ing a gripping portion and a second por- tion, said second portion comprising first and second oppositely oriented surfaces, a first fabric section, pretreated with cleaning preparation, affixed to and being substan- tially co-extensive with the first surface, for use in cleaning, and a second fabric section, affixed to and being substantially co-extensive with the second surface, for use in polishing.

Stack Buff U.S. Patent 5,560,744. Oct. 1, 1996 G.J. Schaffner //I, assignor to Schaffner Mfg. Co. Inc., Piffsburgh

A method of producing a buffing assem- bly with a plurality of buffing wheels with or without spacers, each buffing wheel in- cluding a clinch ring to which is secured fabric layers extending radially therefrom and each spacer including a ring; the method comprising: forming a stack of buffing wheels with or without spacers with the rings contiguous as a hub of the stack and the fabric layers, disposing strap means generally axially along the rings defining the internal periphery of the stack, securing the strap means to the ring at one

end of the stack, impressing a compressive force on the stack, while it is under com- pression, securing the strap means to the ring at the other end of the stack, and removing the compressive force.

Coated Abrasive U.S. Patent 5360,753. Ott 1, 1996 H. W Schnabel ef al., assignors to 3M Co., St. Pat4 Minn.

A coated abrasive article comprising a nonwoven fibrous backing comprising at least one ply, wherein the ply comprises electrically nonconductive fibers and elec- trically conductive material; and an abra- sive layer bonded to one major surface of the backing.

Electroless Gold Plating Solution U.S. Patent5,560,764. Oct. 7, 1996 H. Wachi and Y Otani, assignors to Electroplating Engineers of Japan Ltd., Tokyo

An electroless gold plating solution con- taining an alkaline metal gold cyanide, a boron-based reducing agent, and an alkali

metal hydroxide, where 2 to 20 g/L of dimethylamine is added to the solution.

Protective Layer For Copper and Copper Alloy U.S. Patent 5,560,785. Oct. 1, 1996 H. Hirao et al, assignors to Shikoku Chemicals Corp., Marugame, Japan

A method for forming a chemical layer on the surface of copper or a copper alloy, which comprises contacting with an aque- ous solution consisting essentially of O.Ol-5% by weight of a 2-arylimidazole compound selected from the group consist- ing of 2,4-diphenylimidazole, 2,4-diphe- nyl-Smethylimidazole, and 2-phenyl-4 benzyl-Smethylimidazole, l-20% by weight of an aliphatic carboxylic acid hav- ing not more than 4 carbon atoms, 0.01 up to 10% by weight of a copper compound effective for increasing the rate of forming said chemical layer on the copper or copper alloy, up to 10% by weight of a zinc com- pound effective for improving the heat re- sistance of said chemical layer, a pH stabi- lizing effective amount of ammonia or an amine compound, and an aqueous solvent consisting essentially of water.

Circle 003 on reader information card

CLEAN AS A

WHISTLE WITH RAMCO ULTRASONIC SYSTEMS

Ramco ultrasonic systems automatically load and reciprocate the work through the wave energy. The results are superior cleaning -clean as a whistle

l Sweep Frequency l Hard Chrome l High Intensity l Multi Stage Consoles l Semi or Fully Automated

RAliilCO 32 Montgomery Street, Hillside, NJ 07205 1-800-553-3650 l Fax: (908) 687-0653

Circle 186 on reader information card

166 METAL FINISHING l JUNE 1997