Download - “FO-WLP – A Disruptive Technology: Drivers and … · 2/11/16 4 Chip: Daisy Chain Test Vehicle
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IEEE SCV Components, Packaging andManufacturing Technology Chapter
February 9, 2016
www.cpmt.org/scv
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Source: TPSS.
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Source: ASE.
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Chip: Daisy Chain Test Vehicle Size: 5 mm x 5 mm Thickness 450 µm
Package: Size: 8 mm x 8 mm
Balls: 300 µm dia. 196 I/Os 0.5mm pitch
Chip
5x5
Package 8 mm x 8 mm
Source: Infineon.
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Source: STATS ChipPAC
Source: STATS ChipPAC.
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After Molding
After Pick & Place
After Thin Film Processing, Solder Ball Attach and Singulation
Source: NANIUM
NXP Radar Module
Source: NXP.
Intel Wireless Division LTE analog baseband 5.32 x 5.04 x 0.7mm eWLB 127 balls, 0.4mm pitch
Source: TPSS. Marvell PMIC & Audio CODEC
Source: Nanium.
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Today’s PoP (1.0mm)
FO-WLP as Bottom PoP (<0.8mm)
PMIC WLP-94 Qualcomm
PM8019
RFIC WLP-164 Qualcomm WTR1625L
Audio codec WLP-42
Cirrus 338S1201
RFIC WLP-66 Qualcomm WFR1620
PMIC FCBGA-267
Dialog 338S1251
WiFi/BT/FM FLGA-58
Murata 343S0694
PMIC WLP-28 Qualcomm QFE1100
Modem FCBGA-333 Qualcomm MDM9625M
M8 Co-pro. WLP-40 NXP
LPC18B1UK
A-CPU PoP-1155 Apple/TSMC
APQL-
Source: TPSS.
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*
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Source: TechSearch International, Inc.
Source: Nanium.
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Lamination of double sided adhesive foil to a mold carrier
Pick & Place of (FE-good tested) chips onto the mold carrier
Compression Molding of Reconstituted Wafer
De-bonding of molded wafer from carrier
Application of dielectric, structuring and curing
Infineon/IMC eWLB Process Flow
Source: Infineon/IMC
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Application of Seed Layer; Application of Plating resist and structuring
Application of thick copper redistribution, removal of plating resist and seed layer
Application of solder stop, structuring of landing pad for solder ball
Soldering of preformed ball onto landing pad (UBM) of RDL Separation
Infineon/IMC eWLB Process Flow (Con.)
Source: Infineon/IMC
Source: NEPES.
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Cu Stud Pattern and Plate
`
Singulation
Molding & Cure
Panel Front Grind
Die Location Meas.
Die Attach to Carrier
RDL Pattern and Plate
UBM Pattern and Plate
Polymer Coat, Pattern, Cure
Polymer Coat, Pattern, Cure Laser Mark, Saw,
TnR
Backside Coating
Panel Backgrind
`
Carrier Removal
Source: Deca Technologies.
Source: Amkor.
Source: Infineon.
Source: ASE.
Source: TDK. IC IC
Source: SPIL.
Reconstituted Wafer FO
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SWIFTTM Single Die Overmold
SWIFTTM 2 Die Overmold
SWIFTTM 2 Die Exposed
SWIFTTM 2 Die TMV PoP Overmold
SWIFTTM 2 Die Fan-in PoP
Source: ASE.
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Source: ASE.
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Source: APS.
• ASE Embedded Electronics (new JV company with TDK)
• AT&S
• DNP
• General Electric
• Infineon
• Microsemi
• Schweizer
• Shinko Electric
• Taiyo Yuden
• TDK
• Texas Instruments
• Unimicron Source: TI.
Source: Chipworks
Source: TDK.
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