ee design status d cockerill cern 19 july 2006
DESCRIPTION
EE Design Status D Cockerill CERN 19 July 2006. PATCH PANELS. ENVIRONMENTAL SHIELD. ECAL EE End Cap components. SUPPORT RING. SUPERCRYSTALS THIS FACE. BACKPLATE. ECAL EE End Cap Build – Layout. SUPPORT RING. BACKPLATE. ~3.6m. VFE ELECTRONICS. MODERATOR. END CAP DEE. SIDE VIEW. - PowerPoint PPT PresentationTRANSCRIPT
ECAL – EE Design Status Presentation 19/7/06 D.J.A. Cockerill - RAL 1
EE Design Status
D CockerillCERN 19 July 2006
ECAL – EE Design Status Presentation 19/7/06 D.J.A. Cockerill - RAL 2
ECAL EE End Cap components
BACKPLATE
SUPPORT RING
SUPERCRYSTALS THIS FACE
PATCH PANELS
ENVIRONMENTAL SHIELD
ECAL – EE Design Status Presentation 19/7/06 D.J.A. Cockerill - RAL 3
ECAL EE End Cap Build – Layout
BACKPLATE
SUPPORTRING
VFEELECTRONICS
MODERATOR
END CAP DEE SIDE VIEW
~3.6m
ECAL – EE Design Status Presentation 19/7/06 D.J.A. Cockerill - RAL 4
ECAL End Cap Build - Layers
Arrangement at the Rear of the End Cap Backplate
Backplate Cooling, fitting of patch panels, FOM
Protection plates, HV support
End Cap inner Shielding, Front Moderator
Protection plates, LV support
Mechatronics Support plates
Umbilical connection, VFE Mothercards/support frames, LV
distributionMechtronics cooling system,
internal flow and return manifoldsVFE, LV and FE cards attachment, Inner Moderator
Data/trigger fibre boxes plus support
Rear Moderator, closure of End Cap
ECAL – EE Design Status Presentation 19/7/06 D.J.A. Cockerill - RAL 5
Backplate Cooling, fitting of patch panels, FOM
Backplate cooling
All 4 backplates have
their associated cooling
pipes
However these pipes
must be fitted to the
patch panels and ring
flange exit points to the
(non existant) blocks
for the quick disconnect
fittings
Design/fabrication of
blocks Mario
Mounting Jose
ECAL – EE Design Status Presentation 19/7/06 D.J.A. Cockerill - RAL 6
Backplate Cooling, fitting of patch panels, FOM
Cooling completion
Blocks for quick disconnect fittings mounted on
patch panels and ring flanges
Pipes cut to suit (use of CERN gases division?)
Fit pipes to backplate and to blocks
Dismount pipes
Apply thermal compound to cooling plates
Remount pipes, secure to blocks
Leak tests
ECAL – EE Design Status Presentation 19/7/06 D.J.A. Cockerill - RAL 7
Backplate Cooling, fitting of patch panels, FOM
Patch panels
Have to be redesigned and
remade due to the new
manifold design for the
electronics cooling bars
The ‘plane’ of cooling is 20mm
lower (nearer to
backplate) than before
Design John
Manufacture Mario?
Fitting Jose
ECAL – EE Design Status Presentation 19/7/06 D.J.A. Cockerill - RAL 8
Backplate Cooling, fitting of patch panels, FOM
Fibre Optic monitoring
The new laser layout has been
incorporated by Saclay, new
mounting drawings produced
Updated locations for the
diffusing spheres. Dees are
mirrors of each other on an
Endcap
Additional mounting holes on
backplate, according to Dee
location in CMS
Holes completed for all 4 Dees
by Jose
ECAL – EE Design Status Presentation 19/7/06 D.J.A. Cockerill - RAL 9
Backplate Cooling, fitting of patch panels, FOM
VPT stability pulser
One Patch Panel location per
Dee for LED array and
associated electronics
Must serve 18 L1 diffusers
Allocated volume only
4cm x 15cm x 4.5cm
Design RAL/UVa
RISK: Is volume enough ??
ECAL – EE Design Status Presentation 19/7/06 D.J.A. Cockerill - RAL 10
EndCap EE
All large mechanical pieces are at CERN
Dry assembly of env. screen produced in Russia
ECAL – EE Design Status Presentation 19/7/06 D.J.A. Cockerill - RAL 11
EE: VPT production & gluing, Supercrystals
EE VPT to crystal gluing
2800 VPTs shipped from UK to CERNAll tested upon receipt by Russia - INR
Up to 50 EE crystals/VPTs glued each week
110 of current EE crystal stock (~350 xtals) done
First “Russian” SC completed
in June 2006 built using CRISTAL database
ECAL – EE Design Status Presentation 19/7/06 D.J.A. Cockerill - RAL 12
EE electronics
Preliminary results, ~ 3900 e- per channelCross talk < 0.1%Meets EE requirements
SC HV cards 105 pre-production cards completed All R & C components for EE delivered
Motherboards 2 prototypes on Dee4 600 cards by end 2006
EE VFE cardsRC feedback on MGPA tuned for EEInput diode for VPT spark protection 30 prototypes produced in Feb 06 250 cards now under test
3130 cards by end July 06
FE cards80 pre-production cards tested
800 cards produced by Sep 2006
ECAL – EE Design Status Presentation 19/7/06 D.J.A. Cockerill - RAL 13
EE trigger
Pseudostrip (5 crystal) allocationsEE+ towards I.P
Consequent trigger towers (TCC level)EE+ towards I.P
ECAL – EE Design Status Presentation 19/7/06 D.J.A. Cockerill - RAL 14
EE : preparing for the assembly
Ensuring correct cabling of the channels
Trigger map (H.Heath)LED cabling tester from UVa
ECAL – EE Design Status Presentation 19/7/06 D.J.A. Cockerill - RAL 15
EE data and trigger readout
The fibre readout fan-out boxes (two layers) serving the EE DCCs and TCCs in the control room
900 readout fibres to correctly route per Dee
ECAL – EE Design Status Presentation 19/7/06 D.J.A. Cockerill - RAL 16
“Dee4” project
“Dee4”
First large scale test of integration philosophy
20 SCs mounted on BP Dee4 by end 2006
Trigger mapping at motherboard
10 cooling blocks, main manifold
“Dee4” to testbeam in May 2007
EE assembly has started
“Dee4” will provide crucial assembly and test beam insights
Dee1 assembly from September 2006
ECAL – EE Design Status Presentation 19/7/06 D.J.A. Cockerill - RAL 17
EE Planning
Dee 1 End Sep 2007Dee 2 End Dec 2007Dee 3 Mid Mar 2008Dee 4 Mid Apr 2008
CMS windowfor Dee1end Sep 07
EE+mid Jan 08
EE-mid Mar 08
ECAL – EE Design Status Presentation 19/7/06 D.J.A. Cockerill - RAL 18
EE planning
Crucial to introduce as much parallel assembly and integration as possible
Quality control at each crucial step
Suggestion to carry out all SC mounting and Dee assembly in bldg 867
This offers many very attractive features- all major activities under one roof- proximity of expert teams- realisation of the EE trigger, from motherboard level to fibre readout level- multiple DAQ test systems, needed for EE QA, available locally- cooling capacity for one entire Dee- LV power
Crystal Palace
Advance preparation of all large mechanics- Dees into OPAL frames- dry assembly tests of Environmental screens- BP cooling installation- Mounting laser monitoring system
ECAL – EE Design Status Presentation 19/7/06 D.J.A. Cockerill - RAL 19
EE - Conclusions
EE assembly has started
Much progress with the EE large mechanics, VPTs, SC assembly, electronics, and trigger and data mapping
“Dee4” will provide crucial assembly and test beam insights Dee1 assembly from September 2006
We are on the learning curve for EE assembly
ECAL – EE Design Status Presentation 19/7/06 D.J.A. Cockerill - RAL 20
Additional info follows, next slide