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Page 1: Thermo-Mechanical Simulations of a Copper-to-Copper Direct …ws2.binghamton.edu/park/posters/ECTC2013_Poster_AY.pdf · 2014. 5. 15. · Thermo-Mechanical Simulations of a Copper-to-Copper

Thermo-Mechanical Simulations of

a Copper-to-Copper Direct Bonded 3D TSV Chip Package Interaction Test Vehicle

Ah-Young Park1, Daniel Ferrone1, Stephen Cain1, Dae Young Jung1, Bruce T. Murray1, Seungbae Park1, Klaus Hummler2

1 State University of New York at Binghamton, Binghamton, NY, USA 2 SEMATECH, Albany, NY, USA

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