AMOAMO GmbH
Otto-Blumenthal-Straße 25 ■ D-52074 Aachen ■ Germany
Phone +49 241 88 67-125 ■ Fax +49 241 88 67-571
[email protected] ■ www.amo.de
■ Nanoimprint technology
■ Electron beam lithography■ i-line optical lithography
■ Pattern transfer and thin film deposition
■ NanoCMOS & Nanophotonic process libraries
Being a Nanotechnology lab we offer you our research competencies and prototyping services in the field of micro- and nanotechnology for applications in microelectronics, photonics and biotechnology. AMO is equipped with a high quality R&D infrastructure meeting cross-industry specifications by means of:
AMO provides you with:
■ a lexible and powerful infrastructure for Micro- and Nanostructuring■ a technology platform in the area of Nanophotonics and NanoCMOS■ services from prototyping development to small scale production■ as well as the development of individual solutions
Please contact us for further information. ■ Contact: Dipl.-Ing. Herbert Kleinjans ■ [email protected]
>>> Core Competencies
■ Nanoimprint
■ Nanophotonics
■ NanoBio
■ NanoElectronics
■ Micro- and Nano
>>> Our Strengths
■ individual service■ from ultra-high accuracy
■ to volume production■ flexible
■ short turnaround
■ IP protection
>>> Get Access
Prototyping and Development ServicesFact SheetTechnology
AMO GmbH
Otto-Blumenthal-Straße 25 ■ D-52074 Aachen ■ Germany
Phone +49 241 88 67-125 ■ Fax +49 241 88 67-571
[email protected] ■ www.amo.de
AMO
Foundry Service, Production Service
Description:
AMO runs a class 10 to class 1000 cleanroom with a total area of 400 m²: Nanolab AMICA. Here, high end fabrication equipment for semiconductor technology is operated in a highly lexible way to enable high quality nanofabrication, quick process changes and unconventional solutions.
Fact SheetEquipment
Lithography■ Raith EBPG 5200 e-beam system:
20/50/100 kV , sub 10 nm resolution, from samples of 10x10mm up to 8“ substrates
■ Canon FPA 3000 i5r i-line Stepper with 0,5 µm resolution■ EVG 420: 6” semi-automatic Maskaligner■ EVG 150: 4”- 8” automatic resist coater and developer■ Süss MA8 Gen3 SCIL: 2“-8“ UV-Nanoimprint Lithography■ EVG 770: 4“ - 8“ UV-Nanoimprint Step&Repeat Lithography■ EVG 620 Soft UV Nanoimprint prototype:
4”- 6” lexible template size, sub 50 nm resolution ■ 2 experimental Interference Lithogarphy systems:
180 nm - 2.5 µm pitch, up to 8” substrates
Wet Processing■ ARIAS Wet benches:
single wafer and batch cleaning and resist processes
■ SCFluids Super Critical Dryer: CO
2, semi-automatic, up to 6” substrates
Furnaces
■ Four 6” - 8“ Centrotherm Furnaces: Oxidation, POCl
3-Diffusion and Annealing
■ Jipelec JetFirst: 6” Rapid Thermal Annealing system
CVD (Chemical Vapour Deposition)
■ Centrotherm 6” LPCVD furnaces: Polysilicon, Silicon Nitride and LTO (low temp. SiO
2)
Sputtering /Evaporators
■ Von Ardenne CS730 Cluster system: 6” DC and RF sput-tering. Materials: W, Ni, Ti, TiN, Al, AlSi, AlCr, SiO
2, Ta
2O
5,
Al2O
3, HfO
2 , etc.
■ Pfeiffer Vacuum Classic 580: 6” e-beam and resistive evaporator. Materials: Al, Cr, Si0
2,Ti, Ta
2O
5 , etc.
Atomic Layer Deposition■ 2 Oxford FlexAL Plasma assisted ALD
Materials: AlN, Al2O
3, TaN, TiN
Etchers
■ Oxford PlasmaLab 100: 3 automatic chamber systems, 6” - 8“ chlorine, luorine and bromine based chemistry
■ Tepla Semi 300: Microwave Plasma Etcher, batch and single wafer processes, 0
2 and CF
4 processes
Metrology
■ Zeiss Supra 60 VP, EDX
High resolution SEM with automated CD control module ■ Veeco (DI) Dimension 3100 SPM:
high resolution STM, AFM, MFM, up to 6” substrates ■ Veeco DekTak³ST surface proiler ■ Leica INM 100 and INM 300 optical microscopes
■ Philips PQ Ruby Ellipsometer
Electrical Testing
■ High end Parameter analyser for small signal DC nanoelec-
tronic device testing
Optical Testing
■ Silicon Photonics device testing @1300 nm @1550 nm, tunable laser, iber & butt coupled
■ Contact: Dipl.-Ing. Herbert Kleinjans ■ [email protected]
