C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
SOLSTICE Advanced Electropla/ng Tools
for the Rest of Us
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C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
The big equipment manufacturers focus on big leading-‐edge 300mm tools — which are too expensive for many users Many users just need a good solid tool that’s designed for ≤200mm substrates… At a much more affordable price!
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Addressing a major problem in the equipment industry…
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
New SolsHce plaHng systems address those needs specifically
U/lizing today’s advanced technology Addressing 200mm and smaller substrates And with significantly reduced pricing — Half compared with the Big Guys!
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C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
Three complementary SolsHce tools:
Model LT for Development
2 Chambers
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Model S8 for Volume ProducHon
4-‐6-‐8 Chambers
Model S4 for ProducHon
4 Chambers
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
SolsHce LT — A powerful plaHng development tool
Manual wafer load/unload
Automated recipe execu/on
4-‐inch to 8-‐inch wafer capability
One or two chambers and chemistries
Chambers and soWware match S4/S8
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C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
SolsHce S4 and S8 — Automated volume producHon tools
CasseZe-‐to-‐casseZe automa/on
Up to 75wph throughput
Automated recipe execu/on
Up to 8 chambers and chemistries
4-‐inch to 8-‐inch wafer capability
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C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
SolsHce gives major advantages over wet bench plaHng
BeZer wafer uniformity
Less wafer-‐to-‐wafer varia/on
Reduced scrap
Less human exposure to chemicals
Faster pla/ng rates
Higher yields
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C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
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SolsHce serves many market sectors that use ≤200mm substrates
MEMS
LEDs
Sensors
Power
RF
Photonics
Wafer Level Packaging
Analog / Discrete
Automo/ve
And more…
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
Applying today’s technology to today’s process needs
Ni, Cu, Au, Sn, Ag, Alloys
Cu RDL, Cu Pillar, Cu Damascene
TSV Fill, Cu or NiW
Au Pads and Contacts, Cyanide or Sulfite
Lead-‐free Solders
Indium, Permalloy, Exo/cs
Electroly/c, Electroless and Anodiza/on
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C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
SolsHce is Demonstrated at ClassOne’s world-‐class applicaHons and product development lab
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C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
Designed and driven by a world-‐class team of wet processing professionals
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Win Carpenter VP, Sales
27+ yrs wet processing
Byron Exarcos President
11+ yrs wet processing
Tim McGlenn VP, Development 26+ yrs wet processing
Kevin Witt VP, Technology
11+ yrs wet processing
Dean Campbell VP, Manufacturing 20+ yrs wet processing
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
Backed by world-‐wide sales and support
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Atlanta, GA
Kalispell, MT London, UK
Singapore
Shanghai, China
Israel
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
SolsHce: A unique new class of plaHng tools that deliver…
The performance you need At a price you can afford!
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