A Summer Training Report

Assembly Process on PCB(Through Hole and Surface Mount Technologies)

Dixon Technologies (India) Pvt. Ltd.B-14 & 15, Phase I I , Noida 201 305, ( U.P . ) I nd ia

Under the guidance ofMr. Nainko Singh and other Technicians

Department of Electronics & Communication EngineeringAmity School of Engineering & Technology

Mentor:Mr. Sachin Kumar Compiled By: Puneet Wadhwani B.Tech E&CE (Batch 2011-2015)

Enrollment No.:A7605111132

Acknowledgement

I am very thankful to Dixon Technologies for giving me the opportunity to undertake my summer training at their Noida unit. It was a very good learning experience for me as the training gave me a sense of working in the factory.

I would like to convey my heartiest thanks to Mr. Atul B. Lall (Deputy Managing Director & Chief Executive Officer) and Mr. Vineet Kr. Mishra (Vice President) who heartily welcomed me for the Internship. I would also like to give my heartfelt thanks to Mr. Nainko Singh (Engineer) who guided and encouraged me throughout and imparted in-depth knowledge of the work environment.

I would like to thank Ms. Sonali Samanta (HR) and all the department heads of Dixon Technologies for giving their precious time and valuable guidance during my internship programme. I would like to thank all the staff at Dixon, for being so helpful.

My due respect to my parents who provided me with all the necessities required.

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Declaration

I, Puneet Wadhwani, student of Electronics & Communication Engineering, batch 2011-2015, Amity University (U.P.) hereby declare that the Summer Training Report entitled ‘AssemblyProcess on PCB’ is based on the information collected by me during my tenure at DIXON TECHNOLOGIES (I) PVT. LTD., Noida from 04th June’ 2013 to 04th July’ 2013 which is produced in a best possible manner.

This is a comprehensive study based on the practical knowledge gained and data (theories and pictures) from Internet.

Signature of Trainee

(Puneet Wadhwani)

Place:

Date:

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CERTIFICATE

On the basis of declaration submitted by Puneet Wadhwani student of B. Tech (E&CE), I hereby certify that the project titled ‘Assembly Process on PCB’ which issubmitted to Department of Electronics and Communication Engineering, Amity School of Engineering and Technology, Amity University Uttar Pradesh, Lucknow , in partial fulfillment of the requirement of the award of the degree of Bachelor of Technology is an original contribution with existing knowledge and faithful record of work carried out by him under my guidance and supervision.

Lucknow

Date:

Mr. O.P. Singh Mr. Sachin Kumar (HOD) (Professor) Dept. E&CE Dept. of E&CE

Amity School of Engineering & Technology Amity University, Lucknow, U.P.

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Index

S. No. Contents Page No.

1. Introduction 7

a) About the company 7

b) Genesis 7

c) Awards & Accolades 8

d) Key People 9

e) Present Customers 10

f) Products and their Capacities 11

2. Introduction to Training 12

a) PCB Printing 21

b) Automatic Insertion of components 22

c) Manual Insertion of components 22

d) Inspection of Assembly 24

e) Soldering

f) Circuit testing 24

g) Packaging

3. Basics 18

4. Work Instructions 24-25

5. Products

a) LG TV 26-33

b) Philips Induction Cooker 34-35

c) Landis + Gyr 36-37

d) Philips ODM 38

6. Conclusion 39

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Introduction

About The Company

Headquartered in Noida, Dixon is a leading Electronics Manufacturing Services (EMS) provider focused on delivering high quality, Cost Effective Solutions for Consumer electronics and home appliances for the Domestic (India) and International markets. They run 6 state-of-art manufacturing plants, where they manufacture CTV/LCD, Washer/Washing machine, DVD, Juicer/Mixer/Grinder, Set Top Boxes & LED Lighting Solutions

Dixon is ISO 9000 certified and also ISO 14001 certified. They are committed to Green. In their Consumer Electronic Business they are Lead Free & RoHS (Restriction of Hazardous Substances Directive) compliant manufacturing Process & are committed to education upliftment of backward class.

In India it is the largest OEM to big names like LG Electronics, Tata Sky, Weston, Reliance Retail, Walmart, Airtel, Philips India and TCL.

GENESIS

1993 – Establishment of the Company1995 – Added Philips as a Customer2004 - Established SMT Lines2005 - 100% DVD Requirement for Philips2006 - L1 in Global tender of TN Govt., for CTV's

(1.5 million supplied)2007 - Set Top Boxes Manufacturing2007 - Established LCD Production line for Philips2008 - Started CFL production for Philips2008 - Set up Design & Marketing company for STB2009 - Sheet Metal & Plastic Molding2009 - Rs. 40 Cr. Investment by MOPE (Moti Lal Oswal Private Equity).2009 - Set up New Factory in Dehradun & Noida2009 - ODM CTV Set Approved by Philips2009 - Washing Machine

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AWARDS & ACCOLADES

Dixon's unwavering commitment to quality has yielded outstanding results. Today it is recognized as the most preferred vendor with world class quality systems. For two consecutive years it has been awarded by the Government of India for outstanding export performance in the field of color Televisions.Over the years, it has established strong associations with consumer electronics giants in India. Simply because, this is due to the fact that the company has, consistently excelled in their standards of safety, reliability and on time delivery. 

Some of the other awards that have come Dixon's way are:

* ISO 9001:2008 / 14001:2004 accreditation for all units.* Award from MIT (Ministry of Information Technology) for excellence

in electronics.* Being rated as "Green" Supplier by Philips continuously since September’

2002* Rewarded by LGEIL as "Champion" of the year for achieving the targets in

all Qtrs.* Samman Patra award for highest tax payer in north region from Govt. of

India.

Lighting Science ties up with Dixon to enter India

Mr. James Haworth, CEO and Chairman of the Board, Lighting Science Group, with Mr. Sunil Vachani, Chairman and MD, Dixon Technologies.But the company is not resting on its laurels. Having achieved a leadership status in the domestic consumer electronics market with its alliance partners, Dixon is now ready to repeat the performance in the international arena as well.

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Key People

Mr. Sunil Vachani (Chairman cum Managing Director)

Mr. Sunil Vachani is one of the leading and most respected Industrialists in the country today. He is the Chairman of the Electronics Software Export Promotion Council of India. He is also the Honorary Counselor General for the Republic of Benin.

Mr. Atul B. Lall (Deputy Managing Director &Chief Executive Officer)

Mr. Atul B. Lall is one of the most experienced professionals today with over 25 years experience in the Consumer Electronics Industry. Having Graduated from B.I.T.S Pilani, he is now part of the faculty in many leading Educational Institutions across the country.

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CUSTOMERS

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PRODUCT & CAPACITY

CapacityColor Television 2 Million per annumLCD 50,000 per annumDVD 2 Million per annumCFL Lamps 60 Million per annumCFL Circuits 60 Million per annumElectronic Ballast 6 Million per annumWashing Machine/Washer 2,50,000 per annumSet Top Boxes 1 Million per annum

At NOIDA

Located on the left bank of the Yamuna river and is equidistant from Ghaziabad and Delhi. It was developed near Delhi, across river Yamuna, in the 1970's as a modern industrial city.

CapacityCTV PCB 3.6 Million per annumDVD 2 Million per annumSet Top Box 1 Million per annumCFL 16 Million per annumElectronic Ballast 6 Million per annumCFL PCB Capacity 36 Million Pcs. per annum

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Introduction to Training

Task: Printing, Assembling and Testing of PCB

Duration: 1 month

Steps:

I. PCB Printing

II. Automatic Insertion of components (via machines SMT & THT)

III. Manual Insertion of components (THT)

IV. Inspection of Assembly

V. Soldering

VI. Circuit testing

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VII. Packaging

Process Flow chart

Kitting of components

1. Take relevant drawing of the board to be assembled.

2. Calculate the components quantity-wise and pitch-wise.

3. Put the components in transparent envelop.

4. Put sticker on each envelops mentioning card name, quantity, pitch and name of the

forming machine on which the components are to be formed.

6. Load the components for forming

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Tape and Reel

Wave Solder Machine layout

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Wave Soldering Process

Fluxing Process

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Soldering Process

Common Defects in Assembly

• Wrong polarity

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• Wrong value

• Component leg bend

• Improper insertion

• Solder Bridging

• Dry solder

• No Solder

• Less/Excess Solder

Rework and Repair Steps

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External features of a PCB

Basics

PCB

A printed circuit board or PCB is used to mechanically support and electrically connect electronic components using conductive pathways, tracks or signal traces etched from copper sheets laminated onto a non-conductive substrate. The Austrian engineer Paul Eisler invented the printed circuit while working in England around 1936 as part of a radio set.

There are three basic varieties of printed circuit boards: single‐sided, double‐sided and multilayered

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1. Single sided PCB: conductors on only one surface of a dielectric base.

2. Double sided PCB: conductors on both sides of a dielectric base, usually the two layers are interconnected by plated‐through‐holes

(PTHs).3. Multi‐layer: conductors on 3 or more layers separated by

dielectric material and the layers are interconnected by PTH or pads.

4 layers PCB is a sandwich of 2 double layered PCBs. Likewise 6 layer PCB is a sandwich of 3 double layered PCB. This sandwiching is done by placing oxidizing material between double layered PCBs. The spatial and density requirement and the circuitry complexity determine the type of board to be produced.

Through Hole Technology

• This is the technology used world wide for the assembly of electronic board.

• Gradually this technology is disappearing and it is overcoming by Surface

Mount Technology.

• Large varieties of leaded components are used for the assembly of the

electronic board by inserting the leads of the components into the holes of the

PCB.

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• The electronic components are inserted into plated through holes (PTHS) in

the PCB and soldered on bottom side using wave soldering

SMDs VERSUS CONVENTIONAL COMPONENTSThe compact size of SMD components greatly reduces the area in a Printed circuit board, thus increasing packaging density.

In surface mount technology, both components as conductive paths on

PCB are installed on the same side whereAs in thru hole technology, the components are mounted on the one side and conductive paths are on the other side of a PCB,

A circuit assembled with SMD components is much more complex than

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An identical circuit assembled with conventional components. Use of SMDs

reduces the PCB size in equipment which in turn minimizes the

equipment size.

Advantages of Using SMT

PCB size reduction. RLC losses reduction. Component density increases More function can be incorporated in product. Assembly cost cheaper. Initial capital cost is cheaper. Production is faster.

Disadvantages of Using SMT

• Component identification is difficult.

• Component inspection is difficult.

• Rework is difficult & frequently impossible.

• Capital equipment costs very high.

• Inflexible not easy to make changes excellent skilled.

• Maintenance required.

THT and SMT Comparison

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PCB Printing

Machine used: Horizon Printer

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Here PCB board is printed with the required circuit design and after visualization it is passed further for Automatic Insertion of components.

Automatic Insertion (AI)

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In this process computerized machines are used to insert components from the reel of components over the PCB.

Manual Insertion (MI)

PCB from AI reaches to MI for manual insertion of some components. Below is the machine to cut extra leads from some components.

Inspection of Assembly

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Inspection document

• Board inspection document is known as Cronar sheet. On a transparent plastic sheet the physical geography of the assembled board is photographed . It is made to the size of the board.

• Detail of the each component is mentioned on the figure of each component.

• The cronar sheet is superimposed on the board and the value of the components are compared.

• As per the cronar sheet of the board, it is inspected and sent for wave soldering. If any problem is found it is sent back to the operator.

• The inspected board is sending for testing on respective machine.

Circuit Testing

Testing of components location and soldering takes place.

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Work Instructions:

Wear wrist band:

An antistatic wrist strap, ESD wrist strap, or ground bracelet is an antistatic device used to safely ground a person working on very

sensitive electronic equipment, to prevent the buildup of static electricity on his/her body, which can result in electrostatic discharge(ESD) It is used in the

electronics industry by workers working on electronic devices which can be damaged by ESD.

Check Iron Temp., Iron Grounding

Use calibrated multimeter

Check for any NG or faulty component

Check replaced component with BOM (Bill Of Materials - A document that sets out quantity required, manufacturer's part numbers, device descriptions, value, type or size, and reference designators.).

Check component value

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Use Solder wire SACX 307 lead free, RoHS

Lead-free solders are based on 95% tin metal with the addition of small amounts (around 1%) of silver, copper, bismuth and other metals. Standard tin/lead solder is 60% tin, 40% lead. Most lead-free solders have a melting point some 30/35 °C above that of 60/40 tin/lead solder. Therefore the soldering process has to be performed at temperatures of around 255 °C rather than the more normal 235 °C. The maximum temperature rating of most components is 260 °C, thus restricting the use of an optimum temperature.

Use Flux 8.3 L

Use Antistatic brush and gloves:

An antistatic agent is a compound used for treatment of materials or their surfaces in order to reduce or eliminate buildup of static electricity generally caused by the turboelectric effect. Its role is to make the surface or the material

itself slightly conductive, either by being conductive itself, or by absorbing moisture from the air, so some humectants can be used. The molecules of an antistatic agent often have both hydrophilic and hydrophobic

areas, similar to those of a surfactant; the hydrophobic side interacts with the surface of the material, while the hydrophilic side interacts with the air moisture and binds the water molecules.

Use PCB cleaning thinner RF 800 - ALPHA RF-800:

It provides the broadest process window for a no-clean flux with less than 5% solids content. ALPHA RF-800 is designed to provide excellent soldering results (low defects rates), even when the surfaces to be soldered (component leads and pads) are not highly solderable. RF800 works particularly well with bare copper boards protected with organic or rosin/resin coatings and with tin-lead coated PCB's. ALPHA RF-800 is used successfully in both tin-lead and lead-free applications.

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Product: LG TV Board 21 inches

Manual Insertion:

Clenching stage

Components:

HOLDER-MOLD ABS LED

LED (Light Emitting Diode) DL 110 DEFUSIONT

2 2-PIN for checking ckt in JIG

PCB jigs are used to test PCBs. They have a dump board inside the jig which can find faults in the PCBs.

CONN. TERMINAL 1-PIN

CID SOCKET 8-PIN to attach to picture tube

AV (Audio-Video) Jack RCA-PP1, 126-04 PARR

2 2-PIN wafer assembly plug 366-04, 4-PIN plug

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Tuner

An electronic receiver that detects and demodulates and amplifies transmitted signals of particular frequency.

Power switch

JIG machine to tight components

Molding Stage

Components

Diode-RU4AM Rectifier, Diode RU3AM, Diode RU4D

Simplest type of electronic valve having two electrodes, an anode and a cathode, between which a current can flow only in one direction, used as rectifier.

Supporter – protects ckt from touching to each other. Removable

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Fuse 4000 mA 250 V

Spark Gap 1kV 7.5mm

Res 1.5 E/1W, 2k7/2W, 1.50HM/1W, 100k0HM, 2W,

Res 1.8E/2W

Mylar 103/630 V,473/630 V, 223/400 V, 102/1600 V,

204/630 V, 164/1400 V, 863/630 V, 154/1100 V

Electronics manufacturers use Mylar (a trade name for polyester) in general-purpose, low-cost capacitors. Available in a wide range of values, designers use Mylar capacitors in non-critical parts of circuits, such as for audio, radio, and digital applications.

IC (Integrated Circuit): LTV 817M-VB, AT24C 6- PC, 7806, 111733 78R05, mounted on Heat Sink- TDA 7297 (Sound IC), Vertical LA78.41, STR 6554(Silicon Transistor Regulator)

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CONN-CIRC

Capacitor: 470 pF 10% 2000V, 2kV/2000V 12nF

P.T.C 14M83

Elco:1000/25 V, 470/25 V, 220/160 V, 220/500 V 85 ºC

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SAW (Surface Acoustic Wave) Filter D2910H

Varistor 3K

A varistor is an electronic component with a "diode-like" nonlinear current–voltage characteristic. Varistors are often used to protect circuits against excessive transient voltages by incorporating them into the circuit in such a way that, when triggered, they will shunt the current created by the high voltage away from sensitive components. A varistor is also known as Voltage Dependent Resistor or VDR. A varistor’s function is to conduct significantly increased current when voltage is excessive.

Crystal 24.576H 3A

A quartz crystal oscillator, inside its metal can, it mechanically resonates at a very precise frequency. The 3 most common applications for that frequency are: pacing (synchronization), timekeeping, and radio communication frequency matching.

Box 0.1µF / 275 V

Coil 7001, 5901

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Poly 224/100 V

Hylco R 123/2000 V

Line Noise Filter 7MH

Resistor Cement 10HM 7W

9 PIN wire

Bipolar Transistor npn 9 V, 250 V

SMPS Switch

D.C. to D.C. converters and D.C. to A.C. Converters belong to the category of Switched Mode Power Supplies

(SMPS).

Power Supply

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703 Transformer

Diode Rectifier+Heat Sink SFAF 504 G

IC Video Amplifier +Heat Sink

FBT Transformer

Harness

Final Visual Stage (Location Check)

Lead free Soldering Machine System

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Pre-Heater-1 Temp. Set Value = 400°C

Pre-Heater-2 Temp. Set value = 360°C

Solder Heater Temp. Set Value = 260°C

Pulse meter = 1.6 m/min

Flux Zone: Flux Gravity = 0.800-0.830

Air pressure= 2.3 kgf

Dip Time = 2.5-4.0 sec.

Cutting Stage

Double soldering

Touch-up (remove shorting)

Sticker (e.g. 1306 DX i.e. yr_date_Dixon)

In circuit testing

Glue (on I.R., LED, Resistance 330 Ώ

Base breaking stage

Bar Code Stage

LG JIG Function

Power Cod Insertion

Checking (visual)

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Product: Philips Induction Cooker

Components:

Fuse 12.5 A, 1200 V

Thermistor HCTG39 (2 qty.)

Transistor IC 78205, 58050

Resistor 100 E / 1 W, 100 E 0.5 W, 51 E 0.5 W

Cap Poly 2200 pF / 50 V,

High Volt

Peer

Preset 1k

Header POS13 – XN, 3 PIN

Elco 4.74 F/1400 V

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Line Filter, Blue

AC Line

Choke Coil

Buzzer

Soldering Machine

Solder Heater Temp. Set value 255°C

Pre Heater Temp. Set Value 330°C

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Product: Landis + Gyr

Model: ECO STAR – Starlight

Materials:

Crystal 32-768 kHz

Cap 100 pF/ 2 kV, Box 215 nF

VDR S-14k516

Elco 100µF / 25 V, 100 µF / 40 V, 470 µF / 25 V, 1000 µF /10 V

Key Switch

Ferrite Bead Leaded Coil

Coil PCB 10 Turn

Wooden Support for Coil PCB

Soldering Machine

Solder Heater Temp. Set value 249°C37

Pre Heater Temp. Set Value 310°C

Pulse 1.79 m / min

Cutting - PCB separator machine

Hole & Track check

LED insertion (Phototransistor & Photodiode) and Soldering

In Circuit Testing System

LCD fitting and soldering

FDT Simple Interface – EE programming

PCB Testing

Battery Insertion and soldering 3.6 V and 3 V

OPTO Testing

Scanning of Bar Cod

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Product: Philips ODM

Model: MPEG 3608 / 3618

Materials:

RCA type Socket: 4 ways (WB/RK), 3 ways (NW/YR)

Separator

Transistor npn ZN3904 to 92 RoHS

Crystal 27 MHz HC49US +/- 38 PPM

Transistor pnp S58550 (2 Qty.)

Header connector 4 Pin 2.5 mm DIP, 5 Pin, 6 Pin

Resistance: 2.2 OH DIP 1 W +/- 5%, 5.60 HM DIP 2 W +/- 5% (RoHS)

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Conclusion

It was a wonderful learning experience at Dixon Technologies for a month at Noida. I gained a lot of insight regarding almost every aspect of factory. The friendly welcome from all the employees is appreciating, sharing their experience and giving their peace of wisdom which they have gained in long journey of work. I hope this experience will surely help me in my future and also in shaping my carrier.

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