Download - Lecture 05
![Page 1: Lecture 05](https://reader035.vdocuments.site/reader035/viewer/2022070315/55509427b4c905a85c8b5316/html5/thumbnails/1.jpg)
EE141© Digital Integrated Circuits2nd Manufacturing1
PackagingPackaging
![Page 2: Lecture 05](https://reader035.vdocuments.site/reader035/viewer/2022070315/55509427b4c905a85c8b5316/html5/thumbnails/2.jpg)
EE141© Digital Integrated Circuits2nd Manufacturing2
Packaging RequirementsPackaging Requirements
Electrical: Low parasitics Mechanical: Reliable and robust Thermal: Efficient heat removal Economical: Cheap
![Page 3: Lecture 05](https://reader035.vdocuments.site/reader035/viewer/2022070315/55509427b4c905a85c8b5316/html5/thumbnails/3.jpg)
EE141© Digital Integrated Circuits2nd Manufacturing3
Bonding TechniquesBonding Techniques
Lead Frame
Substrate
Die
Pad
Wire Bonding
![Page 4: Lecture 05](https://reader035.vdocuments.site/reader035/viewer/2022070315/55509427b4c905a85c8b5316/html5/thumbnails/4.jpg)
EE141© Digital Integrated Circuits2nd Manufacturing4
Tape-Automated Bonding (TAB)Tape-Automated Bonding (TAB)
(a) Polymer Tape with imprinted
(b) Die attachment using solder bumps.
wiring pattern.
Substrate
Die
Solder BumpFilm + Pattern
Sprockethole
Polymer film
Leadframe
Testpads
![Page 5: Lecture 05](https://reader035.vdocuments.site/reader035/viewer/2022070315/55509427b4c905a85c8b5316/html5/thumbnails/5.jpg)
EE141© Digital Integrated Circuits2nd Manufacturing5
Flip-Chip BondingFlip-Chip Bonding
Solder bumps
Substrate
Die
Interconnect
layers
![Page 6: Lecture 05](https://reader035.vdocuments.site/reader035/viewer/2022070315/55509427b4c905a85c8b5316/html5/thumbnails/6.jpg)
EE141© Digital Integrated Circuits2nd Manufacturing6
Package-to-Board InterconnectPackage-to-Board Interconnect
(a) Through-Hole Mounting (b) Surface Mount
![Page 7: Lecture 05](https://reader035.vdocuments.site/reader035/viewer/2022070315/55509427b4c905a85c8b5316/html5/thumbnails/7.jpg)
EE141© Digital Integrated Circuits2nd Manufacturing7
Package TypesPackage Types
![Page 8: Lecture 05](https://reader035.vdocuments.site/reader035/viewer/2022070315/55509427b4c905a85c8b5316/html5/thumbnails/8.jpg)
EE141© Digital Integrated Circuits2nd Manufacturing8
Package ParametersPackage Parameters
![Page 9: Lecture 05](https://reader035.vdocuments.site/reader035/viewer/2022070315/55509427b4c905a85c8b5316/html5/thumbnails/9.jpg)
EE141© Digital Integrated Circuits2nd Manufacturing9
Multi-Chip ModulesMulti-Chip Modules
![Page 10: Lecture 05](https://reader035.vdocuments.site/reader035/viewer/2022070315/55509427b4c905a85c8b5316/html5/thumbnails/10.jpg)
EE141© Digital Integrated Circuits2nd Manufacturing10
MCM ArchitectureMCM Architecture
![Page 11: Lecture 05](https://reader035.vdocuments.site/reader035/viewer/2022070315/55509427b4c905a85c8b5316/html5/thumbnails/11.jpg)
EE141© Digital Integrated Circuits2nd Manufacturing11
MCM technologies