ee 201c modeling of vlsi circuits and systems chapter 1 introduction instructor: lei he email:...

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EE 201C Modeling of VLSI Circuits and Systems Chapter 1 Introduction Instructor: Lei He Email: [email protected]

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Page 1: EE 201C Modeling of VLSI Circuits and Systems Chapter 1 Introduction Instructor: Lei He Email: LHE@ee.ucla.edu

EE 201C

Modeling of VLSI Circuits and Systems

Chapter 1 Introduction

Instructor: Lei He

Email: [email protected]

Page 2: EE 201C Modeling of VLSI Circuits and Systems Chapter 1 Introduction Instructor: Lei He Email: LHE@ee.ucla.edu

Instructor Info

Email: [email protected]: [email protected] Phone: 310-206-2037Phone: 310-206-2037 Office: Boelter Hall 6731DOffice: Boelter Hall 6731D Office hours: Office hours:

Tus 2-3pm Tus 2-3pm Thur 4-5pmThur 4-5pm or by appointmentor by appointment

The best way to reach me: The best way to reach me: Email with EE201 in subject lineEmail with EE201 in subject line

Page 3: EE 201C Modeling of VLSI Circuits and Systems Chapter 1 Introduction Instructor: Lei He Email: LHE@ee.ucla.edu

System Specification

Functional Design and Verification

Logic Design and Verification

Circuit Design and Verification

X=(AB*CD)+(A+D)+(A(B+C))

Y=(A(B+C))+AC+D+A(BC+D))

VLSI Design and Verification Cycle

Verification techniquesVerification techniques Formal verificationFormal verification Logic/circuit simulationLogic/circuit simulation Functional and logic emulationFunctional and logic emulation

Page 4: EE 201C Modeling of VLSI Circuits and Systems Chapter 1 Introduction Instructor: Lei He Email: LHE@ee.ucla.edu

Physical Design and Verification

Fabrication and Testing

Packaging

VLSI Design and Verification Cycle (cont.)

Layout verificationLayout verification LVS, DRC, ERCLVS, DRC, ERC Timing, SI, PI, DFM (applied to circuit design as well) Timing, SI, PI, DFM (applied to circuit design as well)

Modeling and simulation is a core component for design and verification considering timing/SI/PI/DFMModeling and simulation is a core component for design and verification considering timing/SI/PI/DFM

Page 5: EE 201C Modeling of VLSI Circuits and Systems Chapter 1 Introduction Instructor: Lei He Email: LHE@ee.ucla.edu

CAD Courses at UCLA

EE dept.EE dept. EE201A Fundamental to CAD (each fall)EE201A Fundamental to CAD (each fall)

Basics to all aspects of CADBasics to all aspects of CAD More on combinatorial optimizationMore on combinatorial optimization

EE201C this course (each Spring)EE201C this course (each Spring) Modeling and simulation of timing, signal/power integrity, Modeling and simulation of timing, signal/power integrity,

and manufacturability for digital and mixed-signal circuitsand manufacturability for digital and mixed-signal circuits Co-development of numerical modeling and optimizationCo-development of numerical modeling and optimization

EE209 Better Interface between design and manufacturing EE209 Better Interface between design and manufacturing (taught by Puneet Gupta each winter)(taught by Puneet Gupta each winter)

CS dept.CS dept. CS258F Physical design of VLSI circuitsCS258F Physical design of VLSI circuits CS258G Logic synthesis of VLSI circuitsCS258G Logic synthesis of VLSI circuits CS259 High Level Synthesis CS259 High Level Synthesis

Page 6: EE 201C Modeling of VLSI Circuits and Systems Chapter 1 Introduction Instructor: Lei He Email: LHE@ee.ucla.edu

201C Course Outline and Schedule Interconnect and timing modeling (3 weeks)Interconnect and timing modeling (3 weeks)

Interconnect extractionInterconnect extraction Delay modeling and model order reductionDelay modeling and model order reduction Project 1 (model order reduction in Matlab)Project 1 (model order reduction in Matlab)

On-chip timing and integrity (4 weeks)On-chip timing and integrity (4 weeks) Static timing and noise analysis for logic and on-chip interconnectsStatic timing and noise analysis for logic and on-chip interconnects Process variation, stochastic timing, power and noise analysisProcess variation, stochastic timing, power and noise analysis Stochastic power and thermal integrityStochastic power and thermal integrity Project 2 (stochastic modeling in Matlab)Project 2 (stochastic modeling in Matlab)

Beyond-die signal and power integrity (3 weeks)Beyond-die signal and power integrity (3 weeks) Chip-package co-design with signal and power integrityChip-package co-design with signal and power integrity Noise analysis for high-speed signaling and other analog componentsNoise analysis for high-speed signaling and other analog components

Final project: Independent study of selected topicsFinal project: Independent study of selected topics Plus, in-class or video presentations by studentsPlus, in-class or video presentations by students

Page 7: EE 201C Modeling of VLSI Circuits and Systems Chapter 1 Introduction Instructor: Lei He Email: LHE@ee.ucla.edu

Programming Projects Project 1: Matlab coding of PRIMA Project 1: Matlab coding of PRIMA

model order reduction methodmodel order reduction method Majority of program is givenMajority of program is given

Project 2: Matlab coding of stochastic model selected Project 2: Matlab coding of stochastic model selected fromfrom Max operation for timingMax operation for timing Leakage power due to processing variationLeakage power due to processing variation Eye open for high-speed signalingEye open for high-speed signaling Again, majority of codes is givenAgain, majority of codes is given

Page 8: EE 201C Modeling of VLSI Circuits and Systems Chapter 1 Introduction Instructor: Lei He Email: LHE@ee.ucla.edu

Student Presentation

One presentation a week by studentsOne presentation a week by students On-campus program (two students a group)On-campus program (two students a group)

Video may be used if there is not enough time slotsVideo may be used if there is not enough time slots Online MS program (one presentation per student via video)Online MS program (one presentation per student via video) Papers and initial slides draft providedPapers and initial slides draft provided

Final slides and references uploaded to wiki by studentsFinal slides and references uploaded to wiki by students

Page 9: EE 201C Modeling of VLSI Circuits and Systems Chapter 1 Introduction Instructor: Lei He Email: LHE@ee.ucla.edu

Final Project

Independent study of selected topic Independent study of selected topic Could be a single student or a team of studentsCould be a single student or a team of students Topic can be decided anytime, but no later than week 8Topic can be decided anytime, but no later than week 8 One or two “seed” papers providedOne or two “seed” papers provided Develop a report based on literature search or other forms of Develop a report based on literature search or other forms of

independent studyindependent study Up to 12 page report using ACM style Up to 12 page report using ACM style

http://www.acm.org/sigs/pubs/proceed/template.htmhttp://www.acm.org/sigs/pubs/proceed/template.htm Deliver a 30 minute presentation during the finals week, like a Deliver a 30 minute presentation during the finals week, like a

conference talk (video for online program)conference talk (video for online program) Again, reports, references, and video uploaded to wikiAgain, reports, references, and video uploaded to wiki

Page 10: EE 201C Modeling of VLSI Circuits and Systems Chapter 1 Introduction Instructor: Lei He Email: LHE@ee.ucla.edu

References for this Course

Web sitesWeb sites http://eda.ee.ucla.edu/EE201Chttp://eda.ee.ucla.edu/EE201C http://eda.ee.ucla.edu/EE201A-04Spring/index.htmlhttp://eda.ee.ucla.edu/EE201A-04Spring/index.html

Selected papers leading journals and conferencesSelected papers leading journals and conferences Tan and He, “Advanced Model Order Reduction Tan and He, “Advanced Model Order Reduction

Techniques for VLSI Designs”, Cambridge Techniques for VLSI Designs”, Cambridge University Press, pp 1-217, 2006University Press, pp 1-217, 2006

H. Bakoglu, H. Bakoglu, Circuits, Interconnects, and Packaging Circuits, Interconnects, and Packaging for VLSIfor VLSI, Addison Wesley, Addison Wesley

Page 11: EE 201C Modeling of VLSI Circuits and Systems Chapter 1 Introduction Instructor: Lei He Email: LHE@ee.ucla.edu

ACM IEEE Design Automation Conference (DAC)

http://www.dac.com (San Diego, Young student program)

International Conference on Computer Aided Design(ICCAD)

Design, Automation and Test in Europe (DATE)

Asia and South Pacific Design Automation Conference (ASP-DAC)

International symposium on physical design (ISPD)

International symposium on low power electronics and design

International symposium on field programmable gate array

IEEE International Symposium on Circuits and Systems (ISCAS)

Related VLSI CAD Conferences

Page 12: EE 201C Modeling of VLSI Circuits and Systems Chapter 1 Introduction Instructor: Lei He Email: LHE@ee.ucla.edu

IEEE Transactions on CAD of Circuits and systems (TCAD)

IEEE Trans. on VLSI Systems (TVLSI)

ACM Trans. on Design Automation of Electronic Systems (TODAES)

IEEE Transactions on Circuits and Systems (TCAS)

IEEE Trans. on Computer

Related VLSI CAD Journals

Page 13: EE 201C Modeling of VLSI Circuits and Systems Chapter 1 Introduction Instructor: Lei He Email: LHE@ee.ucla.edu

Grading Policy

Two Matlab ProjectsTwo Matlab Projects 50%50%

Course presentationCourse presentation 10%10%

Final projectFinal project 40%40%

A A score > 85 score > 85

Page 14: EE 201C Modeling of VLSI Circuits and Systems Chapter 1 Introduction Instructor: Lei He Email: LHE@ee.ucla.edu

Who should take this course

For students who are motivated toFor students who are motivated to Learn SI, power/thermal, DFM for advanced designsLearn SI, power/thermal, DFM for advanced designs Understand CAD betterUnderstand CAD better Become a CAD professionalBecome a CAD professional