Download - PCB Manufacturer China-Hpcb.com
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Pre-engineering
Pattern imaging
Etching
Laminating
Drilling
Cu plating
Hole plugging
Pattern imaging
Lamination
Laser Ablation
Mechanical drilling
Pattern imaging
Cu plating
Solder Mask
Surface Finished
Routing
Visual inspection
Electric test
Shipping
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Pre-engineering
Pattern imaging
Etching
Laminating
Drilling
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Desmear
Cu plating
Hole plugging
Cu plating
Belt Sanding
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Lamination
Laser Ablation
Mechanical drilling
Cu plating
Pattern imaging
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Solder Mask
Gold plating
Routing
Electrical test
Pattern imaging
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Hole counter
Shipping
Visual inspection
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* Raw material (Thin Core,Copper,Prepreg...)
Raw MaterialRaw MaterialRaw MaterialRaw Material :::: FRFRFRFR----4 (4 (4 (4 (Difuntional,TetrafuntionalDifuntional,TetrafuntionalDifuntional,TetrafuntionalDifuntional,Tetrafuntional))))
SupplierSupplierSupplierSupplier : EMC ,Nan: EMC ,Nan: EMC ,Nan: EMC ,Nan----YaYaYaYa
Sheet sizeSheet sizeSheet sizeSheet size : 36: 36: 36: 36*48*48*48*48 , 40, 40, 40, 40*48*48*48*48 ,42,42,42,42*48*48*48*48
Core ThicknessCore ThicknessCore ThicknessCore Thickness : 0.003: 0.003: 0.003: 0.003,0.004,0.004,0.004,0.004,0.005,0.005,0.005,0.005,0.006,0.006,0.006,0.0060.0080.0080.0080.008,0.010,0.010,0.010,0.010,0.012,0.012,0.012,0.012,0.015,0.015,0.015,0.015
0.0210.0210.0210.021,0.031,0.031,0.031,0.031,0.039,0.039,0.039,0.039,0.047,0.047,0.047,0.047
Copper FoilCopper FoilCopper FoilCopper Foil : 1/3: 1/3: 1/3: 1/3 oz,1oz,1oz,1oz,1/2/2/2/2 oz,1.0oz,1.0oz,1.0oz,1.0 oz,2oz,2oz,2oz,2 ozozozoz
PrepregPrepregPrepregPrepreg typetypetypetype : 1080,2113,2116,1506,7628,7630: 1080,2113,2116,1506,7628,7630: 1080,2113,2116,1506,7628,7630: 1080,2113,2116,1506,7628,7630
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1. Innerlayer (THIN CORE)
Laminate
Copper Foil
( )
COPPER FOILCOPPER FOILCOPPER FOILCOPPER FOIL
Epoxy GlassEpoxy GlassEpoxy GlassEpoxy Glass
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Photo ResistPhoto ResistPhoto ResistPhoto Resist
2. Dry Film Resist Coat
(/)
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Photo ResistPhoto ResistPhoto ResistPhoto Resist
3. Inner Artwork Expose
ArtworkArtworkArtworkArtwork
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4. Inner layer immage Develop
Photo ResistPhoto ResistPhoto ResistPhoto Resist
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5. Inner Layer Etch
Photo ResistPhoto ResistPhoto ResistPhoto Resist
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6. Inner Layer Strip Resist
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7. Oxide Coating
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8. Lay-up Building
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9. Lamination
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.
.
.
0.5
,4
0.
,4
0.5
10101010----12121212
0.5
,4
0.
,4
0.5
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10. NC Drilling
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0
11. Desmear & Copper Deposition
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12. Hole Plugging
13. Belt Sanding
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14. Copper ReductionOption
15. Belt SandingOption
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16. Dry Film Lamination (Outer layer)
Photo
Resist
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17. Outerlayer Expose
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18. After Exposed
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19. Outerlayer Develop
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20. Etch
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20. Strip Resist
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21. Build-up Layer Lamination
RCCRCCRCCRCC((((RRRResinesinesinesin CCCCoatedoatedoatedoated CCCCopperopperopperopperfoil)foil)foil)foil)
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ArtworkArtworkArtworkArtwork
ArtworkArtworkArtworkArtwork
22. Conformal Mask
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23.Conformal Mask
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24. Conformal Mask (for Etching)
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25. Conformal Mask
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26. Laser Ablation and NC Drilling
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(...)
Laser Microvia(Blind Via)
27. Mechanical Drill
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28. Desmear & Copper Deposition
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29. Outerlayer Pattern imaging)
)
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30. Solder Mask Process
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HPCB94V-0
R305
31. S/M Developing
32. Legend Printing
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33. Electroless Ni/Au , HAL_lead free and Etc.
R305
HPCB94V-0
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R305
34. Outline Profile and Electrical Testing
HPCB 94V-0
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R305
R305
36. Final Inspection
37. O.S.P. (Entek plus Cu_106A.)
HPCB 94V-0
HPCB 94V-0
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&
A = THROUGH VIA HOLE
B = BURIED VIA HOLE
C = One Level Laser Blind Via
&
D = Two Level Laser Via
BBBB----STAGESTAGESTAGESTAGE
FR-4 Core
FR-4 Core
BBBB----STAGESTAGESTAGESTAGE
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A = THROUGH VIA HOLE
B = BURIED VIA HOLE
C = BLIND VIA HOLE
D = BLIND HOLE MLB VIA
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Conventional PCB
FR-4
Build-up
Layer
Build-up
Layer
Photo-viaPhoto-Imageable Dielectric (PID)
FR-4
Conventional PTH
Conventional PTH
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Conventional PCB
Blind Via PCB
PTH
3 mil line
SVHIV
H
Chip-on-
SVH
FR-4
Conventional PTH
Conventional PTH
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