fre-quency range of 1.0 to 80.0 MHz, all in a compact 2.0 x 1.6-mm footprint with a low 0.8-mm profile. All feature a standby func-tion that reduces current consumption to 10 µA.

The F100 oscillators offer stabili-ties from ±50 and ±100 ppm across an operating temperature range of –20° to 70°C and an extended range of –40° to 85°C. Stability of ±25 ppm is available over an operating tem-perature range of –10° to 60°C. (25-MHz, ±50-ppm F135 model, from $0.99 ea/10,000 — 8 weeks ARO.)Fox ElectronicsFort Myers, FLCustomer Service 888-GET-2-FOXwww.foxonline.com/email.htmwww.foxonline.com

Multilayer varistor features 16-V ratingThe Transguard multilayer varistor clamps transients, filters EMI, and features 16-Vdc rating with a 20-pF capacitance in a 0201 case. The de-vice targets handheld devices includ-ing cell phones and PDAs, as well as embedded components such as hear-ing aids and camera modules.

The multilayer varistor offers multiple strike capability and can withstand 1,000 strikes at 8 kV of contact. It features a sub-1-ns re-sponse time to an ESD strike and has a maximum leakage current of 50 µA at rated voltage. (From $0.005 to $0.024 — available now.)AVX, Greenville, SCJim Wright [email protected]

Tact switch is tinySuited for audio/visual, computer peripherals, consumer electronics,

(initial maximum) of 500 mΩ, and an insulation resistance of 100 MΩ min at 500 Vdc. Operating tempera-ture is –40° to 85°C and dielectric strength (1 min) is rated for 250 Vac. (Contact company for pricing and availability.)E-Switch, Minneapolis, MNInformation 800-867-2717e-switch.com

handheld devices, medical equip-ment, telecommunications applica-tions, the TL3700 series ultraminia-ture micro tact switch is a mere 3.0 x 2.6 x 0.65 mm. It features a 100,000 cycle life expectancy and 2-gf options.

Specs include a contact rating of 20 mA, 15 Vdc, a contact resistance

Components & Subassemblies

HIGHLIGHTS

Development tool aids Kinetis MCU designs The KwikStik all-in-one development tool aids evaluation and development using Freescale’s Kinetis MCU, which has an ARM Cortex-M4 core. The low-cost tool combines a J-Link debug probe, low-power ca-pacitive touch sensing, a 306 segment LCD user interface, and a suite of development and run-time software.

The kit can be used as a standalone, battery-operated tool, as an additional tool with a Tower System, or as a J-Link debugger — which does not need a separate debug probe. The tools card has a 100-MHz Kinetis K40 MCU with 256 Kbytes of flash and an equiv-alent amount of FlexMemory for application code. Also included are aUSB OTG port, infra-red communications, a Micro SD card slot, a 3.5-mm audio output jack, an omnidirectional microphone, a buzzer, six touch buttons, and a recharge-able battery. The Eclipse-based CodeWarrior 10.1 IDE, supporting up to 128 Kbytes of object code, is included, as is the Processor Expert tool with an auto-code generator. ($29 — available now through distribution.) Freescale Semiconductor , Austin , TX Information 800-521-6274 www.freescale.com


NEWPRODUCTS

to 2000 Wattsaccepts three orsingle phase input

Full BrickModel HPHA1

HPHA2

Full Brick Model PHA 1

250/500 Watts

Half BrickModel HPHA1

• Universal AC Input, 85-250 VAC• Operates from 47-440Hz Input

Frequency• 0.99 Power Factor• Use with PICO’s DC-DC Converters

from 3.3 to 5000VDC out, or otherDC-DC Converters

• Meets EN61000-3-2 for LowHarmonic Distortion

• Thermal Protection

200 WattsOne Module for IsolatedPower Factor Corrected

AC-DC Applications• Universal 85-265 input 5 to 48

VDC Isolated Regulated• Outputs to 200 Watts• Full Brick (UAC Series)

INDUSTRIAL• Universal Input

• Single and Dual Outputs 20 & 50 WattsNew 300 Watt

Power Factor Corrected

OPTIONS • 200C/-400C Operating Temp.Selected Environmental Screening Per Mil-Std 883

New800HzInputFor FrequencyDesigns

ConsultFactory

for FREE PICO CatalogCall toll free 800-431-1064

in NY call 914-738-1400Fax 914-738-8225PICOElectronics, Inc.

143 Sparks Ave. Pelham, N.Y. 10803

E Mail: [email protected]

PICO for AC-DCPower FactorCorrectedModules85 to 265VRMS,47-440 Hz

A25_EP_1-3V_2-0625x9-5:A25E.QXD 4/1/11

cost tool combines a J-Link debug probe, low-power ca-

Power design tool adds library of generic blocks Used to model and optimize elec-tronic design power consumption, the Aceplorer 2.2 adds a library of ge-neric blocks that can be used as a starting point for creating libraries of

components including intellectual-property-based power description models. Its graphical user interface and project management capabilities have been improved so that it is easi-er to instantiate, aggregate, and share libraries and designs among differ-ent teams.

The tool automatically outputs Unified Power Format (UPF) 2.0 or IEEE Std. 1801-2009 files to allow ar-chitects to communicate their speci-fications to the implementation or realization teams. An easy-to-under-stand UPF file editor allows for infor-

IC tool gives instant signoff verification The Calibre RealTime platform pro-vides signoff-quality physical verifi-cation during IC design creation. The SoC design tool provides instan-taneous design rule checking (DRC) as place-and-route progresses and improves design speed and quality of results.

The package uses SpringSoft Laker custom IC design software for a new design flow that is seamless, virtual-ly instantaneous, and encompasses analog and digital areas. The tool can handle the two to ten times greater number of design rules re-quired for 28-nm SoCs. ($100,000 — available now.) Mentor Graphics , Wilsonville , OR Sales 503-685-7000 [email protected] www.mentor.com

mation sharing and reduces the risks of misunderstandings among differ-ent teams. (Contact company for pricing — available now.) DOCEA Power Moirans , France Information + 33-0-427-858-262 [email protected] www.doceapower.com

Design & Development Tools

edited byjimharrison and christinanickolas

See more online at electronicproducts.com/software

HIGHLIGHTS

LED cuts electronics space needs to simplify small-bulb designs Designed to be driven from rectified ac voltage rather than a constant dc current source like most other LEDs, the high-voltage emitter Philips Luxeon H LED aims to simplify design of SSL replacements for cande-labra bulbs or other small form-factor lamps. A pair of

LEDs need only a bridge rectifier IC and resistor to work directly from a 120- or 240-Hz ac mains, producing about as much light as a 15-W incandescent.

The 120°-viewing-angle LED is available in two warm-white color tem-peratures, 2,700K and 3,000K, with typical flux of 84 and 90 lm, respectively, efficacies of approximately 60 lm/W, and typical CRIs of 83. Maximum junc-tion temperature is 125°C and, in keeping with use in space-constrained de-signs, the LEDs can provide high output over a case temperature range of –40° to 105°C. The units are said to be highly color stable over their lifetimes, and will deliver, on average, 70% lumen maintenance (L70) at 25,000 hours of operation with a forward current up to 30 mA.

The LED is identical in footprint (approximately 3 x 4.5 mm) to Luxeon Rebel and Luxeon Rebel ES LEDs to further simplify implementation. ($1.20 ea / large qty — available now.) Future Lighting Solutions , Montreal , Quebec , Canada

Information 800-675-1619 [email protected] www.futurelightingsolutions.com/en/Pages/index.aspx


NEWPRODUCTS

• 0.4 Watts to 150 WattsPower Transformers

• 115V/26V-400/800 HzPrimary

• Secondary Voltages 2.5V to 300V

• Manufactured to MIL-PRF27 Grade 5, Class S,(Class V, 1550C available)

• Surface Mount or Plug-In

• Smallest possible size

Now... up to 150

Watts

400 / 800 HzTransformers

See Pico’s full Catalog immediately

www.picoelectronics.com

PICOElectronics, Inc

143 Sparks Ave., Pelham, NY 10803

Call Toll Free 800-431-1064

E Mail: [email protected]

FAX:914-738-8225

Delivery - Stock to one week

INDUSTRIAL • COTS • MILITARY

Surface Mountand Plug-In

A30_EP_2-0625x9.5:A30.qxd 4/1/11 1:00 PM

Efficient APDs have low dark current and noise Using a reach-through structure, the compact SAP500 series avalanche photodiodes (APDs) provide excel-lent quantum efficiency (to 65% typ), low noise (as low as 20 fA/√Hz typ), and minimal dark current (as low as 50 pA typ). Operated in Geiger mode (reverse voltage , V R > break-down voltage, V BR ) they can detect single photons in a time-resolved manner, suiting them for applica-tions such as LIDAR, spectroscopy, fluorescence measurements, or pho-ton counting.

The devices have a large active area (diameter = 0.5 mm) and can also be operated in normal linear mode (V R < V BR ) with internal gain of 250 or higher. Available housings are: her-metic TO-46, TO-37 with thermo-electric cooler (TEC), and TO-8 with two-stage TEC. (Contact Valerie King for pricing and availability.) Laser Components IG , Hudson , NH Valerie King 603-821-7040 [email protected] www.lasercomponents.com

Standard Lens Mounts, Filters, Filter Rings, Step Rings, Adapters, Spacers, Special Metric Taps and Dies, and other Lens Mounting Accessories. Over 60 years of custom design and manufacturing experience.

© 2011 Universe Kogaku (America) Inc.

[email protected]

SINCE 19 4 9

F r o m P r otot y P e to Pr o d u c t i o n

1000s of Lens Sizes in Stock. Most Lenses Ship Same Day.

CUSTOMMOUNTS,FILTERS, &COMPONENTS

Optoelectronicsedited by richardcomerford

See more online at electronicproducts.com/op


NEWPRODUCTS

Coax connectors have 1.0-mm mated profile The JSC series RF micro coaxial con-nector series has a maximum profile of 1.0 mm, suiting it for use in w i r e l e s s produc t s including tablets, smart phones, e-books, and other mobile devices. The connector includes a board-mounted 2 x 1.8 x 0.5-mm receptacle (MM5829-2700) that mates with a 0.81-mm-diameter RF cable (MXJA01xxxxxx) for a total mated height of 1.0 mm.

The connectors can withstand up to 30 mating cycles and has VSWR of 1.3 to 3 GHz, 1.4 GHz max between 3 and 6 GHz, 1.5 GHz max between 6 and 9 GHz, and 1.6 GHz max be-tween 9 and 12 GHz. The connec-tors emit an audible click on connec-tion and are available in multiple cable configurations. ($0.25 each — 10 weeks ARO.) Murata Electronics North America , Smyrna , GA Information 770-436-1300 www.murata-northamerica.com

Desktop enclosures have retro look The HWCHAS and the 1444 / 1441CWW series desktop chassis are

designed to replicate the look of consumer electronics from the 1950s and ‘60s. They are aimed at high-end hi-fi equipment and retro-styled in-strumentation.

HWCHAS units have walnut frames fitted with black-powder-coat or natural-finish alu-minium tops and optional bottom panels; they are available in two siz-es: 13 x 10 x 3 in. and 17 x 10 x 3 in. The 1444CWW models are fabricat-ed from aluminium with a natural finish, and the 1441CWW models are made of steel with a black pow-der coat finish; both types are fitted with walnut end panels on the short-er sides and come in six sizes ranging

from 7 x 5 x 2 in. to 17 x 10 x 4 in. (In single qty: 1444 / 1441CWW from $57; HWCHAS from $85 — available now.) Hammond Manufacturing Cheektowaga , NY Ray Shatzel 716-630-7030 [email protected] www.hammondmfg.com

U-shaped device simplifies PCB connects The Eliminator Series now includes a coaxial F interconnect device de-signed for applications where equally spaced rows of female F con-nectors need to be jumpered horizontally or vertically. The true 75-Ω device features two F push-on male connectors in a U-shaped configuration and can eliminate ca-ble assemblies in board-to-board ap-plications or panel jumpers to the same panel.

The coaxial device manufactured of precision-machined brass with gold-plated contacts and is offered with Teflon insulators. Operating temperature range is –40° to 65°C. Custom spacing and screen-printing is available. (From $10 ea/1,000 — 8 to 12 weeks ARO.) Bomar Interconnect Products Ledgewood , NJ Bob Behrent 973-347-4040 [email protected] bomarinterconnect.com/F_UPR.html

Power cords prevent accidental disconnect The V-Lock cord-retaining system can prevent accidental disconnection

of power in appli-ance couplers and power-entry mod-ules according to IEC 60320 (10- and 16-A cords) and UL (15- and

20-A cords). The system provides pro-tection of IP 20 according to IEC 60529 from the front side.

The V-Lock feature a yellow catch mechanism that latches into a

Packaging & Interconnections

edited by paulo’shea, richardcomerford and christinad’airo See more online at electronicproducts.com/in

Wall-mount enclosures get smaller, bigger Diatec wall-mount enclosures are now available in a smaller XS size (6.10 x 5.90 x 1.45-in.) and larger L size (7.87 x 12.99 x 1.88-in.) that complement ex-isting S and M sizes ( http://bit.ly/DiatecSM ). The cases’ central control panels are recessed 0.10 in. to accept labels or membrane keypads.

notched inlet or outlet, and is released by simply depressing the lever with no additional hardware required. The systems are available with NEMA plugs and a variety of country-specif-ic plugs. Custom cable lengths and plug variations are also available. (Standard V-Lock appliance inlets from $1.49 each/100; power cord prices vary — available now.) Schurter , Santa Rose , CA Cora Umlauf 800-848-2600 [email protected] www.schurterinc.com/new_pems

EPOXIES • SILICONES • POLYURETHANES • CYANOACRYLATES • UV CURES

154 Hobart Street, Hackensack, NJ 07601Tel: 201-343-8983 • Fax: 201-343-2132

www.masterbond.com • [email protected] solve problems.

Epoxy Meets NASALow Outgassing

SpecificationsCryogenically Serviceable

Master BondEP29LPSP

• Withstandscryogenic shocks:room temperature toliquid helium temperatures ina 5 to 10 minute time period• Excellent optical clarity• Low viscosity - easy application• High bond strength• Superior electrical insulation properties• Long working life at room temperatures• 100 to 65 mix ratio by weight• Low exotherm• Chemical resistant• Meets NASA requirements for low outgassing• Convenient packaging

The XS models consist of a top and base assembled by two screws hidden on the base’s underside. The L, like the S and M models, consists of four molded parts: top, base, and two contoured side panels that snap into place and hide assembly / mounting screws. Units come stan-dard in gray and off-white; other col-ors are an option. (From $30 — avail-able now.) OKW Enclosures , Bridgeville , PA Sean Bailey 800-965-9872 [email protected] www.okwenclosures.com

Li-Ion holders accept 18650 batteries The BH-18650-W and BH-18650-PC battery holders accept 3.7-V lithium-ion 18650 rechargeable batteries with a built-in protection circuit module (PCM). The BH-18650-W has stain-less-steel pressure contacts with 24-AWG wires and a 6-in. lead length with striped and tinned ends. The BH-18650-PC has a wide pc-tail contact for applications that require a pulse of energy to flow through them quickly.

The holders’ lightweight, glass-filled plastic body mea-sures 78 (L) x 21 (W) x 22 (H) mm and meets UL 94V-0 stan-dards. The hold-ers also accept two CR2/3A lithium batteries in series con-nection for a 6-V output. (BH-18650-PC, $1.61 ea/1,000 — stock.) Memory Protection Devices Farmingdale , NY Tom Blaha 631-249-0001 [email protected] www.memoryprotectiondevices.com

Eight-channel adapter has tool-free interface The eight-channel Jumpflex Interface Adapter provides a tool-free connec-tion between Jumpflex signal condi-tioners and relays to Wago I/O systems or other PLC interfaces. Eight digital or analog channels are combined within the module assembly, and then the appropriate adapter can be plugged into the input or output side, without any tools.


NEWPRODUCTS

On the module side, the adapter has either a 14- or 16-pin ribbon cable with male connector or a 15-pin cable

with D-sub connec-tor plug connected to the control unit. The control side comes with either a 14- or 16-pin ribbon cable plug or an

open-end connection with stripped wires and ferrule. Each adapter also features marking tag holders and a test location at each channel. (Contact company for pricing and availability.) Wago , Germantown , WI Michelle Goeman 262-255-6333 [email protected] www.wago.us/products/36846.htm

Ethernet connection system is IP67 rated The rugged RJ45-ECS field-replace-able Ethernet connection system for 10Base-T, 100Base-T, and 1000Base-T networks now features a molded strain relief for protec-tion during con-nected/discon-nected. The system features a RJ45 recepta-cle mounted in a U V - p r o t e c t e d housing. A mating cable gland passes the connector to seal the system to IP67 require-ments.

The RJ45-ECS also includes a shielded Cat5e cable with connec-tors for EMI protection. The system can withstand up to 500 mating cy-cles, over 1,000 hrs of salt spray, 10 cycles of thermal shock from –40° to 100°C. (Contact company for pric-ing and availability.) Laird Technologies , St. Louis , MO Information (Americas) 847-839-6907 [email protected] www.lairdtech.com

Simulator features thermal, radiative cooling surface The CS-100 Thermal Chassis Simula-tor provides a thermal mass and ra-diative cooling surface for passive cooling of ADL CPUs. The 100-in. 2 chassis is used with its universal mounting pattern, is compatible with all of the company’s PC/104 heat spreaders and pipes, regardless of the CPU. The product contains both M3 and 4-40 hardware, as well

as standoffs to support 0.600- or 1.000-in. clearance spreaders.

The thermal simulator is made from Blanchard-ground powder-cast plate aluminum, has a surface flatness better than 0.001 in. across the entire face. The anodizing provides basic emissivity of ≤0.75 and represents the radiative area of an aluminum enclo-

sure with 200-in. 2 It is used as devel-opment platform for proof-of-concept passive cooling systems. ($299 — available now.) Advanced Digital Logic San Diego , CA Sales 858-490-0597 [email protected] www.adl-usa.com



Dc power jacks rated to 5 A The KLD-HCX series h igh- c u r-rent dc power jacks are rated at 5 A for por-table device applications. The jacks can withstand up to 5,000 cycles and maximum insertion force of 3.0 kg.

The PCB-mount jacks are avail-able in diameters of 2.0 and 2.5 mm, have a built-in dc on/off switch and are offered with nonlocking and locking option. (Contact company for pricing and availability.) Kycon , San Jose , CA Sales 888-KYCON22 [email protected] www.kycon.com

Thermal material suits high-power devices Designed for use between a high-power electrical device requiring electrical isolation from the heat sink, the High Flow 650P thermally-conductive phase change material is

reinforced with a polyimide film. Naturally tacky on one side, the film offers a 5,000-Vac dielectric break-down voltage, thermal conductivity of 1.5 W/m-K, and a thermal imped-ance of 0.20°C-in 2 /W at 25 psi.

The material is reliable in temper-atures to 150°C. Available in stan-dard thicknesses of 0.0045-, 0.0050- and 0.0055-in. and with a 1.0, 1.5 or 2.0 mil Polyimide reinforcement car-rier. (Contact company for pricing and availability.) Bergquist , Chanhassen , MN Jerry Schmitz 800-347-4572 [email protected] www.bergquistcompany.com

Clip-type test socket for FPC assemblies The LC Series clip-type socket for flex-ible printed circuit (FPC) subassembly testing features horseshoe-shaped contacts with wiping action. Contact resistance is ≤50 mΩ and contact force is ~30 G typ. The sockets are available

in pitches down to 0.3 mm and have a clothespin mechanism for easier in-stallation and to preserve their life of ≥10,000 mating cycles.

The sockets also feature an eleva-tor FPC stage that minimizes dam-age to the FPC pads and protects the contacts dur-ing load/unload operation. Out-put options are discrete wiring, stan-dard 40 to 60-pin MIL connector or FPC connector. (Contact company for pricing and availability.) Yamaichi Electronics U.S.A. San Jose , CA Thomas Rein +49 0-89 4 5190 234 www.yamaichi.de

Wire-to-board series suits variety of apps The 1.25-mm-pitch wire-to-board connector series features a single-row design available with 2 to 20 cir-cuit positions and suits a wide vari-ety of industrial and consumer applications. Products in the series

SPECIFY “MYLAR”TM INSULATING TUBING FOR COIL WINDING OR COVERS WHEN THE JOB CALLS

FOR 5000 VPM @ 150O C. OR 7000 VPM @ 25O C.

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“Mylar” has one of the highest dielectric strengths available in a tube form. Its temperature range is from -60oC to +150oC. It is moisture-vapor resistant and is unaffected by, and does not transmit, oils, greases and volatile aromatics. It is an exceptionally strong, durable, transparent film with high tensile, tear and impact strength. Also in heat-shrinkable grade

To receive literature & details fast - www.pptube.com

Phone: 847-537-4250 • Fax: 847-537-5777E-Mail: [email protected]™ ® DuPont Co.

More Than 75 Years- The Original


NEWPRODUCTS

DIN connectors have external-nut design The Brad mPm DIN valve connectors now feature an external-nut design and the addition of Form C and Form

Micro housings. The connectors con-form to industry-standard EN 175301-803 (formerly DIN 43650) for electri-cal connectors used with solenoid valves. The external nut provides greater and consistent torque and in-creases cable retention force by up to 115% over in-ternal-nut de-signs.

Form A, Form B, and Form Industrial housing have an in-tegrated self-retaining front gasket to ensure a IP67-rated seal, and the internal vol-ume of Form C has been increased by 30% with no change of external di-mensions. The one-size-fits-all con-nectors are supplied ready to use in single sets or as bulk components, and can accommodate PG9 and PG11 cable and cable with up to 9-mm out-er diameters. (Contact company for pricing and availability.) Molex , Lisle , IL Sales 800-786-6539 [email protected] www.molex.com

includes terminals, polarized crimp housings and PCB headers in straight- and right-angle, surface-mount, and through-mount configurations.

The series has a 1-A current rat-ing, 125-Vac/dc voltage rating, 20-mΩ maxi-mum contact re-sistance, 100 MΩ minimum insu-lation resistance, 500-Vac/min dielectric withstand voltage and operates in temperatures from –40° to 105°C. The PCB header material meets halogen-free require-ments and housing meets EU Industry Safe Standard. (Contact company for pricing and availability.) FCI Electronics Etters , PA Information 800-237-2374 [email protected] www.fciconnect.com

Epoxy withstands long-term immersion in acids The EP21AR two-component epoxy can withstand prolonged immersion in acidic en-vironments, i n c l u d i n g those up to 98% sulfuric acid and 36% hydrochloric acid for over a year. The rugged epoxy has a tensile strength over 10,000 psi, a shear strength over 2,700 psi, and a com-pressive strength ≥14,000 psi at 75°F.

The EP21AR is serviceable from –60° to 275°F and has a 400-V/ms di-electric strength and a 45 to 55 ppm/°C coefficient of thermal expansion. The epoxy is 100% reactive, has a 2-to-1 mix ratio by weight, a mixed viscosity of 10,000 to 15,000 cps and a working life of 45 to 55 min for a 200-g batch at ambient tempera-tures. (Contact company for pricing and availability.) Master Bond Hackensack , NJ Technical Support 201-343-8983 [email protected] www.masterbond.com

Mini PCB connectors allow easy termination The 5.0-mm-tall PTSM (print termi-nal spring termination) and PTPM (print terminal insulation piercing) miniature PCB connectors have a 2.5-mm centerline and suit space-limited LED applications. Both con-nectors feature Push-In termination technology for tool-free, termination and THR and SMD headers.

The spring-caged PTSM can pass 5 A and 150 V, and features horizon-tal and vertical headers and fixed PCB terminal blocks, available in through-hole-re-flow or true sur-face mount. The PTPM can trans-mit CAT 5 up to 4 A and offers an insulation piercing contact as connec-tion alternative for PTSM headers. (Contact company for pric-ing and availability.) Phoenix Contact Middletown , PA Technical Service 800-322-3225 [email protected] www.phoenixcon.com/minis




BlockMaster’s Clear Connects™ Push-In Wire ConnectorsBlockMaster’s “Clear Connects™” Push-In Wire Connectors are faster, simpler and safer than twist-on wire connectors. No more twisting or taping! Transparent, color-coded and easy to use, Clear Connects™ provide visual confirmation of wire termination for a perfect connection every time! Available in 2-8 positions, Clear Connects™ accept wire sizes from 22-12 AWG. A built-in strip guide shows how much wire to strip, and their compact size enables connections in tight spaces.

BlockMaster Electronics, Inc.1-800-595-8881www.BlockMaster.com

Small Size, High ReliabilityUltra-Miniature Quartz Crystal With a 3.2 mm x 1.5 mm footprint and a 0.97 mm maximum height, the CX11 crystal is one of the smallest crystals available in the industry. It is available in a 32.768 kHz frequency, as well as frequency ranges of 100 kHz to 180 kHz and 20 MHz to 50 MHz. Calibration tolerances down to 30 ppm are available for this crystal. The CX11 is ideal for medical, military and industrial applications where board space is at a premium. To obtain the latest datasheet for the CX11, visit www.statek.com.Statek [email protected]

Panasonic’s PGS Pyrolytic Graphite Sheet Panasonic Electronic Component’s PGS or Pyrolytic Graphite Sheet is a heat spreading material with high thermal conductivity. This lightweight material is highly flexible and can be cut into custom shapes, making it extremely useful for applications with limited space. In addition, it has excellent thermal conductivity properties, 600 to 80W/(m-K), which is twice as high as copper and three times as high as aluminum.Panasonic Electronic Components1-800-344-2112piccomponentsmarketing@ us.panasonic.comwww.panasonic.com/industrial/ electronic-components

Audiolarm II® Piezoelectric Alarms The industry’s largest selection of piezoelectric whoops, warbles, sirens, beeps and more. Available in variety of voltages and output up to 103dB! Rugged panel mount products are IP68 and NEMA 4X when used with optional gasket. ISO 9001:2000 registered company – all products made in the USA.

Floyd Bell Inc.Tel: (614) 294-4000Fax: (614) [email protected]

MuMetal® Alloy for Electromagnetic Shielding MuMetal® is commonly known worldwide as the material most specified for fabrication of electronic enclosures and low-frequency electromagnetic shields. Unknown by many, MuMetal®

is not a generic name. It is a registered brand, and exclusively available from Magnetic Shield Corporation, Bensenville, IL USA. When specifying MuMetal® in your design, contact Magnetic Shield Corporation to be certain you are receiving the proper material, originally qualified in your design.Magnetic Shield Corporation630-766-7800shields@magnetic-shield.comwww.magnetic-shield.com/ products/mumetal.html

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advertiser index This index is provided as an additional service. The publisher does not assume any liability for errors or omissions.

Absopulse Electronics Limited …… 80Acopian Power Supplies …………… 79Advanced Interconnections Corp. … 96Advanced Power Solutions ………… 78Agilent Technologies ………Cover 2, 31AKM Semiconductor Inc. ………… 89Allied Electronics Inc. ……… Cover 3Ametek Programmable Power …… 81ASIC Advantage Incorporated …… 38 Astrodyne Corp. …………………… 73Avnet Electronics Marketing …… 2, 32Bel-Fuse Inc. ……………………… 69Blockmaster Electronics …………… 100Cadsoft Computer Inc. …………… 56Calex Manufacturing Co. Inc. ……… 72Central Semiconductor …………… 29Clare, Inc. ……………………… 46, 65Coilcraft …………………………… 10ConTech …………………………… 74

CUI / V-Infinity …………………… 62Data Image ………………………… 50Data Modul Inc. …………………… 52Digi-Key Corporation ………………… 1 Elma Electronics, Inc. ……………… 66EMCO High Voltage ……………… 70Endicott Research Group, Inc. …… 64Equipto Electronics Corp. ………… 67Floyd Bell, Inc. …………………… 100Fran Mar International Inc. ………… 14 Garrett Electronics, Corp. ………… 12Global Lighting Technology ……… 54Globtek Inc. …………………Cover 1, 77Harwin ……………………………… 97 Hittite Microwave Corp. …………… 27 Integrated Power Design ……………… 9International Rectifier ……………… 90Knight Electronics ………………… 19Krohn-Hite Corp. ………………… 84

Linear Technology Corp. ………… 13Linx Technologies ………………… 99Magnetic Shield Corp. …………… 100Martek Power Inc. …………………… 7Master Bond Inc …………………… 96Maxim Integrated Products …36, Cover 4Maxon Precision Motors, Inc. ……… 22 Meanwell USA ……………………… 4Measurement Computing Corp … 83, 85 Meder Electronics ………………… 91Mega Electronics Inc ……………… 70Melexis Inc ………………………… 24Memory Protection Devices ……… 81Micrel, Inc. ………………………… 41Micromo Electronics Inc …………… 21Micro Power Direct ………………… 71 Micro Tips Technology …………… 50Minmax Technology Co Ltd ……… 64Mornsun America ………………… 72

Mouser Electronics ………………… 34MS Kennedy Corporation ………… 23Murata Power Solutions, Inc. ……… 75National Instruments ………………… 3OKW Enclosures Inc ……………… 95Panasonic Industrial Co …………… 100Panasonic Industrial Co.- OEM Batteries Group ………… 17 Pelican Products …………………… 57Phihong USA …………………… 44, 45 Pico Electronics Inc. …………… 93, 94Positronic Industries ……………… 51PDuke Technology ………………… 80 Precision Paper Tube Company …… 98Probe Master Inc …………………… 42Rigol Technologies ………………… 82 RF Monolithics, Inc. ……………… 55 Rohde & Schwarz ………………… 39

Samtec Inc ………………………… 53Sensirion AG ……………………… 14 Spectrum Sensors & Controls …… 48, 49Spectrum Advanced Specialty Products …………… 58, 59Statek Corporation …………… 92, 100Syfer Technology Ltd.……………… 98 Taiyo Yuden (U.S.A.), Inc. ………… 20Tensility International Corp. ……… 16 Total Power International Inc. ……… 74Traco Power ……………………… 76 Universe Kogaku (America), Inc. … 94Valpey Fisher Corporation ………… 47Varta Microbattery, Inc. …………… 15Vicor Corp. - VI Chip Group ……… 68 Visual Communications Co. ……… 63 Zilog Inc. …………………………… 18 ZMD America, Inc. ………………… 43

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