disco led device thinning...

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2012 DISCO CORPORATION All rights reservedDISCO CONFIDENTIAL -Only for customers2013/12/12

DISCO LED Device Thinning Solution

DISCO CORPORATION All rights reservedDISCO CONFIDENTIAL

Only for customers


2/23 Content

Issue of LED wafer thinning process Proportion of wafer size for LED productionIssue of wax curing thinning process

DISCO Frame Handling SolutionFeature of Frame HandlingProcess comparisonGrinder & PolisherHigh Productivity Grinder

DISCO Solution for Wax Curing thinning processIssue of expansion of current production lineCost issue of wax curing thinning processDISCO solution for wax curing thinning process

Summary


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3/23 Trend of wafer size for LED production

Migration to larger wafer size is gradually proceedingCurrent progress is about 2-year behind the anticipation

2013/12/12

Reported by Yole,2011

2 year behind the forecast in 2011


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4/23 Current main wafer size used by area

Main wafer size used by areaTaiwan : 2 inch, 4 inch (6 inch from 2014?)China : 2 inch (4 inch, 6 inch from ?)Korea : 4 inch (6 inch)Japan : 3 inch, 4 inch (6 inch)

2012 Worldwide LED Epitaxy capacity2012 Worldwide LED Epitaxy capacity2012 Worldwide LED Epitaxy capacity2012 Worldwide LED Epitaxy capacity

(4" Equivalent per month)(4" Equivalent per month)(4" Equivalent per month)(4" Equivalent per month)

China,

25.80%

Europe,

2.80%

Korea,

17.30%

SE Asia,

1.90%

Japan,

19.20%

Taiwan,

21.80%

America,

11.20%

Size Blank wafer PSS Wafer

List Price 2”equivalent

List Price 2”equivalent

2“ $8（stable） $8 $17 $17

4“ $30 $7.5 $60 $15

6“ $150 $17.7 $ ？？ $？？

Average sapphire wafer price

Best cost preference for LED making (2013) : 4”


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5/23 Issue of 6” wafer Wax cured grinding process 1/2：Throughput

Issues when using 6” wafer for LED makingLower UPH due to less wafers processed at one batchLower UPH due to thicker wafer thickness

2 inch Sapphire 4 inch Sapphire 6 inch Sapphire

Image

Substrate size 200mm ~ 240mm

# of Wafers 8pic ~ 10pic 3 pic 1 pic

Substrate Sapphire Wafer


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6/23

Issue of Thinning process: Worse quality control

>10um TTV, Larger Lapping/ CMP loading after grinding

Issue of De-Wax process : Extremely Low Yield

> 50% breakage rate when peeling

Difficulty of full automation of thinning process

Issue of 6” wafer Wax cured grinding process 2/2：Low Yield

①Wax Bounding ③Lapping/Polishing

⑤Cleaning ⑥Tape Mounting②Grinding ④Heating/Peeling

Thinning Process De-wax Process


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7/23 Content




Summary


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8/23 DISCO Frame Handling Solution

DISCO Original solution for 6” wafer thinning

Roughness (Ra)< 1um< 5nm

Wafer size DFG8830FH＆＆＆＆DFP8140DAG810FH DGP8761FH

Underdevelopment

Tape frameWafer Tape

Wafer

< Tape frame for dicing >

Grinding


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9/23 Feature of Frame Handling Process:1/３ Risk-less demounting

Reduction of total number of process

Excellent Yield rate

Tape Frame Process

①Mount on Tape Frame

②Full-Auto Grinding / Full-Auto Grinding & Polishing

SD DicingGrinding 1 Grinding 4Grinding 3Grinding 2

Grinding 1 Grinding 2 Dry Polishing

DBR Coating Process

③De Tape ④DBR Coating

※All data is for reference only, not guaranteed

Yield: >90% (>150um finishing)


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10/23 Feature of Frame Handling Process:2/3 Automation

Reduction of total number of processes

Reducing the Risk due to de-bounding/ Cleaning and re-mounting

Process:5 to 1

Risk Reduction

Wax bounding Process

Tape Frame Process

①Wax Bounding ③Polishing ⑤Cleaning④Heating/Peeling

⑥Tape Mounting②Grinding

①Mount on Tape Frame

Grinding 1

②Full-Auto Grinding / Full-Auto Grinding & Polishing

Grinding 4Grinding 3

Process in same machine Full Auto

Manual Handling

SD Dicing

Grinding 1 Grinding 2

Grinding 2

Dry Polishing


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11/23

Friendly for environmentNo chemical compound requiredCleaning with pure water only

Tape

Direct going to dicing process

Tape Frame

①Risk of Wafer Peeling ②De-Wax with chemical compound

Wax Process

1. Heating/ Peeling

Frame Handling

Feature of Frame Handling Process:3/3 Easy Cleaning

Sapphire

Substrate

Breakage Risk2.Cleaning

Only pure water used for cleaning


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12/23 Process Comparison for 6 inch sapphire wafer

Method Wax Bonding Frame Handling

Image

Thinning

Breakage Excellent Excellent

Running Cost Excellent Excellent

UPH Excellent Excellent

Afterward

Automation Bad Excellent

Yield Rate Bad Excellent

UPH Bad Excellent

Running Cost Bad Excellent

Sapphire WaferWax

Substrate (Ceramics)

Tape

Tape Frame


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13/23 Polisher integrated grinder: DGP8761

Tool StructureDGP8761 3x axes / 4 chuck tables

Special transfer system cater for 8 inch ring frame

6.3kW high rigidity spindles

Weight : 6,300kg1,690

3,45

0

unit : mm

Touch panel

Cassette

Position table

Z1 Z2

Z3

Spinnertable

�Feature:

�1.Z3 axis : Dry Polish

�2.Wax type/ Frame Handling type selectable

Current market share

6 inch : 100%


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14/23

Advantage of Dry PolishEnvironmental Friendly Polishing Method

No chemical, No water use

To remove grinding damage and warpage reduction

Dry Polish WheelNon-diamond polishing powder

Sapphire wafer warpage on 110µm finish

Before Polish

After Polish

About Dry Polish

AFM image after polish Outer Ra: 5nm（Ry:40nm）


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15/23 Ultra-Find Grinding / High UPH Grinder: DFG8830

Tool StructureHigh UPH: 4x axes (grinding), 5x chuck tables.

Sapphire on Substrate: Up to 3.5 mm thickness

6.3 kW Spindle / 300mm OD wheel

Minimum Footprint

Bridge type Z axis / Optimized wafer transfer layout.

4 cassettes

Compact foot print

Cassettestage

Robot

Spinnertable

1,400

2,50

0

unit : mm

Z2

Z1

Z3

Z4

Positioningtable

Chucktable

�Feature:

�1.Z4 axis : Fine Mesh Grinding wheel

�2.High UPH with 4 spindle

�3.Wax type/ Frame Handling type selectable


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16/23 Feature of Ultra-Find Grinding / High UPH Grinder : Fine Mesh Grinding

Position Surface Cross section 3D

Center

Outside

As an example of roughness : 4 inch Sapphire wafer

AFM profile

Surface roughness measurement result ( Kosaka brand )

Center Ra:6nm ( Ry:45nm ) / Outer Ra:8nm ( Ry:60nm)


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17/23 Feature of Ultra-Find Grinding / High UPH Grinder 2/2: High UPH

Many kinds of applications from the combination of 4-Axis

High UPH High Quality

Multi-spindles share the loading

Z1 : #280 Z2 : #1400

2軸

Thinning (μm) 520 40

Time (sec) 125 210

< Example for φ4 sapphire>

650μm→90μm

Z1 : #280 Z2 : #600 Z3 : #1400Z4 :fine mesh

(under development)

4軸

Thinning (μm) 523 25 10 2

Time (sec) 125 75 70 120



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18/23 Content




Summary


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19/23 DISCO Solution Line up

DSICO solution: wax curing

Roughness (Ra)< 1um < 10nm

Wafer size DFG8830DAG810

2”

4”

6”

nonoYesMulti-pieces

YesYesYesSingle Pieces

DGP8761

（（（（Z3 Axis Grinding ））））


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20/23

Current thinning processes : Rough Grinding � Lapping � CMP

Cost proportion: rough grinding about 75% of CoO

Wax curing thinning Process

①Wax Bounding③Lapping ⑥Cleaning

⑤Heating/Peeling

②Grinding ④Polishing

Issues

Low Machine UPH

High wear of grinding wheel

Issue of Wax cured grinding process


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21/23

DISCO Solution for multi-piece Rough grindingProduce better flatness (Target TTV：<5um)Higher UPH @ 3 pieces grinding of 4 inch sapphire

Machine Maker

Model # of Spindle Ra TTV Substrate SizeUPH(φφφφ2)

DISCO DAG810 1 ~0.5um <5um 300mm >80

A Company 1 ~0.5um 7~10um 240mm 30

B Company 1 ~0.6um 10um 260mm 30

Sapphire Wafer

Wax

Substrate (Ceramics)

Grinding Wheel

Under Development

DAG810

DISCO solution for Wax Curing Thinning Process 1/2: Multi-pieces grinding


Substrate


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22/23 DISCO solution for Wax Curing Thinning Process 2/2: Grinding Wheel

3.5um1480 pc (φφφφ4)9mmMetal460um#320DISCO

Wheel Maker

grid Removal Bond Effective Tooth

Life TTV

DISCO #320 460um Metal 6mm 1000 pc (φφφφ4) 3.5um

A Company

#400 400um Metal 9mm 900 pc ( φφφφ4) 7um

B Company

#400 400um Vitrified 9mm 1000 pc ( φφφφ4) 10um

DISCO Grinding Wheel:Better cost efficient (Wheel wear / Purchasing Cost)

Benefit of using DISCO Rough Grinding wheel:~1.5 times longer life (with same effective tooth length)Better TTV -> Lower Lapping loading / Process time / Cost

※※※※All data is for reference only, not guaranteed

Under Development


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23/23 Summary

DISCO provides the most relevant solution for LED thinningWax curing wafer thinning:

Wheel :Excellent wear/cost efficiency

Grinder :Better production efficiency and quality control

6” sapphire wafer thinning :DISCO Frame handling solution

disco led device thinning...

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