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Great Asia Machinery Co., LTD.
SUNUP High Tech Co., LTD.
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Company Background
• The Sunup Tech Corp. was established in 2006 teamed up with a group of experienced engineers in Semiconductor and Optical-electro industry. We focus on the Semi-con and Optoelectronics supplies, spare parts and equipment maintenance.
• The Great Asia Machinery was established in 1997 and earlier on focused on die make and custom-made machinery manufacturing. Now, the Great Asia Machinery has already stepped in the high-tech industry to design and build-up various equipment and will continue to develop relative equipment in solar cell and flexible display fields.
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Company Organization
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Business Direction Machine Design
Semi-Con and Optical-electro equipment
$50,000 ~100,000 USD Sputtering and Thermal Evaporation
Used Equipment and Maintenance Service
Vacuum Pump Repair:Dry Pump、Oil Pump
Power Supply Repair:DC、RF、Pulse-DC、MF
Used Parts:Gauge、Controller
used vacuum equipment and spare parts imported from Japan,Europe
and America
International Trade and Agency Business
TFT-LCD, LED illumination build-in switch power supply
TFT-LCD Color Filter Glass Polishing Pad
Original creative Invention
original vacuum gate valve
Solar-cell Equipment, Process, Materials, Patent
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Primary Business
Vacuum chamber and equipment manufacturing
CNC machine workshop
3D modeling
Equipment maintenance
Vacuum system spare parts
Semiconductor equipment spare parts
Optoelectronics spare parts
Equipment assembly ODM&OEM
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System Design and Reference
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• Electron Cyclotron Resonance Plasma CVD
(ECRCVD)
• IC Mask Testing Equipment
• Ultra High Vacuum E-Gun Evaporation
• Vacuum Hot Press Furnace
• Vacuum Bonding System
• Nano Ball Mill
Equipment System Design
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Electron Cyclotron Resonance
Plasma CVD (ECRCVD)
Specification
Plasma Source:Electron Cyclotron Resonance
Plasma
Substrate Plate Size:300mm*300mm
Microwave Spec.:2.45GHz、2.5KW
Heating Plate Max. Temp:7000C
Vacuum < 1*10-6 torr
Process Gas:CH4、H2、N2、O2、Ar、He
Process Gas Max. Flow:300 sccm
Application
PECVD:Silicon Thin Film Solar Cell
Dry Etch : Semiconductor
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IC Mask Testing Equipment
Specification:
Particle count: <0.5μm, <5ea
Pressure:
Vacuum pressure: 8*10-3 torr
Saturated pressure: 2 atm
Vacuum pressure deviation while process on ±0.1% FS
Gases injected:
Non-corrosive gases: PN2, CDA (or Ar)
Corrosive gases: NH3, SO2, H2S
Full scale flow rate: 2000 sccm MFC (minimum flow rate: 1% full scale)
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Ultra High Vacuum E-Gun Evaporation
Specification:
Vacuum < 10-9 torr。
Robot system
load-lock chamber
main chamber
IR Lamp annealing in the load-lock chamber
substrate holder rotation system (0~15rpm)
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Vacuum Hot Press Furnace
Specification:
Vacuum < 10-3 torr。
Temperature Control System by Japan RKC
Programmable Control
Electronic Control System by Mitsubishi PLC
Controller
Application:
Ceramic Powder sintering
Sputtering material sintering
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Vacuum Bonding System
Application:
Diffusion Bonding
Ceramic Bonding
Ceramic / Metallic Bonding
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Parts Service
• We specialize in equipment parts/module
repair and part manufacturing for the
processes of thin film and etching in
Semiconductor, as the processes in Opto-
electronics.
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Parts Design
Source Materials Selection for Vacuum Application &
Different Modules in Semiconductor & Opto-
electronics.
Geometric Dimensioning and Tolerance System
Complies with ANSI, JIS & CNS Standards.
Fabrication Standard Recommended.
Heat Treatment Recommended(Annealing, Firing….)
Surface Treatment(Ni,Cr,Au,Ag,Cu,Ti,Al…coated &
Anodization)
Jig & Fixture Design for Fitting & Assembly.
AutoCAD Drawing Available.
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Vacuum Equipment Parts
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Gate Valve
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Engineering Plastics Parts
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Shower Pipe
Vespel Screw Vespel Ring
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Metal(Alloy)
Stainless Steel (SUS 316 , 316L, 304…)
Al, Ti, W, Mo, Cu, Fe, Ni……
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Ti Alloy Deposition Ring 8 inch SUS 316 Clamp
8 inch Al Alloy Sputtering Chamber 6 inch Al Alloy Chuck
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8 inch Al Alloy Sputtering Collimator 6 inch Al Alloy Sputtering Collimator
8 inch Al Alloy Sputtering Collimator 6 inch Al Alloy Shower Head
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8 inch Al Alloy Shower Head 6 inch SUS 316 Front Side Substrate Holder
8 inch SUS Back Side Substrate Holder SUS304 5 inch wafer Evaporation Done
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Evaporation: Free oxide Copper
Source Crucible Assembly Inconel 750 Washer
Evaporation: Free oxide Copper
Source Crucible Assembly SUS 304 Symmetry Clamp
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In Line Sputtering:AET Mask In Line Sputtering:Floating Mask
In Line Sputtering:Ground Shield AET Plane
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Carrier Plate Mask
Mask Holder TRAY
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Ceramic Parts
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Ceramic Bearing
• Ceramic Ball:Si3N4、ZrO2
• Ceramic Ring Material:Si3N4、ZrO2
•Type:6000,6001,6002,6003,6004,6005,6006,6007,6200,6201,6202,6203,6204,6205,6206,6207,6208,6300,6301,6302,6303,6304,6800,6801,6802,6803,6804,6805,6806,6807 and Custom-made
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Machine Workshop
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Machines:
– CNC Machining Centers
– CNC Lathe
– CNC Wire Cutting Machine
– CNC Electric-Discharge Machine(EDM)
– Grinding & Polishing Machine
Machined Parts Via Precision Manufacturing with
Optima Positioning Accuracy:
– Dimensional (Displacement) Accuracy within 0.05mm
– Dimensional (Planar) Accuracy within 0.05mm
– Dimensional (Volumetric) Accuracy as Required
Secondary Machining of Parts within Specified &
Tight Tolerance
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CNC Machining Centers
Facility 1:
CNC Machining Center
Capacity: 850mm * 520mm
Facility 2:
CNC Machining Center
Capacity : 1300mm * 750mm
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Facility 3:
CNC Machining Center
Capacity : 2100mm * 1800mm
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CNC Lathe
Facility 4 : CNC Lathe
Facility5 : CNC Lathe
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Machine
Facility6:
Electric-Discharge Machine
(EDM)
Facility7:
CNC Wire Cutting Machine
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Machine
Facility8:
Horizontal Grinding Machine
Facility9:
High Speed Lathe
Capacity: 430mm * 1100mm
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Machine
Facility10:
High Speed Milling
Capacity: 500mm * 1100mm * 400mm
Facility11:
Horizontal Lathe & Milling Machines
Capacity: 1000mm * 2000mm * 80mm
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Welding Facility
Facility1:
TIG WELDING MACHINE
Facility2:
MIG WELDING MACHINE(CO2)
Facility3:
Plasma cutting machine
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Surface Treatment
Ceramic Materials Thermal Spraying
- Any materials
Electroplating
Anodization
- Only for Aluminum Material
Polishing - Electropolish
- Chemical
- Mechanical
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Vacuum Leak Test
• Helium Detector
– ULVAC HELIOT 700
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Certificates of Quality System