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SWOT of Discrete LAN transformer for 10/100/1G-base-T
Inductive Chip LAN TransformerConductive Chip LAN Transformer
Date: 2021/04/19
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SWOT comparing to Conventional T core
2
Strength• 25 years OBM of power transformer• 15 years OEM of conventional LAN transformer• Experienced sales group on transformer &
passive component• Strong RD & AE/FAE technical service• Investment of LAN transformer SMD automatic
Wiring/Assembly (2020’4E)
Opportunity• 1G LAN transformer cost down pressure• Customer designer start adopting the Capacitive
coupled solution for LAN port protection• Coming 2.5G ethernet networking market• 10G/5G still not auto-wiring design in T core,
profit margin high & worthy to approach
Weakness• High-Pot limited around 1.2KV• Magnetic material limited to NiZn ferrite, costing
more wiring turns to meet the inductance of T core design
• Low profile design is difficult• Machines expansion need more capital expense
Threat• Potential players/competitors: current
inductor/CMC players• The T core process tends to break-through of the
automation of wire wrapping
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Why YSE
3
Company• Existing power transformer vender/manufacture• New member in Conventional LAN transformer market
Product scope/span• Power transformer• Lan transformer• RF transformer• EMC choke• RF inductor
Service• Experienced sales group on transformer & passive component• Strong technical pre/post service• Plenty of instrument & design software for design & FAE support
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Process difference & migration of LAN transformer
Toroid Core process (higher labor cost) Drum Core automation process
SMT & assemblyOn PCB (pin-to-pin)
COB & PCB substrate saving
High labor percentageon assembly of wired core in package case
4
Inductive chip LAN Capacitive chip LAN
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Patented core structure of Auto-wiring SMD lan transformer
5
Size: 4732(MP) 3532 (U/D)
Automation design/manufacturewith less labor’s uncertainty
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• Transformer designwith conventional transformer module
• Transformerless designwith DC blocking discrete capacitors
Two LAN solutions recommended by IC reference design (Intel/TI)- Transformer (Inductive coupled)- Transformerless (Capacitive coupled)
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Inductive Chip LAN solutions for ethernet-1G base-T
• Discrete T1&T2/pair• Size, T1:4532, T2:2012• Chip on board (COB)
T1 T2
T1
T1: Transformer/low freq. EMCT2: CMC for high freq. EMC
T2
+
7
T1T2
T1 T2COB scheme
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Capacitive Chip LAN solutions for ethernet-1G base-T
• Discrete T3/T2 & 2*capacitor/pair• Size, T3:3216, T2:2012/1210• Chip on board (COB)
T1 T2
CAP T2
T3
T1: TransformerT2: CMC for high freq. EMCT3: CMC for low freq. EMC/ESD/Surge (Auto-transformer-like)
Capacitance=33~100nFBV > 50V
8
=
CT pin
T3 T2 CAPCOB scheme
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Discrete LAN solutions guide for 10/100&1G
9
SMD inductive LAN
SMD capacitive LAN
We can help co-layout service
1G 10/100
1G`
BOM cost for 10/100 & 1Gare easily to be counted!
• 4 pairs for 1G/2.5G/5G/10G
• 2 pairs for 10/100
COB scheme
COB scheme
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5001 10 100Frequency (MHz)
RF_performance_Sdd11_Sdd21_Scc21
-70
-60
-50
-40
-30
-20
-10
0
200 MHz100 MHz40 MHz 400 MHz125 MHz 250 MHz
T core vs, Inductive chip LAN
Conventional T core (1G) Discrete T1/T2 (1G)
5001 10 100Frequency (MHz)
RF_performance_Sdd11_Sdd21_Scc21
-70
-60
-50
-40
-30
-20
-10
0
200 MHz100 MHz40 MHz 400 MHz125 MHz 250 MHz
10
No guarantee at CMRRDue to high order EMI band may failCaused by T2 wiring by hand-made
IND chip LAN have deepCMRR at lower EMI band& T2 changeable for firm higher band EMI
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Inductive chip LAN 2.5G/1G
Discrete T1/T2 (2.5G) Discrete T1/T2 (1G)
5001 10 100Frequency (MHz)
RF_performance_Sdd11_Sdd21_Scc21
-70
-60
-50
-40
-30
-20
-10
0
200 MHz100 MHz40 MHz 400 MHz125 MHz 250 MHz
11
5001 10 100Frequency (MHz)
RF_performance_Sdd11_Sdd21_Scc21
-70
-60
-50
-40
-30
-20
-10
0
200 MHz100 MHz40 MHz 400 MHz125 MHz 250 MHz
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Inductive chip LAN 5G/2.5G
Discrete T1/T2 (2.5G) Discrete T1/T2 (5G)
12
5001 10 100Frequency (MHz)
RF_performance_Sdd11_Sdd21_Scc21
-70
-60
-50
-40
-30
-20
-10
0
200 MHz100 MHz40 MHz 400 MHz125 MHz 250 MHz
5001 10 100Frequency (MHz)
RF_performance_Sdd11_Sdd21_Scc21
-70
-60
-50
-40
-30
-20
-10
0
200 MHz100 MHz40 MHz 400 MHz125 MHz 250 MHz
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Inductive chip LAN 5G/10G
Discrete T1/T2 (10G) Discrete T1/T2 (5G)
13
5001 10 100Frequency (MHz)
RF_performance_Sdd11_Sdd21_Scc21
-70
-60
-50
-40
-30
-20
-10
0
200 MHz100 MHz40 MHz 400 MHz125 MHz 250 MHz
5001 10 100Frequency (MHz)
RF_performance_Sdd11_Sdd21_Scc21
-70
-60
-50
-40
-30
-20
-10
0
200 MHz100 MHz40 MHz 400 MHz125 MHz 250 MHz
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T core vs, Cap chip LAN
Conventional T1+T2 module CAP LAN(1G), right T2 CMC
5001 10 100Frequency (MHz)
RF_performance_Sdd11_Sdd21_Scc21
-70
-60
-50
-40
-30
-20
-10
0
200 MHz100 MHz40 MHz 400 MHz125 MHz 250 MHz
14
5001 10 100Frequency (MHz)
RF_performance_Sdd11_Sdd21_Scc21
-70
-60
-50
-40
-30
-20
-10
0
200 MHz100 MHz40 MHz 400 MHz125 MHz 250 MHz
CAP chip LAN a little marginat band edge of EMI band
No guarantee at CMRRDue to high order EMI band may failCaused by T2 wiring by hand-made
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CAP LAN(1G), right T2 CMC CAP LAN(1G), poorer T2 CMC
15
5001 10 100Frequency (MHz)
RF_performance_Sdd11_Sdd21_Scc21
-70
-60
-50
-40
-30
-20
-10
0
200 MHz100 MHz40 MHz 400 MHz125 MHz 250 MHz
5001 10 100Frequency (MHz)
RF_performance_Sdd11_Sdd21_Scc21
-70
-60
-50
-40
-30
-20
-10
0
200 MHz100 MHz40 MHz 400 MHz125 MHz 250 MHz
CMRR pooer & over spec (30dB)at CE/RE band