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Types of RF plasma sources
• Old RIE parallel plate etcher (GEC reference cell)
• Inductively coupled plasmas (ICPs)
• New dual frequency capacitively coupled plasmas (CCPs)
• Helicon wave sources (HWS)
UCLA
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Schematic of a capacitive discharge
UCLA
Plasma
Sheath
Sheath
Gas inlet
Gas outlet
Main RF
He coolant
Chuck
Bias RF
Powered electrode
Wafer
Grounded electrode
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The GEC Reference Cell
In the early days of plasma processing, the Gaseous Electronics Conference standardized a capacitive discharge for 4-inch wafers, so that measurements by different groups could be compared.
Brake et al., Phys. Plasmas 6, 2307 (1999)
UCLA
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Problems with the original RIE discharge
UCLA
• The electrodes have to be inside the vacuum
• Changing the power changes both the density and the sheath drop
• Particulates tend to form and be trapped
• Densities are low relative to the power used
• In general, too few knobs to turn to control the ion and electron distributions and the plasma uniformity
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Dual-frequency CCPs are better
UCLA
W. Tsai et al., JVSTB 14, 3276 (1996)
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One advantage of a capacitive discharge
UCLA
GAS INLETS
HOLESRFGLASS SUBSTRATE
Fast and uniform gas feed for depositing amorphous silicon on very large glass substrates for displays (Applied Komatsu)
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Types of RF plasma sources
• Old RIE parallel plate etcher (GEC reference cell)
• New dual frequency capacitively coupled plasmas (CCPs)
• Helicon wave sources (HWS)
UCLA
• Inductively coupled plasmas (ICPs)
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Inductive coupling: The original TCP patent
US Patent 4,948,458, Ogle, Lam Research, 1990
UCLA
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The Lam TCP (Transformer Coupled Plasma)
UCLASimulation by Mark Kushner
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Top and side antenna types
UCLA
US Patent 4,948,458, Fairbairn, AMAT, 1993
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Applied Materials' DPS (Decoupled Plasma Source)
UCLAUS Patent 4,948,458, Fairbairn, AMAT, 1993
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UCLA
What the DPS looks like
Outside
Inside
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Other antennas in AMAT patent
UCLA
US Patent 4,948,458, Fairbairn, AMAT, 1993
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B-field pattern comparison (1)
UCLA
-30
-20
-10
0
10
20
30
-30 -20 -10 0 10 20 30
-30
-20
-10
0
10
20
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-30 -20 -10 0 10 20 30
Horizontal strips Vertical strips
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B-field pattern comparison (2)
UCLA
-30
-20
-10
0
10
20
30
-30 -20 -10 0 10 20 30
-30
-20
-10
0
10
20
30
-30 -20 -10 0 10 20 30
3 close coils 2 separate coils
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B-field pattern comparison (3)
UCLA
-30
-20
-10
0
10
20
30
-30 -20 -10 0 10 20 30
Lam type AMAT type
-20
-15
-10
-5
0
5
10
15
20
-20 -15 -10 -5 0 5 10 15 20
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How do ICPs really work?
0
z (c
m)
0
2
4
6
8
10
12
-5 0 5 10 15 20r (cm)
n (1
010
cm
-3)
800
240
200
Prf(W)3 mTorr, 1.9 MHz
In MEMs etcher by Plasma-Therm (now Unaxis), density is uniform well outside skin depth
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UCLAIn the plane of the antenna, the density peaks well
outside the classical skin layer
0
1
2
3
0 5 10 15r (cm)
n (1011 cm-3)
KTe (eV)
RF Bz field skin depth
Data by John Evans
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Anomalous skin effect (thermal motions)
UCLA
x
x
x
x
x
Jo
J
B
skin wall
antenna
E.g., Kolobov and Economou, Plasma Sources Sci. Technol. 6, R1 (1997).Most references neglect collisions and curvature.
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Nonlinear effects have been observed
UCLA
Collisionless power absorption
(Godyak et al., Phys. Rev. Lett. 80, 3264 (1998)
Second harmonic currents
Smolyakov et al., Phys. Plasmas 10, 2108 (2003)
Ponderomotive force
Godyak et al., Plasma Sources Sci. Technol.
10, 459 (2001)
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Electron trajectories are greatly affected by the nonlinear Lorentz force
0
180
360
540
720
900
1080
1260
RF phase(degrees)
Skin depth
with FL
without FL
dm e
d t
vE v B
F L UCLA
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Without FL, electrons are fast only in skin
0
20
40
60
80
0 360 720 1080 1440Phase (degrees)
E (
eV)
with V x B
no V x B
Argon ionization threshold
Reason: The radial FL causes electrons to bounce off the sheath at more than a glancing angle.
UCLA
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Electrons spend more time near center
UCLA
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UCLA
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 5 10 15r (cm)
Re
lativ
e d
en
sity
Density profile in four sectors of equal area
Points are data from Slide 5
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Disadvantages of stove-top antennas
UCLA
• Skin depth limits RF field penetration. Density falls rapidly away from antenna
• If wafer is close to antenna, its coil structure is seen
• Large coils have transmission line effects
• Capacitive coupling at high-voltage ends of antenna
• Less than optimal use of RF energy
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B-field pattern comparison (2)
UCLA
-30
-20
-10
0
10
20
30
-30 -20 -10 0 10 20 30
-30
-20
-10
0
10
20
30
-30 -20 -10 0 10 20 30
3 close coils 2 separate coils
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Coupling can be improved with magnetic cover
UCLA
H H
H H
B B
E
H = J
B = H
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Four configurations tested
Meziani, Colpo, and Rossi, Plasma Sources Science and Technology 10, 276 (2001)
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The dielectric is inside the vacuum
Meziani, Colpo, and Rossi, Plasma Sources Science and Technology 10, 276 (2001)
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Iron improves both RF field and uniformity(Meziani et al.)
0 1 2 3 4 5 6 7 8 9 10 11 120
1
2
3
4
5
6
7
700 W
100 W
700 W
100 W
w.o. magnetic pole (C1) w. magnetic pole (C2)
Br (
Ga
uss)
Irms
(A) 0 2 4 6 8 102
10
20
40Argon30 mtorr, 600 W
2 turn coil 2 turn coil + mag. pole Spiral MaPE
Ji (
mA
/cm
2 )
r (cm)
Magnetic material
2 loops in //
2 serpentines in //
3 loops in //
1 2 3 4 5 6 7 8 9
X (cm)
Y (cm)
110 mm 800 x 800 mm
750 x720 mm
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Magnets are used in Korea (G.Y. Yeom)
SungKyunKwan Univ. KoreaSungKyunKwan Univ. Korea
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Both RF field and density are increased
4006008001000120014001600180020002200
2.0x1010
4.0x1010
6.0x1010
8.0x1010
1.0x1011
1.2x1011
Without magnetic fields With magnetic fields
Ni (Ion Density /cm
3 )
RF power(Watts)
0 500 1000 1500 2000
100
200
300
400
500
600
700 Antenna type=serpentine(7m)Operating pressure=15mTorr
Vrm
s (V
olts
)
Input power (W)
No multipolar magnetic fields With multipolar magnetic fields
SungKyunKwan Univ. KoreaSungKyunKwan Univ. Korea
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Serpentine antennas(suggested by Lieberman)
Plasma ApplicationModeling GroupPOSTECH
Magnets
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Density uniformity in two directions
0 10 20 30 40100
150
200
250
300
350
400
450
500
550
600
1000W RF Input power 1500W RF Input power 2000W RF Input power
Ion
Satu
ratio
n C
urr
ent (1
0-6A
)
Position, Parallel to the antenna (cm)
-30 -20 -10 0 10 20 3050
100
150
200
250
300
350
400
450
500
Ion S
atu
ration
Curr
ent(
10
-6A
)
Probe Position (cm)
1000W RF Input Power 1500W RF Input Power 2000W RF Input Power
G.Y. Yeom, SKK Univ., Korea
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Effect of wire spacing on density
7.2cm
7.8cm
9cm
10.2cm
11.4cm
13.2cm
0
2 E + 0 1 0
4 E + 0 1 0
6 E + 0 1 0
8 E + 0 1 0
1 E + 0 1 1
1 E + 0 1 1
1 E + 0 1 1
Plasma ApplicationModeling GroupPOSTECH
Park, Cho, Lee, Lee, and Yeom, IEEE Trans. Plasma Sci. 31, 628 (2003)
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Godyak: All RF lamps use iron cores
UCLA
Philips QL Lamp: 2.65 MHz, 85W (equiv. to 350W lamp)
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Types of RF plasma sources
• Old RIE parallel plate etcher (GEC reference cell)
• Inductively coupled plasmas (ICPs)
• New dual frequency capacitively coupled plasmas (CCPs)
• Helicon wave sources (HWS)
UCLA
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A LAM Exelan oxide etcher
Plasma ApplicationModeling GroupPOSTECH
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A dual-frequency CCP
UCLA
27 MHz
2 MHz
Thin gap. Unequal areas to increase sheath drop on wafer
High frequency controls plasma density
Low frequency controls ion motions and sheath drop
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Most of volume is sheath
UCLA
• Electrons are emitted by secondary emission
• Ionization mean free path is shorter than sheath thickness
• Ionization occurs in sheath, and electrons are accelerated into the plasma
• Why there is less oxide damage is not yet known
Large electrode
Small electrode
PLASMA
Sheath
Sheath
E
E
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(a) (b)
(c) (d)
0 20 40 600
10
20
30
40
50
60
70
Pla
sma
den
sity
(p
eak
valu
e), (
1016
m-3)
Frequency (MHz)
0 20 40 60
0,2
0,4
0,6
0,8
1,0
Sh
eah
wid
th (
cm)
Frequency (MHz)
The density increases with frequency squared
Density Debye length
Reason: The rf power is I2R, where I is the electron current escaping through the sheath. Since one bunch of electrons is let through in each rf cycle, <Irf> is proportional to .
Plasma ApplicationModeling GroupPOSTECH
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Effect of frequency on plasma density profiles
0,030 0,035 0,040 0,045
1013
1014
1015
1016
1017
45 mTorr 13.56 MHz 800 VC
on
cen
trat
ion
(m
-3)
r (m)
13.56 MHz
0,030 0,035 0,040 0,045
1013
1014
1015
1016
1017
45 mTorr 27 MHz 800 V
Co
nce
ntr
atio
n (
m-3)
r (m)
27 MHz
0,030 0,035 0,040 0,045
1013
1014
1015
1016
1017
45 mTorr 40 MHz 800 V
Co
nce
ntr
atio
n (
m-3)
r (m)
40 MHz
0,030 0,035 0,040 0,045
1013
1014
1015
1016
1017
45 mTorr 60 MHz 800 V
Co
nce
ntr
atio
n (
m-3)
r (m)
60 MHz
Plasma ApplicationModeling GroupPOSTECH
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Effect of frequency on IEDF at the smaller electrode
13.56 MHz27 MHz
40 MHz 60 MHz
(a) (b)
(c) (d)
Plasma ApplicationModeling GroupPOSTECH
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IEDF at Wall – Pressure Variation
10 mTorr10 mTorr 20 mTorr20 mTorr
50 mTorr50 mTorr30 mTorr30 mTorr
Plasma ApplicationModeling GroupPOSTECH
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Types of RF plasma sources
• Old RIE parallel plate etcher (GEC reference cell)
• Inductively coupled plasmas (ICPs)
• New dual frequency capacitively coupled plasmas (CCPs)
• Helicon wave sources (HWS)
UCLA
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A helicon source requires a DC magnetic field..
U. Wisconsin
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...and is based on launching a circularly polarized wave in the plasma
UCLA
+
_+
_ _
+
+ +
_ _
_
B
k
(a)
(b)
(c)
+
• Much higher density at given power than ICPs
• Density peak occurs downstream from the antenna
• Magnetic field provides adjustment for uniform density
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Axial density and temperature profiles
UCLA
Density increases greatly as B-field is added.
The density peak is detached from the source.
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Two commercial helicon reactors
UCLAThe Boswell source
The PMT (Trikon) MØRI source
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The Coil Current Ratio shapes the plasma
UCLAThe MØRI source
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How do helicon source really work?
UCLA
A cyclotron (TG) wave at the surface rapidly damps the RF energy
0
1000
2000
3000
4000
5000
0.00 0.01 0.02 0.03 0.04 0.05r (m)
P(r
)
0
2
4
6
8
10
12
14
-6 -4 -2 0 2 4 6r (cm)
J z (a
rb. u
nits
)
4.2
4.2
no TG
n (1011)
40G(b)
Typical radial deposition profile
Direct detection of the TG peak in the RF current
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There are actually 2 types of helicon discharges
UCLA
The Big Blue Mode The Low Field Peak
B > 800G, n > 1013 cm-3
Due to an neutral depletion instability
No important application yet
Low density, low B-fieldIdeal for plasma processing
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Reflection from end causes the L.F. peak
UCLA
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A 7-tube array of stubby helicon sources
UCLA
UCLA
ROT AT ING PROBE ARRAY
PERMANENT MAGNETS
3"
DC MAGNET COIL
18"
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Gives good uniformity and high density
UCLA
Power scan at z = 7 cm, 5 mT A, 20 G, 13.56 MHz,
0.0
0.5
1.0
1.5
2.0
0 5 10 15 20 25 30R (cm)
N (
101
2 cm
-3) 3.0
2.5
2.0
1.5
1.0
P(kW)
7-tube m=0 array
ARGON
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2-D density scans show no m = 6 asymmetry
UCLA
-20 -10 0 10 20-20
-10
0
10
20
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Helicon tools have been modeled
MØRI tool: Kinder and Kushner, JVSTA 19, 76 (2001)
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TG mode is seen
Bose, Govindan, and Meyyappan, IEEE Trans. Plasma Sci. 31, 464 (2003)
Power deposition
Plasma density
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What next for RF sources?
UCLA
• Control of KTe, species production, ion velocities
— Electron filtering, pulsed plasmas, gas feed and pumping, additive gases to absorb electron groups, shaped bias voltage, electronegative optimization. etc.
• Understanding and eliminating oxide damage
• Large area sources for FPDs, not wafers
• Eventual widespread adoption of helicon sources
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