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J. C. Mariscal , Y. Sampurno, D. Slutz and A. Philipossian Effect of Conditioner Design and Polisher Kinematics on Fluid Flow Characteristics during CMP

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Page 1: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

1

J. C. Mariscal, Y. Sampurno, D. Slutz and A. Philipossian

Effect of Conditioner Design and Polisher

Kinematics

on Fluid Flow Characteristics

during CMP

Page 2: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

2

Problem Statement and Objective

• Fluid dynamics in CMP is really complicated – Too many rotating and

oscillating parts – And groove designs.

• This complexity gets exacerbated with in-situ conditioning.

• This complexity gets further exacerbated when discs of varying designs are

employed.

• Current CFD and other numerical simulation capabilities are woefully

inadequate for capturing various nuances in flow patterns.

• Today we will introduce a new experimental method based on fluorescence

to help quantify flow patterns during conditioning

• We will focus on several case studies and explain our observations trends

qualitatively and quantitatively:

✓ Various CVD diamond disc working face designs

✓ Platen velocities

✓ Further work is ongoing!

Page 3: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

3

Mechanisms of Fluid Transport in CMP

• Pad grooves, pad pores and land-area micro-texture

• Oscillatory and rotary motions of the conditioner (and the carrier

head)

❖ Bow wave and boundary layer around the disc (and the retaining ring)

❖ Movement of fluid in and out of the disc-pad (and wafer-pad) interface

• Advection in the radial direction

• Centrifugal forces

• Centripetal forces mainly due to drag between pad and fluid

• Back-flow

❖ Fluid build-up caused by surface tension at the edge of the pad

❖ Conditioner (and wafer carrier) motion

Page 4: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

4

• No wafers were polished – Carrier

head was disengaged

• CVD Conditioners

❖ MGAM – 4S

❖ MGAM – 43

❖ CCW rotation at 95 RPM

❖ 3-pound down-force

❖ 11 sweeps per min

❖ 72 seconds of conditioning

• All runs were repeated once –

Differences in results were less

than 4 percent in all cases!

• Pad

❖ DowDupont Politex – Rotating

CCW at 50 or 100 RPM.

❖ Break-in – 3M PB32A brush for

30 minutes at 95 RPM with

platen at 50 RPM.

• Fluorescent fluid (UPW with 0.5

g/l of 4-methyl-umbelliferone)

flowing at 250 cc/min with LED

UV illumination

• UPW rinse at 2,000 cc/min for

30 seconds at RT between each

test.

Experimental Conditions

Page 5: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

5

Pad

Conditioning

Disc

Fluid Injection

Point

Details on Various Sections Tested

LocationDistance from Pad

Center (")

S1 13.125 – 14.375

S2 11.875 – 13.125

S3 10.375 – 11.875

S4 8.000 – 10.375

Sweep Stroke 2.60 – 14.21

Dispense Point 3.5

Page 6: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

6

The Araca UVIZ-100 System

UV – LED

UV – LED cover

High Resolution

CCD Camera

Page 7: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

7

The UVIZ-100 on our APD-800 Polisher

d

Page 8: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

8

CVD Discs and Procedure

4S 43

Break-in the pad with a bristle brush

for 30 minutes

Perform UVIZ test on the MGAM 4S disc with platen

rotating at 100 RPM – Repeat at 50 RPM.

Repeat with the MGAM 43 disc

Perform fluid thickness calibration (see next page)

Page 9: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

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Thickness-to-Brightness Calibration Curve

All flow visualization experiments and calibrations tests were done in a

darkened room – And in 1 day so as to minimize the effect of

time-dependent photobleaching.

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

0 10 20 30 40 50 60 70 80

Th

ickn

ess [

mm

]

Mean Fluid Brightness due to Fluorescence

Page 10: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

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Data Analysis Flow Chart

Plot raw fluid thickness data for each section analyzed

and reset the data to the origin

Fit a curve in each section using the following equation:

y = fluid thickness (mm)

t = time (s)

Constants a, b, c and n are fitting parameters

Calculate the hypothetical film thickness after 10 minutes (defined as MAFT which

stands for “maximum attainable fluid thickness”)

Calculate the time needed to reach 90% of the MAFT (defined as TTRSS which

stands for “time to reach steady-state”)

𝒚 = 𝒂 − 𝒃 𝒆(−𝒄 𝒕 𝒏)ₓₓ

Page 11: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

11

Data Analysis – 4S at 100 RPMRaw Data and Fitted Curves

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

0 8 16 24 32 40 48 56 64 72

Th

ick

ne

ss

[m

m]

Time (s)

S1

S2

S3

S4

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

0 8 16 24 32 40 48 56 64 72

Time (s)

S1

S2

S3

S4

Page 12: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

12

Data Analysis – 43 at 100 RPMRaw Data and Fitted Curves

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

0 8 16 24 32 40 48 56 64 72

Th

ick

ne

ss

[m

m]

Time (s)

S1

S2

S3

S4

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

0 8 16 24 32 40 48 56 64 72

Time (s)

S1

S2

S3

S4

Page 13: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

13

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

6 8 10 12 14 16

Th

ick

ne

ss

[m

m]

Distance from Pad Center [inches]

5 s

15 s

25 s

50 s

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

6 8 10 12 14 16

Distance from Pad Center [inches]

5 s

15 s

25 s

50 s

50 RPM 100 RPM

Disc 4S – Film Thickness vs. Distance

Page 14: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

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Trend Analysis

• At the shortest time, section closest to pad center has the thickest film

because fresh fluid is dispensed near that region.

• At longer times, film thicknesses:

✓ Closest to pad center, increase (by up to 2X) – Then they level off rapidly.

✓ In regions away from pad center, keep on increasing (by up to 3X) – Then they

level off at a slower rate. This is due to the conditioner’s ability to draw fresh fluid

from the center and carry it further out as it moves away.

✓ Near the edge, keep on increasing (by 5X) – Then they level off at a slower rate.

• Thicknesses near pad edge are lowest because fluid is removed from the

surface as the conditioner moves over the edge.

• Higher pad angular velocity causes films near the edge to get thinner (due

larger centrifugal forces) – No angular velocity dependence near the

center.

Page 15: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

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Disc 43 – Film Thickness vs. Distance

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

6 8 10 12 14 16

Th

ick

ne

ss

[m

m]

Distance from Pad Center [inches]

5 s

15 s

25 s

50 s

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

6 8 10 12 14 16

Distance from Pad Center [inches]

5 s

15 s

25 s

50 s

50 RPM 100 RPM

Page 16: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

16

Disc Comparison (4S vs. 43) at 100 RPM

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

8 10 12 14 16

Distance from Pad Center [inches]

25 s

50 s

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

8 10 12 14 16

Th

ick

ne

ss

[mm

]

Distance from Pad Center [inches]

25 s

50 s

4S 43

Page 17: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

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Trend Analysis

• Same general trends discussed for the 4S are apparent with the 43.

• However:

✓ Full-face conditioner (43) has lower overall film thicknesses because it does not

entrain fluid as effectively as the 4S which has vanes.

✓ 43 tends to impart more of a squeegeeing effect and as it moves over the edge,

more fluid is expelled away.

✓ Due to its fluid retention characteristics, 4S generates more back-flow.

✓ This effect is more pronounced at 100 RPM likely because disc rotation (95

RPM) and platen rotation (100 RPM) are nearly matched.

Page 18: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

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VIDEO – Disc 4S at 100 RPM

Page 19: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

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VIDEO – Disc 43 at 100 RPM

Page 20: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

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Time To Reach Steady State

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

0 8 16 24 32 40 48 56 64 72

Th

ickn

ess [

mm

]

Time (s)

S1

S2

S3

S4

34.530.0 40.3 63.1

TTRSS ≡ Time needed to reach 90% of

the maximum attainable fluid thickness (MAFT)

Page 21: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

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Maximum Attainable Fluid Thickness

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

S1 S2 S3 S4

MA

FT

(m

m)

Sections

4S 43

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

S1 S2 S3 S4

Sections

4S 43

50 RPM 100 RPM

Page 22: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

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Time To Reach Steady State

0

10

20

30

40

50

60

70

S1 S2 S3 S4

TT

RS

S (

s)

Sections

4S 43

0

10

20

30

40

50

60

70

S1 S2 S3 S4

Sections

4S 43

50 RPM 100 RPM

Page 23: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

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MAFT and TTRSS Means and Ranges

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

MA

FT

(m

m)

4S 43

100 RPM

4S 43

0

10

20

30

40

50

60

70

50 RPM

TT

RS

S (

s)

4S 43

4S 43

Page 24: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

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MAFT and TTRSS Summary

• 4S causes thicker fluid films (by 23 and 33 percent at 50 and 100 RPM,

respectively) as compared to 43 – Because 4S has greater retention

capabilities and generates more back-flow

• Sections near the center of the wafer track have thicker fluid

• Near the center of the pad, fluid is only slightly thinner

• Near the edge of the pad, fluid is significantly thinner

• Regarding time to reach steady-state fluid thickness conditions:

✓ 4S takes longer (by 31 and 83 percent at 50 and 100 RPM, respectively) compared to

43 – Because 4S impedes and disrupts flow more effectively

✓ The farther away from the pad center, the longer it takes for film thicknesses to

reach SS due to the area dependence on radius (i.e. the ΠR2 effect)!

• Further work using our novel technique is ongoing with the ultimate goal

being to come up with the ideal disc face designs and process conditions!

Page 25: Effect of Conditioner Design and Polisher Kinematics on ... · 2 Problem Statement and Objective • Fluid dynamics in CMP is really complicated –Too many rotating and oscillating

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Thank You!