digest of technical papers - gbv.de · direct and reverse rotation control bernard legrand, lionel...

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TRANSDUCERS'05SEOUL, KOREA

The 13fh International Conference on

Solid-State Sensors, Actuators and Microsystems

Digest ofTechnical Papers

Volume 1Papers 1P1.1-2E4.161, PP. 1-1102

Sponsored DyKorean Sensors Society

Technical Co-sponsorsIEEE Electron Devices SocietyIEEE Robotics and Auromation SocietyIEE of Japan, Sensors and Micromachines SocietyInternational Federation of Automatic ControlInstitute of Control, Automation and Systems EngineersInstitute of Electronics Engineers of KoreaKorean Institute of Electrical EngineersKorean Society of Mechanical EngineersKorean Society of Precision Engineering TIB/UB Hannover 89Korea Robotics Society

IEEE Catalog Number.- 05TH8791 ISBN: 0-7800-8994-8

Table of Contents

VOLUME 1 / MONDAY, JUNE 6

• Plenary Sessions

1P1.1 A New Age for MEMSKurt PetersenSiTime, USA

09:30-12:00 Monday, June 6

1P2.1

1P2.2

MEMS in RF-Filter Applications:Thin FilmBulk-Acoustic-Wave TechnologyRobert AignerInfineon Technologies AC,, GERMANY

Fusion of Biomedical Microcapsule Endoscope andMicrosystem TechnologyTae Song Kim , Byungkyu Kim ,

Dongil "Dan" Cho", Si Young Song ,

Paolo Dario , and Metin SittiKorean Institute of Science & Technolog}\ KOREA.

'Seoul National University, KOREA,

Yonsei University. KOREA,

Scnola Superiore Sant'Anna, ITALY,

' Carnegie Mellon University. USA,

Intelligent Microsystem Center, KOREA

• 3D Fabrication

13:30-14:45 Monday, June 6

1A3.1 Three-Dimensional Nanosprings for

Electromechanical SensorsD. J. Bell1, Y. Sun2, L. Zhang3, LX. Dong1,B. J. Nelson, and D. Gruzmacher''Swiss Federal Institute of Technology, SHTTZERL-iND.

' University of Toronto, CANADA,

'Paul Seheirer Institute, SMTZER1AND 15

1A3.2 3D-Self-Assembling of SU-8 Microstructures onSilicon by Plasma Induced Compressive StressJean-Baptiste Bureau', Bernard Legrand1,

Dominique Collard \ and Lionel BuchaillotInstitut d'Electronique. de Microelectroniqiie et de

Nanotechnologie, FRA NCE,

''University of Tokyo, JAPAN

1A3.3 Alkali Metal-Wax Micropackets for Chip-ScaleAtomic ClocksShankar Radhakrishnan and Amit LaiCornell University, USA • 23

1A3.4 Fabrication of 3D Nanowire Frames byConventional Micromachining TechnologyE. Sarajlic, E. Berenschot, G. Krijnen, andM. ElwenspoekUniversity of Twente, The NETHERLANDS

1A3.5 The 2D Feedback Conveyance withCiliary Actuator ArraysManabu Ataka', Bernard Legrand2, Lionel Buchaillot",

Dominique Collard1, and Hiroyuki Fujita1

'University of Tokyo. JAPAN.

'Institut d'Electronique de Microelectroniqiie et de

Nanotechnologie, FRANCE

• Pressure Sensors

- 3 1

1B3.1

1B3.2

13:30-14:45 Monday, June 6

Next Generation Pressure Sensors in Surface

Micromachining TechnologyG. Lammel, S. Armbruster, C. Schelling,H. Benzel, J. Brasas, M. tiling, R. Gampp,V. Senz, F. Schaer, and S. FinkbeinerRobert Bosch Gmhll. GERMANY 35

Fully CMOS Compatible On-LSI CapacitivePressure Sensor Fabricated using StandardBack-End-of-line ProcessesT. Fujimori, Y. Hanaoka, K. Fujisaki,

N. Yokoyama, and H. FukudaHitachi Ltd. JAPAN

1B3.3 A CMOS-Based Architecture for a DistributedSensor Matrix in Underwater EnvironmentL. Magagni1. M. Sergio', M. Nicolini1,

D. Gennaretti', R. Canegallo2, and R. Guerrieri'University of Bologna. ITALY.

'STMicroelectronics. ITALY

1B3.4 Multifunctional Smart Tactile-Image Sensor withIntegrated Arrays of Strain and TemperatureSensors on Single Air-PressurizedSilicon Diaphragm

Hidekuni Takao, Kazuaki Sawada,

and Makoto IshidaToyohashi Universit}' of Technology. JAPAN

• 37

•41

• 4 5

1B3.5 A Capacitve Pressure Sensor with a NovelMulti-Layered Composite Membrane StrucutreFabricated by a Three-Mask ProcessMin-Xin Zhou, Qing-An Huang, and Ming QinSoutheast University. CHINA 49

• Electrostatic Actuators

13:30-14:45 Monday. June 6

1C3.1 High Performance Bidirectional Electrostatic

lnchworm Motor Fabricated by Trench IsolationTechnologyE. Sarajlic , E. Berenschot , N. Tas , H. Fujita",

G. Krijnen , and M. Elwenspoek'University of Twente. The NETHERLANDS,

'University of Tokyo, JAPAN 53

VI

1C3.2 Stiction Drive Operation of Micromotors:Direct and Reverse Rotation ControlBernard Legrand, Lionel Buchaillot,and Dominique CollardInstitut d'Electronique. de Microelectroniqiie et de

Nanotechnologie, FR.4NCE 57

1C3.3 Long Travel Parallel Plate ElectrostaticActuatorViacheslav Krylov1 and Yacov Bernstaiir'Tel Aviv University, ISRAEL, 'Tearop Ltd., ISRAEL 61

1C3.4 Design and Fabrication of a Pure-RotationMicroscanner with Self-Aligned ElectrostaticVertical Combdrives in Double SOI WaferY. Mizoguchi' and M. Esashi2

'CANON Inc.. JAPAN, "Tohoku University JAPAN 65

1C3.5 Micro XY-Stages With Spider-Leg Actuatorsfor 2-Dimensional Optical ScanningHo Nam Kwon'~, Jong-Hyun Lee1, Kazuhiro'Jonnie' Takahashi", and Hiroshi Toshiyoshi"Gwangjn Institute oj Science and Technology. KOREA.

'University of Tokyo. JAPAN 69

• Microdroplets and Micro Bead Technology

13:30-14:45 Monday. June 6

1D3.1 Beads Actuation with Kinesin on a IVIicrotubuleImmobilized in a Nano Fluidic ChannelRyuji Yokokawa, Yumi Yoshida,

Shoji Takeuchi, Takahide Kon,

Kazuo Sutoh, and Hiroyuki FujitaThe University of Tokyo. JAPAN 73

1D3.2 Two Dimensional Magnetic Manipulation ofMicrodroplets on a Chip

U. Lehmann, S. Hadjidj, V.K. Parashar,A. Rida, and M.A.M. GijsEcole Polytechnique Federale de Lausanne,

SWITZERLAND • 77

1D3.3 Magnetic Force-Based Immunoassay usingSuperparamagnetic Nanoparticles inMicrofluidic ChannelKyu Sung Kim and Je-Kyun ParkKorea Advanced Institute of Science and

Technology. KOREA

ID3.4 Trapping and Manipulation of Particles andDroplets using Micro-Toroidal ConvectionCurrentsAmar S. Basu and Yogesh B. GianchandaniUniversity of Michigan, USA - 85

1D3.5 EWOD Actuation with Electrode-FreeCover PlateUi-Chong Yi and Chang-Jin "Cl" KimUniversity of California at Los Angeles, USA • - 89

• Carbon Nanotube Processes

15:15-16:15 Monday. June 6

1A4.1 Localized and CMOS Compatible Growth ofCarbon Nanotubes on a 3x3 urn2

Microheater Spot

Alain Jungen, Christoph Stampfer, Marc Tonteling,

Sebastien Schiesser, Debajyoti Sarangi, and

Christofer HieroldETH Zurich. SWITZERLAND 93

1A4.2 Non-Catalyst and Low Temperature Growth ofVertically Aligned Carbon Nanotubes forNanosensor ArraysH.T.M. Pham1", C.R. de Boer1, and P.M. Sarro''Delft Universin- of Technology, the NETHERLANDS.'Vietnamese Academy (if Science and Technology,

VIETNAM 97

1A4.3 Selective Bridging of Single-Walled CarbonNanotubes Controlled with Electric Field Appliedto Silicon StructuresYusuke Takei, Kazunori Hoshino,

Kiyoshi Matsumoto, and Isao ShimoyamaThe University of Tokyo, JAPAN 101

1A4.4 Novel Process Flow for the Integration of CarbonNanotubes into MEMS

Alain Jungen, Christoph Stampfer, Jochen Hoetzel,

and Christofer HieroldETH Zurich. SWITZERLAND 105

• Inertial Microsystems I

15:15-16:15 Monday, June 6

1B4.1 Sub-mm Encapsulated Accelerometers:A Fully Implantable Sensor forCochlear Implants

Woo-Tae Park1, Kevin N. O'Connor'1,

Joseph R. Mallon Jr. ", Toshiki Maetani

Rob N. Candler1, Vipin Ayanoor-Vitikkate',

Joseph B. Roberson ", Sunil Puria ' ,

and Thomas W. KennyStanford University USA. 'California Ear Institute, USA,

'Palo Alto Veterans Administration, USA 109

1B4.2 A MEMS Hybrid Inertial Sensor Based onConvection Heat TransferRong Zhu1, Yan Su", and Henggao Ding1

Tsinghua University, CHINA,

'Southeast University, CHINA 1 13

1B4.3 A Micromachined Gyroscope withPiezoresistance for both High PerformanceCoriolis-Effect Detection andTorsional Vibration MonitoringXuemeng Chen, Xinxin Li, Zhaohui Song,Shusen Huang, Yuelin Wang, Jiwei Jiao,Heng Yang, and Ying ZhangChinese Academy of Sciences. CHINA 117

VII

1B4.4 A Bulk Micromachined Lateral Axis Gyroscope jwith Vertical Sensing Comb Capacitors |

Zhenchuan Yang', Congshun Wang2, j

Guizhen Yan', Yilong Hao', j

and Guoying Wu j'Peking University, CHINA, I'Chinese Academy of Sciences, CHINA 121 j

• Surface Tension & Electrowetting Liquid j

Actuators I

15:15-16:15 Monday. June 6 j

1C4.1 A Distributed Actuation Method Based on j

Young-Laplace Forces \

Ruba T. Borno and Michel M. Maharbiz jThe University of Michigan, USA 125 ;

1C4.2 A Micro Particle Sampler usingElectrowetting-Actuated Droplet Sweeping •

Yuejun Zhao and Sung Kwon Cho jUniversity of Pittsburgh, USA 129 ;

1C4.3 Liquid Loading of Silicon-Based Cantileversusing Electrowetting Actuation forMicrospotting Applications

T. Leichle', D. Saya', P. Belaubre',

JB. Pourciel', F. Mathieu1, J?. Laur1,

L. Nicu1, and C. Bergaud2

'LAAS-CNRS, FRANCE,:LIMMS-CNRS, JAPAN 135

1C4.4 Using EWOD (Electrowetting-On-Dielectric)Actuation in a Micro Conveyor SystemIlju Moon and Joonwon KimP o h a n g University of S c i e n c e a n d Technology, K O R E A •••• 1 3 9

• Biochip

15:15-16:15 Monday, June 6

1D4.1 Invited Speaker

Flat Fluidics: Acoustically Driven PlanarMicrofluidic Devices for Biological andChemical ApplicationsAchim WixforthUniversity of Augsburg, German) 143

1D4.2 Single Potential Electrophoresis on-Chip usingPressure Pulse Injection

Frederic Lacharme and Martin A. M. GijsEeole Polytechnique Fedeale de Lausanne,

SWITZERLAND 147

1D4.3 Elcrochemical Bio-Lithography for in-situImmobilization of Proteins and Cells withinMicrochannelsMatsuhiko Nishizawa, Hirokazu Kaji,

Kazuto Tsukidate, Masahiko Hashimoto,

and Takashi Abe

Tohoku University, JAPAN 151

• AFM/Probe Fabrication16:30-17:30 Monday, June 6

1A5.1 A New Design of Knife Edged-AFM Probe forChromosome Precision ManipulatingMasato Saito', Kazuhisa Nakagawa ,

Keiichiro Yamanaka', Yuzuru Takamura',

Gen Hashiguchi", and Eiichi TamiyaJapan Advanced Institute of Science and Technology,

JAPAN, 'Kagawa University, JAPAN 155

1A5.2 Multifunctional Tool for Expanding AFM-BasedApplicationsS. Deladi, N.R. Tas, G.J.M. Krijnen,and M.C. ElwenspoekUniversity of Twente. The NETHERLANDS 159

1A5.3 Scanning Probe Parallel Nanolithography using Multi-Probes Cantilever Array for Silicon NanodevicesHensy Gandjar, Yuki Takagi, and Yoshitada IsonoRitsumeikan University, JAPAN 163

1A5.4 Fabrication of Silicon Nanostructures withVarious Sidewall Profiles and Sharp TipsChang-Hwan Choi and Chang-Jin "CJ" KimUniversity of California at Los Angeles, USA 168

• Inertial Microsystems II16:30-17:30 Monday. June 6

1B5.1 Inertial-Grade Out-of-Plane and In-Plane DifferentialResonant Silicon Accelerometers (DRXLs)Hyeon Cheol Kim', Seonho Seok', Ilwhan Kim1,

Soon- Don Choi*, and Kukjin ChunSeoul National University. KOREA.

' Yeungnam University, KOREA

1B5.2 Outrigger. Solid Outer Frame LateralAccelerometer DesignGary J. O'Brien, Jonathan Hammond, Gary Li,

Dan Koury, and David J. MonkFreescale Semiconductor, USA

1B5.3 The First Sub-deg/hr Bias Stability, Silicon-Mierofabricated GyroscopeByoung-doo Choi1, Sangjun Park',Hyoungho Ko , Seung-Joon Paik ,Yonghwa Park1, Geunwon Lim', Ahra Lee2,Sang Chul Lee", William Carr , Dadi etiadi,Robert Mozulay3, and Dong-il "Dan" Cho''2

'Seoul National University, KOREA, 'SML Electronics,

Inc., KOREA, 'Nano Inertial Systems, Inc., USA

172

176

180

1B5.4 New Surface Micromachined Angular Rate Sensorfor Vehicle Stabilizing Systems in AutomotiveApplications

U.-M. Goez, B. Kuhlmann, J. Classen, W. Bauer,

C. Lang, M. Veith, E. Esch, J. Frey,F. Grabmaier, K. Offterdinger, T. Raab,

H.-J. Faisst, R. Willig, and R. NeulRobert Bosch GmbH, GERMANY 184

viii

• Micropumps

16:30-17:30 Monday. June 6

1C5.1 A High Performance Bidirectional Micropumpfor a Novel Artificial Sphincter SystemA. Doll', S.Reimers1, M. Heinrichs1, F.

Goldschmidtboeing', H.-J. Schrag2,

U. T. Hopt2, and P. Woias1

'University of Freiburg, GERMANY.2 University Hospital Freiburg, GERMAN}'

1C5.2 Electromagnetically Actuated Ball ValveMicropumps

Christophe Yamahata, Frederic Lacharme,Jan Matter, Silvan Schnydrig, Yves Burri,and Martin A. M. GijsEcole Polytechnique Frede'rale de Lausanne.

SWITZERLAND

188

192

1C5.3

1C5.4

An Electrohydrodynamically DrivenMicrofabricated Actuator for the Stud)' ofMiniature Ion Propulsion Engine andElectric Wind DevicesB. L. Chua, Logeeswaran VJ, M. L. Chan,

H. K. Park, D. A. Horsley, and N. C. TienUniversity of California at Davis, USA

A Polymeric Paraffin Micropump withActive Valves for High-Pressure MicrofluidicsR. Boden, M. Lehto, U. Simu, G. Thornell,

K. Hjort, and J.-A SchweitzUppsala University. SWEDEN

197

•201

• Bio-tool

16:30-17:30 Monday. June 6

1D5.1 MEMS-Based Sonoporation Devices for

Intratumoral Gene TherapyT. Siu, D. M. Trivedi, M. Chiao,and R. RohlingUniversity of British Columbia, CANADA 205

1D5.2 Microdevice Components for a CellularMkrosurgeiy SuiteWesley C. Chang1, Christopher G. Keller2,Elizabeth A. Hawkes1, and David W. Sretavan1

University- of California at San Francisco, USA,

"MEMS Precision Instruments, USA •209

1D5.3 Reliable in-vivo Penetration and TransdermalInjection using Ultra-Sharp Hollow MicroneedlesNiclas Roxhed, Patrick Griss, and Goran StemmeRoyal Institute of Technology, SWEDEN 213

1D5.4 A Novel Fabrication of Ionic Polymer-MetalComposites (IPMQ Actuator with SilverNano-PowdersC. K. Chung', Y. Z. Hong1, P. K. Fung',M. S. Ju', C. C. K. Lin', and T. C. Wu2

'National Cheng Kttng University, TAIWAN,

'Industrial Technology Research Institute, TAIWAN 217

VOLUME 1 / TUESDAY, JUNE 7

• Sensor Network and Integration

09:00-10:15 Tuesday, June 7

2A1.1 Invited SpeakerSmart Clothes and Associated Wearable Devicesfor Biomedical Ambulatory Monitoring

A. Dittmar1 and A. Lymberis2

'CNRS LPM. FRANCE, European Commission

Information Society & Media Directorate, BELGIUM 221

2A1.2 Integrating Wireless ECG Monitoring in TextilesJ. Coosemans, B. Hermans, and R. PuersKatholieke Universiteit Leuven, BELGIUM 228

2A1.3 An Autonomous Microsystem for Environmentaland Biological Data GatheringDavid F. Lemmerhirt, David A. Fick, and

Kensall D. WiseThe University of Michigan, USA 233

2A1.4 CMOS-Based Tactile Sensor for Coronary ArteryIdentification

Tomi Salo, Kay-Uwe Kirstein, Tobias Vanura, and

Henry BaltesETH Zurich, SWITZERLAND 239

• Resonator-type Sensors

09:00-10:15 Tuesday. June 7

2B1.1 Invited Speaker

Vibrating RF MEMS Technology: Fuel for anIntegrated Micromechanical Circuit Revolution?Clark T.-C. NguyenDARPA. USA 243

2B1.2 Quartz-Crystal Canuievered Resonator forNanometric SensingYu-Ching Lin, Takahito Ono, and Masayoshi EsashiTohoku University. JAPAN 247

2B1.3 Feedback Control of High-Intensity SiliconUltrasonic Surgical Actuator11-Seok Son' and Amit Lai2

University of Wisconsin at Madison. USA,

''Cornell University. USA 252

2B1.4 Capacitive Resonant Mass Sensor with LCResonant Circuit for use in AtmosphereSang-Jin Kim, Takahito Ono, and Masayoshi EsashiTohoku University, JAPAN 256

• Nano-electrical Characterization


2C1.1 Invited Speaker

Semiconductor Nanostructure Devices:Recent Advances and Their Potentials for

IX

Transducers ApplicationsHiroyuki SakakiUniversity of Tokyo. JAPAN •

• Power Generator for Stand-alone Systems

•261

2C1.2 Terahertz Emission Properties fromPalladium/Silicon InterfaceToshihiko Kiwa', Keiji Tsukada', Masato Suzuki",

Masayoshi Tonouchi", Sonoko Migitaka , and

Koichi YokosawaOkayama University, JAPAN,

'Osaka University. JAPAN. 'Hitachi Ltd. JAPAN

2C1.3 Schottky Emitters with Carbon Nanotubes asElectron SoureePhan Ngoc Minh1, Nguyen Tuan Hong1,

Ngo Quang Minh', Phan Hong Khoi1,

Yuka Nomura", Takahito Ono", and

Masayoshi Esashi"

Vietnamese Academy of Science and

Technology. VIETNAM.

'Tohoku University, JAPAN

• 263

• 267

2C1.4 Semiconductivity of Pyrolyzed Polymer forMEMS Application

S. Konishi, H. Nagae, T. Sagawa,K. Naka, and K. YoshiokaRitsumeikan University, JAPAN 271

Biosensors and Cells


2D1.1 Invited Speaker

Micromachined Endovascularly-ImplantableWireless Aneuiysm Pressure Sensors:from Concept to ClinicMark G. Allen

Georgia Institute of Technolog\\ USA 275

2D1.2 Smart Microfuluidic Electrochemical DNASensors Integrated Signal Processing CircuitsKazuaki Sawada, Chigusa Oda,Hidekuni Takao, and Makoto IshidaToyohashi University of Technology, JAPAN .... 279

2D1.3 Monitoring of Yeast Cell Concentrationusing a Micromachined Impedance SensorE. E. Krommenhoek1, J. G. E. Gardeniers1,J. G. Bomer', A. Van den Berg', X. Li2,M. Ottens", L. A. M. van der Wielen',G. W. K. van Dedem", M. Van Leeuwen",W. M. van Gulik", and J. J. Heijnen"'University of Twente. The NETHERLANDS,

'Delft University of Technology,

The NETHERLANDS • 283

2D1.4 A Microfabricated Narrow Gap Biofuel Cellwith Membraneless Design Flexibility

Naga S. Korivi and Jin-Woo ChoiLouisiana State University, USA

2A2.1


Thermoelectric MEMS Generators as a Power

Supply for a Body Area NetworkV. Leonov', P. Fiorini1, S. Sedky",

T. Torts', and C. Van Hoof1

Intenmiversity Microelectronics Center, BELGIUM,

'The American University in Cairo, EGYPT • 291

2A2.2 Novel MEMS Power Generator withIntegrated Thermoelectric andVibrational DevicesNorio Sato', Hiromu Ishii', Masami Urano',Tomomi Sakata', Jun Terada'. Hiroki Morimura1,Satoshi Shigematsu , Kazuhisa Kudou",Toshikazu Kamef, and Katsuyuki Machida

'NTT Corporation, JAPAN,

'NTT Advanced Technology Corporation. JAPAN — • 295

2A2.3

2A2.4

Design and Implementation of an IntegratedFloating-Gate Electrostatic Power Micro-GeneratorWei Ma1, Libor Rufer", Yitshak Zohar, and Man Wong1

Hong Kong University of Science and Technology.

HONG KONG. 'TIMA Laboratory. FRANCE,

University of Arizona USA 299

A Micro Direct Methanol Fuel Cell using PDMSAssembly TechnologyYingqi Jiang. Xiaohong Wang, Kewen Xie,

Xinping Qiu, Lingyan Zhong, and Litian LiuTsinghua University, CHINA • 3(0

• Physical Sensors I

2B2.1

2B2.2


Pyroelectric Infrared Sensors with Fast Response

Time and High Sensitivity using Epitaxial

Pb(Zr,Ti)O, Films on Epitaxial y-AhOj/Si

Substrates

Daisuke Akai , Keisuke Hirabayashi ,Mikako Yokawa', Kazuaki Sawada',Yoshiharu Taniguchi", Shinnichi Murashige",Naoto Nakayama2, Tetsuya Yamada".Kensuke Murakami", and Makoto IshidaToyohashi University of Technology. JAPAN,

"Nippon Ceramic Co., Ltd.. JAPAN 307

An Ultra-Low-Power Physics Package for aChip-Scale Atomic Clock

Mark J. Mescher', Robert Lutwakg", andMathew Varghese'Charles Stark Draper Laboratoiy. USA

'Symmetricom Inc., USA

2B2.3

• 287

First Fully CMOS-Integrated 3D Hall ProbeP. Kejik , E. Schurig , F. Bergsma", and

R. S. Popovic'Ecole I'olytechnique Federate de Lausanne,

SWITZERLAND, 'European Organization for

NuclearResearch, SWITZERLAND • 3 1 7

2B2.4 Novel Highly Miniaturized Multi-Stress SensorField Effect Transistor with Eight Source/DrainTerminalsM. Doelle, J. Bartholomeyczik, P. Ruther,

and O. PaulUniversity of Freiburg, GERMANY 321

2B2.5 2-D and 3-D Tactile Pin Display using SMAMicro-coil Actuator and Magnetic LatchT. Matsunaga', W. Makishi1, K. Totsu2,

M. Esashi", and Y. Haga'Tohoku University Biomedical Engineering Research

Organization. JAPAN. ''Tohoku University. JAPAN 325

• Pneumatic and Hydraulic Actuators


2C2.1 Small Footprint Knife Gate Microvalves forLarge How ControlStefan Braun, Sjoerd HaasI, Samir Sadoon,

Anthony S. Ridgevvay, Wouter van

der Wijngaart, and Goran StemmeRoyal Institute of Technology. SWEDEN 329

2C2.2 Comparison of Two Seal Technologies forHydraulic MicroactuatorsMichael De Voider', Jan Peirs1,

Dominiek Reynaerts1. Johan Coosemans',

Robert Puers , Olivier Smal~.

and Benoit Raucent"Katholieke Universiteit Leuven, BELGIUM,

" Universiteit Catholique de Louvain, BELGIUM 333

2C2.3 Fuel and Air Supply System forCombustion Based Power SourcesDaisuke Satoh, Shuji Tanaka, andMasayoshi EsashiTohoku University, JAPAN 337

2C2.4 Charaterization and Modeling of a Liquid-VaporPhase Change Membrane Actuator with anIntegrated SU-8 Micro CapillaryWicking StructureS. A. Whalen1, S.Y. Won2, R. F. Richards2,

D. F. Bahr2, and C. D. Richards"Sandia National Laboratories, USA,

"Washington State University, USA 342

2C2.5 A Lobster-Sniffing Inspired Actuator forManipulation of Micro-Objects viaControlling Local FluidChia-Fang Chiang, Cheng-Hsiang Liu,

Chieh Chang, and Cheng-Hsien Liu

Ying-Chih Wang, Jianping Fu, Pan Mao,

and Jongyoon HanMassachusetts Institute of Technology, USA •••• 3 5 2

National Tsing-Hua University, TAIWAN 348

• Microfiuidics


2D2.1 Nanofluidic Molecular Filtere for Efficient ProteinSeparation and Preconcentration

2D2.2 Nanoliter Liquid Handling on a Low CostDisposable with Embedded Fluid ActuatorsBjorn Samel, Volker Nock, Aman Russom,Patrick Griss and Goran StemmeRoyal Institute of Technology. SWEDEN 356

2D2.3 Microfluidic Device for Immobilization of Bio-Vesicles Towards Controlled on-chip ElectrofusionD. Ziegler, Ph. Coquet, A. Tixier-Mita,

G. Tresset, H. Fujita, S. TakeuchiThe University of Tokyo. JAPAN 360

2D2.4 An on-chip Autonomous Microfluidic CoolingSystemAbhishek K. Agarwal, Sudheer S. Sridharamurthy,David J. Beebe and Hongrui JiangUniversity of Wisconsin-Madison, USA 364

2D2.5 A Planar 2-Stage MicromixerB. Stoeber, D. Liepmann, and S. J. MullerUniversity of California at Berkeley, USA 368

• Microlens/Laser Applications


2A3.1 Novel Fabrication Method of Self Positioned andFocal Length Tuned MicrolensSei-Hwan Jung1, Kook-Nyung Lee",Yun-Ho Jang', and Yong-Kweon Kim'Samsung SDI Co.. Ltd.. KOREA.

"Korea Electronics Technology Institute. KOREA.

Samsung Electronic Co., Ltd., KOREA,

Seoul National University. KOREA 372

2A3.2 Tunable Micro-Aspherical Lens Manipulated by2D Electrostatic ForcesChang-Wei Chen and Fan-Gang TsengNational Tsing Hua University, TAIWAN • •376

2A3.3 Application of Flowing Thermal Lens to FlowSensors for Microchemical ChipsYoshikuni Kikutani12, Keisuke Morishima1'2,

Manabu Tokeshi ", Jun Yamaguchi', Takashi

Fukuzawa3, Akihiko Hattori'1, Yoshikazu Yoshida',

Mitsuo Kitaoka1, and Takehiko Kitamori'"'4

The Research Association of Micro Chemical Process

Technology. JAPAN. 'Kanagawa Academy of Science

and Technology. JAPAN. Nippon Sheet Glass

Co., Ltd.. JAPAN. 4The University of Tokyo. JAPAN 380

2A3.4 High Aspect Ratio Nano-Structures (HAMS) forPhotonic MEMS Based on Vertical DBRArchitectureFrederic Marty', Bassam Saadany1, Tarik

Bourouina', Yoshio Mita , and Tadashi Shibata1'' ESIEE-ESYCOM, FRANCE.

'The University of Tokyo, JAPAN ••• 3 8 4

xi

2A3.5 MEMS Injection-Locked LaserX. M. Zhang, A. Q. Liu, H. Cai, C. Lu, and

D. Y. TangNanyang Technological University, SINGAPORE 388

• Physical Sensors II


2B3.1 Effects of Stress on the Temperature Coefficientof Frequency in Double Clamped Resonators

Renata Melamud, Matt Hopcroft, Chandra Jha,Bongsang Kim, Saurabh Chandorkar,and Rob Candler, Thomas W. KennyStanford University, USA

2B3.2 Novel Integrated Shock Protection for MEMSSang Won Yoon, Navid Yazdi,

Noel C. Perkins, and Khalil NajafiUniversity of Michigan, USA

• 392

- 396

2B3.3 A New Self-Test and Self-Calibration Conceptfor Micro-Machined GyroscopesT. Link1, 1. Simon', M. Trachtler',

A. Gaisser , M. Braxmaier , Y. Manoli '",and H. Sandmaier'HSG-1MIT, GERMANY, ''1MTEK, GERMANY,' Tsinghua University of Beijing, CHINA,

"University of Stuttgart, GERMANY 401

2B3.4 Design of a Micromachined CMOS CompassN. Dumas, L. Latorre, and P. NouetUniversity Montpellier, FRANCE 405

2B3.5 A Hard-Disk Drive Tracking ServoMicroactuator Driven by PZT with StrokeAmplification MechanismToshiki Hirano and Henry YangHitachi Global Storage Technologies, Inc., USA 409

• Packaging of Microsystems


2C3.1 Fabrication of Miniaturized Electron Beam SystemHak Kim', Changho Han1, Hyeon Cheol Kim1,Soondon Choi", and Kukjin Chun'Seoul National University:, KOREA,

'Yeung Nam University:, KOREA 413

2C3.2 Monolithic Integration of High Voltage DriverCircuits and MEMS Actuators by ASIC-LikePostprocessK. Takahashi1, H. N. Kwonu , M. Mita\

H. Fujita', H. Toshiyoshi1, K. Suzuki4,

and H. FunakiUniversity of Tokyo, JAPAN, 'Gwangju Institute of

Science and Technology, KOREA, Japan Aerospace

Exploration Agency, JAPAN, ^TOSHIBA Corp.. JAPAN 417

2C3.3 Microlens Array and Micro Clampers for HighPerformance Optoelectronic Devices Packaging

Arun Kumar Nallani , Ting Chen", J-B.Lee ,

Donald J Hayes2, and David B Wallace2

University of Texas at Dallas, USA,

'MicroFab Technologies, Inc., USA 421

2C3.4 Resonance-Free HRS MEMS Package forMicrowave and Millimeter-WaveYo-Tak Song1, Takahito Ono', Hai-Young Lee2,

and Masayoshi Esashi'Tohoku University, JAPAN, 2Ajou University-, KOREA 427

2C3.5 H2/Air Self-Breathing Micro PEM Fuel CellStacks with MEMS Fabrication TechnologyCong Chen', Tao Wang', Peitao Dong',

Xigui Zhang1, Jufeng Li', Dan Zheng",

Baojia Xia', and Xinxin Li1

Chinese Academy of Sciences, CHINA,

Shanghai Institute of Technology, CHINA 433

• Bio-cells


2D3.1 InvitetLSpeaker

Disposable Polymer "Smart" Lab-on-a-chip forPoint-of-care Testing (POCT) in ClinicalDiagnosticsChong H. AhnUniversity of Cincinnati, USA 437

2D3.2 Design and Operation of a MicromachinedBubble-Jet Cell Sorter

Chung-Chu Chen1, Jen-Shiang Wang2,

Stefan Zappe', Xiaojing Zhang , and Olav Solgaard"Wayne State University. USA, 'Stanford University,

USA, Massachusetts Institute of Technology, USA 441

2D3.3 Multi Particles and Biomolecules Sorting System usingThermoreversible Gelation Controlled by DMD

Shota Watabe , Masayasu Tatsuoka ,

Tomohiro Shimomae1, Yoshitaka Shirasaki',

Jun Mizuno2, Takashi Funatsu', and Shuichi Shoji1

'Tokyo University, JAPAN, "Waseda University, JAPAN 445

2D3.4 Dispensing of Cells for Highly Parallel Productionof Living Cell MkroarraysOliver Gutmann, Markus K. Wintermantel,

Remigius Niekrawietz, Bas de Heij,

Roland Zengerle, and Martina DaubUniversity of Freiburg, GERMANY 449

• Sensing Systems/Networks

Poster Session 14:45-17:30 Tuesday. June 7

2E4.1 RF Smart-Sensor for Venous Ulcer TreatmentMirco Meiners1, Martin Sultenguth1,Wjatscheslaw Missal', Timo Schary',Wolfgang Benecke1, Walter Lang1, andMarkus Stilcker"University Bremen, GERMANY.

"St. Josef Hospital, GERMANY 453

XII

2E4.2 "Chip-Size" Antennas for Implantable Sensorsand Smart DustP. Basset'-', F. Alfaro', D. Novosel2,

A. de la Plaza2, D. Stancil1, and G. K. Fedder'Carnegie Mellon University, USA,

'Novocell Semiconductor, USA,

'ESYCOM-ESIEE, FRANCE 457

2E4.3 Simplified Circuit Modeling and Fabrication ofIntrabody Communication DevicesKeisuke Hachisuka', Yusuke Terauchi1,

Yoshinori Kishi', Terunao Hirota1,

Ken Sasaki , Hiroshi Hosaka , and

Koichi Ito"The University of Tokyo, JAPAN,

"Chiba University, JAPAN 461

2E4.4 A Portable Multi-Sensor Datalogger for HeartRate Variability (HRV) Study DuringSkydiver's Free Fall

B. Hermans, B. Verheyden, F. Beckers,A. Aubert, and R. PuersK.U.Leuven, BELGIUM 465

2E4.5 SiC Pressure Sensor for Detection of CombustorThemio-Acoustic InstabilitesRobert S. Okojie, John C. DeLaat, andJoseph R. SausNASA Glenn Research Center, USA 470

2E4.6 Multipole Marker and Correlation Image Sensorfor Position and Pose Estimation inSensor NetworksYohei Nagai, Takaaki Shimizu, Toru Kurihara,

Nobutaka Ono, Takaaki Nara, and

Shigeru AndoThe University of Tokyo, JAPAN 474

2E4.7 A Locally Autocompensating Image SensorNils Friedrich and Markus BoehmUniversity of Siegen, GERMANY 479

• Pressure SensorsPoster Session 14:45-17:30 Tuesday. June 7

2E4.8 A Micromachined Polyurethane/Stainless-Steel

Capacitive Pressure Sensor without Cavity and

Diaphragm

Kenichi Takahata and Yogesh B. GianchandaniUniversity of Michigan, USA 483

2E4.9 Diaphragm-Type Miniature Optical Fiber PressureSensor with a Sleeve

T. Watanabe, Y. Kaneko, M. Shimada, andK. TakahashiSaitama University. JAPAN 487

2E4.10 Liquid-Core, Piezoresistive, Fully Polymer-BasedPressure SensorJan Lichtenberg and Andreas HierlemannETH Zurich. SWITZERLAND 491

2E4.11 Proposal of a New Magneto-Transistor with aRecombination Region in the Base of theBipolar TransistorMitsuteru Kimura and Sin TakahashiTohoku-Gakuin University. JAPAN

2E4.12 A Thin Film Strip for Aerodynamic BodyPressure Profile MonitoringM. Zagnoni, A. Rossetti, P. Proli,

A. Golfarelli, S. Callegari, A. Talamelli,

E. Sangiorgi, and M. Tartagni

495

University of Bologna. ITALY- •499

2E4.13 Sapphire-based Capacitance Diaphragm Gaugefor High Temperature ApplicationsT. Ishihara1, M. Sekine', Y. Ishikura1,S. Kimura , H. Harada , M. Nagata , andT. Masuda"'Yamatake Corporation, JAPAN,

'Gunma Industrial Technology Center, JAPAN 503

• Accelerometers and Gyroscopes

Poster Session 14:45-17:30 Tuesday, June 7

2E4.14 Two-Chip Implemented, Wafer-Level HermeticPackaged Accelerometer for Tactical and InertialApplications

Hyoungho Ko , Sangjun Park , Byoung-doo Choi ,

Yonghwa Park', Geunwon Lim1, Seung-Joon Paik',

Ahra Lee", Kwangho Yoo", Sangmin Lee",

Jaesang Lim", Sang Chul Lee', Min Ha Park ,

Flyun-Su Jang, Jeongpyo Lee ,

Yong Kyu Roh . and Dong-il "Dan" Cho1"'Seoul National University, KOREA,:SML Electronics, Inc., KOREA,

'Hyundai MOBIS. KOREA 507

2E4.15 SOI Micromachined 5-Axis Motion Sensor usingResonant Electrostatic Drive and Non-ResonantCapacitive Detection Mode

Yoshiyuki Watanabe1, Toshiaki Mitsui1, Takashi

Mineta", Yoshiyuki Matsu', and Kazuhiro OkadaYamagata Research Institute of Technology. JAPAN.

"Hirosaki University. JAPAN.

'Wacoh Corporation. JAPAN 51 I

2E4.16 Sub-Micro-Gravity Capacitive SOIMicroaccelerometersB. Vakili Amini, R. Abdolvand and F. AyaziGeorgia Institute of Technology, USA 515

2E4.17 A Novel Thermal-Bubble-Based MicromachinedAccelerometerKe-Min Liao1, Rongshun Chen1, and

Bruce C. S. Chou"National Tsing Una University, TAIWAN,

''LighTuning Technology Inc.. TAIWAN 519

2E4.18 Fabrication of Nano-Gap Accelerometer using?hoto-Assisted Electrochemical Etching

XIII

Hyeon Cheol Kim, Dae Hyun Kim,Jinwoo Jeong, and Kukjin ChunSeoul National University, KOREA

2E4.19 Poly-silicon Packaging and a New AnchoringTechnology for Thick SOI MEMS - DynamicResponse Model and Application toOver-Damped Inertial Sensors

B. Diem , J. C. Barbee , F. de Creecy ,

S. Giroud1, D. Renaud1, H. Grange1,

J. Hammond", J. Vandemeer', R. Roop", and

B. Gogoi"'CEA-LET1, FRANCE, '"Freescale Semiconductor, USA,

'AKUSTICA INC., USA

2E4.20 Vacuum Packaged Single Crystal SiliconGyroscope with Sub mdeg/s/VHz ResolutionJune-Young Lee , Seung-Hoon Jeon ,

Hyoung-Kyoon Jung , Hyun-Kee Chang",

and Yong-Kweon Kim'Seoul National University, KOREA,

'Intellimicrons Co.. LTD.. KOREA

• 527

• 5 3 1

2E4.21 A Digitally Controlled MEMS Gyroscope with3.2 deg/hr Stability

H. Rodjegard', D. Sandstrom1, P. Pelin1, N.Hedenstiema', D. Eckerbert , and G. I. Andersson'imego AB, SWEDEN. "SensoNor AS. NORWAY 535

2E4.22 Two-Mass System with Wide Bandwidth forSiOG (Silicon on Glass) Vibratory GyroscopesSeung-Hoon Jeon , June-Young Lee",

Hyoung-Kyoon Jung", Hyun-Kee Chang',

and Yong-Kweon Kim"Hyundai Motor Company and Kia Motors Corporation.

KOREA, "Seoul National University, KOREA,

'inteHimicrons Co. Ltd.. KOREA • 539

• Physical Sensors

Poster Session 14:45-/7:30 Tuesday. June 7

2E4.23 Technology and Integration of Poly-CrystallineDiamond Piezoresistive Position Sensor forCochlear Implant ProbeYuxing Tang1, Dean M. Aslam', Jianbai Wang",and Kensall D. Wise2

Michigan State University, USA,

'University of Michigan. USA 543

2E4.24 A Dynamic Millinewton Thrust VectorMeasurement System in SiliconAnders B. Eriksson, Robert Lindegren,and Johan Kohler'Uppsala University-, SWEDEN 547

2E4.25 Micro Force Sensor with PiezoresistiveAmorphous Carbon Strain GaugeE. Peiner', A. Tibrewala1, R. Bandorf2, S. Biehl2,

H. Luhje", and L. DoeringTechnical University Braunschweig, GERMANY,

"Fraunhofer Institute for Thin Film and Surface

Engineering, GERMANY,

'Physikalisch Technische Bundesanstalt. GERMANY 551

2E4.26 Multidirectional Force and Torque Sensor forInsect Flight ResearchMansoor Nasir1, Michael Dickinson",

and Dorian LiepmannUniversity of California at Berkeley. USA.

'California Institute of Technology, USA 555

2E4.27 A New Capacitive Displacement Sensor withHigh Accuracy and Long RangeMoojin Kim', Wonkyu Moon1, Euisung Yoon",

and Kwang-ryeol Lee"Pohang University of Science and Technology. KOREA,

'Korea Institute of Science & Technology, KOREA 559

2E4.28 Thin Film NiTi Fluidic-Thermostat ArrayDaniel D. Shin, Dong-Gun Lee, Kotekar P.

Mohanchandra, and Gregory P. CarmanUniversity- of California at Los Angeles, USA 563

2E4.29 Characteristics of Improved Thin-FilmMultijunction Thermal ConvertersY. H. Lee1, S. W. Kwon2, K. J. Kim2,K. C. Lee2, S. I. Park2, and Y. E. lhm'Cluing Nam National University, KOREA,

'Korea Research Institute of Standards and

Science, KOREA 567

2E4.30 Micromachined Thermal Conductivity Sensorfor the Liquid PhaseJ. Kuntner', F. Kohl2, and B. Jakoby1

Vienna University of Technology. AUSTRIA,

'Austrian Academy of Sciences. AUSTRIA 571

2E4.31 A High-Temperature Thermopile FabricationProcess for Thermal Flow SensorsRainer Buchner, Klaus Rohloff,

Wolfgang Benecke, and Walter LangUniversity of Bremen, GERMANY 575

2E4.32 Thermal Flexible Foil-FingerprintsensorPatrick Schippers, Michael P. Dobmeier,

Ruben Kuehlewein, Burkhard Biistgens,

and Gerald UrbanAlbert-Ludwigs-Universitat. GERMANY 579

2E4.33 Highly Sensitive Electron-Emission-Type InfraredSensor using a Single Crystalline LiNbOjDaisuke Takamuro, Hidekuni Takao,

Kazuaki Sawada. and Makoto IshidaToyohashi University of Technology, JAPAN 581

2E4.34 A Floated Absorbing Structure for UncooledMicrobolometerM. S. Ahn12, Y. H. Han', H. J. Shin1,

K. T. Kim', S. H. Lee', S. Moon1,

and M. H. Oh2

Korea Institute of Science and Technology, KOREA,2Dankook University-, KOREA 585

XIV

2E4.35 Development of a Moems Sun Sensor forSpace ApplicationsTobias Bohnke and Lars Stenmark "'Uppsala University, SWEDEN, :ACR, SWEDEN 589

2E4.36 Novel High Q-Factor Resonant MicrosensorPlatform for Chemical and BiologicalApplicationsJae Hyeong Seo and Oliver BrandGeorgia Institute of Technology, USA 593

2E4.37 Impact of Slot Location on ThermoelasticDissipation in Micromechanical ResonatorsRob N. Candler', Matt Hopcroft',Carrie W. Low", Saurabh Chandorkar,Bongsang Kim', Mathew Varghese3,Amy Duwel3, and Thomas W. Kenny1

Stanford University, USA, ' University of California,

USA, Charles Stark Draper Laboratory, USA 597

2E4.38 A New Height-Adjustable Aeromems SurfaceFence Probe Fabricated in SOI Technology forHigh Resolution Wall Shear Stress Measurementin Turbulent RowsM. Schiffer, E. Obermeier, F. Grewe,A. Ebner, and H. H. FernholzTechnical University of Berlin, GERMANY' 601

2E4.39 Particle Cytometer Utilizing Rotating FlexuralPlate Modes and Capacitive SensingAbhijit Sathaye and Amit LaiUniversity of Wisconsin-Madison, USA,

'Cornell University USA

2E4.40 An Injection Quantity Sensor forAutomotive ApplicationsU. Schmid and H. SeidelSaarland University, GERMANY

2E4.41 Degradation Level Monitoring Sensor forInsulating Oil of Power Transformer usingCapacitive High Aspect Ratio of ElectrodesSunghyun Kim, Yiseok Kim, Jooran Yang,Sangjin Kwon, and Sekwang ParkKvungpook National University, KOREA

•605

609

• 613

2E4.42 Fabrication and Characteristics of the SuppressedSidewall Injection Magnetotransistor using aCMOS ProcessYoun-Gui Song, Ji-Goo Ryu, Young-Shig Choi,

and Nam-Ho KimPukyong National University, KOREA 617

2E4.44 Optimization of the Piezoresistive AFMCantilever Design for use at CryogenicTemperatures

Seung Seoup Lee1, Yutaka Miyatake2,

Ichiro Shiraki , Toshihiko Nagamura",

Kazushi Miki', Takahito Ono1,

and Masayoshi Esashi1

1 Tohoku University, JAPAN, ''UN1SOKU Co.. LTD.,JAPAN. 'National Research Institute for

Materials Science. JAPAN •625

2E4.45 Frequency and Transient Analysis ofMicromachined U-Shaped Cantilever Devicesfor Magnetic Field MeasurementFranz Keplinger, Roman Beigelbeck", Franz Kohl".

Samuel Kvasnica , Artur Jachimowicz ,

and Bernhard Jakoby'Vienna University of Technology. AUSTRIA.

'Austrian Academy of Sciences. AUSTRIA

2E4.46 Enhanced Functionality of Cantilever BasedMass Sensois using Higher Modes andFunctionalized Particles

Soren Dohn, Rasmus Sandberg,

Winnie Svendsen, and Anja BoisenTechnical University of Denmark. DENMARK

2E4.47 Fully Integrated CMOS Resonant CantileverSensor for Biochemical Detection in LiquidEnvironments

Cyril Vancura', Yue Li', Kay-Uwe Kirstein1,

Fabien Josse", Andreas Hierlemann , and

Jan Lichtenberg'ETH Zurich, SWITZERLAND,

' Marquette University, USA

2E4.48 A Piezoelectric Micro-Cantilever Bio-Sensor usingthe Mass-Microbalancing Technique withSelf-ExcitationYeolho Lee, Geunbae Lim, and Wonkyu MoonPohang University of Science and Technology-,

KOREA

• 6 3 0

• 6 3 6

.... 540

• 6 4 4

2E4.49 First Step Towards a Fully Automated TrimControl for Liquid Deposition Device at theMicroscale using Piezoresistive Cantilevers Row

Pascal Belaubre1, Jean-Bernard Pourciel',

Daisuke Saya , Thierry Lei'chle , Fabrice Mathieu .

Liviu Nicu , and Christian Bergaud"

'LAAS-CNRS FRANCE.'University of Tokyo. JAPAN • 648

• Micro/Nano Cantilever Sensors


2E4.43 The AFM Tweezere: Integration of a TweezersFunction With an AFM ProbeTetsuya Takekawa, Kazuhisa Nakagawa,

and Gen HashiguchiKagawa University', JAPAN 621

• Fluid Handling Actuators


2E4.50 Micro Valves Using Nanoparticle-Based GiantElectrorheological FluidXize NIU, Weijia WEN, and Yi-Kuen LEEThe Hong Kong University of Science and Technology.

HONG KONG 652

XV

2E4.51 Buekeld-Type Valves Integrated byPaiylene Micro-TubesJiun-Min Wang , Kuan-Chun Liu ,

Kai-Chung Ko', Lung-Jieh Yang1, and

Wen-Pin Shih2

Tamkang University, TAIWAN,

'National Taiwan University, TAIWAN 656

2E4.52 A Capillary System with Thermal-Bubble-Actuated lxN Micro Flow Switch viaTime-Sequence Power Ontrol forContinuous Liquid HandlingChin-Ming Cheng and Cheng-Hsien LiuNational Tsing Hua University, TAIWAN 660

2E4.53 Thermopneumatic-Actuated PDMS Microvalveand Micropump Integrated with the SameFabrication Process

Jong-Chul Yoo. Min-Chul Moon, C. J. Kang,

and Yong-Sang KimMyong/i University, KOREA 664

2E4.54 A Micro Diaphragm Air Pump for Air Supply ofMicro Fuel CellXing Yang, Zhaoying Zhou, and Xiongying YeTsinghua University, CHINA 668

2E4.55 A Low Temperature Co-Fired Ceramic SolidPropellant Microthruster for MicropropulsionApplications

Kaili Zhang , Siaw Kiang Chou ,

and Simon S Ang"National University of Singapore. SINGAPORE.

' University of Arkansas, USA 672

2E4.56 Micromachined Array Microjet for InhalationDrug TherapyJunhua Zhu, Zhaoying Zhou, Yanying Feng,

Dong Lin, and Guibing DuTsinghua University, CHINA 676

• Microactuators


2E4.57 Foxtail ActuatorsMakoto Mita , Kuniyuki Kakushima",

Manabu Ataka , Hiroshi Toshiyoshi ,

and Hiroyuki FujitaThe Japan Aerospace Exploration Agency, JAPAN,

'Tokyo Institute of Technology, JAPAN.

'The University of Tokyo, JAPAN 680

2E4.58 Out of Plane Motion of AssembledMicrostructures using a SinglemaskSOI ProcessM. Last, V. Subramaniam, and K.S.J. PisterUC Berkeley, USA 684

2E4.59 Resonant Drive for Stabilizing Parallel-PlateActuators Beyond the Pull-in Point

•688

2E4.60

2E4.61

2E4.62

2E4.63

2E4.64

Electrostatic Fringe-Field Actuation forLiquid-Metal DropletsProsenjit Sen and Chang-Jin "CJ" KimUniversity of California at Los Angeles, USA

High Power Electrostatic Motor withMicropattemed Electret on Shrouded TurbineTakashi Genda, Shuji Tanaka,

and Masayoshi EsashiTohoku University. JAPAN

2E4.65

2E4.66

2E4.67

• 693

Baris Cagdaser and Bernhard E. BoserUniversity (if California at Berkeley. USA

A Microball-Bearing-Supported LinearElectrostatic Micromotor with BenzocyclobutenePolymer Insulating LayersAlireza Modafe1, Nima Ghalichechian ,

Alex Frey , Jeffrey H. Lang",

and Reza GhodssiUniversity of Maryland, USA,

'Massachusetts Institute of Technology, USA

2-D Scanning Mirror using Plastically DeformedAngular Vertical Comb Drive ActuatorJongbaeg Kim, Dane Christensen, and Liwei LinUniversity of California at Berkeley. USA 697

High-Speed Characterization and MechanicalModeling of Microscale, Axial-Flux,Permanent-Magnet Generators

David P. Arnold1, Yeun-Ho Joung",

luliea Zana', Jin- Woo Park',

Sauparna Das', Jeffrey H. Lang ,

David Veazie", and Mark G. AllenGeorgia Institute of Technology. USA.

"Clark Atlanta University, USA,

'Massachusetts Institute of Technology, USA • 701

• 7 0 5

• 709

A Piezoelectric Micro-Actuator with ThreeDimensional Structure and its Micro-FabricationPeng Gao', Kui Yao", Xiaosong Tang".

Xujiang He", Santiranjan Shannigrahi",

Yaolong Lou1, Jian Zhang", and Kanzo Okada'Sony Electronics fS) Pte Ltd, SINGAPORE, institute

of Materials Research and Engineering. SINGAPORE 713

Development of Monolithic PZT Microstagefor the Application of Ultra High-DensityData StorageH.G. Xu1, K. Okamoto2, D.Y. Zhang", T. Ono1,

and M. Esashi1 Tohoku University. JAPAN, "NEC Tokin Corporation,

JAPAN. 'Beihang University. CHINA 717

A Cylindrical Micro Ultrasonic Motor usingMicro-Machined Piezoelectric VibratorTakefumi Kanda, Akira Makino,

Yoshitaka Omori, and Koichi SuzumoriOkavama University JAPAN 721

XVI

2E4.68 A Self-limited Large-Displacement-RatioMicromechanical AmplifierJ. Li12, Z. S. Liu3, C. Lu\ Q. X. Zhang2,and A. Q. Liu1

Nanvang Technological University, SINGAPORE,

'"Institute of Microelectronics, SINGAPORE,

' Institute of High Performance Computing,

SINGAPORE

2E4.69 Shape Memory Thin Film Actuator forHolding a Fine Blood VesselTakashi Sugawara1, Ken-ichi Hirota', MasaruWatanabe1, Takashi Mineta1, Eiji Makino',Satoshi Toh , and Takayuki Shibata"Hirosaki University-, JAPAN,

"Toyohashi University, JAPAN

2E4.70

2E4.71

2E4.72

2E4.73

Ti-Ni SMA Film Actuated Si Cantilever Beamsfor MEMS Probe CardTakahiro Namazu, Shozo Inoue, Youichi Tashiro,

Yuuta Okamura, and Keiji KoterazawaUniversity of Ilyogo, JAPAN

Design and Fabrication of MuIti-Degrees-of-reedom Single Crystal Silicon MoveablePlatforms on SOI WaferHuai-Yuan Chu, Shih-Wei Lee,and Weileun FangNational Tsing Hua University-, TAIWAN

Fabrication and Testing of Three-DimensionalStages Providing Displacement of up to 8 umYasuhisa AndoNational Institute of Advanced Industrial Science and

Technology, JAPAN

Development of Intelligent Mckibben Actuatorwith Built-in Soft Conductive Rubber SensorShuichi Wakimoto, Koichi Suzumori,and Takefumi KandaOkayama University. JAPAN

A Reversible Thermo-Sensitive Hydrogel Clamperof Locomotive Mechanism in Gastrointestinal TractJinseok Kim1'2, Byungkyu Kim2, Soohyun Kim",Hyeon Cheol Kim', and Kukjin Chun''Seoul National University, KOREA,

'Korea Institute of Science and Technology. KOREA

2E4.75 A Membrane Actuator Based onPiezo-Polymer-Composite TechnologyElmar Just, David Pustan, and Peter WoiasAlbert-Ludwigs-University Freiburg, GERMANY

2E4.76 Magnetic Planar Micro GeneratorHynek Raisigel, Orphee Cugat,Jerome Delamare, Olivier Wiss,and Herve RostaingLaboratoire d"Electrotechnique de Grenoble, FRANCE •

2E4.77 A Unique Reliability Data Point: The Start-Stop

2E4.74

I Operation of a Polysilicon Micromotor at theEight Year Mark

I Alain Izad, Srihari Rajgopal,

: and Mehran MehreganyCase Western Reserve University, USA 762

725 • MEMS Design & Analysis


2E4.78 Analysis and Modeling of Curvature inCopper-Based MEMS Structures Fabricated usingCMOS Interconnect TechnologyMaric-Ange Eyoum , Nils Hoivik",

Christopher Jahnes", John Cotte".

• 729 : and Xiao-Hu Liu2

University of California at Berkeley. USA.

'IBM T.J. Watson Research Center. USA 764

2E4.79 Nonlinear Dynamics of Micro Impact Oscillatorsin High Frequency MEMS Switch Application

733 Weibin Zhang, Wenhua Zhang,

: and Kimberly L. TurnerUniversity of California at Santa Barbara. USA 768

2E4.80 Air Damping of Microbeam Rsonators in aLow VacuumWenjing Ye and Same Hutcherson"

• 737 ' Georgia Institute of Technology, USA,"Timken Corporation, USA 772

2E4.81 Parametric Model Extraction for MEMS Basedon Variational Finite Element TechniquesJan E. Mehner , Alexey Schaporin".

• 741 Vladimir Kolchuzhin", Wolfram Doetzel",and Thomas Gessner

: 'Fraunhofer Institute for Reliability and

Microintegration. GERMANY,

"Chemnitz University of Technology, GERMANY 776

745 2E4.82 Design and Performance of a MicroelectromagneticVibrationpowered GeneratorS. P. Becby1, M. J. Tudor1, E. Koukharenko',

N. M. White', T. O'Donnell2, C. Saha2,

S. Kulkarni", and S. Roy"University of Southampton, UK.

:Tyndall National Institute. IRELAND 780

2E4.83 Scavenging Energy from Human Body:Design of a Piezoelectric TransducerM. Renaud'", T. Sterken'2, P.Fiorini',R. Puers2, K. Baert', and C. van Hoof12

•••• 7 5 3 ; lnleruniversity Microelectronic Center-Leuven. BELGIUM.

"Kalholieke Universiteit Leuven. BELGIUM 784

2E4.84 Closed form Analysis of Piezoelectric MultilayerBending Actuators using Constituent EquationsRiidiger G. Ballas1, Helmut F. Schlaak',

••• 757 and Andreas J. Schmid2

! Darmstadt University of Technology, GERMANY,

; "'Piezoproducts. Argillon GmbH GERMANY 788

749

XVII

2E4.85 Directivity Steering Principle for BiomimiciySilicon MicrophoneN. Ono, T. Arita, Y. Senjo, and S. AndoThe University of Tokyo, JAPAN • • 792

in LPCVD S13N4 Film with Ion ImplantationWendian Shi, Haixia Zhang, Shasha Wang,Guobing Zhang, and Zhihong LiPeking University, CHINA • 824

2E4.86 Analysis and Design of DifferentialElectromagnetic Transducer for ImplantableMiddle ear using Finite Element Method

Min-Kyu Kim1, Young-Ho Yoon',

Hyung-Gyu Lim1, Byung-Seop Song",

Il-Yong Park1, and Jin-Ho Cho1

Kyungpook National University, KOREA,:Daegu University, KOREA 796

2E4.87 Improvement of Thermal Response inTemperature Controlled Precise Three-AxisAccelerometer with Stabilized Characteristicsover a Wide Temperature RangeKyung 11 Lee , Hidekuni Takao , Kazuaki

Sawada', Hee Don Seo2, and Makoto Ishida'Toyohashi University of Technology, JAPAN,

' Yeungnam University, Korea 800

2E4.88 MEMS littman Tunable Laser usingCurve-Shaped Blazed GratingX. M. Zhang', H. Cai1, A. Q. Liu', J. Z. Hao2.D. Y. Tang', and C. Lu1

'Nanyang Technological University-, SINGAPORE,

'Institute for Infocomm Research, SINGAPORE • 804

2E4.89 The Frequency Design Nozzles Layout of thePiezoelectrically Actuated Micro Droplet GeneratorBased on a Fluid-Solid Interaction Modal Analysis

Yanying Feng, Zhaoying Zhou, Guibin Du,and Junhua ZhuTsinghua University, CHINA 808

2E4.90 Evaporation Evolution of Volatile LiquidDroplets in Nanoliter Well ArrayChin-Tai Chen'", Fan-Gang Tseng",

and Ching-Chang Chieng"Industrial Technology Research Institute, TAIWAN,

'National Tsing Hua University, TAIWAN

2E4.91 Silicon Anisotropic Wet Etching Simulation usingMolecular Dynamics

T. Kakinaga', A. Hatai', O. Tabata",and Yoshitada IsonoRitsumeikan University, JAPAN,

Kyoto University; JAPAN

812

• 816

• Stress and Strength of MEMS Materials


2E4.92 Elimination of Stress-Induced Curvature inMicrobolometer Focal Plane ArraysShusen Huang, Biao Li, and Xin ZhangBoston University', USA 820

2E4.94 Tensile Stress Determination in Silicon NitrideMembrane by AFM CharacterizationAnne-Sophie Rollier1, Bernard Legrand',

Dominique Deresmes , Matthieu Lagouge '",

Dominique Collardand '", and Lionel Buchaillot'lEMN. FRANCE, 2University of Tokyo, JAPAN 828

2E4.95 Temperature-Dependent Fracture Toughness ofSingle-crystal-silicon FilmShigeki Nakao, Taeko Ando, Mitsuhiro Shikida,and Kazuo SatoNagova University. JAPAN 832

2E4.96 An in-situ Technique for Measuring Young'sModulus and Residual Stress of Each Layerfor Multi-layer FilmMeng Nie, Qing-An Huang, Weihua Li,

and Hua RongSoutheast University. CHINA 836

2E4.97 Reliability of Non-Released Microstruetures:Failure Analysis and Innovative Solution ProcessO. Millet', P. Muller2, O. Blanrue',B. Legrand2, D. Collard3, and L. Buchaillot2

Delfmems. FRANCE, 'Institute of Electronic,

Microelectronic and Nanotechnologies, FRANCE.

'University of Tokyo, JAPAN 840

2E4.98 Anisotropic Fracture Behavior of NotchedTensile Single Ciystal Silicon Thin FilmSpecimens on MicroscaleXueping Li, Takashi Kasai, Taeko Ando,Mitsuhiro Shikida, and Kazuo SatoNagova University. JAPAN 843

2E4.99 Effect of Gas Flow Ratio in PE-CVD onElastic Properties of Sub-Micron ThickSilicon Nitride Films for MEMSYoshitada Isono , Takahiro Namazu",Yoshihiro Saito , Akira Yamaguchi ,and Naoyuki Fukushima'Ritsumeikan University, JAPAN,

'University of Hyogo, JAPAN.

'Sumitomo Electric Industries. Ltd, JAPAN 847

2E4.100 Low Stress Atomic Layer Deposited Alumina forNano Electro Mechanical SystemsMarie K. Tripp', Christoph Stampfer",

Cari F. Herrmann', Christofer Hierold2,

Steven George', and Victor M. Bright'University of Colorado, USA,

'ETH Zurich, SWITZERLAND ••• 8 5 1

2E4.93 Modifying Residual Stress and Stress Gradient

2E4.101 Fabrication and Mechanical Characterization ofLCVD-Deposited Carbon Micro-SpringsK.L. Williams, J. Koler, and M. BomanUppsala University, SWEDEN • 855

XVIII

• Functional and New Materials


2E4.102 Fabrication of Polysilicon Gated-Nanowires andTheir Application for pA Precision CurrentMeasurementsSerge Ecoffey, Vincent Pott, Didier Bouvet,

Yusuf Leblebici, Michel Declercq,

and Adrian Mihai lonescuSwiss Federal Institute of Technology Lausanne.

SWITZERLAND 859

2E4.103 Concrete the Aligned CNT-FilmsHuai-Yuan Chu, Tso-Chi Chang,

Wen-Kuang Hsu, and Weileun FangNational Tsing Hua University, TAIWAN 863

2E4.104 Real Time Observation of Micromachined FieldEmission Tips using Transmission ElectronMicroscopeKuniyuki Kakushima1, Gen Hashiguchi",

Manabu Ataka , Hiroshi Toshiyoshi ,

and Hiroyuki Fujita'The University of Tokyo, JAPAN,

'Kagawa University. JAPAN 867

2E4.105 Performance and Reliability Study of Si ( l l l )CMOS Subjected to High Mechanical Stressfor Smart Sensor Application

Radhakrishna Vatedka, Yoshiko Kato,Hidekuni Takao, Kazuaki Sawada,and Makoto IshidaToyohashi University of Technology, JAPAN 871

2E4.106 High-Q Mechanical Tuning of MEMSResonators using a Metal Deposition-AnnealingTechniqueChristophe G. Courcimault and Mark G. AllenGeorgia Institute of Technology. USA 875

2E4.107 Piezoelectric Properties of Sputtered AFX onSilicon SubstrateK. Kano', K. Arakawa', Y. Takeuchi',M. Akiyama", N. Ueno", and N. KawaharaDenso Corporation, JAPAN,

'National Institute of Admnced Industrial

Science and Technology. JAPAN 879

2E4.108 Micromachined Thick Film PiezoelectricUltrasonic Transducer ArrayZhihong Wang, Weiguang Zhu, Jianmin Miao,

Hong Zhu, Chen Chao, and Ooi Kiang TanNanyang Technological University. SINGAPORE 883

2E4.109 GaN on Patterned Silicon (GPS) Technique forFabrication of Gan-Based MEMSZhenchuan Yang, Ruonan Wang, Shuo Jia,

Deliang Wang, Baoshun Zhang,

Kevin J. Chen, and Kei May LauHong Kong University- of Science and Technology.HONG KONG 887

2E4.110 Planar Inductor with Ferrite Layers for DC-DCConverterYasuhiko Mano, Seok Bae, Jinseok Moon,

Hyungmi Jung, and Yongsoo OhSamsung Electro-Mechanics Co.. Ltd., KOREA 891

2E4.111 Fully Integrated Ferrite-Based Inductore forRF ICs

F. Liu1'2, C. Yang1, T. L. Ren', L. T. Liu',

H. G. Feng3, A. Z. Wang3, H. B. Long',

and J. Yu"Tsinghua University. CHINA.

' Huazhong University of Science and Technology.

CHINA. 'Illinois Institute of Technology, USA 895

2E4.112 In-Situ Chemical Vapor Deposition of AluminaCatalyst Bed on a Suspended MembraneMicroreactor

Tomokazu Takahashi, Shuji Tanaka,

Kuei-Sung Chang, and Masayoshi EsashiTohoku University. JAPAN'•••

2E4.113 Thermoelectric Microstructures ofBi2Te3/Sb2Te3 for a Self-CalibratedMicropyrometer

L. M. Goncalves', C. Couto1, P. Alpuim',

D. M. Rowe2, and J. H. Correia''University of Minho. PORTUGAL.

"University of Cardiff. UK

2E4.114 Microelectromechanical Structures in

Langasite (La3Ga5SiOi4) by Wet ChemicalEtchingE. Ansorge1, S. Schimpf1, S. Hirsch1,

B. Schmidt , J. Sauerwald", and H. Fritze"Otto- Von-Guericke-University Magdeburg, GERMANY,

'Clausthal University of Technology, GERMANY

Packaging

•899

• 904

• 908

Poster Session 14:45-17:30 Tuesday, June

2E4.115 Polycrystalline Diamond Thin Film PackagingTechnology for Wireless Integrated Micro-Systems

Xiangwei Zhu and Dean M. AslamMichigan State University. USA •912

2E4.116 Stability of Wafer Level Vacuum EncapsulatedSingle-Ciystal Silicon Resonators

Ville Kaajakari1, Jyrki Kiihamaki', Aarne Oja1,

Heikki Seppa , Sami Pietikainen", Ville Kokkala",

and Heikki Kuisma"ITT Information Technology, FINLAND.

"VT1 Technologies Oy. FINLAND 916

2E4.117 Hydrogen Diffusion and Pressure Control ofEncapsulated MEMS Resonators

Rob N. Candler, Woo-Tae Park, Matt Hopcroft,

Bongsang Kim, and Thomas W. KennyStanford University, USA • • 920

XIX

2E4.118 Reversible Wafer-Level Bonding atRoom TemperatureWen-Yue Zhang, Joseph P. Labukas,

Svetlana Tatic-Lucic, and Gregory S. FergusonLehigh University, USA

2E4.119 Encapsulation of Vacuum Sensors in a WaferLevel Package using a Gold-Silicon Eutectic

Jay Mitchell, G.R. Lahiji, and Khalil Najafi

• 924

University- of Michigan, USA • •928

2E4.120 Room Temperature Vacuum Sealing using SurfacedActivated Bonding With Au Thin FilmsHironao Okada', Toshihiro Itoh', Jorg Fromel",

Thomas Gessner", and Tadatomo Suga'The University- of Tokyo, JAPAN,

''Fraunhofer IZM, GERMANY 932

2E4.121 Bond Strength Tests Between Silicon Wafers andDuran Tubes (Fusion Bonded Fluidic Interconnects)

Imran Fazal, Erwin Berenschot, Rik Deboer,

Henri Jansen and Miko ElwenspoekUniversity of Twente, The NETHERLANDS 936

2E4.122 Film Transfer and Bonding Technique toCover Lab on a Chip

Jae Wan Kwon, Sanat Kamal-Bahl,

and Eun Sok Kim

University of Southern California, USA 940

2E4.123 Low Azeotropic Solvent Sealing of PMMAMicrofluidic DevicesChe-Hsin Lin1, Lung-Ming Fu", Chien-HsiungTsai\ Chien-Hsiang Chao , and Che-Wei Lan'National Sun Yat-Sen University, TAIWAN,

'Graduate Institute of Materials Engineering, TAIWAN,

National Pingtung University of Science and

Technology, TAIWAN • 944

2E4.124 An Active Microscaffold for Culturing 3DNeuronal NetworksLaura Rowe', Mahmoud Almasri1, Nick Fogleman",

A. Bruno Frazier', and Gregory J. Brewer"Georgia Institute of Technology, USA,

'Southern Illinois University USA 948

2E4.125 Fabrication and Wafer-Level Packaging of SiElectrostatic Microgripper for Micro AssemblyKunnyun Kim ', Hyun-Myoung Yoon",

Kang Ryeol Lee', Joon-Shik Park',

Hyoderk Park', Chanwoo Moon',

In-Gyu Lee", and Joungho ParkKorea Electronics Technology Institute. KOREA,

Hankuk Aviation University, KOREA,

'Korea University KOREA •952

2E4.126 Uniquely Orienting Dry Micro Assembly byTwo-Stage Shape RecognitionJiandong Fang and Karl F. Bohringer

2E4.127 Wafer Level Self-Assembly of Microstructuresusing the Global Magnetic Lifting and LocalizedInduction WeldingHsueh-An Yang, Chiung-Wen Lin,

and Weileun FangNational Tsing Hua University, TAIWAN 960

2E4.128 Self-Assembled Silicon Networks on PlasticSean A. Stauth and Babak A. ParvizUniversity of Washington, USA 964

• Optcial MEMSPoster Session 14:45-17:30 Tuesday. June 7

2E4.129 A MEMS 1-D Optical Scanner for Laser ProjectionDisplay using Self-Assembled Vertical Combsand Scan-Angle Magnifying Mechanism

M. Yoda', K. Tsamoto2, C. Chong2, H. lto', A.

Murata1, S. Kamisuki1, M. Atobe',

and H. Toshiyoshi''Seiko Epson Corp.. JAPAN, ''Santec Co., JAPAN.'University of Tokyo, JAPAN 968

2E4.130 Low-Insertion-Loss Compact 3D-MEMS OpticalMatrix Switch with 18 Input/Output PortsAtsushi Kazama , Yasuhiro Itou ,

Masaya Horino', Kazuyuki Fukuda1,

Masatoshi Kanamaru , Teruhisa Akashi ,

Tadaaki Ishikawa", Takeshi Harada",

and Ryoji Okada'Mechanical Engineering Research Laboratory, JAPAN,

2Hitachi, Ltd, JAPAN, 'Hitachi Metals, Ltd, JAPAN 972

2E4.131 Compact Gate-AH-Around Silicon lightModulator for Ultra High Speed OperationK. E. Moselund', P. Dainesi', M. Declercq',

M. Bopp", P. Coronel", T. Skotnicki",

and A. M. lonescuEcole Polytechnique Federate De Lausanne,

SWITZERLAND, 2St Microelectronics, FRANCE 976

2E4.132 Fishbone-Shaped Vertical Comb Actuator forDual-Axis 1-D Analog Micromirror ArrayNorinao Kouma1, Osamu Tsuboi", Hiromitsu

Soneda , Satoshi Ueda", and Ippei Sawaki'Fujitsu Laboratories Ltd., JAPAN,

''Fujitsu Ltd., JAPAN 980

2E4.133 A Discrete Positioning Microactuaton LinearityModeling and VOA ApplicationMan Geun Kim and Jong Hyun LeeGnangju Institute of Science and Technology, KOREA 984

2E4.134 An Electrothermal SCS Micromirror forLarge Bi-Directional 2-D ScanningAnkur Jain and Huikai XieUniversity of Florida, USA 988

University of Washington, USA • • 9 5 6

2E4.135 Diamond Shaped Frame Supported ElectrostaticScanning Micromirror

XX

Chang-Hyeon Ji, Seong-Hyok Kim,

Youngjoo Yee, Moongoo Choi,Sang-Cheon Kim, See-Hyung Lee,

and Jong-Uk BuLG Electronics Institute of Technology; KOREA 992

2E4.136 Single Crystalline Silicon Micromirror Arrayfor Peptide Synthesis ApplicationsYun-Ho Jang', Kook-Nyung Lee",

Dong-Sik Shin, Yoon-Sik Lee,and Yong-Kweon Kim'Samsung Electronic Co., Ltd., KOREA.'Korea Electronics Technology Institute, KOREA.

'Seoul National University; KOREA 996

2E4.137 MOEMS Focusing Device withIdeal Parabolic Deflection ShapeUlrich M. Mescheder., Carlos Estan,

Gergoe Somogyi, and Markus FreudenreichUniversity of Applied Sciences Furtwangen, GERMANY 1000

2E4.138 Step-Wise Tunable MicrobolometerLong-Wavelength Infrared FilterY. Wang, B. Potter, M. Sutton,

R. Supino, and J. TalghaderUniversity of Minnesota, USA 1006

2E4.139 Micromachined Mid-Infrared TunableFabry-Perot FilterNorbert Neumann, Karla Hiller1,

and Steffen Kurth2

Chemnitz University of Technology, GERMANY,

' Fraunhofer Institute for Reliability- and

Microintegration, GERMANY 1010

2E4.140 Tunable Liquid Micro-Lens SystemFlorian Krogmann, Wolfgang Moench,

and Hans ZappeUniversity of Freiburg, GERMANY 1014

2E4.141 Tunable, Membrane-Based, Liquid-FilledMicro-LensesAnnin Werber and Hans ZappeUniversity • of Freiburg. GERMANY 1018

2E4.142 A 2-D Translational Pinhole for Med by TwoOrthogonally Moving Micro-SlitsN. Chronis', M. Okandan2, M. Baker2,

and L. P. Lee1

University- of California at Berkeley. USA.

'Sandia National Laboratories, USA 1022

2E4.143 The Fabrication of Filter-Less FluorescenceDetection Sensor Array using CMOS ImageSensor TechniqueYuki Maruyama, Kazuaki Sawada,

Hidekuni Takao, and Makoto IshidaToyohashi University of Technology, JAPAN 1026

2E4.144 CMOS Imager Based on Single PhotonAvalanche Diodes

Cristiano Niclass, Alexis Rochas,

Pierre-Andre Besse, Radivoje S. Popovic,

and Edoardo CharbonEcolc Polytechnique Federale De Lausanne,SWITZERLAND 1030

2E4.145 Integrated Amorphous Silicon Color Sensor onTFT LCDKi-Chan Lee, Yun-Jae Park, Hyunseok Ko,

Seung-Hwan Moon, Jin-Hyeok Park,

Brian Berkeley, and Sang-Soo KimSamsung Electronics, KOREA

2E4.146 Pure Photonic Crystal Waveguiding forSignal Processing at Optical JunctionsSelin H. G. Teo', A. Q. Liu', J. Singh2,

M. B. Yu2, J. H. Wu', and X. M. Zhang'Nanyang Technological University, SINGAPORE,

''institute of Microelectronics, SINGAPORE

1035

1039

2E4.147 GAN Film Growth on Si Substrate forSub-Wavelength Optical MEMS

F.-R.Hu, K. Ochi, B.-S.Choi, Y. Kanamori,and K. HaneTohoku University; JAPAN 1043

• RF-MEMS


2E4.148 Vertically Integrated Silicon Single CrystallineMEMS SwitchOren Aharon, Shai Feldman.

and Yael NemirovskyTechnion-Israel Institute of Technology. ISRAEL 1047

2E4.149 A Shunt-Type RF MEMS Switch at 3.3VOperation Actauted by Lorentz for CE andElectrostatic Hold

11-Joo Cho, Taeksang Song, Sang-Hyun Baek,

and Euisik Yoon

Korea Advanced Institute of Science and

Technology. KOREA 1051

2E4.150 Metal Contact Capacitive Switeh onLow-Resistivity Silicon WaferQ. X. Zhang1, A. B. Yu2, and A. Q. Liu2

'institute of Microelectronics, SINGAPORE,

Nanyang Technological University, SINGAPORE 1055

2E4.151 A MEMS RF Phase and Frequency ModulatorR. B. Reichenbach, K. L. Aubin,

M. Zalalutdinov, J. M. Parpia,

and H. G. CraigheadCornell University. USA 1059

2E4.152 Low Phase Noise, FBAR-Based VoltageControlled Oscillator Without Varactor

Jong Jin Kim, Hao Zhang, Wei Pang,Hongyu Yu, and Eun Sok KimUniversity of Southern California. USA 1063

XXI

2E4.153 A Micromachined W-Band Iris FilterFiras Sammoura', Ying Cai2, Chen-Yu Chi3,

Toshiki Hirano4, Liwei Lin',

and Jung-Chih Chiao"University of California at Berkeley, USA,

'University of Texas at Arlington, USA.3Agilent Technologies. USA,

Hitachi Gst, Almaden Research Center, USA

2E4.157 High-Performance MicromachinedRF Planar IductorsPatrick Carazzetti1, Marc-Alexandre Dubois2,

and Nicolaas-F. de Rooij'University of Neuchdtel, SWITZERLAND,

"Centre Suisse d'Electronique et De

Microtechnique, SWITZERLAND

1067

2E4.154 Low Loss K-Band Tunable Bandpass Filterusing Micromachined Variable Capacitors

Jong-Man Kim', Sanghyo Lee', Jae-Hyoung Park",

Jung-Mu Kim1, Chang-Wook Baek3

Youngwoo Kwon', and Yong-Kweon Kim''Seoul National University, KOREA,

"LG Electronics Institute of Technology, KOREA,s Chung-Ang University, KOREA 1071

2E4.155 Ultra-Wide Tuning Range Silicon MEMSCapacitors on Glass with Tera-Ohm Isplationand Low Parasitics

Daniel T. Mccormick1 and Norman C. Tien1'2

Neil MacDonald , Robert Matthews,

and Andrew HibbsUniversity of California at Berkeley, USA.

'University of California at Davis. USA

3Quantum Applied Science and Research, USA 1075

2E4.1S6 Mechanically Reliable MEMS Variable Capacitorusing Single Ciystalline Silicon (SCS) Structure

Jong-Man Kim', Sanghyo Lee1, Jung-Mu Kim1,Chang-Wook Baek , Youngwoo Kwon ,and Yong-Kweon Kim1

Seoul National University; KOREA,

'•Chung-Ang University; KOREA 1080

2E4.158 Micromachined S-Band Patch Antenna withReduced Dielectric ConstantHenrik Kratz and Lars StenmarkUppsala University. SWEDEN

2E4.159 Packaging Method for RF MEMS Devicesusing LTCC Capping Substrate andBCB Adhesive BondingKi-Il Kim', Jung-Mu Kim1, Jong-Man Kim1,

Chang-Wook Baek", and Yong-Kweon KimSeoul National University; KOREA,

'Chung-Ang University, KOREA

2E4.160 A Lateral Field-Emission RF MEMS DeviceKiyotaka Yamashita, Winston Sun,

Kuniyuki Kakushima, Hiroyuki Fujita,

and Hiroshi ToshiyoshiUniversity of Tokyo, JAPAN

2E4.161 5Ghz Low-Phase-Noise Oscillator Based onFBAR with Low TCFHao Zhang, Jongjin Kim, Wei Pang,Hongyu Yu, and Eun Sok KimUniversity of Southern California. USA

1084

•••• 1 0 8 8

1092

1096

1100

Author Index A-01Keyword Index A-132007 Announcement A-29

XXII

digest of technical papers - gbv.de · direct and reverse rotation control bernard legrand, lionel...

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