discovery kit for iot node, multi-channel communication€¦ · the stm32l4 discovery kit for the...

October 2019 UM2153 Rev 5 1/57

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UM2153User manual

Discovery kit for IoT node, multi-channel communication with STM32L4

Introduction

The STM32L4 Discovery kit for the IoT node (B-L475E-IOT01A) allows users to develop applications with direct connection to cloud servers.

The STM32L4 Discovery kit enables a wide diversity of applications by exploiting low-power multilink communication (Bluetooth® Low Energy, Sub-GHz), multiway sensing (detection, environmental awareness) and Arm® Cortex®-M4 core-based STM32L4 Series features.

ARDUINO® Uno V3 and PMOD™ connectivity provide unlimited expansion capabilities with a large choice of specialized add-on boards.

The STM32L4 Discovery kit includes an ST-LINK debugger/programmer and comes with the comprehensive STM32Cube software libraries together with packaged software examples to seamlessly connect to cloud servers. In addition a direct access to the Arm® Mbed Enabled™ on-line resources at http://mbed.org is available.

Figure 1. B-L475E-IOT01A Discovery kit

1. Picture is not contractual.

www.st.com

http://www.st.com

Contents UM2153

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Contents

1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2 Product marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3 System requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

4 Development toolchains . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

5 Demonstration software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

6 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

7 Hardware layout and configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

7.1 STM32L4 Discovery kit for IoT node layout . . . . . . . . . . . . . . . . . . . . . . . 10

7.2 STM32L4 Discovery kit for IoT node mechanical drawing . . . . . . . . . . . . 12

7.3 Embedded ST-LINK/V2-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

7.3.1 Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

7.3.2 ST-LINK/V2-1 firmware upgrade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

7.4 Power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

7.5 Programming/debugging when the power supply is not from ST-LINK (5V_ST_LINK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

7.6 Clock sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

7.7 Reset sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

7.8 USB OTG FS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

7.9 Quad-SPI NOR Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

7.10 Virtual COM port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

7.11 RF modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

7.11.1 Bluetooth (V4.1 compliant) SPBTLE-RF module . . . . . . . . . . . . . . . . . . 20

7.11.2 Sub-GHz low-power-programmable RF module (SPSGRF-868 or SPSGRF-915) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

7.11.3 Wi-Fi module Inventek system ISM43362-M3G-L44 (802.11 b/g/n) . . . 22

7.11.4 Dynamic NFC Tag based on M24SR with its printed NFC antenna . . . . 23

7.12 STMicroelectronics sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

7.12.1 Two on-board ST-MEMS microphones (MP34DT01) . . . . . . . . . . . . . . 24

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7.12.2 Capacitive digital sensor for relative humidity and temperature (HTS221) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

7.12.3 High-performance 3-axis magnetometer (LIS3MDL) . . . . . . . . . . . . . . . 25

7.12.4 3D accelerometer and 3D gyroscope (LSM6DSL) . . . . . . . . . . . . . . . . 26

7.12.5 260-1260 hPa absolute digital output barometer (LPS22HB) . . . . . . . . 26

7.12.6 Time-of-Flight and gesture detection sensor (VL53L0X) . . . . . . . . . . . . 27

7.13 STSAFE-A 100 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

7.14 Buttons and LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

7.15 I2C addresses of modules used on MB1297 . . . . . . . . . . . . . . . . . . . . . . 29

8 Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

8.1 ARDUINO® Uno V3 connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

8.2 TAG connector CN5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

8.3 ST-LINK/V2-1 USB Micro-B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

8.4 ST-LINK debug connector CN8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

8.5 USB OTG FS micro-AB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

8.6 PMOD™ connector CN10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

8.7 Jumper JP5 for IDD measurements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Appendix A STM32L4 Discovery kit for IoT node I/O assignment . . . . . . . . . . . 37

Appendix B Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Appendix C Board revision history and limitations . . . . . . . . . . . . . . . . . . . . . . 53

Appendix D Federal Communications Commission (FCC) and Industry Canada (IC) Compliance . . . . . . . . . . . . . . . . . . . . . . . 54

D.1 FCC Compliance Statement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

D.1.1 Part 15.19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

D.1.2 Part 15.105 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

8.7.1 Part 15.21 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

8.8 IC Compliance Statement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

8.8.1 Compliance Statement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

8.8.2 Déclaration de conformité . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

8.8.3 RF exposure statement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

List of tables UM2153

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List of tables

Table 1. Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Table 2. Button and LED control port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29Table 3. I2C addresses for each module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29Table 4. ARDUINO® connector pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31Table 5. TAG connector pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32Table 6. USB Micro-B connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33Table 7. ST-LINK debug connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33Table 8. USB OTG FS Micro-AB pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34Table 9. USB OTG FS power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34Table 10. PMOD™ solder bridge configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35Table 11. STM32L4 Discovery kit for IoT node I/O assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37Table 12. Board revision history and limitations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53Table 13. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

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UM2153 List of figures

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List of figures

Figure 1. B-L475E-IOT01A Discovery kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1Figure 2. Hardware block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Figure 3. STM32L4 Discovery kit for IoT node (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Figure 4. STM32L4 Discovery kit for IoT node (bottom view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Figure 5. STM32L4 Discovery kit for IoT node mechanical drawing . . . . . . . . . . . . . . . . . . . . . . . . . 12Figure 6. USB composite device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Figure 7. JP4: 5V_ST_LINK selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Figure 8. JP4: 5V_ARD selection from CN6 (VIN). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Figure 9. JP4: 5V_USB_FS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16Figure 10. JP4: 5V_VBAT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16Figure 11. JP4: 5V_USB_CHARGER selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17Figure 12. Power tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18Figure 13. SPBTLE-RF module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21Figure 14. SPSGRF module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22Figure 15. ISM43362-M3G-L44 module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23Figure 16. Label for Class 1 laser products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28Figure 17. ARDUINO® connector (front view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30Figure 18. TAG connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32Figure 19. TC2050-IDC-NL cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32Figure 20. USB Micro-B connector CN7 (front view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33Figure 21. USB OTG FS Micro-AB connector CN9 (front view). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34Figure 22. STM32L4 Discovery kit for IoT node (top) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42Figure 23. STM32L475VG microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43Figure 24. STM32L475VG microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44Figure 25. USB OTG FS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45Figure 26. RF module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46Figure 27. ST-MEMS sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47Figure 28. NFC and STSAFE part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48Figure 29. Power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49Figure 30. ARDUINO® Uno V3 connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50Figure 31. Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51Figure 32. ST-LINK/V2-1 with support of SWD only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

Features UM2153

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1 Features

• Ultra-low-power STM32L4 Series MCU based on Arm® Cortex®-M4 core with 1 Mbyte of Flash memory and 128 Kbytes of SRAM, in LQFP100 package

• 64-Mbit Quad-SPI Flash memory

• Bluetooth® V4.1 module (SPBTLE-RF)

• Sub-GHz (868 or 915 MHz) low-power-programmable RF module (SPSGRF-868 or SPSGRF-915)

• Wi-Fi® module Inventek system ISM43362-M3G-L44 (802.11 b/g/n compliant)

• Dynamic NFC tag based on M24SR with its printed NFC antenna

• 2 digital omnidirectional microphones (MP34DT01)

• Capacitive digital sensor for relative humidity and temperature (HTS221)

• High-performance 3-axis magnetometer (LIS3MDL)

• 3D accelerometer and 3D gyroscope (LSM6DSL)

• 260-1260 hPa absolute digital output barometer (LPS22HB)

• Time-of-Flight and gesture-detection sensor (VL53L0X)

• 2 push-buttons (user and reset)

• USB OTG FS with Micro-AB connector

• ARDUINO® Uno V3 expansion connector

• PMOD™ expansion connector

• Flexible power-supply options: ST-LINK USB VBUS or external sources

• On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: mass storage, Virtual COM port and debug port

• Comprehensive free software including a variety of examples, as part of the STM32Cube package, as well as a cloud connector software expansion, enabling direct access to cloud servers

• Support of wide choice of Integrated Development Environments (IDEs) including IAR™, Keil®, GCC-based IDEs, Arm® Mbed Enabled™

• Arm® Mbed Enabled™ (see http://mbed.org)

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2 Product marking

Evaluation tools marked as "ES" or "E" are not yet qualified and therefore they are not ready to be used as reference design or in production. Any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering sample tools as reference design or in production.

"E" or "ES" marking examples of location:

• On the targeted STM32 that is soldered on the board (for illustration of STM32 marking, refer to the section “Package characteristics” of the STM32 datasheet at www.st.com).

• Next to the evaluation tool ordering part number, that is stuck or silk-screen printed on the board.

3 System requirements

• Windows® OS (7, 8 and 10), Linux® or macOS®(a)

• USB Type-A to Micro-B cable

4 Development toolchains

• Keil® MDK-ARM(b)

• IAR™ EWARM(b)

• GCC-based IDEs

• Arm® Mbed™ online(c) (see mbed.org)

5 Demonstration software

The demonstration software, included in the STM32Cube package, is preloaded in the STM32 Flash memory for easy demonstration of the device peripherals in standalone mode. The latest versions of the demonstration source code and associated documentation can be downloaded from the www.st.com/stm32app-discovery webpage.

a. macOS® is a trademark of Apple Inc. registered in the U.S. and other countries.

b. On Windows® only.

c. Refer to the www.mbed.com website and to the Ordering information section to determine which order codes are supported.

Ordering information UM2153

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6 Ordering information

To order the B-L475E-IOT01A Discovery kit for IoT node, depending on the frequency of the Sub-GHz module, refer to Table 1.

Table 1. Ordering information

Order code Sub-GHz operating frequency

B-L475E-IOT01A1 915 MHz

B-L475E-IOT01A2 868 MHz

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7 Hardware layout and configuration

The STM32L4 Discovery kit for IoT node is designed around the STM32L475VGT6 (100-pin, LQFP package). The hardware block diagram (see Figure 2) illustrates the connection between the STM32 and peripherals (embedded ST-LINK, ARDUINO® Uno V3 shields, PMOD™ connector, Quad-SPI Flash memory, USB OTG connectors, digital microphones, various ST-MEMS sensors and the four RF modules (Wi-Fi, Bluetooth, Sub-GHz and NFC)). Figure 4 and Figure 5 help users to locate these features on the STM32L4 Discovery kit.

Figure 2. Hardware block diagram

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Figure 3. STM32L4 Discovery kit for IoT node (top view)

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Figure 4. STM32L4 Discovery kit for IoT node (bottom view)

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7.2 STM32L4 Discovery kit for IoT node mechanical drawing

Figure 5. STM32L4 Discovery kit for IoT node mechanical drawing

1. Plastic Spacer Height = 14mm, Overall Height = 26mm +/- 1mm.

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7.3 Embedded ST-LINK/V2-1

The ST-LINK/V2-1 programming and debugging tool is integrated on the STM32L4 Discovery kit for IoT node. Compared to the ST-LINK/V2 the changes are listed below.

The new features supported on the ST-LINK/V2-1 are:• USB software re-enumeration

• Virtual COM port interface on USB

• Mass storage interface on USB

• USB power management request for more than 100 mA power on USB

The following features are no more supported on the ST-LINK/V2-1:

• SWIM interface

• Application voltage lower than 3 V

For all general information concerning debugging and programming features common between V2 and V2-1 versions, refer to ST-LINK/V2 in-circuit debugger/programmer for STM8 and STM32 User manual (UM1075) at the www.st.com website.

7.3.1 Drivers

Before connecting STM32L475VG to a Windows® PC (XP, 7, 8 or 10) via USB, a driver for the ST-LINK/V2-1 must be installed. It is available at the www.st.com website.

In case the STM32L4 Discovery kit for IoT node is connected to the PC before the driver is installed, some STM32L4 Discovery kit interfaces may be declared as “unknown” in the PC device manager. In this case the user must install the driver files, and update the driver of the connected device from the device manager (see Figure 6).

Note: Prefer using the “USB Composite Device” handle for a full recovery.

Figure 6. USB composite device

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7.3.2 ST-LINK/V2-1 firmware upgrade

The ST-LINK/V2-1 embeds a firmware upgrade mechanism for in-situ upgrade through the USB port. As the firmware may evolve during the lifetime of the ST-LINK/V2-1 product (for example new functionalities, bug fixes, support for new microcontroller families), it is recommended to visit the www.st.com website, before starting to use the STM32L4 Discovery kit for IoT node and periodically, to stay up-to-date with the latest firmware version.

7.4 Power supply

The STM32L4 Discovery kit for IoT node is designed to be powered by 5 V DC power supply. It is possible to configure the STM32L4 Discovery kit to use any of the following five sources for the power supply: 5V_ST_LINK, 5V_ARD, 5V_USB_FS, 5V_VBAT and 5V_USB_CHARGER.

In case of external 5 V DC power adapter, the STM32L4 Discovery kit must be powered by a power supply unit or by an auxiliary equipment complying with the standard EN-60950-1: 2006+A11/2009, and must be Safety Extra Low Voltage (SELV) with limited power capability.

• 5V_ST_LINK (See Figure 7) is a 5V DC power with limitation from CN7 (the USB type Micro-B connector of ST-LINK/V2-1). In this case, jumper of JP4 should be on pins 1 and 2 to select the 5V_ST_LINK power source on silkscreen of JP4. This is the default setting. If the USB enumeration succeeds, the 5V_ST_LINK power is enabled, by asserting the PWR_ENn signal (from STM32F103CBT6). This pin is connected to a power switch ST890, which powers the board. This power switch features also a current limitation to protect the PC in case of a short-circuit on board (more than 750 mA). STM32L4 Discovery kit for IoT node can be powered from the ST-LINK USB connector CN7, but only ST-LINK circuit has the power before USB enumeration, because the host PC only provides 100 mA to the board at that time. During the USB enumeration, STM32L4 Discovery kit for IoT node asks for the 500 mA power to the host PC. If the host is able to provide the required power, the enumeration finishes by a “SetConfiguration” command and then, the power transistor ST890 is switched ON, the red LED LD7 is turned ON, thus the STM32L4 Discovery kit for IoT node consumes up to 500 mA current, but no more. If the host is not able to provide the requested current, the enumeration fails. Therefore the ST890 remains OFF and the MCU part including the extension board is not powered. As a consequence the red LED LD7 remains turned OFF. In this case it is mandatory to use an external power supply.

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Figure 7. JP4: 5V_ST_LINK selection

• 5V_ARD (see Figure 8) is the 7 to 12 V DC power from ARDUINO® CN2 pin 8 (named VIN on ARDUINO® connector silkscreen). In this case, jumper of JP4 should be on pins 3 and 4 to select the 5V_ARD power source on silkscreen of JP4. In that case, the DC power comes from the power supply through the ARDUINO® Uno V3 battery shield (compatible with Adafruit® PowerBoost 500 Shield).

Figure 8. JP4: 5V_ARD selection from CN6 (VIN)

• 5V_USB_FS (see Figure 9) is the DC power with 500 mA limitation from CN9, the USB OTG FS micro-AB connector. In this case, jumper of JP4 should be on pins 5 and 6 to select the 5V_USB_FS power source on silkscreen of JP4.


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Figure 9. JP4: 5V_USB_FS

• 5V_VBAT (see Figure 10) is the DC power coming from external. In this case, jumper of JP4 should be on pins 7 and 8 to select the 5V_VBAT power source on silkscreen of JP4.

Figure 10. JP4: 5V_VBAT

• 5V_USB_CHARGER (see Figure 11) is the DC power charger connected to the USB ST-LINK (CN7). To select the 5V_USB_CHARGER power source on silkscreen of JP4, the jumper of JP4 should be on pins 9 and 10. In this case, if the STM32L4 Discovery kit for IoT node is powered by an external USB charger then the debug is not available. If the PC is connected instead of the charger, the limitation is no longer effective and the PC could be damaged.

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Figure 11. JP4: 5V_USB_CHARGER selection

Note: If the board is powered by a USB charger, there is no USB enumeration, so the led LD7 remains OFF permanently and the board is not powered. In this specific case only, the resistor R30 needs to be soldered, to allow the board to be powered anyway.

Caution: Do not connect the PC to the ST-LINK (CN7) when R30 is soldered. The PC may be damaged or the board may not be powered correctly.

The green LED LD5 is lit when the STM32L4 Discovery kit for IoT node is powered by the 5 V correctly.

The power tree is showed in the Figure 12.


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Figure 12. Power tree

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7.5 Programming/debugging when the power supply is not from ST-LINK (5V_ST_LINK)

It is mandatory to power the board first using CN2 (VIN) or CN9 (USB_FS_OTG), then connecting the USB cable to the PC. Proceeding this way ensures that the enumeration succeeds thanks to the external power source.

The following power sequence procedure must be respected:

• Connect the jumper JP4 on (5V_ARD) or (5V_USB_FS)

• Connect the external power source to CN2 in case of an ARDUINO® shield or to CN9 in case of USB FS host interface

• Check that the red LED LD5 is turned ON

• Connect the PC to USB connector CN7

If this sequence is not respected, the board may be powered by VBUS first from ST-LINK, and the following risks may be encountered:

• If more than 500 mA current is needed by the board, the PC may be damaged or current can be limited by PC. As a consequence the board is not powered correctly.

• 500 mA is requested at the enumeration, so there is a risk that the request is rejected and enumeration does not succeed if the PC cannot provide such current.

7.6 Clock sources

Three clock sources are described below:

• X1 which is the 8 MHz oscillator for STM32L475VG microcontroller. This clock is not implemented in a basis configuration.

• X2 which is the 32.768 KHz crystal for the STM32L475VG embedded RTC

• X3 which is the 8 MHz clock from ST-LINK MCU for the STM32L475VG microcontroller.

7.7 Reset sources

The reset signal of the STM32L4 Discovery kit is active low and the reset sources includes:

• A reset button B1

• An ARDUINO® Uno V3 shield board from CN2

• An embedded ST-LINK/V2-1

7.8 USB OTG FS

The STM32L4 Discovery kit supports USB OTG FS communication via a USB Micro-AB connector (CN9).

To do this the following components must be added by the users:

• 8 MHz crystal (at X1 position); ref: NX3225GD-8.00M

• 8.2 pF capacitor (0402 size) at C2 position

• 8.2 pF capacitor (0402 size) at C4 position


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• 0 ohm resistor (0402 size) at R5 position

• 0 ohm resistor (0402 size) at R7 position

The STM32L4 Discovery kit can be powered by the USB connectors at 5 V DC with 500 mA current limitation.

A USB power switch (IC19) is also connected on VBUS and provides power to CN9. The green LED LD9 is lit when either:

• Power switch is ON and STM32L4 Discovery kit works as an USB host

• VBUS is powered by another USB host when STM32L4 Discovery kit works as a USB device.

The red LED LD8 is lit when an over-current occurs.

7.9 Quad-SPI NOR Flash memory

64-Mbit Quad-SPI NOR Flash memory is connected to the Quad-SPI interface of the STM32L475VGT6.

7.10 Virtual COM port

The serial interface USART1 is directly available as a Virtual COM port of the PC connected to the ST-LINK/V2-1 USB connector CN7. The Virtual COM port settings are configured as: 115200 b/s, 8 bits data, no parity, 1 stop bit, no flow control.

7.11 RF modules

Four RF interfaces are available on the STM32L4 Discovery kit for IoT node board:

• Bluetooth (V4.1 compliant) SPBTLE-RF module

• Sub-GHz (868 or 915 MHz) low-power-programmable RF module (SPSGRF-868 or SPSGRF-915),

• Wi-Fi module Inventek system ISM43362-M3G-L44 (802.11 b/g/n compliant)

• Dynamic NFC tag based on M24SR with its printed NFC antenna (double layer inductive antenna etched on the PCB).

7.11.1 Bluetooth (V4.1 compliant) SPBTLE-RF module

The ST SPBTLE-RF module (M1) is implemented on top side of the STM32L4 Discovery kit for IoT node board.

The SPBTLE-RF is an easy to use Bluetooth smart master/slave network processor module, compliant with Bluetooth V4.1. The SPBTLE-RF B-Smart module supports multiple roles simultaneously, and it can act at the same time as Bluetooth Smart sensor and hub device.

The entire Bluetooth Smart stack and protocol are embedded into the SPBTLE-RF B-Smart module. The external host application processor, where the application resides, is connected to the SPBTLE-RF B-Smart module through a standard SPI interface (SPI3 of STM32L475VGT6).

The SPBTLE-RF B-Smart module provides a complete RF platform in a tiny form factor (foot print of this module is 13.5 mm x 11.5 mm). Radio, antenna, high frequency and LPO

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oscillators are integrated to offer a certified solution to optimize the time to market of the final applications.

Figure 13. SPBTLE-RF module

The main features of the ST SPBTLE-RF module are listed below.

• Bluetooth V4.1 compliant (supports master and slave modes, multiple roles supported simultaneously

• Embedded Bluetooth low-energy protocol stack (GAP, GATT, SM, L2CAP, LL, RFPHY)

• Bluetooth low-energy profiles provided separately

• Bluetooth radio performance:

• Embedded ST BlueNRG-MS

• Tx power: + 4 dBm

• Host interface: SPI, IRQ, and RESET. On-field stack upgrading available via SPI.

• Certification: CE qualified, FCC, IC modular approval certified, BQE qualified

• On-board chip antenna

7.11.2 Sub-GHz low-power-programmable RF module (SPSGRF-868 or SPSGRF-915)

Two modules are available depending on the frequency of the Sub-GHz module (M3). The SPSGRF-868 and SPSGRF-195 are easy-to-use, low-power Sub-GHz modules based on the SPIRIT1 RF transceiver, operating respectively in the 868 MHz SRD and 915 MHz ISM bands.

The modules provide a complete RF platform in a tiny form factor (foot print of this module is 13.5 mm x 11.5 mm). The SPSGRF-915 is an FCC certified module (FCC ID: S9NSPSGRF) and IC certified (IC 8976CSPSGRF), while the SPSGRF-868 is certified CE0051.

The modules include four programmable I/O pins and an SPI serial interface (SPI3 of STM32L475VG).


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Figure 14. SPSGRF module

The main features of the ST SPSGRF module are listed below.

• Programmable radio features:

– Based on Sub-1GHz SPIRIT1 transceiver and integrated Balun (BALF-SPI-01D3)

– Modulation schemes: 2-FSK, GFSK, MSK, GMSK, OOk and ASK

– Air data rate from 1 to 500 kbps

– On-board antenna

• Programmable RF output power up to +11.6 dBm

• Host interface: SPI

• General I/O (up to 32 programmable I/O functions on 4 GPIO programmable module pins

• Two typical carrier frequency versions:

– SPSGRF-868 with 868 MHz tuned antenna

– SPSGRF-195 with 915 MHz tuned antenna

7.11.3 Wi-Fi module Inventek system ISM43362-M3G-L44 (802.11 b/g/n)

The Inventek system ISM43362-M3G-L44 module (M2) is implemented on top side of the STM32L4 Discovery kit for IoT node board. This module is an embedded (eS-WiFi) wireless Internet Connectivity device. The Wi-Fi module hardware consists of an Arm® Cortex® -M3 STM32 host processor, an integrated antenna (or optional external antenna) and a Broadcom Wi-Fi device. The module uses either a UART (UART3 of STM32L475VG) or an SPI (SPI3 of STM32L475VG) interface. As default, an SPI interface is used, as the corresponding firmware (for SPI capability) is downloaded on the Wi-Fi ISM43362-M3G-L44 module. The Wi-Fi module requires no operating system and has a completely integrated TCP/IP stack that only requires AT commands to establish connectivity for wireless product. The foot print of this module is 14.5 mm x 30 mm.

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Figure 15. ISM43362-M3G-L44 module

The main features of the Inventek system ISM43362-M3G-L44 module are:

• Based on the Broadcom BCM43362 MAC/Baseband/Radio device

• Supports Broadcom WICED SDK

• CPU Arm® Cortex®-M3 32-bit RISC core from ST Microelectronics

• IEEE 802.11n D7.0 -OFDM-72.2 Mbps -single stream w/20 MHz, Short GI

• IEEE 802.11g (OFDM 54 Mbps)

• IEEE 802.11b (DSSS 11 Mbps)

• IEEE 802.11i (Security)

– WPA (Wi-Fi Protected Access) –PSK/TKIP

– WPA2 (Wi-Fi Protected Access 2)- AES/CCMP/802.1x Authentication

• GPIO, 5 ADC (SPI interface utilizes ADC pins)

• Power-saving mode allows the design of low-power applications

• Lead Free Design which is compliant with ROHS requirements

• EMI/EMC Metal Shield for best RF performance in noisy environments and to accommodate for lower RF emissions/signature for easier FCC compliance.

• FCC/CE compliance certification

On both MB1297 rev C and MB1297 rev D, the firmware revision inside the Wi-Fi module must be: C3.5.2.3.BETA9. The Wi-Fi module maximum output power is limited to 9 dBm to fulfill FCC/IC/CE requirements. A Wi-Fi output power higher than 9 dBm at the Wi-Fi antenna is not allowed.

Note: Since Wi-Fi and Bluetooth Low Energy modules are using the same frequency ISM band (2.4 to 2.485 GHz), the simultaneous activity of both modules may affect the RF performances of Wi-Fi and/or Bluetooth Low Energy (in term of range or throughput).

7.11.4 Dynamic NFC Tag based on M24SR with its printed NFC antenna

M24SR64-Y belongs to the ST25 family which includes all STMicroelectronics NFC/RFID Tag and reader products. The M24SR64-Y device is a dynamic NFC/RFID Tag IC with a dual interface. It embeds an EEPROM memory. It can be operated from an I2C interface or by a 13.56 MHz RFID reader or by an NFC phone. The I2C interface uses a two-wire serial interface, consisting of a bidirectional data line and a clock line. It behaves as a slave in the I2C protocol.

The RF protocol is compatible with ISO/IEC 14443 Type A and NFC Forum Type 4 Tag.


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The main features of the M24SR64-Y are:

• I2C interface (I2C2 of STM32L475VGT6). The two-wire I2C serial interface supports 1 MHz protocol.

• Contactless interface:

– NFC Forum Type 4 Tag

– ISO/IEC 14443 Type A

– 106 Kbps data rate

– Internal tuning capacitance: 25 pF

• Memory:

– 8-Kbyte (64-kbit) EEPROM

– Support of NDEF data structure

– Data retention: 200 years

– Write cycle endurance:

1 million Write cycles at 25 °C

600 K Write cycles at 85 °C

500 K Write cycles at 105 °C

• Read up to 246 Bytes in a single command

• Write up to 246 Bytes in a single command

• 7-Byte unique identifier (UID)

• 128-bit password protection

7.12 STMicroelectronics sensors

Several STMicroelectronics sensors are available on the STM32L4 Discovery kit for IoT node board, they are listed below:

• 2 on-board ST-MEMS audio sensor omnidirectional digital microphones (MP34DT01)

• Capacitive digital sensor for relative humidity and temperature (HTS221)

• High-performance 3-axis magnetometer (LIS3MDL)

• 3D accelerometer and 3D gyroscope (LSM6DSL)

• 260-1260 hPa absolute digital output barometer (LPS22HB)

• Time-of-Flight and gesture detection sensor (VL53L0X)

7.12.1 Two on-board ST-MEMS microphones (MP34DT01)

The MP34DT01 is an ultra-compact, low-power, omnidirectional, digital ST-MEMS microphone built with a capacitive sensing element and an IC interface.

The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to produce audio sensors.

The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format.

The MP34DT01 has an acoustic overload point of 120 dBSPL with a 63 dB signal-to-noise ratio and –26 dBFS sensitivity.

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On the STM32L4 Discovery kit for IoT node, there are two MP34DT01 microphones: one with LR pulled to VDD and the second with LR pulled low. DFSDM1_CKOUT and DFSDM1_DATIN2 are connected for both. In addition, both microphones are spaced at 21 mm apart for the beamforming algorithm to work. Indeed, several algorithm configurations are available for the user to find the best trade off between audio output quality and resource consumption. For more details refer to STEVAL-IHM038V1: 3-phase BLDC/PMSM motor drive up to 50 W, suitable for fan controllers User manual (UM1697) on the www.st.com website.

The MP34DT01 is available in a package HCLGA (3x4 x1 mm) 4LD, in a top-port design, SMD-compliant, EMI-shielded package and it is guaranteed to operate over an extended temperature range from -40°C to +85°C.

7.12.2 Capacitive digital sensor for relative humidity and temperature (HTS221)

The HTS221 is an ultra-compact sensor for relative humidity and temperature. It includes a sensing element and a mixed signal ASIC to provide the measurement information through digital serial interfaces.

The sensing element consists of a polymer dielectric planar capacitor structure capable of detecting relative humidity variations and it is manufactured using a dedicated ST process.

The HTS221 is available in a small top-holed cap land grid array (HLGA-6L (2 x 2 x 0.9 mm)) package guaranteed to operate over a temperature range from -40 °C to +120 °C.

The main features of the HTS221 are:

• 0 to 100% relative humidity range,

• Low-power consumption: 2 μA @ 1 Hz ODR

• Selectable ODR from 1 Hz to 12.5 Hz

• High rH sensitivity: 0.004% rH/LSB

• Humidity accuracy: ± 3.5% rH, 20 to +80% rH

• Temperature accuracy: ± 0.5 °C,15 to +40 °C

• Embedded 16-bit ADC

• 16-bit humidity and temperature output data

• SPI and I2C interfaces. On the STM32L4 Discovery kit for IoT node, the I2C2 bus from STM32L475VG is used.

• Factory calibrated

• Tiny 2 x 2 x 0.9 mm package

• ECOPACK compliant

7.12.3 High-performance 3-axis magnetometer (LIS3MDL)

The LIS3MDL is an ultra-low-power high-performance three-axis magnetic sensor.

The LIS3MDL has user-selectable full scales of ±4/ ±8/ ±12/±16 gauss.

The self-test capability allows the user to check the functionality of the sensor in the final application.

The device may be configured to generate interrupt signals for magnetic field detection.


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The LIS3MDL includes an I2C serial bus interface, that supports standard and fast mode (100 kHz and 400 kHz), and an SPI serial standard interface. On the STM32L4 Discovery kit IoT node, the I2C2 bus from STM32L475VG is used.

The LIS3MDL is available in a small thin plastic land grid array package (LGA-12 (2.0x2.0x1.0 mm)) and is guaranteed to operate over an extended temperature range of -40 °C to +85 °C.

LIS3MDL is also ECOPACK, RoHS and “Green” compliant.

7.12.4 3D accelerometer and 3D gyroscope (LSM6DSL)

The LSM6DSL is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 0.65 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.

The event-detection interrupts enable efficient and reliable motion tracking and contextual awareness, implementing hardware recognition of free-fall events, 6D orientation, click and double-click sensing, activity or inactivity, and wake-up events.

The LSM6DSL supports main OS requirements, offering real, virtual and batch sensors with 4 Kbytes for dynamic data batching.

The LSM6DSL has been designed to implement features such as significant motion, tilt, pedometer functions, step detector and step counter, time stamping and to support the data acquisition of an external magnetometer with ironing correction (hard, soft).

The LSM6DSL has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±245/±500/±1000/±2000 dps.

The registers embedded inside the LSM6DSL may be accessed through both the I2C and SPI serial interfaces. On the STM32L4 Discovery kit for IoT node, the I2C2 bus from STM32L475VGT6 is used.

The LSM6DSL is available in a plastic land grid array (LGA-14L (2.5x3x0.83mm)) package, ECOPACK, RoHS and “Green” compliant.

7.12.5 260-1260 hPa absolute digital output barometer (LPS22HB)

The absolute pressure-sensing device LPS22HB is an ultra-compact piezoresistive sensor which functions as a digital output barometer.

The device comprises a sensing element and an IC interface which communicates from the sensing element to the application through I2C or SPI. On the STM32L4 Discovery kit for IoT node the I2C2 bus from the STM32L475VG is used.

The sensing element, which detects absolute pressure, consists of a suspended membrane manufactured using a dedicated process developed by ST.

The LPS22HB is available in a full-mold, holed LGA package (HLGA). It is guaranteed to operate over a temperature range extending from -40 °C to +85 °C. The package is holed to allow external pressure to reach the sensing element.

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The main features of the LPS22HB are:

• 260 to 1260 hPa absolute pressure range

• Current consumption down to 3 μA

• High overpressure capability: 20x full-scale

• Embedded temperature compensation

• 24-bit pressure data output

• 16-bit temperature data output

• ODR from 1 Hz to 75 Hz

• SPI and I²C interfaces

• Embedded FIFO

• Interrupt functions: Data Ready, FIFO flags, pressure thresholds

• Supply voltage: 1.7 to 3.6 V

• High shock survivability: 22,000 g

• Small and thin package

• ECOPACK lead-free compliant

7.12.6 Time-of-Flight and gesture detection sensor (VL53L0X)

The VL53L0X is a new generation Time-of-Flight (ToF) laser-ranging module housed in a small package, providing accurate distance measurement whatever the target reflectance unlike conventional technologies. It can measure absolute distances up to 2 m, setting a new benchmark in ranging performance levels, opening the door to various new applications.

The VL53L0X integrates a leading-edge SPAD array (Single Photon Avalanche Diodes) and embeds an ST second generation FlightSense patented technology.

The VL53L0X 940 nm VCSEL emitter (Vertical Cavity Surface-Emitting Laser), is totally invisible to the human eye, coupled with internal physical infrared filters, it enables longer ranging distance, higher immunity to ambient light and better robustness to cover-glass optical cross-talk.

The main features of the VL53L0X are listed below.

• Fully integrated miniature module:

– 940 nm Laser VCSEL

– VCSEL driver

– Ranging sensor with advanced embedded micro controller

– 4.4 x 2.4 x 1.0 mm size

• Fast, accurate distance ranging:

– Measures absolute range up to 2 m

– Reported range is independent of the target reflectance

– Operates in high infrared ambient light levels

– Advanced embedded optical cross-talk compensation to simplify cover glass selection

• Eye safe:

– Class 1 laser device compliant with the latest standard IEC 60825-1:2014 - 3rd edition. The laser output will remain within Class 1 limits as long as the


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STMicroelectronics recommended device settings are used and the operating conditions, specified in the STM32L4 datasheets, are respected. The laser output power must not be increased by any means and no optics should be used with the intention of focusing the laser beam. Figure 16 shows the warning label for Class 1 laser products.

• Easy integration:

– No additional optics

– Single power supply

– I2C interface for device control and data transfer: I2C2 from STM32L475VGT6 is used

– Xshutdown (Reset) and interrupt GPIO

– Programmable I2C address

Figure 16. Label for Class 1 laser products

7.13 STSAFE-A 100

The STSAFE-A100 is a highly secure solution that acts as a secure element, providing authentication and data management services to a local or remote host. It consists of a full turnkey solution with a secure operating system running on the latest generation of secure microcontrollers. The STSAFE-A100 can be integrated in IoT (Internet of things) devices, smart-home, smart-city and industrial applications, consumer electronics devices, consumables and accessories. The STSAFE-A100 can be mounted on:

• A device that authenticates to a remote host (IoT device case), the local host being used as a pass-through to the remote server.

• A peripheral that authenticates to a local host, for example games, mobile accessories or consumables.

The STSAFE-A100 is not implemented on the MB1297 Rev C board.

7.14 Buttons and LEDs

The black button B1 located on top side is the reset of the microcontroller STM32L475VGT6. Refer to the Figure 3: STM32L4 Discovery kit for IoT node (top view).

The blue button B1 located top side is available to be used as a digital input or as alternate wake-up function.

When the button is depressed the logic state is “0”, otherwise the logic state is “1”.

Two green LEDs (LD1 and LD2), located on the top side are available for the user. To light a LED a high logic state “1” should be written in the corresponding GPIO.

Table 2 gives the assignment of the control ports to the LED indicators.

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7.15 I2C addresses of modules used on MB1297

The Table 3 displays the I2C addresses (read and write) for the modules that are connected to the I2C2 bus.

Table 2. Button and LED control port

Reference Color Name Comment

B1 black Reset -

B2 blue Wake-up Alternate function Wake-up

LD1 green LED1 PA5 (alternate with ARD.D13)

LD2 green LED2 PB14

LD3 yellow LED3 (Wi-Fi) PC9, Wi-Fi activity

LD4 blue LED4 (BLE) PC9, Bluetooth activity

LD5 green 5V Power 5 V available

LD6 Bicolor (red and green) ST-LINK COM green when communication

LD7 red Fault Power Current upper than 750 mA

LD8 red VBUS OCRCR PE3

LD9 green VBUSOK 5 V USB available

Table 3. I2C addresses for each module

Modules Description SAD[6:0] + R/WI2C write address

I2C read address

HTS221Capacitive digital sensor for

relative humidity and temperature1011111x 0xBE 0xBF

LIS3MDL 3-axis magnetometer 0011110x 0x3C 0x3D

LPS22HB MEMS nano pressure sensor 1011101x 0xBA 0xBB

LSM6DSL3D accelerometer and 3D

gyroscope1101010x 0xD4 0xD5

VL53L0XTime-of-Flight ranging and gesture

detection sensor0101001x 0x52 0x53

M24SR64-Y Dynamic NFC/RFID tag IC 1010110x 0xAC 0xAD

STSAFE-A100 - 0100000x 0x40 0x41

Connectors UM2153

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8 Connectors

Nine connectors are implemented on the STM32L4 Discovery kit for IoT node:

• CN1, CN2, CN3 and CN4 for ARDUINO® Uno V3 connector

• CN5: Tag connector

• CN7: ST-LINK USB connector,

• CN8: ST-LINK debug connector,

• CN9: USB_OTG_FS connector,

• CN10: PMOD™ connector.

In addition, one jumper JP5 is used for IDD measurements.

8.1 ARDUINO® Uno V3 connectors

CN1, CN2, CN3 and CN4 are female connectors (SMD component devices) compatible with ARDUINO® Uno V3. Most shields designed for ARDUINO® can fit to the STM32L4 Discovery kit for IoT node.

Example connector references (see Figure 17):

• CN4: Header 6X1_Female_SMD




Figure 17. ARDUINO® connector (front view)

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Table 4. ARDUINO® connector pinout

ConnectorPin

numberPin name Signal name

STM32 pin

Function

CN2

1 NC - - -

2 IOREF - - 3.3 V reference

3 NRST STM_NRST NRST Reset

4 3.3 V - - 3.3 V input/output

5 5V - - 5V

6 GND - - GND

7 GND - - GND

8 VIN - - Power input

CN4

1 A0 ARD.A0-ADC PC5 ADC




5 A4 ARD.A4-ADC PC1 ADC / I2C3_SDA

6 A5 ARD.A5-ADC PC0 ADC / I2C3_SCL

CN1

10 SCL/D15 ARD.D15-I2C1_SCL PB8 I2C1_SCL

9 SDA/D14 ARD.D14-I2C1_SDA PB9 I2C1_SDA

8 AVDD VDDA - VDDA

7 GND GND - Ground

6 SCK/D13ARD.D13-

SPI1_SCK/LED1PA5 SPI1_SCK / LED1

5 MISO/D12 ARD.D12-SPI1_MISO PA6 SPI1_MISO

4PWM/MOSI/D

11ARD.D11-

SPI1_MISO/PWMPA7

SPI1_MOSI / TIMxx

3 PWM/CS/D10ARD.D10-

SPI_SSN/PWMPA2 TIM2_CH3

2 PWM/D9 ARD.D9-PWM PA15 TIM2_CH1

1 D8 ARD.D8 PB2 GPIO

CN3

8 D7 ARD.D7 PA4 GPIO

7 PWM/D6 ARD.D6-PWM PB1 TIM3_CH4

6 PWM/D5 ARD.D5-PWM PB4 TIM3_CH1

5 D4 ARD.D4 PA3 TIMxx

4 PWM/D3ARD.D3-

PWM/INT1_EXTI0PB0 TIM3_CH3 / EXTI0

3 D2 ARD.D2-INT0_EXTI14 PD14 EXTI14

2 TX/D1 ARD.D1-UART4_TX PA0 UART4_TX

1 RX/D0 ARD.D0-UART4_RX PA1 UART4_RX

Connectors UM2153

32/57 UM2153 Rev 5

8.2 TAG connector CN5

The TAG connector is implemented on the STM32L4 Discovery kit for IoT node. The TAG connector is a 10-pin footprint supporting SWD mode, which is shared with the same signals as for the ST-LINK.

The TC2050-IDC-NL cable is used to link ST-LINK and TAG connector on the STM32L4 Discovery kit for IoT node, so that the STM32L4 can be easily programmed and debugged without any extra accessory.

Figure 18. TAG connector Figure 19. TC2050-IDC-NL cable

Table 5. TAG connector pinout

ConnectorPin


STM32L4 pin

Function

CN5

1 3.3 V 3V3_ST_LINK - Power

2 SWD SYS_JTMS-SWDIO PA13Serial Wire Data Input/Output

3 GND - - Ground

4 SWCLK SYS_JTCK-SWCLK PA14 Serial Wire Clock

5 GND - - Ground

6 SWO STLINK_JTDO_SWO PB3 Serial Wire Output

7 NC - - -

8 NC - - -

9 NC - - -

10 NRST STM_NRST NRST RESET

UM2153 Rev 5 33/57

UM2153 Connectors

56

8.3 ST-LINK/V2-1 USB Micro-B

The USB connector is used to connect the embedded ST-LINK/V2-1 to the PC to program and debug the STM32L475VGT6 microcontroller.

Figure 20. USB Micro-B connector CN7 (front view)

8.4 ST-LINK debug connector CN8

The ST-LINK debug connector is a 1x4-pin, 2.54-mm pitch male connector. It provides access to the embedded SWJ-DP interface of the STM32F103CBT6 MCU. This SWJ-DP interface is a combined JTAG and serial wire debug port that enables either a serial wire debug or a JTAG probe, to be connected to the target.

Table 6. USB Micro-B connector

ConnectorPin


STM32L4 pin

Function

CN7

1 VBUS 5V_USB_ST_LINK -5 V power and detection

2 DM USB_STLK_N PA11 USB diff pair M

3 DP USB_STLK_P PA12 USB diff pair P

4 ID USB_STLK_ID - USB Identification

5 GND - - GND

Table 7. ST-LINK debug connector

Connector Pin number Signal name STM32F103CBT6 Function

CN8

1 3V3_ST_LINKVBAT, VDDA, VDD_1,

VDD_2, VDD_33.3 V voltage supply

2 STM_JTCK PA14 TCK/SWCLK

3 GND All GND pins GND

4 STM_JTMS PA13 JTMS/SWDIO

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8.5 USB OTG FS micro-AB

Figure 21. USB OTG FS Micro-AB connector CN9 (front view)

8.6 PMOD™ connector CN10

On STM32L4 Discovery kit for IoT node, the PMOD™ connector provides flexibility in small form factor application. Based on PMOD™ Digilent standard popular in connectivity, the PMOD™ connector is implemented in type 2A and 4A.

The related STM32L475VG I/Os for PMOD™ function are listed in Table 10. The PMOD™ connector is 2x6 pins with 2.54 mm pitch and right angle female connector.

Table 8. USB OTG FS Micro-AB pinout

ConnectorPin

numberPin names Signal name

STM32L4 pin

Function

CN9

1 VBUS USB_OTG_5V_VBUS PA95 V power and detection

2 DM USB_OTG_FS_DM PA11 USB diff pair M

3 DP USB_OTG_FS_DP PA12 USB diff pair P

4 ID USB_OTG_FS_ID PA10 USB identification

5 GND - - GND

Table 9. USB OTG FS power management

Pin number Pin names Signal names STM32L4 pin Function

IC19-3 FAULTn USB_OTG_FS_OVRCR_EXTI3 PE3 Over Current IT

IC19-4 ENn USB_OTG_FS_PWR_EN PD12 USB Power enable

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Table 10. PMOD™ solder bridge configuration

Alternate configuration (UART) Standard configuration (SPI)

STM32L4pin

Solder bridge configuration

Pin nameSTM32L4

pinSolder bridge configuration

Pin namePMOD™

pin number

Pinname

STM32L4 pin

- - - - - - - - - -

- - - - - - - - - -

- - - - - - - - - -

PD3SB14 open; SB19 close

PMOD-UART2_CTS/SPI2_MISO

PD5SB14 close; SB19 open

PMOD-UART2_Tx/SPI2_CSN

1 7 PMOD-IRQ_EXTI2 PD2


PMOD-UART2_Tx/SPI2_CSN


PMOD-UART2_RTS/SPI2_MOSI

2 8 PMOD-RESET PD0


PMOD-UART2_RX



3 9 NC NC




PMOD-SPI2_SCK

4 10 NC NC

- - - - - GND 5 11 GND -

- - - - - 3.3 V 6 12 3.3 V -

Connectors UM2153

36/57 UM2153 Rev 5

8.7 Jumper JP5 for IDD measurements

The STM32 current measurement can be done on JP5. By default a jumper is placed on JP5.

For current measurement configuration, the jumper on JP5 should be removed and an amp-meters should be placed on JP5.

UM2153 Rev 5 37/57

UM2153 STM32L4 Discovery kit for IoT node I/O assignment

56

Appendix A STM32L4 Discovery kit for IoT node I/O assignment

Table 11. STM32L4 Discovery kit for IoT node I/O assignment

Pin No.

Pin Name Feature / Comment Signal or Label

1 PE2 GPIO_Output M24SR64-Y-RF_DISABLE

2 PE3 GPIO_EXTI3 USB_OTG_OVRCR_EXTI3

3 PE4 GPIO_EXTI4 M24SR64-Y-GPO

4 PE5 GPIO_EXTI5 SPSGRF-915-GPIO3_EXTI5

5 PE6 GPIO_EXTI6 SPBTLE-RF-IRQ_EXTI6

6 VBAT Voltage supply VBAT

7 PC13 GPIO_EXTI13 BUTTON_EXTI13

8 PC14/OSC32_IN RTC CLK RCC_OSC32_IN

9 PC15/OSC32_OUT RTC CLK RCC_OSC32_OUT

10 VSS GND GND

11 VDD 3.3 V VDD_MCU

12 PH0/OSC_IN 8MHz CLK RCC_OSC_IN

13 PH1/OSC_OUT 8MHz CLK RCC_OSC_OUT

14 NRST reset STM_NRST

15 PC0 ADC1_IN1 ARD.A5-ADC




19 VSSA GND GND

20 VREF- GND GND

21 VREF+ 3.3 V VDDA

22 VDDA 3.3 V VDDA

23 PA0 UART4_TX ARD.D1-UART4_TX

24 PA1 UART4_RX ARD.D0-UART4_RX

25 PA2 TIM2_CH3 ARD.D10-SPI_SSN/PWM

26 PA3 GPIO_Output ARD.D4

27 VSS GND VSS


29 PA4 GPIO_Output ARD.D7

30 PA5 SPI1_SCK ARD.D13-SPI1_SCK/LED1

31 PA6 SPI1_MISO ARD.D12-SPI1_MISO

STM32L4 Discovery kit for IoT node I/O assignment UM2153

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32 PA7 SPI1_MOSI ARD.D11-SPI1_MOSI/PWM



35 PB0 TIM3_CH3 ARD.D3-PWM/INT1_EXTI0

36 PB1 TIM3_CH4 ARD.D6-PWM

37 PB2 GPIO_Output ARD.D8

38 PE7 MEMS microphone DFSDM1_DATIN2

39 PE8 GPIO_Output ISM43362-RST

40 PE9 MEMS microphone DFSDM1_CKOUT

41 PE10 QSPI NOR Flash memory QUADSPI_CLK

42 PE11 QSPI NOR Flash memory QUADSPI_NCS

43 PE12 QSPI NOR Flash memory QUADSPI_BK1_IO0




47 PB10 I2C2_SCL INTERNAL-I2C2_SCL

48 PB11 I2C2_SDA INTERNAL-I2C2_SDA

49 VSS GND VSS


51 PB12 GPIO_Output ISM43362-BOOT0

52 PB13 GPIO_Output ISM43362-WAKEUP

53 PB14 GPIO_Output LED2

54 PB15 GPIO_Output SPSGRF-915-SDN

55 PD8 USART3_TX INTERNAL-UART3_TX

56 PD9 USART3_RX INTERNAL-UART3_RX

57 PD10 GPIO_EXTI10 LPS22HB_INT_DRDY_EXTI10

58 PD11 GPIO_EXTI11 LSM6DSL_INT1_EXTI11

59 PD12 GPIO_EXTI12 USB_OTG_FS_PWR_EN

60 PD13 GPIO_Output SPBTLE-RF-SPI3_CSN

61 PD14 GPIO_EXTI14 ARD.D2-INT0_EXTI14

62 PD15 GPIO_EXTI15 HTS221_DRDY_EXTI15

63 PC6 GPIO_Output VL53L0X_XSHUT

64 PC7 GPIO_EXTI7 VL53L0X_GPIO1_EXTI7

65 PC8 GPIO_EXTI8 LIS3MDL_DRDY_EXTI8

Table 11. STM32L4 Discovery kit for IoT node I/O assignment (continued)

Pin No.


UM2153 Rev 5 39/57

UM2153 STM32L4 Discovery kit for IoT node I/O assignment

56

66 PC9 GPIO_EXTI9 LED3 (WIFI) & LED4 (BLE)

67 PA8 GPIO_Output SPBTLE-RF-RST

68 PA9 USB_OTG USB_OTG_FS_VBUS

69 PA10 USB_OTG USB_OTG_FS_ID

70 PA11 USB_OTG USB_OTG_FS_DM

71 PA12 USB_OTG USB_OTG_FS_DP

72 PA13 ST-LINK SYS_JTMS-SWDIO

73 VDDUSB 3.3 V VDD_MCU

74 VSS GND GND


76 PA14 ST-LINK SYS_JTCK-SWCLK

77 PA15 TIM2_CH1 ARD.D9-PWM

78 PC10 SPI3_SCK INTERNAL-SPI3_SCK

79 PC11 SPI3_MISO INTERNAL-SPI3_MISO

80 PC12 SPI3_MOSI INTERNAL-SPI3_MOSI

81 PD0 GPIO_Output PMOD-RESET

82 PD1 GPIO_Output PMOD-SPI2_SCK

83 PD2 GPIO_EXTI2 PMOD-IRQ_EXTI2

84 PD3 USART2_CTS PMOD-UART2_CTS/SPI2_MISO

85 PD4 USART2_RTS PMOD-UART2_RTS/SPI2_MOSI

86 PD5 USART2_TX PMOD-UART2_TX/SPI2_CSN

87 PD6 USART2_RX PMOD-UART2_RX

88 PD7 GPIO_Output STSAFE-A100-RESET

89 PB3 ST-LINK SYS_JTDO-SWO

90 PB4 TIM3_CH1 ARD.D5-PWM

91 PB5 GPIO_Output SPSGRF-915-SPI3_CSN

92 PB6 USART1_TX ST-LINK-UART1_TX

93 PB7 USART1_RX ST-LINK-UART1_RX

94 BOOT0 Boot BOOT0

95 PB8 I2C1_SCL ARD.D15-I2C1_SCL

96 PB9 I2C1_SDA ARD.D14-I2C1_SDA

97 PE0 GPIO_Output ISM43362-SPI3_CSN

98 PE1 GPIO_EXTI1 ISM43362-DRDY_EXTI1


Pin No.


STM32L4 Discovery kit for IoT node I/O assignment UM2153

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99 VSS GND GND



Pin No.


UM2153 Rev 5 41/57

UM2153 Schematics

56

Appendix B Schematics

This section provides the design schematics for the STM32L4 Discovery kit for IoT node:

• Overall schematics for the B-L475E-IOT01A, see Figure 22

• STM32L475VG MCU, see Figure 23 and Figure 24

• USB OTG FS, see Figure 25

• RF Module, see Figure 26

• ST-MEMS sensors, see Figure 27

• NFC and STSAFE Part, see Figure 28

• Power supply, see Figure 29

• ARDUINO® Uno V3 connector, see Figure 30

• Peripherals, see Figure 31

• ST-LINK with support of SWD only, see Figure 32

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Figure 22. STM32L4 Discovery kit for IoT node (top)

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MB1297

INTERNAL-SPI3_SCKINTERNAL-SPI3_MOSIINTERNAL-SPI3_MISO

ISM43362-SPI3_CSN

SPSGRF-915-SDN

SPSGRF-915-SPI3_CSN

SPBTLE-RF-SPI3_CSN

SYS_JTCK-SWCLKSYS_JTMS-SWDIO

ARD.D3-PWM/INT1_EXTI0ARD.D2-INT0_EXTI14

ARD.D1-UART4_TXARD.D0-UART4_RX

ARD.D4ARD.D5-PWMARD.D6-PWM

ARD.D7ARD.D8

ARD.D9-PWMARD.D10-SPI_SSN/PWM

ARD.D11-SPI1_MOSI/PWMARD.D12-SPI1_MISO

ARD.D13-SPI1_SCK/LED1ARD.D14-I2C1_SDAARD.D15-I2C1_SCL

ARD.A5-ADCARD.A4-ADCARD.A3-ADCARD.A2-ADCARD.A1-ADCARD.A0-ADC

USB_OTG_FS_OVRCR_EXTI3USB_OTG_FS_PWR_ENUSB_OTG_FS_VBUSUSB_OTG_FS_DMUSB_OTG_FS_DPUSB_OTG_FS_ID

INTERNAL-I2C2_SCLINTERNAL-I2C2_SDA

M24SR64-Y-GPOM24SR64-Y-RF_DISABLESTSAFE-A100-RESET

LED2LED3(WIFI) & LED4(BLE)

BUTTON_EXTI13

PMOD-UART2_RTS/SPI2_MOSIPMOD-UART2_CTS/SPI2_MISO

PMOD-SPI2_SCKPMOD-IRQ_EXTI2

PMOD-RESET

PMOD-UART2_RXPMOD-UART2_TX/SPI2_CSN

LSM6DSL_INT1_EXTI11LSM3MDL_DRDY_EXTI8LPS22HB_INT_DRDY_EXTI10HTS221_DRDY_EXTI15VL53L0X_GPIO1_EXTI7VL53L0X_XSHUT

DFSDM1_CKOUTDFSDM1_DATIN2

SPBTLE-RF-RST

SYS_JTDO-SWO

QUADSPI_NCSQUADSPI_CLKQUADSPI_BK1_IO0QUADSPI_BK1_IO1QUADSPI_BK1_IO2QUADSPI_BK1_IO3

SPSGRF-915-GPIO3_EXTI5

SPBTLE-RF-IRQ_EXTI6

ISM43362-DRDY_EXTI1

ISM43362-RSTISM43362-WAKEUPISM43362-BOOT0

INTERNAL-UART3_RXINTERNAL-UART3_TX

ST-LINK-UART1_RXST-LINK-UART1_TX

MCU1 Page 2/11MB1297_MCU1.SchDoc

STM_NRST

MCU2 Page 3/11MB1297_MCU2.SchDoc

INTERNAL-SPI3_SCKINTERNAL-SPI3_MOSIINTERNAL-SPI3_MISOSPSGRF-915-SPI3_CSN

SPSGRF-915-GPIO3_EXTI5SPSGRF-915-SDN

SPBTLE-RF-SPI3_CSNSPBTLE-RF-RST

SPBTLE-RF-IRQ_EXTI6

QUADSPI_NCSQUADSPI_CLK

QUADSPI_BK1_IO0QUADSPI_BK1_IO1QUADSPI_BK1_IO2QUADSPI_BK1_IO3

INTERNAL-UART3_RXINTERNAL-UART3_TX

ISM43362-SPI3_CSNISM43362-RST

ISM43362-WAKEUPISM43362-BOOT0

ISM43362-DRDY_EXTI1

RF Modules Page 5/11MB1297_RF_Module.SchDoc

STM_NRSTARD.D13-SPI1_SCK/LED1

LED2LED3(WIFI) & LED4(BLE)BUTTON_EXTI13

PMOD-UART2_RTS/SPI2_MOSIPMOD-UART2_CTS/SPI2_MISOPMOD-SPI2_SCKPMOD-IRQ_EXTI2PMOD-RESET

PMOD-UART2_RXPMOD-UART2_TX/SPI2_CSN

Peripherals Page 10/11MB1297_Peripherals.SchDocINTERNAL-I2C2_SCL

INTERNAL-I2C2_SDA

M24SR64-Y-GPOM24SR64-Y-RF_DISABLE

STSAFE-A100-RESET

NFC & ST-SAFE Page 7/11MB1297_NFC_SAFE.SchDoc

SYS_JTCK-SWCLKSYS_JTMS-SWDIOSYS_JTDO-SWOST-LINK-UART1_RXST-LINK-UART1_TXSTM_NRST

STLink V2.1 Page 11/11MB1297_STLINK_V2-1.SCHDOC

ARD.D3-PWM/INT1_EXTI0ARD.D2-INT0_EXTI14ARD.D1-UART4_TXARD.D0-UART4_RX


ARD.D4ARD.D5-PWMARD.D6-PWMARD.D7ARD.D8ARD.D9-PWMARD.D10-SPI_SSN/PWMARD.D11-SPI1_MOSI/PWMARD.D12-SPI1_MISOARD.D13-SPI1_SCK/LED1ARD.D14-I2C1_SDAARD.D15-I2C1_SCL

STM_NRST

Arduino Connectors Page 9/11MB1297_Arduino.SchDoc


LSM6DSL_INT1_EXTI11LSM3MDL_DRDY_EXTI8

LPS22HB_INT_DRDY_EXTI10HTS221_DRDY_EXTI15

VL53L0X_GPIO1_EXTI7VL53L0X_XSHUT

DFSDM1_CKOUTDFSDM1_DATIN2

MEMS Part Page 6/11MB1297_MEMS.SchDoc

USB_OTG_FS_OVRCR_EXTI3USB_OTG_FS_PWR_EN

USB_OTG_FS_VBUSUSB_OTG_FS_DMUSB_OTG_FS_DPUSB_OTG_FS_ID

USB_OTG_FS Page 4/11MB1297_USB_OTG_FS.SchDoc

Power part Page 8/11MB1297_POWER.SchDoc

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Figure 23. STM32L475VG microcontroller

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PE2 1

PE3 2

PE4 3

PE5 4

PE6 5

PE7 38

PE8 39

PE9 40

PE10 41

PE11 42

PE12 43

PE13 44

PE14 45

PE15 46

PD855

PD956

PD1057

PD1158

PD1259

PD1360

PD1461

PD1562

PD081

PD182

PD283

PD384

PD485

PD586

PD687

PD788

PE0 97

PE1 98

U1B

STM32L475VGTx

PA0/WKUP123

PA124

PA225

PA326

PA429

PA530

PA631

PA732

PB0 35

PB1 36

PB2 37

PB10 47

PB12 51

PB13 52

PB14 53

PB15 54

PA867

PA968

PA1069

PA1170

PA1271

PA13/SWDIO72

PA14/SWCLK76

PA1577

PB3/SWO 89

PB4 90

PB5 91

PB6 92

PB7 93

PB8 95

PB9 96

PC13/WKUP2 7

PC14-OSC32_IN 8

PC15-OSC32_OUT 9

PC015

PC116

PC217

PC318

PC433

PC534

PC663

PC764

PC8 65

PC9 66

PC10 78

PC11 79

PC12 80

PB11 48

U1A

STM32L475VGTx

M24SR64-Y-RF_DISABLE

M24SR64-Y-GPOSPSGRF-915-GPIO3_EXTI5SPBTLE-RF-IRQ_EXTI6

BUTTON_EXTI13

X2NX3215SA-32.768K

ARD.A5-ADCARD.A4-ADCARD.A3-ADCARD.A2-ADC


ARD.D10-SPI_SSN/PWMARD.D4ARD.D7

ARD.D13-SPI1_SCK/LED1ARD.D12-SPI1_MISO

ARD.D11-SPI1_MOSI/PWM

ARD.A1-ADCARD.A0-ADC

ARD.D3-PWM/INT1_EXTI0ARD.D6-PWMARD.D8

ISM43362-RST


ISM43362-BOOT0ISM43362-WAKEUPLED2SPSGRF-915-SDN

INTERNAL-UART3_TXINTERNAL-UART3_RX

LPS22HB_INT_DRDY_EXTI10LSM6DSL_INT1_EXTI11USB_OTG_FS_PWR_ENSPBTLE-RF-SPI3_CSNARD.D2-INT0_EXTI14HTS221_DRDY_EXTI15

VL53L0X_XSHUTVL53L0X_GPIO1_EXTI7

LSM3MDL_DRDY_EXTI8LED3(WIFI) & LED4(BLE)

SPBTLE-RF-RST

DFSDM1_DATIN2

DFSDM1_CKOUT

SYS_JTMS-SWDIOSYS_JTCK-SWCLK

ARD.D9-PWM

USB_OTG_FS_VBUSUSB_OTG_FS_ID

USB_OTG_FS_DMUSB_OTG_FS_DP

QUADSPI_CLKQUADSPI_NCSQUADSPI_BK1_IO0QUADSPI_BK1_IO1QUADSPI_BK1_IO2QUADSPI_BK1_IO3

SYS_JTDO-SWO

INTERNAL-SPI3_SCKINTERNAL-SPI3_MISOINTERNAL-SPI3_MOSI

PMOD-RESETPMOD-SPI2_SCKPMOD-IRQ_EXTI2

PMOD-UART2_CTS/SPI2_MISOPMOD-UART2_RTS/SPI2_MOSIPMOD-UART2_TX/SPI2_CSN

PMOD-UART2_RXSTSAFE-A100-RESET

ARD.D5-PWMSPSGRF-915-SPI3_CSNST-LINK-UART1_TXST-LINK-UART1_RX

ARD.D14-I2C1_SDAARD.D15-I2C1_SCL

ISM43362-SPI3_CSNISM43362-DRDY_EXTI1

3V3

R82K2

R92K2

3V3

R102K2

R112K2

R12

0R

C14

5.1pFGND

C15

5.1pFGND

USB_OTG_FS_OVRCR_EXTI3

USB_NUSB_P

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Figure 24. STM32L475VG microcontroller

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STM_NRST

L1FCM1608KF-601T03

VDDA

VDD_MCU

VBAT

VDD_MCU

VDD_MCU

C3

100nFGND

GND

GNDGND

SB17Close

C81uF

GND

VDD_MCU

SB13Close

SB9Open

C5100nF

GND

VDD_MCU

GND

12

X1Not Fitted (NX3225GD-8.00M)

VSS 10

VDD11

VSSA 19

VREF+21

VDDUSB 73

PH0/PF0-OSC_IN12

PH1/PF1-OSC_OUT13 NRST 14

BOOT0 94

VDDA22

VDD28

VDD50

VDD75

VDD100

VBAT6

VREF- 20

VSS 74

VSS 27

VSS 49

VSS 99

U1C

STM32L475VGTx

GND

C61uF

GND

VDD_MCU

C7100nF

GND

C2Not Fitted (8.2pF)

GND

C4

Not Fitted (8.2pF)

GND

R5Not Fitted (0R)

R7

Not Fitted (0R)

C9100nF

C10100nF

C11100nF

C12100nF

C13100nF

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Figure 25. USB OTG FS

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5V

3V3

USB_OTG_FS_VBUS

5V_USB_FS

USB_OTG_FS_DMUSB_OTG_FS_DPUSB_OTG_FS_ID

USB_OTG_FS_PWR_EN

GND2

IN5

EN4 OUT 1FAULT 3U19

STMPS2141STR

DzA2

ID A3

Pd1 B1

PupB2

VbusB3

D+in C1

Pd2 C2

D+outC3

D-in D1

GND D2

D-outD3

U20

EMIF02-USB03F2

VBUS1

DM2

DP3

ID4

GND5

Shield6

USB

_Mic

ro-A

Bre

cept

acle

Shield7

Shield8

Shield9

EXP10

CN9

475900001

VBUS OK LED

3V3

USB_OTG_FS_OVRCR_EXTI3

3V3

VBUS OVRCR LED

ESD PROTECTION SHOULD BE CLOSE TO THE CONNECTOR

GND

GND

GND

GND

GND

GND

Designed by DiZiC

R6247K

R5847K

REDLD8

LED

R56

1K

R610R

R57

47K

0603

R59100K

3V3GREENLD9

LED

R55

330R

3

1

2

Q2BSR14

C664.7uF06

03

USB_NUSB_P

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Figure 26. RF module

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GND1

VDD2

GND3

TMS4

TCK5

TDI6

TDO7

TRSTN8

ADC4/MOSI9

ADC3/MISO10

ADC2/SCK11

ADC1/SSN12

ADC0/DATARDY13

VD

D14

VB

AT15

WK

UP

16

GN

D17

DP

18

DM

19

GN

D20

RX

21

TX22

GPIO0 23GPIO1 24GPIO2 25GPIO3 26GPIO4 27CFG0 28CFG1 29RES 30RES 31RES 32BOOT0 33RSTN 34GND 35GN

D36

GN

D37

GN

D38

GN

D39

GN

D40

GN

D41

GN

D42

GN

D43

GN

D44 M2

ISM43362-M3G-L44

GPIO (3)1

GPIO (2)2

GPIO (1)3

GPIO (0)4

Vin 5

GND 6

SPI_CLK7

SPI_MISO8

SPI_MOSI9

SPI_CS10

SDN11

GPIO (3)GPIO (2)GPIO (1)GPIO (0)

ViVV n

GND

SPI_CLKSPI_MISOSPI_MOSISPI_CS

SDN

M3

SPSGRF

EXT_LPCLK 1GPIO22

ANA_TEST 0 3

SPI_IRQ4

Vin 5

GND 6

SPI_SCLK7

SPI_MISO8

SPI_MOSI9

SPI_CS10

BT_RESET11

EXT_LPCLKGPIO2

ANA_TEST 0SPI_IRQ

ViVV n

GND

SPI_SCLKSPI_MISOSPI_MOSISPI_CS

BT_RESET

M1

BT Module

3V3_WIFI

GND

C47100nF

GND

GND

GND

C44100nF

GND

GND

GND GND

3V3

GND

C43100nF

3V3

GND

C45100nF

GND

GND

SPBTLE-RF-RST

SPBTLE-RF-SPI3_CSN

SPBTLE-RF-IRQ_EXTI6

ISM43362-RST

ISM43362-SPI3_CSN

ISM43362-DRDY_EXTI1



ISM43362-BOOT0

ISM43362-WAKEUP

SPSGRF-915-SDN

INTERNAL-UART3_TXINTERNAL-UART3_RX

SO/SIO12

WP#/SIO23

RESET#/SOI37

GND 4SCLK6 CS#1

SI/SIO05

VCC 8U11

MX25R6435F

IN1 OUT 3

GN

D2

U12LT1963EST-3.3

3V3_WIFI

3V3_WIFI

GNDGND

C5010uF

GND

C4910uF

5V

3V3

GND

C48100nF

GND

QUADSPI_CLKQUADSPI_NCS

QUADSPI_BK1_IO0QUADSPI_BK1_IO1QUADSPI_BK1_IO2QUADSPI_BK1_IO3

SPSGRF-915-SPI3_CSN

SPSGRF-915-GPIO3_EXTI5

3V3


GND3V3_WIFI3V3_WIFI

R66

Not

Fitte

d(1

0K)

R65

Not

Fitte

d(1

0K)

R64

Not

Fitte

d(1

0K)

R2647K

0603

0603

TP1TP2TP3TP4TP5

TP6

GND

C752.2uF

GND

C762.2uF

UM

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Figure 27. ST-MEMS sensors

6 11

MEMS Sensors

MB1297 D

29/01/2017

Title:

Size: Reference:

Date: Sheet: of

A4 Revision:

Project:

VDD_IO 6

C1 4

SCL/SPC1

GND 3

SDA/SDI/SDO11

SDO/SA19

CS10

DRDY8 Res 2INT7

Res 12

VDD 5

U5

LIS3MDL

3V3

GND

Microphone MEMS

GND GND

Designed by DiZiC

C19

100nF

GND

C18

4.7uF

GND

C20

100nF

GND

GND

C25

100nF

GND

C24

1uF

GND

C26

100nF

GNDGND

C23

100nF

GND

C31

100nF

GND

C30

4.7uF

GND

C29

100nF

GND

VDD_IO 1

SCL/SPC2

GND 8SDA/SDI/SDO4

SDO/SA05

CS6

RES 3

INT_DRDY7 GND 9

VDD 10

U7

LPS22HB

VDD 1SCL/SPC2

DRDY3

SDA/SDI/SDO4

GND 5

CS6

U6

HTS221

3V3

GND

GND GND

C28

100nF

C27

2.2uF

GPIO17

DNC8

GND 3

XSHUT5

SCL10

SDA9

GND2 4

AVDD_VCSEL 1

AVSS_VCSEL 2

AVDD 11

GND3 6

GND4 12

U4

VL53L0X

3V3

GND GND

C22

100nF

C21

4.7uF

GND

3V3

R1510K

R1410K



VL53L0X_XSHUTVL53L0X_GPIO1_EXTI7



LSM3MDL_DRDY_EXTI8

LPS22HB_INT_DRDY_EXTI10

LSM6DSL_INT1_EXTI11

INTERNAL-I2C2_SCL

INTERNAL-I2C2_SDA

3V3 3V3

3V3 3V3

3V3

3V3 3V33V3

3V3VDDIO 5

SCL13

SDA14

SDO/SA01

CS12

SDx 2

INT14

SCx 3

nc 11nc 10

GND6 GND 7

VDD 8

INT29

U3

LSM6DSLGND

GND

3V3

HTS221_DRDY_EXTI15

Read=10111011 (BBh)Write=10111010 (BAh)

Read=00111101 (3Dh)Write=00111100 (3Ch)

Read=11010101 (D5h)Write=11010100 (D4h)

Read=01010011(53h)Write=01010010(52h)

Read=10111111 (BFh)Write=10111110 (BEh)

0603

0603

0603

0603

0603

CLK3 VDD 1

LR 2

DOUT4 GND 5

U2

MP34DT01-MGND

Microphone MEMS

C17

100n

F

GND

C16

10uF

GND

DFSDM1_DATIN2

DFSDM1_CKOUT

3V3

0603

3V3R6710K

CLK3 VDD 1

LR 2

DOUT4 GND 5

U10

MP34DT01-M

C74

100nF

C46

10uF

R60R

R130R

Sc

he

ma

tics

UM

215

3

48/5

7U

M2

153 R

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Figure 28. NFC and STSAFE part

7 11

NFC & ST-SAFE Part

MB1297 D

12/03/2017

Title:

Size: Reference:

Date: Sheet: of

A4 Revision:

Project:

Designed by DiZiC

PCB Antenna 15x15mm

GND

GND

/RESET1

VCC 2

NC 3

GND 4

SDA5

NC 6

SCL7

NC 8

U9

STSAFE-A100 (Not Fitted)

3V3

GND

C32100nF

3V3

GND

C33100nF

STSAFE-A100-RESET



M24SR64-Y-GPOM24SR64-Y-RF_DISABLE RFDIS1 AC0 2

AC1 3

VSS 4SDA5 SCL6

GPO7

VCC 8U8

M24SR64-Y

See ANT7-T-M24SR-MB1255GND

C67100pF

GND

C681uF

GND

C7110pF

GND

C5310pF

GND

C72Not Fitted

GND

C69Not Fitted

C70

Not Fitted

R130K

GND

L2

742792042

R420K

3V3

Read=01000001(41h)Write=01000000(40h)

Read=10101101(ADh)Write=10101100(ACh)

ANT

UM

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atics

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Figure 29. Power supply

8 11

POWER SUPPLY

MB1297 D

29/01/2017

Title:

Size: Reference:

Date: Sheet: of

A4 Revision:

Project:

Designed by DiZiC

5V_ARD

5V

5V 3V3

5V_ARD

5V_ST_LINK

VDD_MCU

VINFrom Arduino power pin

5V_USB_FS

Open solder bridge if Discovery is suppliedfrom +3V3 of extension connector

Jumper to measure IDD of the MCU

IDD

5V / 800mA

3V3 / 800mA

5V PWR SELECTION FROM EXTERNAL SOURCES

GND PROBE

5V INPUT PWR FROM ARDUINO

3V3 PWR

Vin3 Vout 2

Gnd

1

Tab 4

U13 LD1117S50TR

Vin3 Vout 2

Gnd

1

Tab 4

U14LD1117S33TR

5V_USB_CHARGER

JP6

JP5

CannotopenfileC:\Data

HW1

SHUNT_BK


HW2

SHUNT_BKLDO_3V3

GND

GNDGNDGND

GND GND GND GND

GNDGNDJP7

GNDGND

246810

13579

JP4

HEADER_2X5

5V_VBAT


HW3

SHUNT_BK


HW4

SHUNT_BK

0603

0603

0603

0603

GREEN

LD5LED

R25

330R

C3810uF

C3910uF

C4110uF

C4010uF

C42100nF

SB4Close

+5V

STLINK_V2-1 Page11/11USB_OTG_FS Page4/11

POWER SUPPLY Page8/11

MEMS Page6/11

RF_Module Page5/11

NFC_SAFE Page7/11

ARDUINO Page9/11 Peripherals Page10/11

3V3

3V3

5V

3V3

5V_A

RD

3V3

5V VDDA

3V3

VIN

MCU1&2 Page2&3/11

5V_U

SB_F

S

5V 3V3

5V_U

SB_S

T_LIN

K

5V_U

SB_C

HARG

ER

5V_A

RD 5V

5V_U

SB_F

S

3V3

VDD_

MCU

Sc

he

ma

tics

UM

215

3

50/5

7U

M2

153 R

ev 5

Figure 30. ARDUINO® Uno V3 connector

9 11

Arduino Uno connector

MB1297 D

29/01/2017

Title:

Size: Reference:

Date: Sheet: of

A4 Revision:

Project:

ARDUINO UNO connector

A0A1A2A3A4A5 RX/D0

TX/D1D2

D4PWM/D3

PWM/D5PWM/D6

D7

D8PWM/D9

PWM/CS/D10

SDA/D14SCL/D15

VIN

SCK/D13MISO/D12

PWM/MOSI/D11

AVDDGNDIOREF

NRST3V35VGNDGNDVIN

POWER

AIN

3V35V

WARNING voltage applied to VIN <11.5V

5V_ARD

GND

GND


ARD.D10-SPI_SSN/PWM

ARD.D4

ARD.D7

ARD.D13-SPI1_SCK/LED1ARD.D12-SPI1_MISOARD.D11-SPI1_MOSI/PWM


ARD.D3-PWM/INT1_EXTI0

ARD.D6-PWM

ARD.D8

ARD.D5-PWM

ARD.D14-I2C1_SDAARD.D15-I2C1_SCL

ARD.D2-INT0_EXTI14

STM_NRST

ARD.D9-PWM

VDDA

Designed by DiZiC

R3 1k R2

0R

GND

C1100nF

123456

CN4

Header 6X1_Female_SMD

12345678

CN2


12345678

CN3


123456789

10

CN1


UM

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atics

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Figure 31. Peripherals

10 11

Peripherals

MB1297 D

29/01/2017

Title:

Size: Reference:

Date: Sheet: of

A4 Revision:

Project:

LED2

The 2 LEDs are top sideUSER LED

RESET BUTTON USER & WAKE-UP Button 3V3

100nF should be place close to the MCU10pF and 1K should be place close to the button

100nF should be place close to the MCU10pF and 1K should be place close to the button

GND GND

GND

STM_NRST BUTTON_EXTI13

PMOD-RESET

PMOD-SPI2_SCK

PMOD-IRQ_EXTI2



PMOD-UART2_TX/SPI2_CSN

PMOD-UART2_RXLED3(WIFI) & LED4(BLE) GND

3V3

WIFI

BLE

GND

3V3

Designed by DiZiC

ARD.D13-SPI1_SCK/LED1

2

4

6

8

10

12

1

3

5

7

9

11

CN10

HEADER_2X6_PMOD3V3

GND GND

PMOD

4

5

1

3 2 VCC-

VCC+U21

TSV631AILTGND

GND

3V3

GND

C34100nF

GND

C3510pF

GNDC73

100nF

R19

1K

R16

10KR38

200K

R18

1K GREENLD1 LED

GREEN

LD2 LED

YELLOW

LD3 LED

BLUE

LD4 LED

GND

C36100nF

GND

C3710pF

R24

1K

R23100K

R20

330R

R21

1K

R22

680R

SB2Close

SB1Close

SB3Close

SB14

Close

SB12

Open

SB15

Close

SB16

OpenSB19

Open

SB18

Close

SB21Close

SB20Open

B1

SW-PUSH-CMS_BLACK

B2

SW-PUSH-CMS_BLUE

Sc

he

ma

tics

UM

215

3

52/5

7U

M2

153 R

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Figure 32. ST-LINK/V2-1 with support of SWD only

11 11

ST-LINK/V2-1 with support of SWD only

MB1297 D

12/03/2017

Title:

Size: Reference:

Date: Sheet: of

A4 Revision:

Project:

STM_RST

T_JT

CK

T_JTCKT_JTMS

STM_JTMS

STM_JTCK

OSC_INOSC_OUT

T_N

RS

T

AIN_1

3V3_ST_LINK

3V3_ST_LINK

USB_STLK_NUSB_STLK_P

ST-LINK USB CONNECTOR STLINK_LED

ST-LINK POWER 3V3 / 150mA

3V3_ST_LINK

Board Ident: PC13=0

T_JTCK

T_JTMS

SWD INTERFACE

3V3_ST_LINK

Fitted: NO

1 2 3 4

CN8 Header 4 pins

STM_JTMSSTM_JTCKSWCLK SWDIO

T_SWDIO_IN

T_SWOLED_STLINK

LED_STLINK

3V3_ST_LINK

Red

_Green

21

34

LD6

LD_BICOLOR_CMS

T_NRST

51

2

GND3

4

BYPASSINH

Vin Vout

U16 LD3985M33R

3V3_ST_LINK

USB_RENUMn

PW

R_E

XT

PWR_ENn

3V3_ST_LINK

USB_RENUMn

PWR_ENn

3V3_ST_LINK

3V3_ST_LINK

3V3_ST_LINK

VBAT1

PA7

17

PC132

PA12 33PC143

PB0

18

PC154 JTMS/SWDIO 34

OSCIN5

PB1

19

OSCOUT6

VSS_2 35

NRST7

PB2/

BO

OT1

20

VSSA8

VDD_2 36

VDDA9

PB10

21

PA010

JTC

K/S

WC

LK37

PA111

PB11

22

PA212

PA15

/JTD

I38

PA3

13

VSS

_123

PA4

14

PB3/

JTD

O39

PA5

15

VD

D_1

24

PA6

16

PB4/

JNTR

ST40

PB12 25

PB5

41

PB13 26

PB6

42

PB14 27

PB7

43

PB15 28

BO

OT0

44

PA8 29

PB8

45

PA9 30

PB9

46

PA10 31

VSS

_347

PA11 32

VD

D_3

48

U15STM32F103CBT6

5V_USB_ST_LINK

D2

BAT60JFILM

IN1

IN2

ON3 GND 4

SET 5

OUT 6

OUT 7

FAULT8

U17

ST890CDR

T_SWO

Ilim = 625mA1.2Ilim = 750mA < Isc1.5Ilim = 938mA > Isc

Must be on a border or the PCB.

5V_ST_LINK

D3 BAT60JFILM

D4 BAT60JFILM5V_USB_ST_LINK

5V

VBUS 1

DM 2

DP 3

ID 4

GND 5

Shield 6

USB

_Mic

ro-B

rece

ptac

le

Shield 7

Shield 8

Shield 9

EXP 10

EXP 11

CN7

1050170001

USB_STLK_NUSB_STLK_P

5V_USB_ST_LINK

5V_ARD

ST-LINK MCU

ST LINK USB Power switch 5V / 1.2A

ST-LINK DEBUG

5V_USB_FS D5 BAT60JFILM

1 2X3

NX3225GD-8.00M

Dz A2

IDA3

Pd1B1

Pup B2

Vbus B3

D+inC1

Pd2C2

D+out C3

D-inD1

GNDD2

D-out D3

U18

EMIF02-USB03F2

USB_STLK_ID

ESD PROTECTION SHOULD BE CLOSE TO THE CONNECTOR

3V3_ST_LINK

Only footprint with Cable: TC2050-IDC-NL

TAG

_NR

ST

TAG

_SWO

TAG

_SWC

LK

TAG

_SWD

IO

Fitted: NO

1 102 93 84 75 6

CN5

TC2050-IDC-NL

Fitted: NO

12CN6

5V_USB_CHARGER

GND

GND

GND

GND

GND

GND GND

GND

GND

GND

GND

GND GND

GND

GND GND GND GND

GND

GND

GNDGND

GND

GND

GND GND GND

GND

GND GND

GND

GND GND GND

GND

ST-LINK-UART1_TX

ST-LINK-UART1_RX

SYS_JTMS-SWDIO

SYS_JTCK-SWCLK

SYS_JTDO-SWO

STM_NRST

Designed by DiZiC

JP83

1

2

Q1

BSR14

SB5 Close

SB6 Close

SB7 Close

SB8 Close

R3322R

R3222R

R3422R

R3522R

SB10

Close

C56

1uF

C57

100nF

C58

10nF

C59

1uF

C55

100nF

SB11

Open

C65

100nF

C64

1uF

R51

10K

R52

1K

R49

100K

R532K2RED

LD7

LED

R44

330R

R47

330R

R45 100R

R46 36K

R48 10KR501K5

R54100K

C60

100nF

C61

100nF

C62

100nF

C63

100nF

R39

100R

R27

4K7

R28

2K7R29

100K R30 Not Fitted (0R)R3110K

R36Not Fitted (10K)

C51

10pF

C52

10pF

C54100nF

R42 0R

R43 0R

R41 4K7

R40 4K7

UM2153 Rev 5 53/57

UM2153 Board revision history and limitations

56

Appendix C Board revision history and limitations

Table 12. Board revision history and limitations

Board Version Revision details Known limitations

MB1297 ANot available; engineering samples only

-

MB1297 BNot available; engineering samples only

-

MB1297 C-01

First official IoT Discovery kit version with following changes compared to MB1297C schematics:

– Capacitor value for NFC matching changed (C53 = 10 pF instead of 47 pF and C71 = 10 pF instead of 47 pF)

– STSAFE-A100 (U9 component) not fitted on MB1297C

– Firmware revision inside the Wi-Fi module must be: C3.5.2.3.BETA9. The Wi-Fi module maximum output power is limited to 9 dBm to fulfill FCC/IC/CE requirements.

– A limitation is present on the MB1297C-01 board. The reset connexion between STM32L4 and the ST-LINK MCU (STM32F103) is not present even if schematics are correct. The software reset is available so that the hardware missing reset may not be necessary. If the hardware reset is needed, a simple workaround is available by soldering an external wire between the SB2 and SB8.

– Firmware revision inside the Wi-Fi module must be: C3.5.2.3.BETA9. The Wi-Fi module maximum output power is limited to 9 dBm to fulfill FCC/IC/CE requirements.

MB1297 D-01

Second official IoT Discovery kit. No BOM changes compared to the MB1297 C-01 BOM, that is C53 = 10pF, C71 = 10pF and STSAFE-A100 (U9 component) not fitted.

Two pcb changes compared to the MB1297 C-01 pcb:

– The reset connexion between STM32L4 and the ST-LINK MCU (STM32F103) is implemented of the MB1297 rev D

– The pcb below the Wi-Fi antenna has been removed to have more Wi-Fi radiated output power

– Firmware revision inside the Wi-Fi module must be: C3.5.2.3.BETA9. The Wi-Fi module maximum output power is then limited to 9 dBm to fulfill FCC/IC/CE requirements.

– A board serial number is printed on the back side of the board. This number is on a sticker under the MB1297 reference. For B-L475EIOT01A1C boards, if this number is lower than 182 404 896 or for B-L475EIOT01A2C boards, if this number is lower than 184 906 074, the default firmware connecting to AWS Cloud does not work anymore. It can be changed by downloading an updated version available at http://www.st.com/x-cube-aws.

Federal Communications Commission (FCC) and Industry Canada (IC) Compliance UM2153

54/57 UM2153 Rev 5

Appendix D Federal Communications Commission (FCC) and Industry Canada (IC) Compliance

Applicable for IoT node Discovery kit products with order code B-L475E-IOT01A1 (containing SPSGRF-915 module).

D.1 FCC Compliance Statement

Contains FCC ID: O7P-362

Contains FCC ID: S9NSPBTLERF

Contains FCC ID: S9NSPSGRF

D.1.1 Part 15.19

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

D.1.2 Part 15.105

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and the receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help.

8.7.1 Part 15.21

Any changes or modifications to this equipment not expressly approved by STMicroelectronics may cause harmful interference and void the user’s authority to operate this equipment.

8.8 IC Compliance Statement

Contains/Contient IC: 10147A-362

Contains/Contient IC: 8976C-SPBTLERF

UM2153 Rev 5 55/57

UM2153 Federal Communications Commission (FCC) and Industry Canada (IC) Compliance

56

Contains/Contient IC: 8976C-SPSGRF

8.8.1 Compliance Statement

Industry Canada ICES-003 Compliance Label: CAN ICES-3 (B)/NMB-3(B)

This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions:

1. This device may not cause interference; and

2. This device must accept any interference, including interference that may cause undesired operation of the device.

8.8.2 Déclaration de conformité

Étiquette de conformité à la NMB-003 d’Industrie Canada: CAN ICES-3 (B)/NMB-3(B)

Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes:

1. L’appareil ne doit pas produire de brouillage;

2. L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.

8.8.3 RF exposure statement

To satisfy FCC and IC RF Exposure requirements for mobile devices, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance, operation at closer than this distance is not recommended. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

Pour satisfaire aux exigences FCC et IC concernant l'exposition aux champs RF pour les appareils mobiles, une distance de séparation de 20 cm ou plus doit être maintenu entre l'antenne de ce dispositif et les personnes pendant le fonctionnement. Pour assurer la conformité, il est déconseillé d'utiliser cet équipement à une distance inférieure. Cet émetteur ne doit pas être co-situé ou fonctionner conjointement avec une autre antenne ou un autre émetteur.

Revision history UM2153

56/57 UM2153 Rev 5

Revision history

Table 13. Document revision history

Date Revision Changes

31-Mar-2017 1 Initial version.

14-Apr-2017 2Updated Section 7.12.6: Time-of-Flight and gesture detection sensor (VL53L0X) to add Class 1 laser information.

28-Jun-2017 3Updated: Section 7.11.3: Wi-Fi module Inventek system ISM43362-M3G-L44 (802.11 b/g/n) and Section Appendix B: Schematics to reflect MB1297 rev D updates.

14-Mar-2018 4Updated Section 7.10: Virtual COM port and Table 4: ARDUINO® connector pinout.

08-Oct-2019 5Updated Section 1: Features, Section 7.9: Quad-SPI NOR Flash memory, Table 12: Board revision history and limitations

UM2153 Rev 5 57/57

UM2153

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