STMicroelectronics presentation
Packaging services
SEMI Packaging Tech Seminar
Nanium Portugal, June 18th 2015
Who we are 2
As of December 31, 2014
Listed on New York Stock Exchange,
Euronext Paris and Borsa Italiana, Milano
• A global semiconductor leader
• 2014 revenues of $7.40B
• Approximately 43,600 employees worldwide
• Approximately 8,700 people working in R&D
• 11 manufacturing sites
Where you find us 3
Our automotive products
are making driving safer,
greener and more
entertaining
Our smart power products
are allowing our mobile products to operate longer
and making more of our energy resources
Our MEMS & Sensors
are augmenting
the consumer experience
Our Microcontrollers
are everywhere
making everything smarter
and more secure
Our digital consumer products
are powering the augmented
digital lifestyle
Packaging R&D sites
Grenoble - France Kirkop - Malta
Corporate Packaging and Automation / Packaging R&D sites
(France, Italy, Malta, Singapore, Philippines, China)
Agrate - Italy
Calamba - Philippines
Toa Payoh - Singapore
4
Agrate
Grenoble
CPA - China
Kirkop CPA-China
Calamba
Toa Payoh
Packaging Platforms 5
Leadframe
package
Laminate substrate
package (BGA)
MEMS & sensors
package
Wafer level
package / 3D
WL
Camera
6
BGA (Ball Grid Array) Platform Development
& Advanced Packaging R&D – ST Grenoble, France
• Assembly Process R&D
• Low k/ Ultra Low k Packaging solutions
• Package Design & BGA Substrate Technology
• New Product / Packaging Project Management
• Package Electrical Modeling & Measurement
• Assembly Design Rules Management
• 3D Advanced Packaging
• Wafer Level Solutions
Copper wire dev.
For low k wafers
3D TSV assembly
(ST & Leti)
Flip-Chip dev.
For low k wafers
Ceramic, BGA (Ball Grid Array)
& Advanced Packaging Prototyping – ST Grenoble, France
• Best in class cycle time with
Fab/EWS/Package test proximity
• 1000m² clean room facilities
• Class 10K to class100
• Thin wafers < 100um
• Wire Bonding @ 36um pitch
• Fine Pitch Flip-Chip assembly @
80um (D2substrate) 40um (D2D)
• 0.3mm BGA ball pitch
Laminate
& ceramic packages
12 inches wafer
size capability
SIP capability
including
01005 SMD & FC
3D TSV assembly
Now open for external customers
ST Grenoble – External offer 8
Package
Design
Modeling
Assembly Package test
Package
reliability/
Physical
analysis
9
ST Gnb assembly pilot line– packages portfolio
PBGA WB 27² & 35²
Heat spreader
BGA Matrix& Single
FC & Stud bump
Matrix BGA WB
Matrix BGA SIP
WB and/or FC
Ceramic WB
Gel or waffle pack
service
Backgrinding &
Sawing service
WB: Wire Bonding, FC: flip-Chip
Package Interconnections 10
BGA, 3D die to die, 3D die to wafer
Process Mass Reflow
process
Thermo
Compression
Process
Thermo
Compression
Process
Thermosonic
Process (GGI)
Bumping
capability No No Yes Yes
Bump /
Process
Solder bump +
CUF Copper
pillar + CUF
Copper pillar
+ NCP
Gold stud bump
+ NCP Gold stud bump
Flip-Chip
Wire Bonding Stacked dies
ST Grenoble external offer
• Complete offer
• High expertise
• Advanced process capability
11
• Cycle time
• Flexibility
• Security/ Traceability