electron beam technology for printing and packaging ... › presentations › printing... · •...
TRANSCRIPT
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Electron Beam Technology for Printing and Packaging
Applications
Stephen C. Lapin, Ph.D. PCT Engineered Systems, LLC
Davenport, IA, USA
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Electron Beam Technology • Industrial uses for over 30 years • Accelerated electrons produced using electrically operated
filaments • Low energy equipment is self-shielded • Ionizing radiation initiates acrylate polymerization without
photoinitiators • Considered to be more food friendly compared to UV • Very consistent output
– Beam current ramps with line speed to give constant dose – Excellent cross-web uniformity – Output does not degrade with time
• High throughput
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Presentation Outline
I. EB Printing and Packaging Applications
II. Advances in Low Energy EB Equipment
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EB Technology for Printing and Packaging Applications
• Web offset printing • Flexo printing • Gravure printing • EB clear coating over conventional inks • EB laminating • Specialty converting: holograms, transfer
coating, specialty inks, etc.
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EB Web Offset Printing • Advantages
– Commercial >25 years – Wet trap paste ink technology well established – Low plate cost – Low ink usage – High print quality – Variable repeat technology (VSOP) – Current use for cartons, labels, paper based pouches, and multi-wall
bags • Challenges
– Extensible substrates – High ink coverage (first down or last down white) – Offset printing not familiar to most package printers – High capital cost of press equipment – Little current use in flexible packing
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Central Impression Web Offset Printing • New press technology from Comexi • Offset stations with variable repeat sleeves mounted on a CI drum • Combines advantages of web offset printing with ability to use
extensible films
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EB Flexo Printing
• Interstation EB not practical • Need strategy to trap inks after each color
– Wetflex (Sun Chemical) – EasyRad (TechnoSolutions) – Paste Ink System (IdeOn) – Dual UV-EB
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WetflexTM EB Ink Technology • Description/Advantages
– Developed by Sun Chemical – Allows flexo application of multiple ink colors without interstation drying – Curing is accomplished with a single EB unit at the end of the press – Inks contain limited amounts (about 20%) of water – Attractive for food packaging (water replaces monomer content for
viscosity reduction) – High print quality due to low dot gain
• Challenges – Ink stability/dirty printing in long runs – Requires specially modified ink handing equipment – Wet trapping over first down white ink – Inks available only from Sun
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EasyRad EB Ink Technology • TechnoSolutions business venture formed by partners in
Brazil – Antilhas (package printer) – Saturno (ink manufacturer) – Comexi (press manufacturer)
• Public announcement of demonstration at Antilhas August 2009 (www.pack.com.br/blog)
• Flexo printing with CI press platform • Final EB cure only; no interstation drying necessary for
ink trapping • High solids solvent/EB hybrid • Compliance with VOC emission standards?
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Solvent/Water Free Paste Ink System
• Recent US Patent 7,997,194 to IdeOn LLC – Paste ink >5000 cps – Little or no VOC content – Apply with photopoylmer based letterpress or flexo
plate – Wet trap multiple colors and cure with single EB unit
• Ink metering system described in Patent Application publication US 2011/0192297
• No known current commercial installations
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Dual UV-EB Curing of Inks • Description/Advantages
– Interstation UV cure with low power lamps followed by final cure by EB – Uses well known stable UV flexo ink technology – Excellent print quality due to low dot gain with 100% solids inks – Faster press speeds compared to UV curing alone – No limit on ink sequence or density of inks that may be used – Potential for food packing using low levels of migration resistant
photointiators – EB effectively completes the cure of UV inks without nitrogen inerting
• Challenges – Higher capital costs to install both UV and EB equipment – Need press, EB equipment, lamp equipment, and ink supplier partners
to demonstrate commercial viability • Patent
– US 5,407,708 covering dual UV-EB cure for CI-flexo assigned to Sealed Air expires January 2014
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EB Gravure Printing • Patent and publication by IdeOn LLC with Amgraph
Packaging • Water based EB curable inks • Interstation drying with conventional thermal ovens • Single EB at end of press to crosslink inks • Advantages
– Maintains print quality advantages of gravure – Eliminates VOCs from solvents – Food friendly: water diluent (no monomer), high molecular
weight acrylated polymer dispersions – Crosslinked inks have superior resistance properties
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EB Clear Overprint Coatings Over Conventional Inks
• Typical configuration is conventional CI press with coating station and EB after tunnel dryer
• Advantages – Lower cost by replacing film laminated flexible packing with surface printed
and coated mono-web packaging – High gloss appearance – High heat, mechanical, and chemical resistance of cured EB coating
• Challenges – Matching appearance and handling of reverse printed laminated packaging – Odor, taint, food law compliance – Functional properties (COF, weatherability, ink protection) – Patent covering film food packaging applications (Cryovac US 6,528,127)
• Current Applications – Outdoor film bags – Multi-wall paper bags – Paper/foil tobacco package – Cold seal release coatings for confectionary packaging
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EB Laminating • Advantages
– Stable one component adhesives – Bubble-free barrier-barrier lamination – Lamination in-line or off-line with printing – Instant bonding
• Immediate QC, slitting, die cutting, shipping • Enables in-line processing (dye cutting, additional laminate layers)
– FDA compliance established for select adhesives (FCN 642 -Northwest Coatings)
• Challenges – Higher cost compared to 2-component solventless adhesives – Good bonding of a limited range of inks and substrates
• Current Successes – Folding cartons (film-to-paperboard) – Non-food flexible packaging (film-to-film and film-to-paper) – Food packaging with foil barrier
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Low Energy EB Equipment Development
• Industry defines low energy as <300 kV • Initial self-shielded low energy beams installed in early
1980’s • Multi-filament gun established as preferred configuration • New generation of “lower” energy systems introduced in
2000 – 90 to125 kV – Primarily used in the curing of inks and coatings
• Modular sealed tube emitters introduced in early 2000’s – Performance and reliability have continued to evolve
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EB User Requests
• Lower capital costs • Improved reliability • Lower cost of operation • Easy and inexpensive maintenance • Wider ranges of voltages • Customization for new applications • Lager range of web widths • Non-web product handling
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New Advancements in EB Equipment • Integrated shield roll • Low profile side fire • Integrated converting on shield roll (4-in-1 System) • Extended voltage range for lower energy systems • Digital high voltage power supplies • Sealed tube emitters
– Narrow web curing systems – 3-D curing systems – Lab systems
• Ultra-low energy EB systems
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Integrated Shield Roll • New patented (US 8,106,369) design • Supports the material and serves as a functional portion
of the shielding • Reduced machine size • Reduced volume for inerting • Optimum temperature control for heat sensitive
substrates • Facilitates integration of other processes on the exposed
roll surface – Roll coaters, extruders, nips, etc.
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Integrated Shield Roll
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Low Profile Design
• Ideal for variable sleeve web offset presses – No need to raise the press or dig a pit for the beam
• Low entry height – varies with sleeve size • New design maintains “side fire” orientation • Easy access for foil change • Uses integrated shield roll technology • Allows printing on heat sensitive films such as
shrink sleeve label stock
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Low Profile EB on Variable Sleeve Web Offset Press
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4-in-1 Package Decorating System
• Flexo coating station and nip rolls integrated directly on EB shield roll
• Four modes of operation – EB coating – EB laminating – Cast & Cure (hologram embossing) – Cold foil transfer
• May be in-line of off-line with printing
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4-in-1 Package Decorating System Enabled by process integration with
integrated shield roll
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4-in-1 Package Decorating System
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Examples of 4 in 1 Curing
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Extended Voltage Systems • Same size profile as new generation lower energy EB
systems • Energy range increased up to 175 kV • Maintains “side fire” orientation for easy foil access &
changing • Penetration up to 150 microns
– Film crosslinking – Pressure sensitive adhesive crosslinking – Simultaneous curing of inks on the outside surface and sterilization
of food contact surface
• More cost effective than current industrial EB processors
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Depth/Dose Curve for Low Energy EB Up to 175 kV
0.00
0.20
0.40
0.60
0.80
1.00
1.20
0 25 50 75 100 125 150 175 200 225 250
Rel
ativ
e D
ose
Depth of Penetration (g/m2) For unit density g/m2 = microns
90 kV 110 kV 125 kV 150 kV 175 kV
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Extended Voltage Low Energy Systems
175 kV system with 24 inch integrated shield roll
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High Voltage Power Supply • Newly available high frequency, switch-mode power
supplies • Power factor above 0.90 • Significantly reduced power consumption • Integrated digital signal processors • Configuration and diagnostics via Ethernet • Fast (50 microsecond) control • Replace SF6 insulating gas (greenhouse gas) with
silicone oil • Compact size • High voltage cable connection allows remote installation
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High Voltage Power Supply
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Sealed Tube Emitters • Modular design • 16 inches (400 mm) wide • Voltage ranges of 90 to 180kV • Speeds up to 300 ft/min (100 m/min) with 30 kGy dose • New developments providing significant increase in foil
life (over 6000 hours) • Integrated systems based on sealed tube emitters
enable new applications – Narrow web printing and converting – Curing of 3-D surfaces – Lab curing units
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Seal Tube EB Systems Emitter, Cable, Power Supply
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EB Systems Based on Sealed Tube Emitters
Narrow web application with integrated shield roll
Custom 3-D curing application with sealed tube emitter
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Narrow Web Printing Technology Incorporating Sealed Tube Emitter Based EB System
• EB curing of thick / high density ink layers • Supplemental curing of current UV inks • EB inks and coatings designed for food
packaging • EB adhesive lamination • Cold foil transfer
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Narrow Web EB System
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Lab EB Curing System
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Ultra-Low Energy Electron Beam Systems • Ultra-low energy range of 15 kV to 25 kV • Compact size; widths 20 to 90+ inches • Digital power supply • Direct installation in vacuum coating chambers • Elimination of the need for titanium foil as a vacuum barrier • Cure coatings that are vacuum deposited or roll coated on a
web within a vacuum chamber • 15 kV EB generated in a vacuum will penetrate coating
weights of about 4 g/m2
• Use together with other vacuum coating processes such as metallization
• EB designed to operate in 10-5 torr vacuum range
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Depth/Dose Curve for 15 kV EB (operating in a 10-5 torr vacuum)
0.00
0.50
1.00
1.50
2.00
2.50
0 1 2 3 4 5
Rel
ativ
e EB
Dos
e
Depth of Penetration (g/m2)