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How Engineering Supports Manufacturing
How Engineering Supports Manufacturing
Larry E. HandLarry E. Hand
Peavey ElectronicsMarch 28, 2000
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IntroductionIntroduction
Senior Design Senior Design Larry E. Hand, MEE PE MCSELarry E. Hand, MEE PE MCSE
Master Electrical Engineering, Auburn Master Electrical Engineering, Auburn University 1977University 1977
Harris Corporation, Melbourne Fl. 1977-83Harris Corporation, Melbourne Fl. 1977-83 Peavey Electronics, 1983-PresentPeavey Electronics, 1983-Present
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Proof of Concept..Proof of Concept..
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After Proof of Concept, What Next?After Proof of Concept, What Next? VacationVacation Big BonusBig Bonus Two AttaboysTwo Attaboys Another ProjectAnother Project Physical Design and Transition to Physical Design and Transition to
ManufacturingManufacturing
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Life After PrototypingLife After Prototyping
Physical Design and PC LayoutPhysical Design and PC Layout Parts ProcurementParts Procurement CostingCosting Agency ApprovalsAgency Approvals Documentation, Literature and ManualsDocumentation, Literature and Manuals
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More things to considerMore things to consider
Mechanical Design and PackagingMechanical Design and Packaging Manufacturing DeliverablesManufacturing Deliverables Murphy’s Law- ECN’s and reworkMurphy’s Law- ECN’s and rework It’s Always yours..It’s Always yours..
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Printed Circuit Board DesignPrinted Circuit Board Design
Component PlacementComponent Placement Input/Output locationsInput/Output locations Mounting ConsiderationsMounting Considerations Technology SelectionTechnology Selection Restricted areasRestricted areas Minimize crossing countMinimize crossing count Thermal ManagementThermal Management
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Printed Circuit Board DesignPrinted Circuit Board Design
Electrical ConsiderationsElectrical Considerations High Impedance NodesHigh Impedance Nodes Differential signal pairingDifferential signal pairing Shielding for Magnetic and Capacitive CouplingShielding for Magnetic and Capacitive Coupling Transmission Line Effects- OverShoot and Transmission Line Effects- OverShoot and
RingingRinging EMI/EMCEMI/EMC Ground is NOT Ground......Ground is NOT Ground......
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Printed Circuit Board DesignPrinted Circuit Board Design
Manufacturing ConsiderationsManufacturing Considerations Component SpacingComponent Spacing OrientationsOrientations Hole SizesHole Sizes Insertion Tooling RestrictionsInsertion Tooling Restrictions Tooling HolesTooling Holes PanelizationPanelization
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Parts Approval and ProcurementParts Approval and Procurement
Standard PartsStandard Parts Multiple SourcedMultiple Sourced
Cost EffectiveCost Effective Minimal Specifications requiredMinimal Specifications required Improved response to demand changesImproved response to demand changes Note: Not all parts are created equal....Note: Not all parts are created equal....
Single SourcedSingle Sourced Unique or Patented Technical AdvantageUnique or Patented Technical Advantage An Act of Nature could shut you down!An Act of Nature could shut you down! Know Who You’re Dealing WithKnow Who You’re Dealing With
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Parts Approval and ProcurementParts Approval and Procurement
Custom PartsCustom Parts Product DifferentiationProduct Differentiation Protect Trade Secrets and Intellectual PropertyProtect Trade Secrets and Intellectual Property Extensive Specifications/DocumentationExtensive Specifications/Documentation If you change your mind, They’re still yoursIf you change your mind, They’re still yours Requires Accurate ForecastingRequires Accurate Forecasting
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Parts Approval and ProcurementParts Approval and Procurement
Approved Vendor List (AVL)Approved Vendor List (AVL) Lead TimesLead Times Minimum QuantitiesMinimum Quantities Packaging/Delivery OptionsPackaging/Delivery Options
BulkBulk Tape and ReelTape and Reel Tape and AmmoTape and Ammo Trays or TubesTrays or Tubes
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How is Cost DeterminedHow is Cost Determined
Material CostMaterial Cost Labor CostLabor Cost Manufacturing BurdenManufacturing Burden SG&ASG&A
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How Much does it CostHow Much does it Cost
Material Cost---52% of Total CostMaterial Cost---52% of Total Cost Unit Price * Quantity for all BOM itemsUnit Price * Quantity for all BOM items
Labor Cost --- 8% of Total CostLabor Cost --- 8% of Total Cost Direct labor or value added labor required to Direct labor or value added labor required to
manufacture the productmanufacture the product
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How Much Does it CostHow Much Does it Cost
Manufacturing Burden --- 17% of CostManufacturing Burden --- 17% of Cost Indirect Labor Indirect Labor UtilitiesUtilities FacilitiesFacilities Employee BenefitsEmployee Benefits Depreciation, rent, etc..Depreciation, rent, etc..
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How Much Does it CostHow Much Does it Cost
Sales/General and Administrative -- 23% Sales/General and Administrative -- 23% Cost of Selling the ProductCost of Selling the Product Sales commissionSales commission AdvertisingAdvertising Service and WarrantyService and Warranty Corporate ManagementCorporate Management Research and DevelopmentResearch and Development IS, Bad Debt, etc..IS, Bad Debt, etc..
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Agency ApprovalsAgency Approvals
ULUL CSACSA FCCFCC NOMNOM CECE NEMKONEMKO DEMKODEMKO
VDEVDE IRAMIRAM SASOSASO SANZSANZ SAASAA JISJIS and more.....and more.....
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Documentation Documentation
User ManualUser Manual Technical SpecificationsTechnical Specifications Service ManualService Manual Assembly DirectionsAssembly Directions Marketing SupportMarketing Support Advertising CopyAdvertising Copy
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PackagingPackaging
Protect Unit During ShipmentProtect Unit During Shipment Attractive at Point of SaleAttractive at Point of Sale AdvertisingAdvertising OEM or Consumer packagingOEM or Consumer packaging
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PCB Manufacturing FlowPCB Manufacturing Flow
Top Side SMTTop Side SMT DIP IC’s and SocketsDIP IC’s and Sockets Axial leaded Axial leaded
componentscomponents Bottom side SMTBottom side SMT Radial leaded Radial leaded
componentscomponents
Hand AssemblyHand Assembly Wave SolderWave Solder Touchup and InspectTouchup and Inspect PrecheckPrecheck
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Manufacturing DeliverablesManufacturing Deliverables
Programs for Automated Assembly Programs for Automated Assembly EquipmentEquipment Axial Sequencer and InsertionAxial Sequencer and Insertion Radial InsertionRadial Insertion DIP Socket and IC insertionDIP Socket and IC insertion Surface Mount Chips, IC’s, Odd Shaped Surface Mount Chips, IC’s, Odd Shaped
ComponentsComponents GenRad Automated TestGenRad Automated Test
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Manufacturing DeliverablesManufacturing Deliverables
PCB Assembly DrawingsPCB Assembly Drawings Gerber FilesGerber Files Mechanical Fabrication DrawingsMechanical Fabrication Drawings Functional Test ProcedureFunctional Test Procedure Technical SpecificationsTechnical Specifications Trouble Shooting proceduresTrouble Shooting procedures Your Experience and KnowledgeYour Experience and Knowledge
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Oops....Oops....
TolerancesTolerances Incomplete Beta TestingIncomplete Beta Testing Parts AvailabilityParts Availability Poor Manufacturing YieldPoor Manufacturing Yield Poor ReliabilityPoor Reliability Marketing Redirection/Feature AdditionMarketing Redirection/Feature Addition
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Engineering Change OrdersEngineering Change Orders
ECO’s document a change that ECO’s document a change that manufacturing will implementmanufacturing will implement
Disposition of existing inventoryDisposition of existing inventory Disposition of Work In ProcessDisposition of Work In Process Reason for ChangeReason for Change Cost/Performance/Schedule ImpactsCost/Performance/Schedule Impacts
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Engineering Change OrdersEngineering Change Orders
Safety - LiabilitySafety - Liability Recall, Disposition of units already soldRecall, Disposition of units already sold Obsolete inventoryObsolete inventory
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Sustaining EngineeringSustaining Engineering
If you birth it, It’s always your babyIf you birth it, It’s always your baby Customer complaintsCustomer complaints Obsolete PartsObsolete Parts Unique PartsUnique Parts Warranty claims and Field FailuresWarranty claims and Field Failures Specification changes in standard Specification changes in standard
componentscomponents